Photoelectric packaging structure

Abstract

The utility model provides a photoelectric packaging structure. The photoelectric packaging structure comprises a shell, a plurality of light-emitting chips and a packaging body, the shell is provided with a containing groove and comprises a main body part and a protruding part. The protruding part is arranged on the main body part in a protruding mode and comprises a first protruding sub-part and a second protruding sub-part which are connected. The included angle between the upper surface of the first protruding sub-part and the upper surface of the second protruding sub-part is smaller than 1 degree and larger than 0 degree. The light-emitting chips are arranged in the containing groove. The packaging body is filled in the accommodating groove. Due to the design of the two protruding sub-parts and the fact that the two upper surfaces are close to the same plane, the adsorption area of the shell is increased, the suction nozzle does not incline when adsorbing the shell, the photoelectric packaging structure can be stably adsorbed and properly placed on a circuit board, a conductive frame of the photoelectric packaging structure is made to evenly make contact with solder paste of the circuit board, and therefore the circuit board is prevented from being damaged. Therefore, the manufacturing yield is improved. In addition, the included angle formed by extending the two upper surfaces is larger than 0 degree, and demolding of the shell in the injection molding process is facilitated.

Description

Technical Field

[0001] The utility model relates to a packaging structure, and in particular to an optoelectronic packaging structure. Background Art

[0002] At present, surface-mounted device (SMD) light-emitting diodes have the advantage of small volume, and can meet the product requirements of three-color independent light emission and mixed light emission by, for example, fixing three chips of red, green, and blue on the same surface. In the manufacturing process of SMD light-emitting diodes, a pick-up nozzle adsorbs the housing (or called bracket) of the SMD light-emitting diode to accurately place it on the circuit board for subsequent soldering processes.

[0003] However, due to the too small area available for adsorption on the traditional housing, it is easy for the pick-up nozzle to tilt during the adsorption process, resulting in uneven contact between the conductive frame on the housing and the solder paste on the circuit board when the housing is placed on the circuit board, thereby reducing the yield of component placement. On the other hand, when the conductive frame is bent and passes through the aforementioned housing, the reaction force of the bending easily causes the functional section of the conductive frame (that is, the area for arranging die bonding and wire bonding) to deviate from the preset position, affecting the yield of wire bonding configuration. Summary of the Utility Model

[0004] The utility model provides an optoelectronic packaging structure, which can improve the manufacturing yield.

[0005] An optoelectronic packaging structure of the utility model includes a housing, a plurality of light-emitting chips, and a package body. The housing has a receiving groove and includes a main body portion and a protruding portion. The protruding portion protrudes from the main body portion and includes a connected first protruding sub-portion and a second protruding sub-portion. The included angle between the extension of the upper surface of the first protruding sub-portion and the upper surface of the second protruding sub-portion is less than 1 degree and greater than 0 degree. These light-emitting chips are disposed in the receiving groove. The package body is filled in the receiving groove.

[0006] In an embodiment of the utility model, the above-mentioned main body portion has opposite first and second side edges. The first protruding sub-portion is flush with the first side edge. The second protruding sub-portion is flush with the second side edge.

[0007] In an embodiment of the utility model, the above-mentioned first protruding sub-portion has two opposite first bevel edges. The distance between the two first bevel edges gradually decreases from the second protruding sub-portion to the first side edge. The second protruding sub-portion has two opposite second bevel edges. The distance between the two second bevel edges gradually decreases from the first protruding sub-portion to the second side edge.

[0008] In an embodiment of the utility model, the ratio of the maximum length of the protruding portion in the length direction of the receiving groove to the length of the first side edge is 0.6 to 1.

[0009] In an embodiment of the present utility model, in the depth direction of the accommodation groove, the ratio of the width of the first protruding sub - part to the width of the second protruding sub - part is 1 to 1.5 to 2.0.

[0010] In an embodiment of the present utility model, the above - mentioned protruding part and the main body part are integrally formed.

[0011] Another optoelectronic packaging structure of the present utility model includes a housing, a plurality of light - emitting chips, a plurality of support bodies, and a packaging body. The housing has an accommodation groove and includes opposite first and second walls. The accommodation groove is located between the first and second walls. These light - emitting chips are disposed in the accommodation groove. These support bodies are disposed in the accommodation groove and connect the first wall and the second wall. The packaging body is filled in the accommodation groove.

[0012] In an embodiment of the present utility model, the above - mentioned support bodies are parallel to each other and arranged along the length direction of the accommodation groove.

