Display device

Abstract

A display device is provided. The display device includes a substrate, a circuit layer, an element layer, and a sealing layer. The substrate includes a main region and a sub-region. The main area includes a display area and a non-display area. The non-display area includes a dam area in which one or more dam portions surrounding the display area are arranged, and a bonding area surrounding the dam area. The sub-region includes a bending region, a first sub-region, and a second sub-region. The circuit layer comprises a power line. The power line includes a main supply portion disposed in the non-display area, a sub-connection portion extending from the main supply portion to the sub-area, and a branch portion disposed in the bonding area and protruding from one side of the sub-connection portion. The branch portion is spaced apart from a bank covering a bending hole of the bending area. Quality and lifetime of the display device may be improved by reducing a tilt defect or a corrosion defect of a line disposed in the bonding region.

Description

[0001] This application claims the priority of, and all benefits derived from, Korean Patent Application No. 10-2023-0101990, filed with the Korean Intellectual Property Office on August 4, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0002] One or more embodiments described herein relate to a display device. Background Art

[0003] The demand for display devices continues to increase. For example, display devices are used in smartphones, digital cameras, laptop computers, navigation devices, smart TVs, and other types of electronic devices.

[0004] Flat panel display devices include liquid crystal display devices, field emission display devices, and light-emitting display devices. Examples of light-emitting display devices include organic light-emitting display devices (which include organic light-emitting elements), inorganic light-emitting display devices (which include inorganic light-emitting elements using inorganic semiconductors), and micro or nano light-emitting display devices including micro or nano light-emitting elements.

[0005] An organic light-emitting display device uses light-emitting elements to generate an image, and each of the light-emitting elements includes a light-emitting layer made of an organic light-emitting material. Since the organic light-emitting display device uses self-luminous elements to display an image, the organic light-emitting display device can exhibit relatively excellent performance in terms of power consumption, response speed, emission efficiency, brightness, and wide viewing angle compared to other display devices.

[0006] A display device as described above may include a display area for displaying an image and a non-display area surrounding the display area. A light-emitting area that emits light having a corresponding brightness and color may be disposed in the display area.

[0007] Structurally, a display device may include a substrate including a display area and a non-display area, a circuit layer disposed on the substrate and including pixel drivers corresponding to respective light-emitting areas, a light-emitting element layer disposed on the circuit layer and including light-emitting elements corresponding to respective light-emitting areas, and a sealing layer disposed on the light-emitting element layer. The sealing layer may be bonded to an inorganic insulating material of the circuit layer in the non-display area to seal the light-emitting element layer. Such a sealing layer may block the penetration of oxygen or moisture, thereby preventing the rapid deterioration of the organic light-emitting material of the light-emitting element layer.

[0008] The circuit layer may include an insulating layer disposed between conductive layers. The conductive layers are electrically connected to the pixel driver. Since the conductive layers of the circuit layer are made of a metal material, some of the insulating layers in the circuit layer adjacent to the substrate may include an inorganic insulating material. Additionally, considering the uniformity of the direction in which the light-emitting elements of the light-emitting element layer emit light, some of the insulating layers in the circuit layer adjacent to the light-emitting element layer may include an organic insulating material having a relatively thick thickness. SUMMARY OF THE UTILITY MODEL

[0009] An object of the present utility model is to provide a display device that can improve quality and lifespan by reducing the warping defects or corrosion defects of the lines disposed in the bonding region.

[0010] According to an aspect of the present disclosure, there is provided a display device including: a substrate; a circuit layer disposed on the substrate; an element layer disposed on the circuit layer; and a sealing layer disposed on the element layer. The substrate includes a main region and a sub-region protruding from one side of the main region. The main region includes a display region in which a light-emitting region is arranged and a non-display region disposed around the display region. The non-display region includes a dam region and a bonding region. In the dam region, one or more dam portions surrounding the display region are arranged, and the bonding region surrounds the dam region. The sub-region includes a bending region that can be bent into a bent shape, a first sub-region disposed between one side of the bending region and the main region, and a second sub-region connected to the other side of the bending region. The circuit layer includes a power supply line configured to transmit power. The power supply line includes a main supply portion disposed in the non-display region, a sub-connection portion extending from the main supply portion to the sub-region, and a branch portion disposed in the bonding region and protruding from one side of the sub-connection portion. The branch portion is spaced apart from a levee covering a bending hole of the bending region.

[0011] The branch portion is spaced apart from at least one dam portion.

[0012] The levee includes: a first extension portion extending to a portion of the bonding region adjacent to the sub-region; and a first groove portion facing the branch portion, spaced apart from the branch portion, and recessed in a direction spaced apart from the branch portion as compared with the first extension portion. One of the one or more dam portions adjacent to the bonding region includes: a second extension portion extending to another portion of the bonding region adjacent to the dam region; and a second groove portion facing the branch portion, spaced apart from the branch portion, and recessed in a direction spaced apart from the branch portion as compared with the second extension portion.

[0013] The display device further includes: a pressing layer disposed on the branch portion and covering the branch portion, edges of the first groove portion, and edges of the second groove portion.

[0014] The display device further includes a touch sensor layer disposed on the sealing layer. The touch sensor layer includes: a first touch conductive layer disposed on the sealing layer; a touch interlayer insulating layer covering the first touch conductive layer; a second touch conductive layer disposed on the touch interlayer insulating layer; and a touch planarization layer covering the second touch conductive layer. The pressing layer and the first touch conductive layer are disposed on the same layer.

[0015] The branch portion includes one or more branch main portions and branch sub-portions. The branch main portions extend in parallel with the sub-connection portion, and the branch sub-portions connect the sub-connection portion to the one or more branch main portions. The branch sub-portions are arranged adjacent to the sub-region.

[0016] One edge of the portion of the sub-connection portion that overlaps with the bonding region includes an uneven portion arranged along the extending direction of the sub-connection portion. The edge of the branch portion includes an uneven portion arranged along the extending direction of the branch portion. The uneven portion is spaced apart from the embankment and at least one dam portion.

[0017] The power supply line further includes protrusions arranged along the edges of the portion of the sub-connection portion that overlaps with the bonding region and the edge of the branch portion. Each of the edges of the protrusions has an uneven shape. The protrusions are spaced apart from the embankment and at least one dam portion.

[0018] The power supply line includes a first power supply line and a second power supply line, which are configured to transmit first power and second power having different voltage levels, respectively.

[0019] According to an aspect of the present disclosure, a display device is provided. The display device includes: a substrate; a circuit layer disposed on the substrate; an element layer disposed on the circuit layer; and a sealing layer disposed on the element layer. The substrate includes a main region and a sub-region protruding from one side of the main region. The main region includes a display region where a light-emitting region is disposed and a non-display region disposed around the display region. The non-display region includes a dam region and a bonding region. One or more dam portions surrounding the display region are disposed in the dam region, and the bonding region surrounds the dam region. The sub-region includes a curved region that can be bent into a curved shape, a first sub-region disposed between one side of the curved region and the main region, and a second sub-region connected to the other side of the curved region. The element layer includes a light-emitting element disposed in the light-emitting region. The circuit layer includes a light-emitting pixel driver and a power supply line. The light-emitting pixel driver is electrically connected to the light-emitting element, and the power supply line is configured to transmit power for driving the light-emitting element to the light-emitting pixel driver or the light-emitting element. The power supply line includes a main supply portion, a sub-connection portion, and a branch portion. The main supply portion is disposed in the non-display region, the sub-connection portion extends from the main supply portion to the sub-region, and the branch portion is disposed in the bonding region and protrudes from one side of the sub-connection portion. One edge of the portion of the sub-connection portion that overlaps with the bonding region includes an uneven portion disposed along the extending direction of the sub-connection portion. The edge of the branch portion includes an uneven portion disposed along the extending direction of the branch portion. The uneven portion is spaced apart from a bank surrounding a curved hole covering the curved region.

[0020] The uneven portion is spaced apart from at least one dam portion.

[0021] The branch portion includes one or more branch main portions and a branch sub-portion. The one or more branch main portions extend in parallel with the sub-connection portion, and the branch sub-portion connects the sub-connection portion and the one or more branch main portions. The branch sub-portion is disposed adjacent to the sub-region.

[0022] The bank includes: a first extension portion extending to a portion of the bonding region adjacent to the sub-region; and a first groove portion facing the branch portion, spaced apart from the branch portion, and recessed in a direction spaced apart from the branch portion compared to the first extension portion. One of the one or more dam portions adjacent to the bonding region includes: a second extension portion extending to another portion of the bonding region adjacent to the dam region; and a second groove portion facing the branch portion, spaced apart from the branch portion, and recessed in a direction spaced apart from the branch portion compared to the second extension portion.

[0023] The display device further includes: a pressing layer disposed on the branch portion and covering the branch portion, an edge of the first groove portion, and an edge of the second groove portion.

[0024] The display device further includes a touch sensor layer disposed on the sealing layer. The touch sensor layer includes: a first touch conductive layer disposed on the sealing layer; a touch interlayer insulating layer covering the first touch conductive layer; a second touch conductive layer disposed on the touch interlayer insulating layer; and a touch planarization layer covering the second touch conductive layer. The pressing layer and the first touch conductive layer are disposed on the same layer.

[0025] According to an aspect of the present disclosure, there is provided a display device including: a substrate; a circuit layer disposed on the substrate; an element layer disposed on the circuit layer; and a sealing layer disposed on the element layer. The substrate includes a main region and a sub-region protruding from one side of the main region. The main region includes a display region where a light-emitting region is disposed and a non-display region disposed around the display region. The non-display region includes a dam region and a bonding region. In the dam region, one or more dam portions surrounding the display region are arranged, and the bonding region surrounds the dam region. The sub-region includes a curved region that can be bent into a curved shape, a first sub-region disposed between one side of the curved region and the main region, and a second sub-region connected to the other side of the curved region. The element layer includes a light-emitting element disposed in the light-emitting region. The circuit layer includes a light-emitting pixel driver and a power supply line. The light-emitting pixel driver is electrically connected to the light-emitting element, and the power supply line is configured to transmit power for driving the light-emitting element to the light-emitting pixel driver or the light-emitting element. The power supply line includes a main supply portion, a sub-connection portion, a branch portion, and a protrusion. The main supply portion is disposed in the non-display region, the sub-connection portion extends from the main supply portion to the sub-region, the branch portion is disposed in the bonding region and protrudes from one side of the sub-connection portion, and the protrusion is arranged along the edges of the portion of the sub-connection portion that overlaps with the bonding region and the edge of the branch portion. Each edge of the protrusion has an uneven shape. The protrusion is spaced apart from the dike and at least one dam portion.

[0026] The uneven portion is spaced apart from at least one dam portion.

[0027] The branch portion includes one or more branch main portions and a branch sub-portion. The branch main portions extend in parallel with the sub-connection portion, and the branch sub-portion connects the sub-connection portion and the one or more branch main portions. The branch sub-portion is arranged adjacent to the sub-region.

