Package substrate capable of flexible wiring

By designing the structure of wiring rings, wiring barrels and limit rods on the packaging substrate, flexible wiring of the pads is achieved, and the possible leakage and short circuit problems of vacant pads are solved, and the assembly reliability is improved.

CN222980502UActive Publication Date: 2025-06-13JIANGXI HONGSEN TECH CO LTD
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Patent Information

Application Number
CN202421610614.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-09
Publication Date
2025-06-13
Estimated Expiration
2034-07-09

AI Technical Summary

Technical Problem

When assembling chips of existing packaging substrates, vacant pads are easily blocked by dust, debris and other dirt, resulting in a risk of short circuit.

Method used

A package substrate structure including wiring rings, wiring barrels and limit rods is designed so that the pads can be freely controlled to power on or off, avoiding leakage and short circuit problems of vacant pads.

Benefits of technology

It realizes flexible wiring of solder pads on the packaging substrate, effectively avoids leakage and short circuit problems, and ensures assembly reliability through anti-free design.

✦ Generated by Eureka AI based on patent content.

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Abstract

A packaging substrate capable of flexible wiring comprises a power supply base, a substrate body, a wiring ring, a wiring cylinder and a limiting rod, the substrate body is arranged on the power supply base, an electrical connection through hole is formed in the middle of the substrate body, a plurality of bonding pads are further distributed on the substrate body, the wiring ring is installed in the electrical connection through hole in a clamped mode, and the wiring cylinder is arranged on the substrate body. The wiring cylinder is fixedly arranged on the power supply seat and penetrates through the wiring ring from bottom to top, and the limiting rod penetrates through the wiring cylinder from top to bottom; the wiring ring comprises a ring body and a plurality of first elastic electric contact pins; the wiring cylinder comprises a cylinder body and a plurality of second elastic electric contact pins; a plurality of vertical limiting sliding grooves with openings in the lower ends are formed in the side face of the limiting rod, and receding grooves are further formed in part of the limiting sliding grooves. According to the utility model, by designing the structures of the wiring ring, the wiring cylinder and the limiting rod, the problems of electric leakage, short circuit and the like possibly caused by a vacant bonding pad on a packaging substrate can be effectively avoided; the utility model has the advantages of strong practicability and strong popularization significance.
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Description

Technical Field

[0001] The utility model relates to a circuit board, in particular to a packaging substrate with flexible wiring. Background Art

[0002] The packaging substrate, abbreviated as the substrate, is a substrate used to repackage multiple first-level packaged IC components to form a substrate with a higher density and capacity. It can provide functions such as electrical connection, protection, support, heat dissipation, and assembly for the chip, so as to achieve the purpose of multi-pin, reducing the volume of the packaged product, improving electrical performance and heat dissipation, ultra-high density or multi-chip modularization.

[0003] When assembling a chip on the existing packaging substrate, the chip is usually welded and fixed on the pads preset on the surface of the substrate. Due to process and customer requirements, not all pads on the packaging substrate are used for welding, that is, some pads may be in a vacant state. Since most of the internal power supply wiring of the existing packaging substrate is integrated, these vacant pads are also in a charged state when the packaging substrate is powered on. However, these vacant pads are often exposed on the surface of the substrate and are easily affected by dirt coverage and blockage such as dust and debris, resulting in a short-circuit risk. Summary of the Utility Model

[0004] Based on this, it is necessary to provide a packaging substrate with flexible wiring in view of the deficiencies in the prior art.

[0005] A packaging substrate with flexible wiring includes a power supply base, a substrate, a wiring ring, a wiring cylinder, and a limiting rod. The substrate is arranged on the power supply base. A through hole for electrical connection is provided in the middle of the substrate, and a number of pads are also distributed on the substrate. The wiring ring is snap-fitted in the through hole for electrical connection. The wiring cylinder is fixedly arranged on the power supply base and passes through the wiring ring from bottom to top. The limiting rod passes through the wiring cylinder from top to bottom. The wiring ring includes a ring body and a number of first elastic electrical contact pins. The ring body is snap-fitted in the through hole for electrical connection. The number of first elastic electrical contact pins are respectively snap-fitted on the inner side of the ring body and can elastically expand and contract radially. The number of first elastic electrical contact pins are also respectively electrically connected to the number of pads. The wiring cylinder includes a cylinder body and a number of second elastic electrical contact pins. The cylinder body is designed as a vertically penetrating cylindrical structure. The cylinder body is fixedly arranged on the power supply base. The number of second elastic electrical contact pins are respectively snap-fitted on the side of the cylinder body, and both ends of each of them extend to the inner and outer sides of the cylinder body. The number of second elastic electrical contact pins are respectively horizontally corresponding to the number of first elastic electrical contact pins and can elastically expand and contract radially. The number of second elastic electrical contact pins are also respectively electrically connected to the power supply base. A number of vertical limiting chutes with open bottoms are provided on the side of the limiting rod, and some of the limiting chutes are also provided with avoidance grooves, which are horizontally corresponding to the second elastic electrical contact pins.