[0013] In an embodiment of the present utility model, the above - mentioned support bodies are dome - shaped, arched, or stepped.

[0014] In an embodiment of the present utility model, the above - mentioned optoelectronic packaging structure further includes an adhesive layer. A filling area is formed between two adjacent ones of these support bodies. One of these light - emitting chips is adapted to be disposed in the filling area. The adhesive layer is disposed in the filling area.

[0015] In an embodiment of the present utility model, the height of the above - mentioned adhesive layer is less than the height of the light - emitting chip disposed in the filling area.

[0016] In an embodiment of the present utility model, the above - mentioned housing further includes an annular step portion. The annular step portion surrounds the opening of the accommodation groove.

[0017] Another optoelectronic packaging structure of the present utility model includes a housing, a plurality of conductive frames, a plurality of support bodies, and a packaging body. The housing has an accommodation groove and includes opposite first and second walls. The accommodation groove is located between the first and second walls. These light - emitting chips are disposed in the accommodation groove. These conductive frames are arranged along the length direction of the accommodation groove and penetrate through the second wall, and are electrically connected to these light - emitting chips. The packaging body is filled in the accommodation groove.

[0018] In an embodiment of the present utility model, the above - mentioned accommodation groove is symmetric about a central axis. The central axis is parallel to the length direction of the accommodation groove. The distance between the outer surface of the first wall and the central axis is less than the distance between the outer surface of the second wall and the central axis.

[0019] In an embodiment of the present utility model, each of the above - mentioned conductive frames includes a functional section and a bending section. The functional section is located in the accommodation groove and is adapted to carry one of these light - emitting chips and / or is adapted to be provided with wire bonding. The bending section connects the functional section and penetrates through the second wall and is exposed outside the housing.

[0020] In an embodiment of the present utility model, the above-mentioned functional section includes opposite connection ends and a fixed end. The functional section is connected to the bending section through the connection ends. The connection ends each have a recess on both sides in the length direction of the accommodation groove.

[0021] In an embodiment of the present utility model, the above-mentioned fixed end includes an adjacent flat area and at least one fixing convex portion. The flat area and the at least one fixing convex portion are embedded in the first wall.

[0022] In an embodiment of the present utility model, the above-mentioned at least one fixing convex portion includes two fixing convex portions. The two fixing convex portions are respectively located on both sides of the fixed end. The flat area is located between the two fixing convex portions.

[0023] In an embodiment of the present utility model, the above-mentioned conductive frames include a plurality of first conductive frames and a plurality of second conductive frames. The area of the functional section of each first conductive frame is larger than the area of the functional section of each second conductive frame. These light-emitting chips are respectively arranged on these first conductive frames. Each first conductive frame and the corresponding second conductive frame are respectively electrically connected to the corresponding light-emitting chip.

[0024] In an embodiment of the present utility model, the above-mentioned housing further includes two protection portions. The two protection portions are arranged on both sides of the outer surface of the second wall. These conductive frames are located between the two protection portions.

[0025] Based on the above, in the optoelectronic packaging structure of the present utility model, the housing includes a protruding portion protruding from the main body portion for a nozzle for component placement to adsorb. The protruding portion includes a connected first protruding sub-portion and a second protruding sub-portion. By virtue of the design that the protruding portion has two protruding sub-portions, and in addition, the included angle between the extension of the upper surface of the first protruding sub-portion and the upper surface of the second protruding sub-portion is less than 1 degree, the two upper surfaces approach the same plane, which is equivalent to increasing the adsorption area of the housing, so that the nozzle will not tilt when adsorbing the housing, but can stably adsorb the optoelectronic packaging structure and properly place it on the circuit board, so that the conductive frames of the optoelectronic packaging structure uniformly contact the solder paste on the circuit board, thereby improving the manufacturing yield. In addition, the included angle between the extensions of the two upper surfaces is greater than 0 degree, forming a draft angle, which helps the housing to demold during the injection molding process.

[0026] In addition, the optoelectronic packaging structure may further include a plurality of support bodies arranged in the accommodation groove. These support bodies support the first wall and the second wall of the housing, increasing the structural strength of the housing when receiving a component force in a direction perpendicular to the extension direction of the support bodies, so that the conductive frames passing through the housing will not deviate from the preset position due to the reaction force of bending, thereby maintaining good flatness, which helps to improve the yield of wire bonding.