[0028] The dike includes: a first extension portion extending to a portion of the bonding region adjacent to the sub-region; and a first groove portion facing the branch portion, spaced apart from the branch portion, and recessed in a direction spaced apart from the branch portion compared to the first extension portion. One of the one or more dam portions adjacent to the bonding region includes: a second extension portion extending to another portion of the bonding region adjacent to the dam region; and a second groove portion facing the branch portion, spaced apart from the branch portion, and recessed in a direction spaced apart from the branch portion compared to the second extension portion.

[0029] The display device further includes: a pressing layer disposed on the branch portion and covering the branch portion, the edges of the first groove portion, and the edges of the second groove portion.

[0030] The display device further includes a touch sensor layer disposed on the sealing layer. The touch sensor layer includes: a first touch conductive layer disposed on the sealing layer; a touch interlayer insulating layer covering the first touch conductive layer; a second touch conductive layer disposed on the touch interlayer insulating layer; and a touch planarization layer covering the second touch conductive layer. The pressing layer and the first touch conductive layer are disposed on the same layer.

[0031] The display device according to an embodiment includes a substrate, a circuit layer, an element layer, and a sealing layer. The substrate includes a main region and a sub-region protruding from one side of the main region. The main region includes a display region in which a light-emitting region is disposed and a non-display region disposed around the display region. The non-display region includes a dam region and a bonding region. In the dam region, one or more dam portions surrounding the display region are arranged, and the bonding region surrounds the dam region. The sub-region includes a curved region that can be bent into a curved shape, a first sub-region disposed between one side of the curved region and the main region, and a second sub-region connected to the other side of the curved region.

[0032] The circuit layer includes a power supply line configured to transmit power. That is, the circuit layer includes a light-emitting pixel driver and a power supply line. The light-emitting pixel driver is electrically connected to the light-emitting element of the element layer, and the power supply line is configured to transmit power for driving the light-emitting element to the light-emitting pixel driver or the light-emitting element.

[0033] The power supply line includes a main supply portion, a sub-connection portion, and a branch portion. The main supply portion is disposed in the non-display region, the sub-connection portion extends from the main supply portion to the sub-region, and the branch portion is disposed in the bonding region and protrudes from one side of the sub-connection portion.

[0034] According to an embodiment, the branch portion is spaced apart from the bank covering the bending hole in the curved region.

[0035] According to an embodiment, the branch portion may be spaced apart from one or more dam portions arranged in the dam region.

[0036] The bank includes a structure in which two or more bank layers are stacked. Each of the two or more bank layers includes an organic insulating material, and each of the one or more dam portions includes a structure in which two or more dam layers are stacked. Each of the two or more dam layers includes an organic insulating material.

[0037] According to one or more embodiments, a display device includes a main area and a sub-area protruding from one side of the main area, the main area including a display area and a non-display area arranged around the display area, wherein the display device includes: a power line, which is in the non-display area and includes a sub-connection portion; and at least one dam, which is in a circuit layer and surrounds the display area adjacent to the non-display area, wherein a joining area included in the non-display area is between at least one dam and a bending area included in the sub-area, and wherein at least one dam restricts a sealing layer from entering the joining area, and wherein the power line includes one or more branch portions located in the joining area and protruding from one side of the sub-connection portion, and the one or more branch portions increase the outer circumference of the sub-connection portion of the power line.

[0038] The display device may include a bank covering the bending hole in the bending area, wherein one or more branch portions are spaced apart from the bank. The bank may include an organic insulating material. The one or more branch portions may be spaced apart from the bank by a distance corresponding to an angle at which a side surface of the bank is inclined relative to a layer below.

[0039] The one or more branch portions may be spaced apart from the at least one dam. The one or more branch portions may be spaced apart from the at least one dam by a distance corresponding to an angle at which a side surface of the at least one dam is inclined relative to an underlying layer.

[0040] At least one dam may include an organic insulating material. One or more branch portions may include one or more branch main portions and branch sub-portions, the branch main portions extending in parallel with the sub-connection portion, and the branch sub-portions connecting the one or more branch main portions with the sub-connection portion. The sub-connection portion may include an uneven portion. One or more branch portions may include an uneven portion. The uneven portion may include a concave portion and a convex portion.

[0041] The sub-connecting portion may include at least one uneven portion in the bank region. The one or more branch portions may include a plurality of protrusions. The sub-connecting portion may include a protrusion. The sealing layer may contact the inorganic insulating material of the circuit layer at the bonding region.

[0042] In the display device of the present invention, the quality and life of the display device can be improved by reducing the warping defect or the corrosion defect of the wire disposed in the bonding area.

[0043] The effects of the present disclosure are not limited to the above-mentioned effects, and various other effects are included in the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The above and other aspects and features of the present disclosure will become more apparent by describing in detail embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0045] Figure 1 is a perspective view showing a display device according to an embodiment;

[0046] Figure 2 is a plan view showing a display device according to an embodiment; Figure 1 of;

[0047] Figure 3 is a cross-sectional view taken along line A-A' according to an embodiment; Figure 2 of;

[0048] Figure 4 is a plan view showing a substrate according to an embodiment; Figure 3 of;

[0049] Figure 5 is a layout view showing a part B according to an embodiment; Figure 4 of;

[0050] Figure 6 is an equivalent circuit diagram showing a light-emitting pixel driver according to an embodiment; Figure 5 of;

[0051] Figure 7 is a plan view showing a touch sensor layer according to an embodiment; Figure 3 of;

[0052] Figure 8 is an enlarged view showing a part D according to an embodiment; Figure 7 of;

[0053] Figure 9 is a cross-sectional view taken along line E-E' according to an embodiment; Figure 8 of;

[0054] Figure 10 is a layout view showing a part C according to an embodiment; Figure 4 of;

[0055] Figure 11 is a cross-sectional view taken along line F-F' according to an embodiment; Figure 10 of;

[0056] Figure 12 is a cross-sectional view taken along line G-G' according to an embodiment; Figure 10 of;

[0057] Figure 13 is a cross-sectional view taken along line H-H' according to an embodiment; Figure 10 of;

[0058] Figure 14 is a cross-sectional view taken along line H-H' according to an embodiment; Figure 10 of;

[0059] Figure 15 is a layout diagram showing Part I according to an embodiment; Figure 10 of Part I;

[0060] Figure 16 is a layout diagram showing Part I according to an embodiment; Figure 10 of Part I;

[0061] Figure 17 is a layout diagram showing Part I according to an embodiment; Figure 10 of Part I;

[0062] Figure 18 is a magnified view showing Part J according to an embodiment; Figure 17 of Part J;

[0063] Figure 19 is a layout diagram showing Part I according to an embodiment; Figure 10 of Part I;

[0064] Figure 20 is a magnified view showing Part K according to an embodiment; Figure 19 of Part K;

[0065] Figure 21 is a layout diagram showing Part C according to an embodiment; Figure 4 of Part C;

[0066] Figure 22 is a layout diagram showing Part L according to an embodiment; and Figure 21 of Part L; and

[0067] Figure 23 is a cross-sectional view taken along line M-M' according to an embodiment; Figure 21 of. DETAILED DESCRIPTION

[0068] Embodiments of the present disclosure will now be described more fully hereinafter with reference to the accompanying drawings. However, the embodiments may be provided in different forms and should not be construed as limiting. Throughout the present disclosure, the same reference numerals denote the same components. In the drawings, the thicknesses of layers and regions may be exaggerated for clarity.

[0069] For the description of the embodiments of the present disclosure, some components irrelevant to the description may not be provided in the components.

[0070] It will also be understood that when a layer is referred to as being "on" another layer or substrate, the layer may be directly on the other layer or substrate, or there may also be an intervening layer. In contrast, when an element is referred to as being "directly on" another element, there may be no intervening element.

[0071] Additionally, the phrase "in a plan view" means when viewing the object part from above, and "in a schematic cross-sectional view" means when viewing a schematic cross-section obtained by vertically cutting the object part from the side. The term "superposed" or its variants means that the first object can be above, below, or to one side of the second object, and / or vice versa. Additionally, the term "superposed" can include laminating, stacking, facing or being oriented towards, extending over, covering or partially covering, or any other suitable terms as would be appreciated and understood by one of ordinary skill in the art. The expression "not superposed" can include meanings such as "spaced apart from", "offset from", or "displaced from", and any other suitable equivalents as would be appreciated and understood by one of ordinary skill in the art. The terms "facing" and "being oriented towards" can mean that the first object can be directly or indirectly opposite the second object. In the case where a third object is between the first object and the second object, the first object and the second object can be understood to be indirectly opposite each other although still facing each other.

[0072] For ease of description, the spatial relative terms "below", "beneath", "under", "above", "over", etc. may be used herein to describe the relationship between one element or component and another as shown in the figures. It will be understood that the spatial relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device shown in the figures is flipped, a device located "below" or "beneath" another device can be placed "above" the other device. Thus, the exemplary term "below" can include both lower and upper positions. The device can also be oriented in other directions, and thus the spatial relative terms can be interpreted differently depending on the orientation.

[0073] When an element is referred to as "connected" or "coupled" to another element, the element can be "directly connected" or "directly coupled" to the other element, or "electrically connected" or "electrically coupled" to the other element with one or more intervening elements therebetween. It will also be understood that when the terms "comprising", its variants, "having", its variants, and / or "including", its variants are used, they can specify the presence of the stated features, wholes, steps, operations, elements, and / or components, but do not preclude the presence or addition of other features, wholes, steps, operations, elements, components, and / or any combination thereof.

[0074] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another or for the convenience of their description and explanation. For example, when discussing a "first element" in the specification, it may be referred to as a "second element" or a "third element", and the "second element" and "third element" may be named in a similar manner without departing from the spirit and scope of the present disclosure herein.

[0075] As used herein, the term "about" or "approximately" includes the stated value and means within an acceptable deviation of the particular value as determined by a person of ordinary skill in the art, taking into account the measurements discussed and the errors associated with the measurement of a particular quantity (e.g., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0076] In the specification and claims, for purposes of their meaning and interpretation, the term "and / or" is intended to include any combination of the terms "and" and "or". For example, "A and / or B" may be understood to mean "A, B, or A and B". The terms "and" and "or" may be used in a conjunctive or disjunctive sense and may be understood to be equivalent to "and / or". In the specification and claims, for purposes of their meaning and interpretation, the phrase "at least one of..." is intended to include the meaning of "at least one of the group consisting of...". For example, "at least one of A and B" may be understood to mean "A, B, or A and B".

[0077] Unless otherwise defined or implied, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by a person of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in a common dictionary) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly defined in the specification.

[0078] Hereinafter, embodiments will be described with reference to the accompanying drawings.

[0079] Figure 1 is a perspective view showing a display device 100 according to an embodiment. Figure 2 is showing Figure 1 a plan view of the display device 100. Figure 3 is a cross-sectional view taken along line A-A' of Figure 2 the same.