[0006] Further, an anti-fooling notch is provided on one side of the upper end of the cylinder body, and an anti-fooling convex block is correspondingly provided on one side of the upper end of the limiting rod. The anti-fooling convex block can be engaged with the anti-fooling notch from top to bottom.

[0007] Further, a plurality of alignment rods are provided on the power supply base, and a plurality of alignment through holes are correspondingly provided on the substrate. The plurality of alignment rods respectively pass through the corresponding alignment through holes from bottom to top.

[0008] Further, there are multiple groups of the substrate and the wiring ring. The multiple groups of substrates are sequentially stacked on the power supply base, and the multiple groups of wiring rings are respectively engaged and installed in the electrical connection through holes of the multiple groups of substrates. The wiring cylinder sequentially passes through the multiple groups of wiring rings.

[0009] Further, a plurality of separating and buffering sheets are provided between the power supply base and the substrate and between the multiple groups of substrates. The plurality of separating and buffering sheets are all designed in a ring shape and are respectively sleeved on the wiring cylinder and the plurality of alignment rods. Limiting nuts are also provided at the upper ends of the wiring cylinder, the limiting rod, and the plurality of alignment rods.

[0010] Further, the lower end of the limiting rod is designed in a hemispherical shape.

[0011] In summary, the beneficial effects of the present utility model, a flexible wiring package substrate, are as follows: By designing the structures of the wiring ring, the wiring cylinder, and the limiting rod, the pads on the package substrate can freely control power on or off, thus realizing the flexible wiring effect of the package substrate, and effectively avoiding problems such as leakage and short circuit that may occur in the vacant pads on the package substrate; The anti-fooling structures are designed for the wiring cylinder and the limiting rod, which can prevent the wrong insertion and assembly of the two from affecting the pad wiring and power supply on the package substrate; The design of the alignment structure makes the assembly between the package substrate and the power supply base easier and more reliable; The present utility model has strong practicability and has great significance for popularization. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a schematic structural diagram of a flexible wiring package substrate of the present utility model;

[0013] Figure 2 is Figure 1 the exploded structural diagram of

[0014] Figure 3 is Figure 2 the exploded structural diagram of the power supply base in

[0015] Figure 4 is Figure 2 the structural diagram of the substrate in

[0016] Figure 5 is Figure 2 the exploded structural diagram of the wiring ring in

[0017] Figure 6 is Figure 2 exploded structural schematic diagram of the middle wiring cylinder;

[0018] Figure 7 is Figure 2 structural schematic diagram of the middle limiting rod. Specific embodiments

[0019] In order to make the purpose, technical solutions and advantages of the utility model more clear and understandable, the following further details the utility model in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model.

[0020] As Figures 1 to 7 shown, the utility model provides a flexible wiring package substrate 100, which includes a power supply base 10, a substrate 20, a wiring ring 30, a wiring cylinder 40 and a limiting rod 50. The substrate 20 is arranged on the power supply base 10. A electrical connection through hole 21 is provided in the middle of the substrate 20, and a plurality of pads 22 are also distributed on the substrate 20. The wiring ring 30 is snap-fitted into the electrical connection through hole 21. The wiring cylinder 40 is fixedly arranged on the power supply base 10 and passes through the wiring ring 30 from bottom to top. The limiting rod 50 passes through the wiring cylinder 40 from top to bottom. It can be understood that in the utility model, there are also a number of electrical connection structures such as wires or conductive holes, etc., which are all conventional technical contents in the technical field, so they will not be elaborated here.

[0021] The wiring ring 30 includes a ring body 31 and a plurality of first elastic electrical contact pins 32. The ring body 31 is snap-fitted into the electrical connection through hole 21. A plurality of the first elastic electrical contact pins 32 are respectively snap-fitted inside the ring body 31 and can elastically expand and contract radially. The plurality of first elastic electrical contact pins 32 are also respectively electrically connected to a plurality of pads 22.