[0027] To make the above features and advantages of the present utility model more obvious and understandable, specific embodiments are hereinafter given and described in detail in conjunction with the accompanying drawings as follows. Description of the Drawings

[0028] Figure 1A is a schematic diagram of an optoelectronic packaging structure according to an embodiment of the present utility model;

[0029] Figure 1B is Figure 1A a schematic diagram of the optoelectronic packaging structure before packaging;

[0030] Figure 2 is Figure 1A a schematic diagram of the optoelectronic packaging structure when adsorbed by a suction nozzle;

[0031] Figure 3 is Figure 1A a top view of the optoelectronic packaging structure;

[0032] Figure 4 is Figure 2 a partial side view of the optoelectronic packaging structure when adsorbed by a suction nozzle;

[0033] Figure 5 is Figure 1B a front view of the optoelectronic packaging structure;

[0034] Figure 6A is Figure 1B a schematic diagram of a conductive frame and a light-emitting chip;

[0035] Figure 6B is Figure 6A a top view of the conductive frame and the light-emitting chip;

[0036] Figure 7 is Figure 1A a cross-sectional view of the optoelectronic packaging structure along the Z1-Z1 section line;

[0037] Figure 8 is Figure 1B a schematic diagram of the optoelectronic packaging structure from another perspective;

[0038] Figure 9 is a schematic diagram of an optoelectronic packaging structure according to another embodiment of the present utility model;

[0039] Figure 10 is Figure 9 a partial cross-sectional view of the optoelectronic packaging structure along the Z2-Z2 section line.

[0040] Explanation of reference numerals

[0041] 10, 10a: Optoelectronic packaging structure;

[0042] 20: Suction nozzle;

[0043] 100: Housing;

[0044] 110: Main body part;

[0045] 112: First side edge

[0046] 114: Second side edge

[0047] 120: Protrusion

[0048] 122: First protruding sub - part

[0049] 122a: First upper surface

[0050] 124: Second protruding sub - part

[0051] 124a: Second upper surface

[0052] 126: Annular step

[0053] 132: First wall

[0054] 134: Second wall

[0055] 134a: Positioning groove

[0056] 136: Third wall

[0057] 138: Fourth wall

[0058] 140: Light - emitting chip

[0059] 142: Bonding wire

[0060] 150: Encapsulation body

[0061] 160: Support body

[0062] 170: Conductive frame

[0063] 172: First conductive frame

[0064] 174: Second conductive frame

[0065] 176: Functional section

[0066] 178: Bending section

[0067] 180: Protection part

[0068] 190: Adhesive layer

[0069] AX: Central axis

[0070] A: Receiving groove

[0071] C: Depression

[0072] CN: Connection end

[0073] D1: Length direction

[0074] D2: Depth direction;

[0075] E1: First hypotenuse;

[0076] E2: Second hypotenuse;

[0077] E3: Shared long side;

[0078] E4: First short side;

[0079] E5: Second short side;

[0080] F: Filling area;

[0081] FX: Fixed end;

[0082] FX1: Flat area;

[0083] FX2: Fixed convex part;

[0084] H1, H2: Height;

[0085] L: Length;

[0086] LP: Lower half;

[0087] ML: Maximum length;

[0088] O: Opening;

[0089] OS: Outer surface;

[0090] P1: First conductive frame group;

[0091] P2: Second conductive frame group;

[0092] P3: Third conductive frame group;

[0093] S1, S2, S3, S4: Distance;

[0094] UP: Upper half;

[0095] W1, W2: Width;

[0096] Z1-Z1, Z2-Z2: Section line;

[0097] θ: Included angle. Detailed implementation manners

[0098] Figure 1A is a schematic diagram of an optoelectronic packaging structure according to an embodiment of the present utility model. Figure 1B is Figure 1A a schematic diagram of the optoelectronic packaging structure before packaging. It should be noted that Figure 1B is Figure 1A the state where the encapsulation body in Figure 1AWith Figure 1B , the optoelectronic packaging structure 10 of this embodiment is, for example, a packaging structure of a surface-mounted device (SMD) light-emitting diode, which is suitable for being disposed on a circuit board to convert electrical energy into light energy and achieve the effect of side emission.

[0099] The optoelectronic packaging structure 10 includes a housing 100, a plurality of light-emitting chips 140 (labeled in Figure 1B ) and a packaging body 150. As Figure 1B shown, the housing 100 has a receiving groove A and includes a main body portion 110 and a protruding portion 120. The protruding portion 120 protrudes from the main body portion 110. The receiving groove A is, for example, in a capsule shape and is disposed in the main body portion 110, but the shape of the receiving groove A is not limited thereto.