[0080] Referring to Figure 1 andFigure 2 The display device 100 displays moving images or still images and can be used as a display screen for various products. Examples include televisions, laptop computers, monitors, billboards, and Internet of Things (IoT) devices, as well as portable electronic devices such as mobile phones, smartphones, tablet personal computers (PCs), smartwatches, watch phones, mobile communication terminals, electronic organizers, e-books, portable multimedia players (PMPs), navigation devices, and ultra-mobile PCs (UMPCs).

[0081] The display device 100 can be a light-emitting display device such as an organic light-emitting display device using organic light-emitting diodes, a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including an inorganic semiconductor, or a micro light-emitting display device using micro or nano light-emitting diodes (micro or nano LEDs). Hereinafter, for the purpose of illustration, it is assumed that the display device 100 is an organic light-emitting display device. However, the present disclosure is not limited thereto, and can be applied to display devices including organic insulating materials, organic light-emitting materials, and metal materials.

[0082] The display device 100 can be formed flat, but is not limited thereto. For example, the display device 100 can include curved surface portions formed at its left and right distal ends and having a constant curvature or a variable curvature. Additionally, the display device 100 can be flexibly formed to be curved, bent, folded, or curled.

[0083] As Figure 1 、 Figure 2 and Figure 3 shown in Figure 2 , the display device 100 includes a substrate 110, and the substrate 110 can include a main area MA corresponding to the display surface of the display device 100 and a sub-area SBA protruding from one side of the main area MA. As Figure 2 shown in

[0084] The display area DA can be formed as a rectangular plane having a short side in a first direction DR1 and a long side in a second direction DR2 intersecting the first direction DR1. The corners where the short side in the first direction DR1 and the long side in the second direction DR2 intersect can be rounded to have a predetermined curvature, or can be formed as right angles. The planar shape of the display area DA is not limited to a quadrilateral shape. In some embodiments, the display area DA can be formed to have other polygonal shapes, circular shapes, or elliptical shapes.

[0085] The non-display area NDA can be provided at the edge (or border or periphery) of the main area MA to surround the display area DA.

[0086] The sub-region SBA may be a region that protrudes from the non-display region NDA of the main region MA to one side in the second direction DR2. Since a part of the sub-region SBA can be bent into a curved shape, another part of the sub-region SBA can be disposed on the rear surface of the display device 100. Figure 2 and Figure 3 FIG. shows the display device 100 having a curved portion of the sub-region SBA.

[0087] Referring Figure 3 , the display device 100 according to an embodiment includes a substrate 110, a circuit layer 120 disposed on the substrate 110, and an element layer 130 disposed on the circuit layer 120. The display device 100 according to an embodiment may further include a sealing layer 140 disposed on the element layer 130 and a touch sensor layer 150 disposed on the sealing layer 140. Additionally, the display device 100 according to an embodiment may further include a polarization layer 160 disposed on the touch sensor layer 150 to reduce reflection of external light.

[0088] The substrate 110 may be made of an insulating material such as a polymer resin. For example, the substrate 110 may be made of polyimide. The substrate 110 may be a flexible substrate that can be bent, folded, or curled. Optionally, the substrate 110 may be made of an insulating material such as glass. The substrate 110 may include a main region MA and a sub-region SBA. The main region MA may include the display region DA and the non-display region NDA as previously indicated.

[0089] Figure 4 is a plan view of the Figure 3 substrate 110 according to an embodiment.

[0090] Referring Figure 4 , the substrate 110 of the display device 100 according to an embodiment may include a main region MA corresponding to the display surface and a sub-region SBA protruding from one side of the main region MA. The main region MA may include the display region DA disposed at most of the center and the non-display region NDA disposed at the edge and surrounding the display region DA.

[0091] The non-display area NDA may include a gate driving circuit region GDRA where a gate driving circuit is provided. The gate driving circuit region GDRA may be provided in a portion of the non-display area NDA that is adjacent to at least one side of the display area DA in a first direction DR1. The gate driving circuit in the gate driving circuit region GDRA may sequentially transmit gate signals to gate lines. The gate lines may include, for example, a scan write-in line GWL that transmits a scan write-in signal GW, a scan initialization line GIL that transmits a scan initialization signal GI, a gate control line GCL that transmits a gate control signal GC, and an emission control line ECL that transmits an emission control signal EC. See, for example, Figure 6 .

[0092] The non-display area NDA may include a dam area DMA that surrounds the display area DA and a bonding area JNA that surrounds the dam area DMA. One or more dam portions (e.g., Figure 10 DM in) surrounding the display area DA may be arranged in the dam area DMA. Each of the one or more dam portions DM may include a structure in which two or more dam layers are stacked. Each of the two or more dam layers may include an organic insulating material. Since each of the dam layers of the organic insulating material is provided with a relatively large thickness, valleys may be generated on both sides of each of the one or more dam portions DM. Therefore, due to the valleys generated by the one or more dam portions DM, the area where the organic layer of the sealing layer 140 spreads may be limited.

[0093] A bonding structure between the inorganic layer of the sealing layer 140 and the inorganic layer of the circuit layer 120 ( Figure 11 124 in) may be provided in the bonding area JNA.

[0094] The sub-region SBA may include a bending region BA that can be bent into a curved shape, a first sub-region SB1 provided between one side of the bending region BA and the main region MA, and a second sub-region SB2 connected to the other side of the bending region BA. When the bending region BA is deformed into a curved shape, the second sub-region SB2 is provided below the substrate 110 and may overlap with the main region MA.

[0095] The display driving circuit 200 may be provided in the second sub-region SB2.

[0096] A signal pad (also referred to as a "bonding pad" or "pad") SPD bonded to the circuit board 300 may be provided at one edge of the second sub-region SB2.

[0097] Figure 5 is a layout diagram showing a portion B according to an embodiment Figure 4 of.

[0098] Refer toFigure 5 , the display area DA of the display device 100 according to an embodiment may include a light-emitting area EA. Additionally, the display area DA may include a non-light-emitting area provided in an interval portion between the light-emitting areas EA.

[0099] The element layer 130 may include a light-emitting element ( Figure 6 LE in each of the light-emitting areas EA).

[0100] The circuit layer 120 may include a light-emitting pixel driver EPD that is electrically connected to the light-emitting elements of the element layer 130, respectively. The light-emitting pixel drivers EPD may be arranged parallel to each other in a first direction DR1 and a second direction DR2 in the display area DA.

[0101] The light-emitting area EA may have a predetermined shape such as a rhombus planar shape or a rectangular planar shape, for example. However, this is merely an example, and the planar shape of the light-emitting area EA according to an embodiment is not limited to Figure 5 the planar shape shown therein. For example, the light-emitting area EA may have a polygonal planar shape such as a square, pentagon, or hexagon, or a circular or elliptical planar shape including a curved edge.

[0102] Each of the light-emitting areas EA may include a first light-emitting area EA1 that emits light of a first color in a predetermined wavelength band, a second light-emitting area EA2 that emits light of a second color in a wavelength band lower than that of the light of the first color, and a third light-emitting area EA3 that emits light of a third color in a wavelength band lower than that of the light of the second color. As an example, the first color may be red in a wavelength band of approximately 600 nm to 750 nm. The second color may be green in a wavelength band of approximately 480 nm to 560 nm. The third color may be blue in a wavelength band of approximately 370 nm to 460 nm.

[0103] The first light-emitting area EA1 and the third light-emitting area EA3 may be alternately provided in at least one of the first direction DR1 and the second direction DR2.

[0104] The second light-emitting areas EA2 may be arranged parallel to each other in at least one of the first direction DR1 and the second direction DR2. Additionally, the second light-emitting areas EA2 may be adjacent to the first light-emitting area EA1 and the third light-emitting area EA3 in diagonal directions DR4 and DR5 that intersect the first direction DR1 and the second direction DR2. In other embodiments, the arrangements of the light-emitting areas EA1, EA2, and EA3 may be different.

[0105] Pixels PX that display various brightnesses and colors can be set by a first light-emitting region EA1, a second light-emitting region EA2, and a third light-emitting region EA3 that are adjacent to each other within the light-emitting region EA. For example, a pixel PX can be a basic unit that emits light of various colors including white at a predetermined brightness. Each of the pixels PX can include at least one first light-emitting region EA1, at least one second light-emitting region EA2, and at least one third light-emitting region EA3 that are adjacent to each other. Therefore, each of the pixels PX can display various colors by mixing the light emitted from the first light-emitting region EA1, the second light-emitting region EA2, and the third light-emitting region EA3 that are adjacent to each other.

[0106] Figure 6 is a diagram showing Figure 5 the equivalent circuit diagram of the light-emitting pixel driver EPD (or pixel circuit).

[0107] Referring to Figure 6 , one of the light-emitting elements LE of the element layer 130 can be electrically connected between one of the light-emitting pixel drivers EPD of the circuit layer 120 and the second power ELVSS. For example, the anode electrode ( Figure 9 131 in) of the light-emitting element LE can be electrically connected to the light-emitting pixel driver EPD. The second power ELVSS having a voltage level lower than the first power ELVDD can be applied to the cathode electrode ( Figure 9 134 in) of the light-emitting element LE. The capacitor Cel connected in parallel with the light-emitting element LE represents the parasitic capacitance between the anode electrode 131 and the cathode electrode 134.

[0108] The circuit layer 120 may further include a first power line VDL and an initialization power line VIL. The first power line VDL can transmit the first power ELVDD. The initialization power line VIL transmits the initialization power Vint. The circuit layer 120 may further include a scan write line GWL that transmits a scan write signal GW, a scan initialization line GIL that transmits a scan initialization signal GI, an emission control line ECL that transmits an emission control signal EC, and a gate control line GCL that transmits a gate control signal GC.

[0109] As Figure 6 further shown in, one of the light-emitting pixel drivers EPD of the circuit layer 120 can include a driving transistor DT that generates a driving current for driving the light-emitting element LE, two or more transistors ST1 to ST6 electrically connected to the driving transistor DT, and at least one capacitor PC1.

[0110] The driving transistor DT is connected in series with the light-emitting element LE between the first power supply ELVDD and the second power supply ELVSS. For example, the first electrode (e.g., the source electrode) of the driving transistor DT may be electrically connected to the first power line VDL through the fifth transistor ST5. The second electrode (e.g., the drain electrode) of the driving transistor DT may be electrically connected to the anode electrode 131 of the light-emitting element LE through the sixth transistor ST6. The first electrode of the driving transistor DT may be electrically connected to the data line DL through the second transistor ST2.

[0111] The gate electrode of the driving transistor DT may be electrically connected to the first power line VDL through the first capacitor PC1. For example, the first capacitor PC1 may be electrically connected between the gate electrode of the driving transistor DT and the first power line VDL. Therefore, the potential of the gate electrode of the driving transistor DT may be maintained at the first power supply ELVDD through the first power line VDL.