[0022] The wiring cylinder 40 includes a cylinder body 41 and a plurality of second elastic electrical contact pins 42. The cylinder body 41 is designed as a vertically penetrating cylindrical structure. The cylinder body 41 is fixedly arranged on the power supply base 10. A plurality of the second elastic electrical contact pins 42 are respectively snap-fitted on the side of the cylinder body 41 and their two ends respectively extend to the inside and outside of the cylinder body 41. The plurality of second elastic electrical contact pins 42 are respectively horizontally corresponding to the plurality of first elastic electrical contact pins 32 and can elastically expand and contract radially. The plurality of second elastic electrical contact pins 42 are also respectively electrically connected to the power supply base 10.

[0023] On the side of the limiting rod 50, there are several vertically arranged limiting chutes 51 with open lower ends. Some of the limiting chutes 51 are also provided with avoidance grooves 52, and the avoidance grooves 52 are horizontally corresponding to the second elastic electric contact pins 42. The lower end of the limiting rod 50 is designed in a hemispherical shape. The hemispherical end enables the limiting rod 50 to be inserted into the wiring cylinder 40 more easily.

[0024] When it is necessary to wire and energize the pads 22 on the substrate 20, just sleuth the wiring ring 30 on the wiring cylinder 40 and ensure that the first elastic electric contact pins 32 and the second elastic electric contact pins 42 are in one-to-one correspondence on the same horizontal plane. At this time, the first elastic electric contact pins 32 and the corresponding second elastic electric contact pins 42 are arranged at intervals, and the power supply circuits are all in a disconnected state. Then, insert the limiting rod 50 into the wiring cylinder 40 from top to bottom. When inserting, the limiting chutes 51 on the limiting rod 50 will abut and squeeze the inner ends of the second elastic electric contact pins 42, causing them to extend radially outwards. At this time, the first elastic electric contact pins 32 will abut and contact the second elastic electric contact pins 42, forming a connected power supply circuit.

[0025] Since there are also avoidance grooves 52 in some of the limiting chutes 51 of the limiting rod 50, these avoidance grooves 52 will provide a certain space to relieve the abutting and squeezing of the limiting rod 50 on the second elastic electric contact pins 42, causing some of the second elastic electric contact pins 42 to contract inwards again and disconnect the abutting connection with the first elastic electric contact pins 32, and thus some of the power supply circuits on the board will remain in a disconnected state. The structural cooperation of the wiring ring 30, the wiring cylinder 40 and the limiting rod 50 can realize the flexible wiring of the pads 22 on the encapsulated substrate, and avoid problems such as electric leakage and short circuit that may be caused by the energization of the vacant pads 22. By replacing the limiting rod 50 with different designs of avoidance grooves 52, the power supply on and off of different pads 22 on the encapsulated substrate can be adjusted at any time.

[0026] On one side of the upper end of the cylinder body 41, there is an anti-fooling notch 411. On the corresponding side of the upper end of the limiting rod 50, there is an anti-fooling convex block 53, and the anti-fooling convex block 53 can be snapped into the anti-fooling notch 411 from top to bottom. The anti-fooling notch 411 and the anti-fooling convex block 53 can prevent the problem of incorrect wiring of the power supply circuit of the pads 22 on the encapsulated substrate caused by the incorrect insertion angle of the limiting rod 50 and the wiring cylinder 40. There are also several alignment rods 11 on the power supply base 10, and several alignment through holes 23 are correspondingly provided on the substrate 20, and several of the alignment rods 11 respectively pass through the corresponding alignment through holes 23 from bottom to top. The structure of the alignment rods 11 and the alignment through holes 23 is more convenient for the combination and installation between the substrate 20 and the power supply base 10, and can also ensure that the overall product structure after assembly is more firm and reliable.

[0027] Specifically, in this embodiment, there are multiple groups of the substrate 20 and the wiring rings 30. The multiple groups of the substrate 20 are sequentially stacked on the power supply base 10, and the multiple groups of the wiring rings 30 are respectively snap-fitted into the electrical connection through holes 21 of the multiple groups of substrates 20. The wiring cylinder 40 passes through the multiple groups of wiring rings 30 in sequence. The stacked structure design of the multiple groups of substrates 20 enables the packaging substrate to be welded with more chips to achieve more abundant functions, and each pad 22 on each substrate 20 can still be wired flexibly.