[0100] These light-emitting chips 140 are disposed in the receiving groove A and are, for example, three light-emitting diode chips that respectively emit red, green, and blue light. The optoelectronic packaging structure 10 can achieve the effect of individual independent emission or simultaneous emission to generate a color mixing effect by means of the three light-emitting chips 140. In addition, the packaging body 150 (labeled in Figure 1A ) has light transmissivity and can be filled in the receiving groove A to further protect the light-emitting chips 140.

[0101] Figure 2 is Figure 1A a schematic diagram when the optoelectronic packaging structure is adsorbed by a nozzle. Please refer to Figure 2 , the optoelectronic packaging structure 10 of this embodiment can be accurately disposed on the circuit board through the pick-and-place nozzle 20 for subsequent soldering operations.

[0102] Specifically, the protruding portion 120 of the optoelectronic packaging structure 10 provides an area for the nozzle 20 to adsorb. When the nozzle 20 adsorbs on the protruding portion 120, the optoelectronic packaging structure 10 can be lifted and positioned at an appropriate position on the circuit board. The protruding portion 120 of the optoelectronic packaging structure 10 of this embodiment has a special design, which can enable the nozzle 20 to stably adsorb on the housing 100, thereby improving the manufacturing yield. Further explanations for this design will be provided later.

[0103] Figure 3 is Figure 1A a top view of the optoelectronic packaging structure. Please refer to Figure 3 , in this embodiment, the protruding portion 120 of the housing 100 includes a connected first protruding sub-portion 122 and a second protruding sub-portion 124. The first protruding sub-portion 122 and the second protruding sub-portion 124 are, for example, two trapezoids respectively. The total area of the first protruding sub-portion 122 and the second protruding sub-portion 124 is greater than the opening area of the nozzle 20 (labeled in Figure 2 ).

[0104] The first protruding sub - part 122 has opposite shared long side E3 and first short side E4, as well as opposite two first inclined sides E1, while the second protruding sub - part 124 has opposite shared long side E3 and second short side E5 and opposite two second inclined sides E2. The main body part 110 has opposite first side 112 and second side 114. The first short side E4 of the first protruding sub - part 122 is flush with the first side 112, and the second short side E5 of the second protruding sub - part 124 is flush with the second side 114. The first protruding sub - part 122 and the second protruding sub - part 124 are connected to each other through the shared long side E3.

[0105] The distance S1 between the two first inclined sides E1 of the first protruding sub - part 122 tapers from the second protruding sub - part 124 towards the first side 112, and the distance S2 between the two second inclined sides E2 of the second protruding sub - part 124 tapers from the first protruding sub - part 122 towards the second side 114.

[0106] On the other hand, the maximum length ML (which is the length of the shared long side E3) of the protruding part 120 in the length direction D1 of the receiving groove A ( Figure 1B ) and the ratio of the length L of the first side 112 is 0.6 to 1. In addition, in the depth direction D2 of the receiving groove A, the ratio of the width W1 of the first protruding sub - part 122 to the width W2 of the second protruding sub - part 124 is 1 to 1.5 to 2.0.

[0107] Figure 4 is Figure 2 A partial side view when the optoelectronic packaging structure is adsorbed by the suction nozzle. In the prior art, the surface - mounted light - emitting diode is limited by the thin - type size, and the area of its housing available for the suction nozzle to adsorb is very small. Therefore, when a relatively large - sized suction nozzle adsorbs the housing, the suction nozzle is prone to tilt relative to the housing, resulting in poor placement yield.

[0108] Please refer to Figure 4 , the protruding part 120 of this embodiment is composed of the first protruding sub - part 122 and the second protruding sub - part 124. The included angle θ between the extension of the first upper surface 122a of the first protruding sub - part 122 and the second upper surface 124a of the second protruding sub - part 124 is less than 1 degree and greater than 0 degree.

[0109] That is to say, the first upper surface 122a and the second upper surface 124a are close to the same plane, which is equivalent to increasing the effective adsorption area, so that the suction nozzle 20 does not tilt when adsorbing the protruding part 120. Thus, the suction nozzle 20 can smoothly pick up the optoelectronic packaging structure 10 and properly place it on the circuit board. In this way, the conductive frame 170 of the optoelectronic packaging structure 10 uniformly contacts the solder paste on the circuit board, thereby improving the placement yield.