[0112] In addition, when the data signal Vdata of the data line DL is transmitted to the first electrode of the driving transistor DT through the turned-on second transistor ST2, a voltage difference corresponding to the first power supply ELVDD and the data signal Vdata may be generated between the gate electrode of the driving transistor DT and the first electrode of the driving transistor DT. In this case, when the voltage difference (e.g., the gate-source voltage difference) between the gate electrode of the driving transistor DT and the first electrode of the driving transistor DT is equal to or greater than the threshold voltage, the driving transistor DT may be turned on, thereby generating a drain-source current of the driving transistor DT corresponding to the data signal Vdata. As described below, this drain-source current causes the light-emitting element LE to emit light having a brightness corresponding to the data signal Vdata.

[0113] Subsequently, when the fifth transistor ST5 and the sixth transistor ST6 are turned on, the driving transistor DT may be connected in series with the light-emitting element LE between the first power line VDL and the second power line VSL. Therefore, the drain-source current of the driving transistor DT corresponding to the data signal Vdata may be supplied as the driving current of the light-emitting element LE. Therefore, the light-emitting element LE may emit light having a brightness corresponding to the data signal Vdata.

[0114] The first transistor ST1 may be electrically connected between the gate electrode of the driving transistor DT and the second electrode of the driving transistor DT. The first transistor ST1 may be turned on by the scan write signal GW of the scan write line GWL.

[0115] In one embodiment, the first transistor ST1 may include a plurality of sub-transistors connected in series. As an example, the first transistor ST1 may include a first sub-transistor ST11 and a second sub-transistor ST12. A first electrode of the first sub-transistor ST11 may be connected to a gate electrode of the driving transistor DT, a second electrode of the first sub-transistor ST11 may be connected to a first electrode of the second sub-transistor ST12, and a second electrode of the second sub-transistor ST12 may be connected to a second electrode of the driving transistor DT. In this way, it is possible to prevent the potential of the gate electrode of the driving transistor DT from being changed due to a leakage current caused by the non-conducting first transistor ST1.

[0116] The second transistor ST2 may be electrically connected between a first electrode of the driving transistor DT and the data line DL. The second transistor ST2 may be turned on by a scan write signal GW of the scan write line GWL.

[0117] The third transistor ST3 may be connected between the gate electrode of the driving transistor DT and the initialization power line VIL. The third transistor ST3 may be turned on by a scan initialization signal GI of the scan initialization line GIL.

[0118] The third transistor ST3 may include a plurality of sub-transistors connected in series. As an example, the third transistor ST3 may include a third sub-transistor ST31 and a fourth sub-transistor ST32. A first electrode of the third sub-transistor ST31 may be connected to the gate electrode of the driving transistor DT, a second electrode of the third sub-transistor ST31 may be connected to a first electrode of the fourth sub-transistor ST32, and a second electrode of the fourth sub-transistor ST32 may be connected to the initialization power line VIL. In this way, it is possible to prevent the potential of the gate electrode of the driving transistor DT from being changed due to a leakage current caused by the non-conducting third transistor ST3.

[0119] The fourth transistor ST4 may be electrically connected between an anode electrode 131 of the light-emitting element LE and the initialization power line VIL. The fourth transistor ST4 may be turned on by a gate control signal GC of the gate control line GCL to initialize the light-emitting element LE.

[0120] The fifth transistor ST5 may be electrically connected between a first electrode of the driving transistor DT and the first power line VDL.

[0121] The sixth transistor ST6 may be electrically connected between a second electrode of the driving transistor DT and the anode electrode 131 of the light-emitting element LE. The fifth transistor ST5 and the sixth transistor ST6 may be turned on by an emission control signal EC of the emission control line ECL to allow light to be emitted from the light-emitting element LE.

[0122] As Figure 6As shown, the driving transistor DT and the first transistor ST1 to the sixth transistor ST6 can be set as P-type MOSFETs. However, this is merely an example, and some of the driving transistor DT and the first transistor ST1 to the sixth transistor ST6 can also be set as N-type MOSFETs. As an example, the first transistor ST1 and the third transistor ST3 can be set as N-type MOSFETs.

[0123] Figure 7 is a plan view showing a Figure 3 touch sensor layer according to an embodiment. Figure 8 is an enlarged view showing a Figure 7 part D according to an embodiment.

[0124] Figure 7 The capacitive touch sensor layer 150 is shown. In this case, the touch driving circuit 400 can detect a touch based on whether there is a change in capacitance. However, Figure 7 the illustration in Figure 7 is merely an example for ease of explanation, and the touch sensor layer 150 according to an embodiment is not limited to Figure 7 the illustration in

[0125] Referring to Figure 7 , the touch sensor layer 150 can be disposed in the main area MA. The touch sensor layer 150 can include a touch sensing area TSA for detecting a touch of a user's finger or a stylus, and a touch peripheral area TPA surrounding the touch sensing area TSA.

[0126] The touch sensing area TSA can be wider than the display area DA and can be similar to the display area DA. Therefore, the touch peripheral area TPA around the touch sensing area TSA can be similar to the non-display area NDA around the display area DA. As an example, the touch sensing area TSA can overlap with the edge of the display area DA adjacent to the display area DA and the non-display area NDA. In this case, the touch peripheral area TPA can overlap with the remaining portion of the non-display area NDA that does not correspond to the touch sensing area TSA.

[0127] The touch sensor layer 150 can include sensor electrodes SE and dummy electrodes DE arranged in a predetermined pattern (e.g., matrix) in the touch sensing area TSA and generating mutual capacitance. Sensor lines TL1, TL2, and RL can be disposed in the touch peripheral area TPA.

[0128] The sensor electrode SE may include a touch driving electrode TE to which a driving signal is applied and a receiving electrode RE for detecting a voltage charged in the mutual capacitance with the touch driving electrode TE.

[0129] The sensor line may include a first touch driving line TL1, a second touch driving line TL2, and a receiving line RL. Each of the first touch driving line TL1 and the second touch driving line TL2 may be electrically connected to two or more touch driving electrodes TE connected in the second direction DR2 among the touch driving electrodes TE.

[0130] The first touch driving line TL1 may extend from a part of the touch peripheral area TPA, and the part of the touch peripheral area TPA is located between one side of the touch sensing area TSA in the second direction DR2 and the sub - area SBA.

[0131] The second touch driving line TL2 may extend from a part of the touch peripheral area TPA (i.e., the part in contact with the other side of the touch sensing area TSA in the second direction DR2) through the part in contact with one side of the touch sensing area TSA in the first direction DR1 to the sub - area SBA.

[0132] The receiving line RL may be electrically connected to two or more receiving electrodes RE connected in the first direction DR1 among the receiving electrodes RE.

[0133] The receiving electrodes RE may be arranged in parallel in the first direction DR1. The adjacent receiving electrodes RE in the first direction DR1 may be electrically connected to each other through a protruding part in the first direction DR1.

[0134] The touch driving electrodes TE may be arranged in parallel in the second direction DR2. The adjacent touch driving electrodes TE in the second direction DR2 may be electrically connected to each other through a bridge electrode (e.g., Figure 8 BE in ) in the second direction DR2.

[0135] Each of the touch driving electrode TE and the receiving electrode RE may have a predetermined shape that surrounds a dummy electrode DE provided at the center of each of the touch driving electrode TE and the receiving electrode RE, for example. The dummy electrode DE may be spaced apart from the touch driving electrode TE and the receiving electrode RE surrounding each dummy electrode DE. The dummy electrode DE may be kept in a floating state.

[0136] Figure 7 It is shown that each of the touch driving electrode TE, the receiving electrode RE, and the dummy electrode DE has a rhombus planar shape, but the embodiment is not limited to Figure 7The illustration in []. In another embodiment, these electrodes may have different shapes. Additionally, in an embodiment, the shapes of the electrodes may be different. As an example, the touch driving electrode TE, the receiving electrode RE, and the dummy electrode DE may have planar shapes such as a quadrilateral shape other than a rhombus, a polygon other than a quadrilateral, a circle, or an ellipse.

[0137] The display device 100 according to an embodiment may include a signal pad SPD disposed in the second sub-region SB2 of the substrate 110 and connected to the circuit board 300. The signal pad SPD may include a display signal pad DPD and touch signal pads TPD1 and TPD2. The display signal pad DPD transmits and receives signals for driving the circuit layer 120. The touch signal pads TPD1 and TPD2 transmit and receive signals for driving the touch sensor layer 150.

[0138] As an example, the second sub-region SB2 may include a display pad region DPDA adjacent to the display driving circuit 200 and a first touch pad region TPDA1 and a second touch pad region TPDA2 disposed on respective sides of the display pad region DPDA. The display signal pad DPD for transmitting and receiving signals sent to the circuit layer 120 or the display driving circuit 200 may be disposed in the display pad region DPDA. The first touch pad TPD1 electrically connected to the first touch driving line TL1 and the second touch driving line TL2, respectively, may be disposed in the first touch pad region TPDA1. Each of the second touch pads TPD2 may be electrically connected to the receiving line RL and may be disposed in the second touch pad region TPDA2.

[0139] Referring to Figure 8 , the bridge electrode BE may be disposed in the first touch conductive layer on a touch buffer layer (e.g., see 151 in Figure 9 ), and the touch driving electrode TE and the receiving electrode RE may be disposed in the second touch conductive layer on a touch interlayer insulating layer (e.g., see 152 in Figure 9 ). The touch driving electrode TE and the receiving electrode RE may be spaced apart from each other. In Figure 8 , the bridge electrode BE has a shape including at least one bent portion, but the shape of the bridge electrode BE according to an embodiment is not limited to Figure 8 the shape shown in

[0140] Touch driving electrodes TE adjacent in the second direction DR2 may be electrically connected to each other through two or more bridge electrodes BE. In this way, the reliability of the electrical connection between the touch driving electrodes TE can be improved. Figure 8 Two bridge electrodes BE parallel to each other are shown disposed between touch driving electrodes TE adjacent in the second direction DR2, but the embodiment is not limited to Figure 8As shown in. The bridge electrode BE can be electrically connected to the touch driving electrode TE through the touch electrode connection hole TCNT1.

[0141] Each of the touch driving electrode TE, the receiving electrode RE, and the bridge electrode BE can have a planar shape such as a grid or a mesh structure. The dummy electrode DE can also have a planar shape such as a grid or a mesh structure. Since the width of the light-emitting region EA that overlaps with the touch driving electrode TE, the receiving electrode RE, the dummy electrode DE, and the bridge electrode BE can be reduced, a decrease in the light-emitting efficiency of the light-emitting region EA (a decrease in the light-emitting efficiency of the light-emitting region EA caused by the touch driving electrode TE, the receiving electrode RE, the dummy electrode DE, and the bridge electrode BE) can be reduced or prevented.

[0142] Figure 9 is a cross-sectional view taken along the Figure 8 line E-E' according to an embodiment.