[0028] There are several separation and buffer sheets 12 between the power supply base 10 and the substrate 20 and between the multiple groups of substrates 20. The several separation and buffer sheets 12 are all designed in a ring shape and are respectively sleeved on the wiring cylinder 40 and several alignment rods 11. Limiting nuts 13 are also provided at the upper ends of the wiring cylinder 40, the limiting rod 50, and the several alignment rods 11. The separation and buffer sheets 12 can separate the multiple layers of substrates 20, enabling the circuit board to maintain a better heat dissipation level during operation.

[0029] In summary, the beneficial effects of a packaging substrate 100 with flexible wiring according to the present utility model are as follows: By designing the structures of the wiring ring 30, the wiring cylinder 40, and the limiting rod 50, the pads 22 on the packaging substrate can freely control the power on or off, thus achieving the flexible wiring effect of the packaging substrate and effectively avoiding problems such as leakage and short circuit that may occur in the vacant pads 22 on the packaging substrate; The wiring cylinder 40 and the limiting rod 50 are designed with an anti-misassembly structure, which can prevent the incorrect insertion and assembly of the two from affecting the wiring and power on of the pads 22 on the packaging substrate; The design of the alignment structure makes the assembly between the packaging substrate and the power supply base 10 easier and more reliable; The present utility model has strong practicability and has strong promotional significance.

[0030] The above embodiments only represent one implementation mode of the utility model, and the description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the utility model, several deformations and improvements can still be made, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. A packaging substrate with flexible wiring, characterized in that: The invention comprises a power supply seat, a substrate, a wiring ring, a wiring barrel and a limiting rod, wherein the substrate is arranged on the power supply seat, an electrical connection through hole is arranged in the middle of the substrate, and a plurality of welding pads are distributed on the substrate, the wiring ring is clamped and installed in the electrical connection through hole, the wiring barrel is fixedly installed on the power supply seat and passes through the wiring ring from bottom to top, and the limiting rod is passed through the wiring barrel from top to bottom; the wiring ring comprises a ring body and a plurality of first elastic electric contact pins, the ring body is clamped and installed in the electrical connection through hole, the plurality of first elastic electric contact pins are respectively clamped and installed on the inner side of the ring body and can be radially elastically retracted, and the plurality of first elastic electric contact pins are also respectively electrically connected to a plurality of welding pads Connection; the wiring barrel includes a barrel body and a plurality of second elastic electric contact pins, the barrel body is a cylindrical structure design that penetrates from top to bottom, the barrel body is fixedly mounted on the power supply socket, and the plurality of second elastic electric contact pins are respectively mounted on the side of the barrel body and their two ends extend to the inner and outer sides of the barrel body respectively, the plurality of second elastic electric contact pins respectively correspond horizontally to the plurality of first elastic electric contact pins and can be elastically retracted and contracted radially, and the plurality of second elastic electric contact pins are also electrically connected to the power supply socket respectively; the side of the limit rod is provided with a plurality of vertical limit sliding grooves that are open at the lower end, some of the limit sliding grooves are also provided with avoidance grooves, and the avoidance grooves correspond horizontally to the second elastic electric contact pins.

2. The packaging substrate with flexible wiring as claimed in claim 1, characterized in that: An anti-foolproof notch is arranged on one side of the upper end of the cylinder, and an anti-foolproof convex block is correspondingly arranged on one side of the upper end of the limit rod, and the anti-foolproof convex block can be engaged in the anti-foolproof notch from top to bottom.

3. The packaging substrate with flexible wiring as claimed in claim 1, characterized in that: The power supply seat is also provided with a plurality of alignment rods, and the base plate is correspondingly provided with a plurality of alignment through holes, and the plurality of alignment rods respectively pass through the corresponding alignment through holes from bottom to top.

4. The packaging substrate with flexible wiring as claimed in claim 3, characterized in that: There are multiple groups of substrates and wiring rings, and the multiple groups of substrates are stacked on the power supply seat in sequence. The multiple groups of wiring rings are respectively engaged and installed in the electrical connection through holes of the multiple groups of substrates; the wiring barrel passes through the multiple groups of wiring rings in sequence.

5. The packaging substrate with flexible wiring as claimed in claim 4, characterized in that: A plurality of partition buffer plates are arranged between the power supply seat and the substrate and the multiple groups of substrates. The plurality of partition buffer plates are all annular in design and are respectively sleeved on the wiring barrel and a plurality of alignment rods; the upper ends of the wiring barrel, the limiting rod and the plurality of alignment rods are also provided with limiting nuts.

6. The packaging substrate with flexible wiring as claimed in claim 1, characterized in that: The lower end of the limiting rod is designed to be hemispherical.