[0110] In addition, in this embodiment, the material of the housing 100 is plastic, for example, manufactured by injection molding, and the protruding portion 120 and the main body portion 110 are integrally formed. The angle θ between the extension of the first upper surface 122a of the first protruding sub-portion 122 and the second upper surface 124a of the second protruding sub-portion 124 is not 0 degree, so a draft angle is formed, which helps the formed housing 100 to be smoothly removed from the mold and improves the quality of injection molding.

[0111] The following will describe the more detailed structure of the optoelectronic packaging structure 10. Figure 5 is Figure 1B the front view of the optoelectronic packaging structure. Figure 6A is Figure 1B the schematic diagram of the conductive frame and the light-emitting chip. Figure 6B is Figure 6A the top view of the conductive frame and the light-emitting chip. To clearly show the internal structure of the optoelectronic packaging structure, Figure 5 the encapsulation body in Figure 5 is hidden. In addition,

[0112] Please refer to Figures 5 to 6B , the housing 100 of this embodiment further includes opposite first wall 132 and second wall 134 and opposite third wall 136 and fourth wall 138. The receiving groove A is located between the first wall 132 and the second wall 134, and the third wall 136 and the fourth wall 138 are respectively located on both sides of the receiving groove A along the length direction D1 of the receiving groove A. That is to say, the first wall 132, the second wall 134, the third wall 136 and the fourth wall 138 surround to form the receiving groove A.

[0113] The optoelectronic packaging structure 10 further includes a plurality of conductive frames 170. The material of the conductive frame 170 is metal, arranged along the length direction D1 of the receiving groove A, and penetrates through the second wall 134 and is electrically connected to the light-emitting chip 140. When the optoelectronic packaging structure 10 is placed on the circuit board, the conductive frame 170 contacts the solder paste on the circuit board, and the light-emitting chip 140 can be electrically connected to the circuit board via the conductive frame 170.

[0114] The conductive frame 170 of this embodiment is shown as six, but the number of the conductive frames 170 can be determined according to actual design requirements. Each of these conductive frames 170 includes a functional section 176 and a bending section 178. The functional section 176 is located in the receiving groove A and is adapted to set the bonding wire 142 and / or carry the light-emitting chip 140. The bending section 178 is bent to connect the functional section 176 and penetrates through the second wall 134 and is exposed outside the housing 100.

[0115] As Figure 6AAs shown, these conductive frames 170 include a plurality of first conductive frames 172 (shown as three) and a plurality of second conductive frames 174 (shown as three). The light-emitting chip 140 is disposed on the functional section 176 of the first conductive frame 172. The area of the functional section 176 of the first conductive frame 172 is larger than the area of the functional section 176 of the second conductive frame 174. Therefore, there is sufficient space on the functional section 176 of the first conductive frame 172 to dispose the light-emitting chip 140 and the wire bonding 142 simultaneously.

[0116] In this way, the first conductive frame 172 and the corresponding second conductive frame 174 can be electrically connected to the light-emitting chip 140 through the wire bonding 142 respectively, so that the light-emitting chip 140 is electrically connected to the circuit board through the first conductive frame 172 and the second conductive frame 174.

[0117] In this embodiment, the first conductive frame 172 and the corresponding second conductive frame 174 can form a conductive frame group. The conductive frames 170 can be divided into, for example, a first conductive frame group P1, a second conductive frame group P2, and a third conductive frame group P3. The first conductive frame 172 and the second conductive frame 174 of the first conductive frame group P1 and the first conductive frame 172 and the second conductive frame 174 of the third conductive frame group P3 are in a mirror-image arrangement relationship.

[0118] The second conductive frame group P2 is located between the first conductive frame group P1 and the second conductive frame group P2. The arrangement of the first conductive frame 172 and the second conductive frame 174 of the second conductive frame group P2 can be the same as the arrangement of the first conductive frame 172 and the second conductive frame 174 of the first conductive frame group P1 or the third conductive frame group P3. By the cooperation of the conductive frame groups P1, P2, P3 and the light-emitting chip 140, the optoelectronic packaging structure 10 ( Figure 5 ) can achieve the effect of independent light emission or mixed light emission.

[0119] On the other hand, the functional section 176 of the conductive frame 170 includes opposite connection ends CN and fixed ends FX. The functional section 176 is connected to the bent section 178 through the connection end CN. The connection end CN has depressions C on both sides in the length direction D1 of the receiving groove A ( Figure 5 ). The depression C of the connection end CN is embedded in the second wall 134 ( Figure 5 ), which not only makes the combination between the conductive frame 170 and the housing 100 closer, but also effectively reduces the bending stress generated by the bending of the conductive frame 170.