[0143] Referring to Figure 9 , the display device 100 according to an embodiment can include a substrate 110, a circuit layer 120 on the substrate 110, an element layer 130 on the circuit layer 120, and a sealing layer 140 on the element layer 130. In addition, the display device 100 according to an embodiment can include a touch sensor layer 150 on the sealing layer 140 and a polarization layer 160 provided on the touch sensor layer 150.

[0144] The substrate 110 can be made of an insulating material such as a polymer resin. For example, the substrate 110 can include polyimide.

[0145] The circuit layer 120 can include a light-emitting pixel driver EPD, and each of the light-emitting pixel drivers EPD can be electrically connected to a light-emitting element LE provided in the light-emitting region EA.

[0146] The light-emitting pixel driver EPD can include a driving transistor DT and two or more transistors ST1 to ST6 electrically connected to the driving transistor DT. According to an embodiment, each of the driving transistor DT and the two or more transistors ST1 to ST6 can include a channel region CA, a source region SA, and a drain region DA made of a semiconductor layer, and a gate electrode GE made of a first gate conductive layer on a first gate insulating layer 122 covering the semiconductor layer.

[0147] The source region SA and the drain region DA can be respectively connected to corresponding sides of the channel region CA. The source region SA and the drain region DA can have higher conductivity than the channel region CA. The gate electrode GE overlaps with the channel region CA.

[0148] The first capacitor PC1 of the light-emitting pixel driver EPD can be disposed in the overlapping region between the gate electrode GEDT of the driving transistor DT and the capacitor electrode CAE. The capacitor electrode CAE can be formed of a second gate conductive layer on the second gate insulating layer 123 covering the first gate conductive layer.

[0149] The anode electrode 131 of the element layer 130 can be electrically connected to the drain region DA6 of the sixth transistor ST6 through the first anode connection electrode ANDE1 and the second anode connection electrode ANDE2.

[0150] The first anode connection electrode ANDE1 can be disposed in the first source / drain conductive layer on the interlayer insulating layer 124 covering the second gate conductive layer. The first anode connection electrode ANDE1 can be electrically connected to the drain region DA6 of the sixth transistor ST6 through the first anode contact hole ANCT1 penetrating the interlayer insulating layer 124, the second gate insulating layer 123, and the first gate insulating layer 122.

[0151] The second anode connection electrode ANDE2 can be disposed in the second source / drain conductive layer on the first planarization layer 125 covering the first source / drain conductive layer. The second anode connection electrode ANDE2 can be electrically connected to the first anode connection electrode ANDE1 through the second anode contact hole ANCT2 penetrating the first planarization layer 125.

[0152] The anode electrode 131 of the element layer 130 can be disposed on the second planarization layer 126. The anode electrode 131 can be electrically connected to the second anode connection electrode ANDE2 through the third anode contact hole ANCT3 penetrating the second planarization layer 126.

[0153] For example, the circuit layer 120 can include a buffer layer 121 disposed on the substrate 110, semiconductor layers CADT, SADT, DADT, CA6, SA6, and DA6 disposed on the buffer layer 121, a first gate insulating layer 122 covering the semiconductor layers, a first gate conductive layer GEDT and GE6 disposed on the first gate insulating layer 122, a second gate insulating layer 123 covering the first gate conductive layer, a second gate conductive layer CAE disposed on the second gate insulating layer 123, an interlayer insulating layer 124 covering the second gate conductive layer, a first source / drain conductive layer ADNE1 disposed on the interlayer insulating layer 124, a first planarization layer 125 covering the first source / drain conductive layer, a second source / drain conductive layer ANDE2 disposed on the first planarization layer 125, and a second planarization layer 126 covering the second source / drain conductive layer.

[0154] Each of the buffer layer 121, the first gate insulating layer 122, the second gate insulating layer 123, and the interlayer insulating layer 124 may be made of at least one inorganic film. As an example, each of the buffer layer 121, the first gate insulating layer 122, the second gate insulating layer 123, and the interlayer insulating layer 124 may be made of a multilayer film in which one or more inorganic films such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide are alternately stacked.

[0155] Each of the first planarization layer 125 and the second planarization layer 126 may be made of an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0156] The semiconductor layers CADT, SADT, DADT, CA6, SA6, and DA6 may be made of one semiconductor material among polysilicon, amorphous silicon, and an oxide semiconductor.

[0157] The channel region CA of the semiconductor layer that overlaps with the gate electrode GE may maintain semiconductor characteristics, and the remaining source region SA and drain region DA thereof may be conductive.

[0158] Each of the first gate conductive layer, the second gate conductive layer, the first source / drain conductive layer, and the second source / drain conductive layer may be formed of a multilayer of two or more selected from molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). Each of the first source / drain conductive layer and the second source / drain conductive layer may include a multilayer structure in which two or more metal layers are stacked.

[0159] The element layer 130 is disposed on the second planarization layer 126 of the circuit layer 120, and may include light-emitting elements LE respectively disposed in the light-emitting region EA. The element layer 130 may include an anode electrode 131 respectively disposed in the light-emitting region EA, a pixel defining layer 132 disposed in the non-light-emitting region NEA (which is an interval region between the light-emitting regions EA and covers the edges of each of the anode electrodes 131), a spacer layer 132' disposed on a part of the pixel defining layer 132, a light-emitting layer 133 disposed on each of the anode electrodes 131, and a cathode electrode 134 disposed on the pixel defining layer 132, the spacer layer 132', and the light-emitting layer 133.

[0160] The element layer 130 may further include a first common layer 135 disposed between the anode electrode 131 and the light-emitting layer 133, and a second common layer 136 disposed between the light-emitting layer 133 and the cathode electrode 134. For example, each of the light-emitting elements LE may include an anode electrode 131 and a cathode electrode 134 facing each other, and a light-emitting layer 133 disposed therebetween. In one embodiment, each of the light-emitting elements LE may further include a first common layer 135 disposed between the anode electrode 131 and the light-emitting layer 133, and a second common layer 136 disposed between the light-emitting layer 133 and the cathode electrode 134.

[0161] The first common layer 135 may include a hole transport layer. In one embodiment, the first common layer 135 may further include a hole injection layer between the anode electrode 131 and the hole transport layer.

[0162] The light-emitting layer 133 on the first common layer 135 may be disposed in each of the light-emitting regions EA. The light-emitting layer 133 of the first light-emitting region EA1, the light-emitting layer 133 of the second light-emitting region EA2, and the light-emitting layer 133 of the third light-emitting region EA3 may include different materials or organic light-emitting materials. As an example, the light-emitting layer 133 may be made of an organic light-emitting material that converts electron-hole pairs into light. The organic light-emitting material may include a host material and a dopant. The dopant may include, for example, a phosphorescent material or a fluorescent material.

[0163] The second common layer 136 under the cathode electrode 134 may be entirely disposed in the display region DA including the light-emitting region EA. The second common layer 136 may include an electron transport layer. In one embodiment, the second common layer 136 may further include an electron injection layer between the cathode electrode 134 and the electron transport layer.

[0164] The sealing layer 140 may be disposed on the circuit layer 120 and cover the element layer 130. The sealing layer 140 may include a first sealing layer 141, a second sealing layer 142, and a third sealing layer 143. The first sealing layer 141 is disposed on the element layer 130 and made of an inorganic insulating material. The second sealing layer 142 is disposed on the first sealing layer 141, stacked with the element layer 130, and includes an organic insulating material. The third sealing layer 143 is disposed on the first sealing layer 141, covering the second sealing layer 142, and includes an inorganic insulating material.

[0165] In one embodiment, the second sealing layer 142 may include an organic insulating material. Examples include acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. For example, the second sealing layer 142 may be prepared by a process of dropping a liquid organic material on the first sealing layer 141, spreading the organic material to cover the display region DA, and then curing the organic material.

[0166] Thus, according to an embodiment, the display device 100 may include one or more dam portions (e.g., Figures 10 to 14 the DM in Figures 11 to 14 ), and the one or more dam portions form at least one valley for restricting the spreading range of the organic material of the second sealing layer 142. As will be discussed in more detail below, the one or more dam portions DM may be disposed in the dam area DMA of the non-display area NDA. As explained, for example, with respect to

[0167] the one or more dam portions DM may restrict the second sealing layer 142 from moving into the bonding area JNA during the formation of the layers of the display device 100. Since the second sealing layer 142 is made of an organic insulating material, the one or more dam portions DM may prevent the organic insulating material from being included in the bonding area JNA.

[0168] According to an embodiment, the touch sensor layer 150 may be disposed on the sealing layer 140, and the polarization layer 160 may be disposed on the touch sensor layer 150. According to an embodiment, the touch sensor layer 150 may include a first touch conductive layer BE disposed on the sealing layer 140, a touch interlayer insulating layer 152 covering the first touch conductive layer, a second touch conductive layer TE and RE disposed on the touch interlayer insulating layer 152, and a touch planarization layer 153 covering the second touch conductive layer. The touch sensor layer 150 may further include a touch buffer layer 151 covering the sealing layer 140. In this case, the first touch conductive layer BE may be disposed on the touch buffer layer 151.

[0169] The bridge electrode BE may be disposed in the first touch conductive layer on the touch buffer layer 151.

[0170] The touch driving electrode TE and the receiving electrode RE may be disposed in the second touch conductive layer on the touch interlayer insulating layer 152.

[0171] Similar to the touch driving electrodes TE and the receiving electrodes RE, dummy electrodes DE provided inside each of the touch driving electrodes TE and the receiving electrodes RE, a first touch driving line TL1 and a second touch driving line TL2 connected to the touch driving electrodes TE, and a receiving line RL connected to the receiving electrodes RE may be provided in the second touch conductive layer on the touch interlayer insulating layer 152.

[0172] The touch driving electrode TE may be electrically connected to the bridge electrode BE through a touch electrode connection hole TCNT1 penetrating the touch interlayer insulating layer 152.

[0173] The polarization layer 160 may be provided on the touch planarization layer 153. In one embodiment, the polarization layer 160 may also be provided on a polarization buffer layer 161 covering the touch planarization layer 153.

[0174] Figure 10 is a layout diagram showing part C according to an embodiment Figure 4 of. Figure 11 is a cross-sectional view taken along line F-F' according to an embodiment Figure 10 of. Figure 12 is a cross-sectional view taken along line G-G' according to an embodiment Figure 10 of.

[0175] Referring to Figure 10 , the circuit layer 120 of the display device 100 according to an embodiment may include a light-emitting pixel driver EPD electrically connected to the light-emitting element LE of the element layer 130 and a power supply line VSPL that transmits power for driving the light-emitting element LE to the light-emitting pixel driver EPD or the light-emitting element LE.

[0176] The power supply line VSPL may include a first power supply line VDSPL and a second power supply line VSSPL that respectively transmit a first power ELVDD and a second power ELVSS having different voltage levels. Hereinafter, for simplicity of description, the first power supply line VDSPL and the second power supply line VSSPL may be collectively referred to as the power supply line VSPL.