[0120] In addition, as Figure 6BAs shown, the fixed end FX includes an adjacent flat area FX1 and at least one fixed protrusion FX2, and the fixed protrusion FX2 protrudes relative to the flat area FX1. In this embodiment, the second conductive frame 174 includes one fixed protrusion FX2. The first conductive frame 172 includes two fixed protrusions FX2, and the two fixed protrusions FX2 are respectively located on both sides of the fixed end FX in the length direction D1, and the flat area FX1 is located between the two fixed protrusions FX2.

[0121] When the conductive frame 170 is assembled to the housing 100, the flat area FX1 and the fixed protrusion FX2 of the fixed end FX are embedded in the first wall 132( Figure 5 ), which can further strengthen the bonding between the conductive frame 170 and the housing 100, so as to keep the functional section 176 flat and prevent warping and displacement due to the bending of the conductive frame 170, thus improving the yield of wire bonding.

[0122] Figure 7 is Figure 1A a cross-sectional view of the optoelectronic packaging structure along the Z1-Z1 section line. Please refer to Figure 5 and Figure 7 , the optoelectronic packaging structure 10 of this embodiment further includes a plurality of support bodies 160. The support bodies 160 are arranged in the accommodation groove A and connect the first wall 132 and the second wall 134 to increase the structural strength of the housing 100. These support bodies 160 are parallel to each other and arranged along the length direction D1 of the accommodation groove A, and are integrally formed with the housing 100. The support bodies 160 in this embodiment are shown as seven, but the number of support bodies 160 is not limited thereto.

[0123] As Figure 7 shown, the support body 160 is, for example, a dome-shaped column, but the shape of the support body 160 can also be arched, stepped or other protruding shapes. Since the support body 160 protrudes from the housing 100, it can enhance the bonding strength between the encapsulant 150 filled in the accommodation groove A and the housing 100, reduce the risk of peeling of the encapsulant 150, and thus enhance the reliability of the product.

[0124] In addition, two of the support bodies 160 are respectively connected to the third wall 136 and the fourth wall 138, and the remaining support bodies 160 are arranged alternately with the functional section 176 of the conductive frame 170 along the length direction D1 of the accommodation groove A. In other words, the remaining support bodies 160 are located between the functional section 176 of the first conductive frame 172 and the functional section 176 of the second conductive frame 174, or between the two functional sections 176 of the two first conductive frames 172.

[0125] Meanwhile, the support body 160 abuts against the functional segments 176 of the respective conductive frames 170 in the depth direction D2 of the accommodation groove A, restricting the displacement of the conductive frames 170 in the depth direction D2, preventing the conductive frames 170 from warping and shifting due to bending, thereby keeping the functional segments 176 flat, which is beneficial to improving the yield of wire bonding.

[0126] Figure 8 is Figure 1B a schematic diagram of the optoelectronic packaging structure from another perspective. Please refer to Figure 8 , in this embodiment, the accommodation groove A is symmetric about the central axis AX, and the central axis AX is parallel to the length direction D1 of the accommodation groove A. The distance S3 between the outer surface of the first wall 132 (for example, the first upper surface 122a of the first protruding portion 122) and the central axis AX is less than the distance S4 between the outer surface OS of the second wall 134 and the central axis AX.

[0127] In other words, if the housing 100 is divided by the central axis AX, it can be divided into a thinner upper half UP (including the protruding portion 120) and a thicker lower half LP. When the conductive frame 170 passes through the lower half LP of the housing 100 via the positioning groove 134a of the second wall 134, the thicker lower half LP helps to counteract the bending stress of the conductive frame 170, ensuring the stable positioning of the conductive frame 170. At the same time, since the lower half LP has a longer size, it can effectively prevent moisture from entering the housing 100 through the positioning groove 134a.

[0128] In addition, the housing 100 of this embodiment further includes an annular step portion 126. The annular step portion 126 surrounds the opening O of the accommodation groove A, which helps to enhance the bonding strength between the package 150 ( Figure 7 ) and the housing 100, reducing the possibility of the package 150 peeling off. At the same time, during the operation of injecting the encapsulation glue into the accommodation groove A, the annular step portion 126 can make the encapsulation glue easily detectable when approaching the opening O, reducing the possibility of the encapsulation glue overflowing from the accommodation groove A.

[0129] In addition, the housing 100 of this embodiment further includes two protection portions 180. The two protection portions 180 are disposed on both sides of the outer surface OS of the second wall 134, and the conductive frame 170 is located between the two protection portions 180. The protection portions 180 have the effect of adjusting the center of gravity of the optoelectronic packaging structure 10 and can protect the conductive frame 170 from being deformed under external collision, especially protecting the bending portion 178 from being deformed under external collision.

[0130] Figure 9 is a schematic diagram of the optoelectronic packaging structure according to another embodiment of the present invention. Figure 10 is Figure 9 a partial cross-sectional view of the optoelectronic packaging structure along the Z2-Z2 section line. To clearly show the glue layer, Figure 9 the package inFigure 9 The main difference between the illustrated embodiment and Figure 1A the illustrated embodiment is that Figure 9 the optoelectronic packaging structure 10a of

[0131] Specifically, as Figure 10 shown, a filling area F for accommodating the glue layer 190 can be formed between two adjacent support bodies 160. The light-emitting chip 140 can be disposed in the filling area F, for example, on the functional section 176 of the first conductive frame 172 within the filling area F. The glue layer 190 is, for example, white glue, disposed in the filling area F, which can increase the brightness of the light emitted by the light-emitting chip 140 by, for example, 10%, achieving a good light-emitting effect. In addition, the height H1 of the glue layer 190 is less than the height H2 of the light-emitting chip 140 disposed thereon, so the glue layer 190 does not obstruct the light emission of the light-emitting chip 140.

[0132] In this embodiment, the glue layer 190 is filled to the height H1, and the encapsulation body 150 is filled from the top of the glue layer 190 to the top of the annular step portion 126 or flush with the plane of the opening O. The part of the light-emitting chip 140 and the wire bonding 142 are both covered by the encapsulation body 150, which can effectively prevent moisture from contacting the light-emitting chip 140 or the wire bonding 142.

[0133] In other embodiments, the glue layer 190 can be a colloid with an appearance such as transparent, translucent, black, gray, etc.

[0134] In summary, in the optoelectronic packaging structure of the present utility model, the housing includes a protruding portion protruding from the main body portion for the suction nozzle of the pick-and-place operation to adsorb. The protruding portion includes a first protruding sub-portion and a second protruding sub-portion connected to each other. By virtue of the design that the protruding portion has two protruding sub-portions, and the included angle between the upper surface of the first protruding sub-portion and the upper surface of the second protruding sub-portion is less than 1 degree, the two upper surfaces approach the same plane, which is equivalent to increasing the adsorption area of the housing, so that the suction nozzle will not tilt when adsorbing the housing, and can stably adsorb the optoelectronic packaging structure and properly place it on the circuit board, enabling the conductive frame of the optoelectronic packaging structure to uniformly contact the solder paste on the circuit board, thereby improving the manufacturing yield. In addition, the included angle between the two upper surfaces is greater than 0 degree, forming a draft angle, which helps the housing to be demolded during the injection molding process.

[0135] In addition, the optoelectronic packaging structure further includes a plurality of support bodies disposed in the accommodation groove. These support bodies connect the first wall and the second wall of the housing, increasing the structural strength of the housing, so that the conductive frame passing through the housing will not deviate from the preset position due to the reaction force of bending, thereby maintaining good flatness and helping to improve the yield of wire bonding. At the same time, since the support bodies protrude from the housing, the bonding strength between the package and the housing can be increased, and the possibility of the package accidentally detaching from the housing can be reduced, thereby enhancing the product reliability. Further, a filling area for accommodating the glue layer can be formed between two adjacent support bodies, so that the light emitted by the light-emitting chip can increase the brightness through the glue layer.

[0136] In addition, the conductive frame of the optoelectronic packaging structure further includes a fixed convex portion and a recessed structure, which can further enhance the bonding between the conductive frame and the housing and effectively reduce the bending stress generated by the bending of the conductive frame. Therefore, the functional section remains flat, which is beneficial to improving the yield of wire bonding.

[0137] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An optoelectronic packaging structure, characterized in that: include: A housing having a receiving groove and including a main body and a protruding portion, wherein the protruding portion is convexly disposed on the main body and includes a first protruding sub-portion and a second protruding sub-portion connected to each other, and an angle between an extension of an upper surface of the first protruding sub-portion and an upper surface of the second protruding sub-portion is less than 1 degree and greater than 0 degree; A plurality of light-emitting chips are disposed in the receiving groove; as well as The packaging body is filled in the containing groove.

2. The optoelectronic packaging structure according to claim 1, characterized in that: The main body has a first side and a second side opposite to each other. The first protruding sub-portion is flush with the first side, and the second protruding sub-portion is flush with the second side.