[0177] Each of the first power supply line VDSPL and the second power supply line VSSPL of the power supply line VSPL may include a main supply portion MSP provided in the non-display area NDA, a sub-connection portion SCN extending from the main supply portion MSP to the sub-area SBA, and a branch portion BRN provided in the bonding area JNA and protruding from one side of the sub-connection portion SCN.

[0178] According to an embodiment, the circuit layer 120 of the display device 100 may further include a data line DL, which is electrically connected to the light-emitting pixel driver EPD, extends in the second direction DR2, and transmits a data signal.

[0179] The circuit layer 120 may further include a data supply line DSPL, a data bending line DBDL, and a data output line DOPL. The data supply line DSPL is disposed in the non-display area NDA, extends to the sub-area SBA, and is electrically connected to the data lines DL respectively. The data bending line DBDL is disposed in the bending area BA and is connected to the data supply line DSPL respectively. The data output line DOPL is disposed in the second sub-area SB2 and is electrically connected to the data bending line DBDL respectively. For example, the data lines DL may be electrically connected to the display driving circuit 200 in the second sub-area SB2 through the data supply line DSPL, the data bending line DBDL, and the data output line DOPL.

[0180] Referring Figure 11 , the circuit layer 120 of the display device 100 according to an embodiment may include one or more dam portions DM sequentially disposed in the dam area DMA and an inorganic bonding structure disposed in the bonding area JNA. According to one or more embodiments, since valleys in which the interlayer insulating layer 124 is exposed are provided on corresponding sides of the one or more dam portions DM, the area in which the second sealing layer 142 is provided may be limited by providing the one or more dam portions DM. Since the second sealing layer 142 is made of an organic insulating material, this may prevent the organic sealing material from diffusing into the bonding area JNA, thereby preventing moisture and oxygen from entering this area of the display device 100.

[0181] As an example, the one or more dam portions DM may include a first dam portion DM1 surrounding the display area DA and a second dam portion DM2 surrounding the first dam portion DM1. The first dam portion DM1 and the second dam portion DM2 may each include two or more dam layers DML11 and DML12 and DML21, DML22, and DML23 respectively.

[0182] The first dam layer DML11 of the first dam portion DM1 may be disposed on the same layer as the first planarization layer 125. The second dam layer DML12 of the first dam portion DM1 may be disposed on the same layer as one of the second planarization layer 126, the pixel defining layer 132, and the spacer layer 132'.

[0183] The first dam layer DML21 of the second dam portion DM2 may be disposed on the same layer as the first planarization layer 125. Each of the second dam layer DML22 and the third dam layer DML23 of the second dam portion DM2 may be disposed on the same layer as one of the second planarization layer 126, the pixel defining layer 132, and the spacer layer 132'.

[0184] According to an embodiment, in the bonding area JNA, the first sealing layer 141 may be in contact with the interlayer insulating layer 124.

[0185] The second sealing layer 142 can be restrictively disposed within an area surrounded by one or more dam portions DM provided in the dam area DMA. As a result of these features, the third sealing layer 143 can be in contact with the first sealing layer 141 in a part of the dam area DMA and the bonding area JNA. For example, a bonding structure of inorganic insulating materials formed by the interlayer insulating layer 124, the first sealing layer 141, and the third sealing layer 143 can be provided in the bonding area JNA. As a result, the penetration of moisture or oxygen through the organic insulating material can be blocked, thereby increasing the service life of the display device 100.

[0186] According to an embodiment, the circuit layer 120 of the display device 100 may further include a bending hole BDH provided in the bending area BA and a bank BNK covering the bending hole BDH. The bending hole BDH can be used to remove the inorganic insulating material of the circuit layer 120 that overlaps with the bending area BA. Since the inorganic insulating material has relatively large stress when bent into a bent shape, cracks or breakages of the inorganic insulating material due to bending stress are likely to occur relatively easily. To prevent such problems, the bending hole BDH provided in the bending area BA can penetrate the buffer layer 121, the first gate insulating layer 122, the second gate insulating layer 123, and the interlayer insulating layer 124, and each of the buffer layer 121, the first gate insulating layer 122, the second gate insulating layer 123, and the interlayer insulating layer 124 includes an inorganic insulating material.

[0187] The bank BNK is used to fill the bending hole BDH and protect the lines in the bending area BA. As will be discussed in more detail, for example, with reference to Figure 13 and Figure 14 , the bank BNK can be spaced apart from the bonding area JNA (and more specifically, from the branched portion of the power supply line) to improve the operation of the display device 100. The bank BNK may include two or more bank layers BNL1, BNL2, BNL3, and BNL4, and each of the bank layers BNL1, BNL2, BNL3, and BNL4 includes an organic insulating material. As an example, the two or more bank layers may include a first bank layer BNL1 provided on the same layer as the first planarization layer 125, a second bank layer BNL2 provided on the same layer as the second planarization layer 126, a third bank layer BNL3 provided on the same layer as the pixel defining layer 132, and a fourth bank layer BNL4 provided on the same layer as the spacer layer 132'.

[0188] According to an embodiment, the data supply line DSPL and the data pad line DPDL can be provided in the first gate conductive layer on the first gate insulating layer 122 or in the second gate conductive layer on the second gate insulating layer 123.

[0189] The data line DL can be disposed in the second source / drain conductive layer on the first planarization layer 125. In this case, the data line DL can be electrically connected to the data supply line DSPL through a data supply connection hole DSCH that penetrates the first planarization layer 125 and the interlayer insulating layer 124.

[0190] The data bend line DBDL can be disposed in the second source / drain conductive layer on the first bank layer BNL1 in the same layer as the first planarization layer 125. The data bend line DBDL can be electrically connected to the data supply line DSPL through a first data bend connection hole DBDCH1, and can be electrically connected to the data pad line DPDL through a second data bend connection hole DBDCH2.

[0191] As Figure 10 shown, according to an embodiment, the circuit layer 120 of the display device 100 may further include a first power bend line VDBDL disposed in the bending region BA and connected to the first power supply line VDSPL, and a first power pad line VDPDL disposed in the second sub-region SB2 and electrically connected to the first power bend line VDBDL. The first power pad line VDPDL may be connected to at least one signal pad among the signal pads SPD in the second sub-region SB2 that transmits the first power ELVDD. For example, the first power supply line VDSPL may be electrically connected to the circuit board 300 through the first power bend line VDBDL, the first power pad line VDPDL, and at least one signal pad that transmits the first power ELVDD.

[0192] According to an embodiment, the circuit layer 120 of the display device 100 may further include a second power bend line VSBDL disposed in the bending region BA and connected to the second power supply line VSSPL, and a second power pad line VSPDL disposed in the second sub-region SB2 and electrically connected to the second power bend line VSBDL. The second power pad line VSPDL may be connected to at least one signal pad among the signal pads SPD in the second sub-region SB2 that transmits the second power ELVSS. For example, the second power supply line VSSPL may be electrically connected to the circuit board 300 through the second power bend line VSBDL, the second power pad line VSPDL, and at least one signal pad that transmits the second power ELVSS.

[0193] Referring to Figure 12 , the second power supply line VSSPL of the power supply line VSPL may extend to the first sub-region SB1, and may be connected to the second power bend line VSBDL in the bending region BA. The second power supply line VSSPL may be disposed in the first source / drain conductive layer on the interlayer insulating layer 124 or in the second source / drain conductive layer on the first planarization layer 125.

[0194] The first source / drain conductive layer and the second source / drain conductive layer may include a multi-layer structure and may be covered by the first planarization layer 125 or the second planarization layer 126, and the first planarization layer 125 or the second planarization layer 126 includes a relatively thick organic insulating material to have a relatively low line resistance. As an example, a part of the second power supply line VSSPL may be disposed in the first source / drain conductive layer, and another part of the second power supply line VSSPL may be disposed in the second source / drain conductive layer.

[0195] Similar to the data bend line DBDL, the second power bend line VSBDL may be disposed in the second source / drain conductive layer on the first bank layer BNL1 in the same layer as the first planarization layer 125.

[0196] Similar to the data pad line DPDL, the second power pad line VSPDL may be disposed in the first gate conductive layer on the first gate insulating layer 122 or in the second gate conductive layer on the second gate insulating layer 123.

[0197] The second power bend line VSBDL may be electrically connected to the second power pad line VSPDL through a power bend connection hole VSBDCH.

[0198] Since the first power supply line VDSPL is similar to the second power supply line VSSPL, the first power bend line VDBDL is similar to the second power bend line VSBDL, and the second power pad line VSPDL is similar to the first power pad line VDPDL, redundant descriptions will be omitted.

[0199] As Figure 11 shown, according to an embodiment, the non-display area NDA of the substrate 110 may include a dam area DMA surrounding the display area DA and a bonding area JNA surrounding the dam area DMA.

[0200] The bonding area JNA may be disposed adjacent to the first sub-area SB1 of the sub-area SBA. A bonding structure may be disposed in the bonding area JNA. The bonding structure may include an inorganic material capable of blocking the permeation path of oxygen or moisture. For example, the first planarization layer 125, the second planarization layer 126, the pixel defining layer 132, and the spacer layer 132' that all include organic insulating materials may be removed from the bonding area JNA.

[0201] When the sub-connection part SCN of the power supply line VSPL extends from the non-display area NDA to the sub-area SBA, the sub-connection part SCN may overlap with the dam area DMA and the bonding area JNA. As described in more detail below, one or more branch parts BRN may extend from the sub-connection part SCN and be spaced apart from the bank BNK and one or more dam areas DMA.

[0202] However, since the first planarization layer 125, the second planarization layer 126, the pixel definition layer 132, and the spacer layer 132' are removed from the bonding region JNA, the portion of the sub-connection part SCN of the power supply line VSPL that overlaps with the bonding region JNA is not covered with the organic insulating material, but is covered with the first sealing layer 141 and the third sealing layer 143 of the sealing layer 140.

[0203] In addition, the first source / drain conductive layer and the second source / drain conductive layer include a multi-layer structure, and the reactivity to the etching material can vary depending on the metal materials included in the multi-layer structure. However, the portion of the sub-connection part SCN of the power supply line VSPL that overlaps with the bonding region JNA is not protected by the second planarization layer 126, and thus, is exposed to the etching material during the arrangement of the anode electrode 131. As a result, the portion of the sub-connection part SCN of the power supply line VSPL that overlaps with the bonding region JNA includes an undercut structure with a relatively large width.

[0204] Therefore, it may be difficult to completely cover the side surface of the portion of the sub-connection part SCN of the power supply line VSPL that overlaps with the bonding region JNA with the first sealing layer 141. Thus, due to the gap between the first sealing layer 141 and the side surface of the portion of the sub-connection part SCN of the power supply line VSPL that overlaps with the bonding region JNA, there may be a penetration path for oxygen or moisture.