3. The optoelectronic packaging structure according to claim 2, characterized in that: The first protrusion has two opposite first oblique sides, and the distance between the two first oblique sides gradually decreases from the second protrusion toward the first side. The second protrusion has two opposite second oblique sides, and the distance between the two second oblique sides gradually decreases from the first protrusion toward the second side.

4. The optoelectronic packaging structure according to claim 3, characterized in that: The ratio of the maximum length of the protrusion in the length direction of the accommodating groove to the length of the first side is 0.6 to 1.

5. The optoelectronic packaging structure according to claim 1, characterized in that: In the depth direction of the receiving groove, the ratio of the width of the first protruding sub-portion to the width of the second protruding sub-portion is 1 to 1.5 to 2.

0.

6. The optoelectronic packaging structure according to claim 1, characterized in that: The protrusion and the main body are integrally formed.

7. An optoelectronic packaging structure, characterized in that: include: The housing has a receiving groove and includes a first wall and a second wall opposite to each other, wherein the receiving groove is located between the first wall and the second wall; A plurality of light-emitting chips are disposed in the receiving groove; A plurality of supporting bodies are disposed in the receiving groove and connect the first wall and the second wall; as well as The packaging body is filled in the containing groove.

8. The optoelectronic packaging structure according to claim 7, characterized in that: The plurality of support bodies are parallel to each other and arranged along the length direction of the receiving groove.

9. The optoelectronic packaging structure according to claim 7, characterized in that: The plurality of support bodies are dome-shaped, arch-shaped or stepped-shaped.

10. The optoelectronic packaging structure according to claim 7, characterized in that: It also includes an adhesive layer, wherein a filling area is formed between two adjacent ones of the plurality of support bodies, one of the plurality of light-emitting chips is suitable for being configured in the filling area, and the adhesive layer is disposed in the filling area.

11. The optoelectronic packaging structure according to claim 10, characterized in that: The height of the glue layer is smaller than the height of the light-emitting chip disposed in the filling area.

12. The optoelectronic packaging structure according to claim 7, characterized in that: The shell further includes an annular step portion, and the annular step portion surrounds the opening of the accommodating groove.

13. An optoelectronic packaging structure, characterized in that: include: The housing has a receiving groove and includes a first wall and a second wall opposite to each other, wherein the receiving groove is located between the first wall and the second wall; A plurality of light-emitting chips are disposed in the receiving groove; A plurality of conductive frames are arranged along the length direction of the accommodating groove and penetrate the second wall, and are electrically connected to the plurality of light-emitting chips; as well as The packaging body is filled in the containing groove.

14. The optoelectronic packaging structure according to claim 13, characterized in that: The containing groove is symmetrical to the central axis, the central axis is parallel to the length direction of the containing groove, and the distance between the outer surface of the first wall and the central axis is smaller than the distance between the outer surface of the second wall and the central axis.

15. The optoelectronic packaging structure according to claim 13, characterized in that: Each of the plurality of conductive frames includes a functional segment and a bending segment. The functional segment is located in the accommodating groove and is suitable for carrying one of the plurality of light-emitting chips and / or for setting a bonding wire. The bending segment is connected to the functional segment and passes through the second wall to be exposed outside the shell.

16. The optoelectronic packaging structure according to claim 15, characterized in that: The functional section includes an opposite connecting end and a fixing end. The functional section is connected to the bending section via the connecting end. The connecting end has recesses on both sides of the length direction of the accommodating groove.

17. The optoelectronic packaging structure according to claim 16, characterized in that: The fixing end includes adjacent flat areas and at least one fixing protrusion, and the flat area and the at least one fixing protrusion are embedded in the first wall.

18. The optoelectronic packaging structure according to claim 17, characterized in that: The at least one fixing protrusion includes two fixing protrusions, the two fixing protrusions are respectively located on both sides of the fixing end, and the flat area is located between the two fixing protrusions.

19. The optoelectronic packaging structure according to claim 16, characterized in that: The multiple conductive frames include multiple first conductive frames and multiple second conductive frames, the area of ​​the functional segment of each first conductive frame is larger than the area of ​​the functional segment of each second conductive frame, the multiple light-emitting chips are respectively arranged on the multiple first conductive frames, and each first conductive frame is electrically connected to the corresponding light-emitting chip with the corresponding second conductive frame.

20. The optoelectronic packaging structure according to claim 13, characterized in that: The shell further includes two protection parts, which are arranged on both sides of the outer surface of the second wall, and the plurality of conductive frames are located between the two protection parts.

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