[0205] Therefore, as Figure 10 and Figure 11 shown, according to an embodiment, the power supply line VSPL may include a branch portion BRN disposed in the bonding region JNA and protruding from at least one side of the sub-connection part SCN to prevent a penetration path for oxygen or moisture due to the gap between the first sealing layer 141 and the side surface of the portion of the sub-connection part SCN of the power supply line VSPL that overlaps with the bonding region JNA.

[0206] In this way, since the outer peripheral length of the portion of the sub-connection part SCN of the power supply line VSPL that overlaps with the bonding region JNA is increased by the outer periphery of the branch portion BRN, oxygen or moisture can be delayed or prevented from penetrating into the display area DA through the gap between the side surface of the portion of the sub-connection part SCN of the power supply line VSPL that overlaps with the bonding region JNA and the first sealing layer 141.

[0207] Figure 13 and Figure 14 are cross-sectional views taken along the line H-H' according to an embodiment. Figure 10 of

[0208] As Figure 13 and Figure 14As shown in FIG. 1 , according to an embodiment, the branch portion BRN of the power line VSPL may be spaced apart from the bank BNK including the organic insulating material. The bank BNK is disposed on the interlayer insulating layer 124 with a relatively thick thickness, and therefore, at the edge of the bank BNK, a relatively high tension may be concentrated near the valley of the corner where the organic insulating material and the inorganic insulating material are combined.

[0209] However, as in the embodiment, if the branch portion BRN of the power line VSPL is spaced apart from the bank BNK, the branch portion BRN may be relatively less affected by tension around the bank BNK. Therefore, a warping defect or corrosion defect of the branch portion BRN may be reduced or prevented.

[0210] The magnitude of the tension concentrated around the bank BNK may correspond to the angle θ1 of the side surface of the bank BNK relative to the interlayer insulating layer 124. Therefore, the distance GB' by which the branch portion BRN is spaced apart from the bank BNK may correspond to (e.g., increase or decrease in proportion to) the angle θ1 of the side surface of the bank BNK relative to the interlayer insulating layer 124.

[0211] As an example, the distance (or referred to as the spacing distance) GB' between the branch portion BRN and the embankment BNK may be about 2 μm or more. When the spacing distance GB' between the branch portion BRN and the embankment BNK is less than 2 μm, the tension concentrated around the embankment BNK may cause a warping defect or a corrosion defect of the branch portion BRN. In one embodiment, the distance GB' between the branch portion BRN and the embankment BNK may be about 5 μm or more. In this way, most of the effect of the tension concentrated around the embankment BNK on the branch portion BRN can be eliminated. In another embodiment, the spacing distance between the branch portion BRN and the embankment BNK may be within a different distance range.

[0212] At the same time, if Figure 14 As shown in , according to an embodiment, as the angle θ2 (θ2>θ1) of the side surface of the bank BNK relative to the interlayer insulating layer 124 increases, the influence of the tension concentrated around the bank BNK may increase. In this case, the distance GB" (GB">GB') by which the branch portion BRN is spaced from the bank BNK can be further increased.

[0213] Likewise, if Figure 13 As shown in , according to an embodiment, the branch portion BRN of the power line VSPL may be spaced apart from one or more dam portions DM including an organic insulating material. As a result, a warping defect or a corrosion defect of the branch portion BRN of the power line VSPL due to tension concentrated around the dam portion DM may be reduced or prevented.

[0214] The magnitude of the tension concentrated around the dam portion DM can correspond to the angle of the side surface of the dam portion DM with respect to the interlayer insulating layer 124. Accordingly, the minimum distance (or called the spacing distance) GD' by which the branch portion BRN is spaced apart from the dam portion DM can correspond to (e.g., increase or decrease proportionally) the angle of the side surface of the dam portion DM with respect to the interlayer insulating layer 124. As an example, the minimum distance GD' by which the branch portion BRN is spaced apart from the dam portion DM can be about 2 μm or greater. In one embodiment, the minimum distance GD' by which the branch portion BRN is spaced apart from the dam portion DM can be about 5 μm or greater. In another embodiment, the spacing distance between the branch portion BRN and the dam portion DM can be within different distance ranges.

[0215] As Figure 14 shown, according to an embodiment, as the angle of the side surface of the dam portion DM with respect to the interlayer insulating layer 124 increases, the distance GD” (GD”>GD') by which the branch portion BRN is spaced apart from the dam portion DM can further increase.

[0216] Meanwhile, as described above, according to an embodiment, the power supply line VSPL includes a branch portion BRN provided in the bonding region JNA.

[0217] Figure 15 、 Figure 16 and Figure 17 show a layout diagram of a portion I according to an embodiment showing Figure 10 this. Figure 18 is an enlarged view of a portion J according to an embodiment showing Figure 17 this. These drawings show different embodiments of the features and configurations of the branch portion BRN and the sub-connection portion SCN.

[0218] Referring Figure 15 to, according to an embodiment, the branch portion BRN can be provided in the bonding region JNA and protrude from one side of the sub-connection portion SCN. When the sub-region SBA protrudes from the main region MA in the second direction DR2, the sub-connection portion SCN can extend in the second direction DR2. In this case, the branch portion BRN can protrude in the first direction DR1 from at least one side of the sub-connection portion SCN. In some embodiments, the branch portion can protrude from the opposite side of the sub-connection portion. As described below, the branch portions provided on the opposite sides of the sub-connection portion can have the same or different arrangements.

[0219] For example, the branch portion BRN can include one or more branch main portions BMP extending parallel to the sub-connection portion SCN and branch sub-portions BSP connecting the sub-connection portion SCN and the one or more branch main portions BMP.

[0220] The branch portion BRN may extend the perimeter of the portion of the sub-connection portion SCN that overlaps with the bonding region JNA to extend the penetration path of oxygen or moisture toward the display region DA. Accordingly, the branch sub-portion BSP may be disposed adjacent to the sub-region SBA such that oxygen or moisture passing through the side portion of the power supply line VSPL is not adjacent to the display region DA as much as possible.

[0221] According to an embodiment, both ends of the branch main portion BMP in the second direction DR2 may be spaced apart from the bank BNK and the dam portion DM. The spacing distance GB between the branch main portion BMP and the bank BNK may be about 2 μm or greater, or about 5 μm or greater. In another embodiment, the spacing distance may have a different distance value. Similarly, the spacing distance GD between the branch main portion BMP and the dam portion DM may be about 2 μm or greater, or about 5 μm or greater. In another embodiment, the spacing distance may be within different distance ranges.

[0222] Referring to Figure 16 , except that one edge of the portion of the sub-connection portion SCN that overlaps with the bonding region JNA includes one or more uneven portions BP and the edge of the branch portion BRN includes one or more uneven portions BP, the power supply line VSPL according to the embodiment is Figures 1 to 15 substantially the same as the power supply line VSPL of the embodiment shown in

[0223] In one embodiment, the uneven portion BP according to the embodiment may have a structure in which concave portions CVE and convex portions CVX are alternately arranged. According to an embodiment, one edge of the portion of the sub-connection portion SCN that overlaps with the bonding region JNA may include uneven portions BP arranged along the extending direction of the sub-connection portion SCN (e.g., the second direction DR2).

[0224] The uneven portion BP provided on one edge of the portion of the sub-connection portion SCN that overlaps with the bonding region JNA may be spaced apart from each of the bank BNK and the dam portion DM. The minimum distance GB between the uneven portion BP provided on one edge of the portion of the sub-connection portion SCN that overlaps with the bonding region JNA and the bank BNK may be about 2 μm or greater, or about 5 μm or greater. The minimum distance GD between the uneven portion BP provided on one edge of the portion of the sub-connection portion SCN that overlaps with the bonding region JNA and the dam portion DM may be about 2 μm or greater, or about 5 μm or greater. In another embodiment, the minimum distance may be within different distance ranges. Although the features located on the branch portion are described as uneven portions, in other embodiments, the surface of the branch portion may be formed to have features with regular geometric shapes, such as triangular extensions, rectangular extensions, or extensions with another type of geometric shape.

[0225] According to an embodiment, an edge of another portion of the sub-connection part SCN that overlaps with the embankment BNK may include at least one uneven portion BP'. In order to reduce the impact from the tension concentrated around the embankment BNK, at least one uneven portion BP' provided on one edge of another portion of the sub-connection part SCN that overlaps with the embankment BNK may be spaced apart from the bonding region JNA. The minimum distance GIB between at least one uneven portion BP' provided on one edge of another portion of the sub-connection part SCN that overlaps with the embankment BNK and the bonding region JNA may be, for example, about 2 μm or greater, or about 5 μm or greater.

[0226] According to an embodiment, the branch part BRN may include an uneven portion BP provided on an edge of the branch main part BMP and arranged along the extending direction of the branch main part BMP. The uneven portion BP provided on the edge of the branch part BRN may be spaced apart from each of the embankment BNK and the dam part DM. The minimum distance GB between the uneven portion BP provided on the edge of the branch part BRN and the embankment BNK may be about 2 μm or greater, or about 5 μm or greater. The minimum distance GB between the uneven portion BP provided on the edge of the branch part BRN and the dam part DM may be about 2 μm or greater, or about 5 μm or greater. These values are given as examples and may correspond to different values in another embodiment.

[0227] Referring to Figure 17 , except that one edge of the portion of the sub-connection part SCN that overlaps with the bonding region JNA includes one or more protrusions PRJ and the edge of the branch part BRN includes one or more protrusions PRJ, the power supply line VSPL according to an embodiment is Figures 1 to 15 substantially the same as the power supply line VSPL of the embodiment shown in

[0228] The protrusions PRJ may be arranged along the outer periphery of the portion of the power supply line VSPL that overlaps with the bonding region JNA. According to an embodiment, the extending direction of the protrusions PRJ may be perpendicular to the outer periphery of the power supply line VSPL. The protrusions PRJ provided on the edge of the portion of the power supply line VSPL that overlaps with the bonding region JNA may be spaced apart from each of the embankment BNK and the dam part DM.

[0229] The minimum distance GB between the protrusion PRJ provided at the edge of the portion of the power supply line VSPL that overlaps with the bonding region JNA and the dam BNK can be, for example, about 2 μm or greater, or about 5 μm or greater. In one embodiment, the minimum distance GD between the protrusion PRJ provided at the edge of the portion of the power supply line VSPL that overlaps with the bonding region JNA and the dam portion DM can be, for example, about 2 μm or greater, or about 5 μm or greater.

[0230] According to an embodiment, at least one protrusion PRJ can also be provided at the edge of the portion of the sub-connection part SCN that overlaps with the dam BNK. In order to reduce the impact from the tension concentrated around the dam BNK, at least one protrusion PRJ provided at the edge of the portion of the sub-connection part SCN that overlaps with the dam BNK can be spaced apart from the bonding region JNA. The minimum distance GIB between at least one protrusion PRJ provided at the edge of the portion of the sub-connection part SCN that overlaps with the dam BNK and the bonding region JNA can be, for example, about 2 μm or greater, or about 5 μm or greater.

[0231] As Figure 18 shown, according to an embodiment, the power supply line VSPL can further include an uneven portion BP arranged along the edge of each of the protrusions PRJ. The uneven portion BP can have a structure in which concave portions CVE and convex portions CVX are alternately arranged along the extending direction of the protrusion PRJ. Additionally, the power supply line VSPL can overlap with the data supply line DSPL. In at least a portion of the bonding region JNA, the data supply line DSPL can extend in a predetermined (e.g., diagonal) direction that intersects the first direction DR1 and the second direction DR2.

[0232] Figure 19 is a layout diagram showing part I of Figure 10 according to an embodiment. Figure 20 is an enlarged view showing part K of Figure 19 according to an embodiment.

[0233] Referring to Figure 19 and Figure 20 , except that the protrusion PRJ extends in a diagonal direction intersecting the first direction DR1 and the second direction DR2, the power supply line VSPL according to an embodiment is substantially the same as the power supply line VSPL in the embodiments shown in Figure 17 and Figure 18 , so redundant descriptions are omitted below.

[0234] According to an embodiment, the protrusion PRJ arranged along the outer periphery of the portion of the power supply line VSPL that overlaps with the bonding region JNA can extend parallel to the data supply line DSPL. As Figure 20As shown in FIG, the midpoint APX of the convex portion CVX among the uneven portion BP of each of the protrusions PRJ may overlap with the spaced portion between the data supply lines DSPL. In one embodiment, the midpoint of the concave portion CVE among the uneven portion BP of each of the protrusions PRJ may overlap with the spaced portion between the data supply lines DSPL. In this way, the warping defect or corrosion defect of the uneven portion BP caused by the step difference depending on whether the data supply line DSPL is arranged can be reduced.

[0235] Figure 21 is a diagram showing a method according to an embodiment of the present invention. Figure 4 Layout diagram of part C. Figure 22 is a diagram showing a method according to an embodiment of the present invention. Figure 21 Layout diagram of part L. Figure 23 According to the embodiment along Figure 21 A cross-sectional view taken along line M-M'.

[0236] Reference Figure 21 and Figure 22 , except that the display device 100 according to the embodiment further includes a pressing layer PRSL covering the branch portion BRN of the power line VSPL, the display device 100 according to the embodiment and Figures 1 to 20 In addition, the bank BNK includes a first extension portion EXT1 and a first groove portion GR1, and one dam portion DM2 adjacent to the joining area JNA among the one or more dam portions DM includes a second extension portion EXT2 and a second groove portion GR2.

[0237] like Figure 21 and Figure 22 As shown in , according to an embodiment, the bank BNK disposed in the sub-region SBA may include a first extension portion EXT1 and a first groove portion GR1, the first extension portion EXT1 extending to a portion of the junction region JNA adjacent to the sub-region SBA, the first groove portion GR1 facing the branch portion BRN, being spaced apart from the branch portion BRN, and being recessed (e.g., recessedly recessed) in a direction away from the branch portion BRN compared to the first extension portion EXT1. As an example, the minimum distance GB by which the first groove portion GR1 of the bank BNK is spaced apart from the branch portion BRN in the second direction DR2 may be about 2 μm or more, but may correspond to a different distance in another embodiment.

[0238] In addition, one dam portion DM2 adjacent to the junction area JNA among one or more dam portions DM arranged in the dam area DMA may include a second extension portion EXT2 and a second groove portion GR2, the second extension portion EXT2 extending to another portion of the junction area JNA adjacent to the dam area DMA, the second groove portion GR2 facing the branch portion BRN and spaced apart from the branch portion BRN, and concavely recessed in a direction away from the branch portion BRN compared to the second extension portion EXT2. As an example, the minimum distance GD by which the second groove portion GR2 of one dam portion DM2 is spaced apart from the branch portion BRN in the second direction DR2 may be about 2 μm or more, but may be a different distance in another embodiment.

[0239] In this way, since the bank BNK can be set to have a relatively wide width by the first extension portion EXT1, damage such as separation or collapse of the bank BNK can be reduced. Similarly, since one dam portion DM2 can be set to have a relatively wide width by the second extension portion EXT2, damage such as separation or collapse of one dam portion DM2 can be reduced.

[0240] In addition, since the branch portion BRN of the power line VSPL may be spaced apart from the bank BNK and the one dam portion DM2 by the first groove portion GR1 of the bank BNK and the second groove portion GR2 of the one dam portion DM2, a warping defect or a corrosion defect of the branch portion BRN may be reduced.

[0241] like Figure 21 and Figure 22 As shown in FIG. 1 , the pressing layer PRSL according to an embodiment may cover the branch portions BRN and edges of the first and second groove portions GR1 and GR2 disposed around edges of the branch portions BRN.

[0242] Reference Figure 23 The pressing layer PRSL of the display device 100 according to the embodiment may be disposed on the branch portions BRN. Since the pressing layer PRSL may increase the adhesion of the branch portions BRN, the warping defect or corrosion defect of the branch portions BRN may be further reduced.

[0243] As an example, the pressing layer PRSL may be disposed at the same layer as the first touch conductive layer of the touch sensor layer 150 covered by the touch interlayer insulating layer 152. In this manner, a deposition process and a mask process for disposing the pressing layer PRSL may be omitted.

[0244] As described above, the organic light-emitting material used in a display device may rapidly deteriorate due to moisture or oxygen. To prevent such deterioration, the display device may include a sealing layer that seals a light-emitting element. The sealing layer may contact an inorganic insulating material of a circuit layer in a bonding region surrounding a dam region in a non-display area.

[0245] For example, in at least a part of the bonding region, an organic insulating material may not be provided. Thus, a lifting defect or a corrosion defect of a line provided in the bonding region may easily occur. Since the lifting defect or the corrosion defect of the line causes a penetration path of moisture or oxygen, the quality and the lifespan of the display device may deteriorate.

[0246] According to one or more embodiments, a display device is provided that can improve quality and lifespan by reducing a lifting defect or a corrosion defect of a line provided in a bonding region.

[0247] In addition, since the organic insulating material of each of the bank and the dam part is provided on the inorganic insulating material in the bonding region with a relatively thick thickness, a valley may occur at an edge where the organic insulating material and the inorganic insulating material are joined to each other, and a relatively high tension may be generated near the valley.

[0248] However, according to an embodiment, a branch portion of a power line (spaced apart from each of the bank including the organic insulating material and the dam part including the organic insulating material) is spaced apart from the valley occurring at an edge where the organic insulating material and the inorganic insulating material are joined to each other. Thus, since the influence of the tension near the valley on the branch portion of the power line can be reduced, the lifting defect and the corrosion defect of the branch portion of the power line can be reduced. Accordingly, the quality and the lifespan of the display device can be improved.

[0249] That is, according to an embodiment, the branch portion may be spaced apart from each of the bank including the organic insulating material and the dam part including the organic insulating material.

[0250] The effects of the present disclosure are not limited to the effects set forth herein. By referring to the claims, the above and other effects of the present disclosure will become more apparent to those of ordinary skill in the art to which the present disclosure pertains. Embodiments may be combined to form additional embodiments.

Claims

1. A display device, characterized in that: The display device comprises: substrate; A circuit layer is disposed on the substrate; a component layer, disposed on the circuit layer; and A sealing layer is provided on the element layer, wherein the substrate comprises a main region and a sub-region protruding from one side of the main region, The main area includes a display area in which a light emitting area is arranged and a non-display area provided around the display area, The non-display area includes a dam area, in which one or more dam portions surrounding the display area are arranged, and a bonding area surrounding the dam area. The sub-region includes a bending region that can be bent into a curved shape, a first sub-region disposed between one side of the bending region and the main region, and a second sub-region connected to the other side of the bending region, The circuit layer includes a power line configured to transmit power, The power line includes a main supply portion provided in the non-display area, a sub-connection portion extending from the main supply portion to the sub-area, and a branch portion provided in the bonding area and protruding from one side of the sub-connection portion, and The branch portion is spaced apart from a bank covering the bending hole of the bending region.

2. The display device according to claim 1, characterized in that The branch portion is spaced apart from the at least one dam portion.

3. The display device according to claim 2, characterized in that: The embankment comprises: a first extending portion extending to a portion of the joining region adjacent to the sub-region; and a first groove portion facing the branch portion, spaced apart from the branch portion, and concavely recessed in a direction spaced apart from the branch portion compared to the first extension portion, and A dam portion of the one or more dam portions adjacent to the joining region includes: a second extending portion extending to another portion of the joining region adjacent to the dam region; and The second groove portion faces the branch portion, is spaced apart from the branch portion, and is concavely recessed in a direction spaced apart from the branch portion compared to the second extension portion.

4. The display device according to claim 3, characterized in that: The display device further includes: A pressing layer is disposed on the branch portion and covers the branch portion, an edge of the first groove portion, and an edge of the second groove portion.

5. The display device according to claim 4, characterized in that: The display device further includes: A touch sensor layer is disposed on the sealing layer, Wherein, the touch sensor layer comprises: A first touch conductive layer, disposed on the sealing layer; a touch interlayer insulating layer, covering the first touch conductive layer; A second touch conductive layer, disposed on the touch interlayer insulating layer; and A touch planarization layer covering the second touch conductive layer, and The pressing layer and the first touch conductive layer are arranged on the same layer.

6. The display device according to claim 2, characterized in that: The branch portion includes one or more branch main portions and branch sub-portions, the one or more branch main portions extending in parallel with the sub-connection portion, the branch sub-portions connecting the sub-connection portion with the one or more branch main portions, and The branch sub-portion is arranged adjacent to the sub-region.

7. The display device according to claim 2, characterized in that: One edge of a portion of the sub-connection portion overlapping the bonding region includes an uneven portion arranged along an extending direction of the sub-connection portion, The edge of the branch portion includes an uneven portion arranged along an extending direction of the branch portion, and The uneven portion is spaced apart from the bank and the at least one dam portion.

8. The display device according to claim 2, characterized in that: The power line further includes a protrusion arranged along an edge of a portion of the sub-connection portion overlapping the bonding area and an edge of the branch portion, An edge of each of the protrusions has an uneven portion, and The protrusion is spaced apart from the bank and the at least one dam portion.

9. The display device according to claim 2, characterized in that: The power line includes a first power line and a second power line configured to transmit first power and second power having different voltage levels, respectively.

10. A display device, characterized in that: The display device includes a main area and a sub-area protruding from one side of the main area, the main area includes a display area and a non-display area arranged around the display area, Wherein, the display device comprises: a power supply line in the non-display area and including a sub-connection portion; and at least one dam in the circuit layer and surrounding the display area adjacent to the non-display area, wherein a bonding area included in the non-display area is between the at least one dam and a bending area included in the sub-area, and wherein the at least one dam limits the sealing layer from entering the joining area, and wherein the power cord comprises one or more branch portions located in the joining area and protruding from one side of the sub-connection portion, the one or more branch portions increasing the circumferential length of the sub-connection portion of the power cord.

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