BMS control circuit, BMS assembly and battery pack

Abstract

The utility model belongs to the technical field of batteries, and discloses a BMS control circuit, a BMS assembly and a battery pack, the BMS control circuit comprises a power supply unit, and a CAN communication module, a control unit and a sensing module which are respectively connected with the power supply unit; the power supply unit is used for providing electric energy for the CAN communication module, the control unit and the sensing module. The CAN communication module is connected with the control unit, and the CAN communication module is used for enabling the whole vehicle to be in communication connection with the control unit; the sensing module is connected with the control unit, and the sensing module is used for collecting sensing data of a battery pack of the whole vehicle in real time and sending the sensing data to the control unit. According to the utility model, the sensing module is integrated on the BMS control circuit, so that the mounting and dismounting processes of the battery system are simplified, the management cost and the possibility of errors are reduced, the space occupancy rate in the battery pack is reduced, and the electromagnetic compatibility and the anti-interference capability of the whole BMS are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of batteries, and in particular to a BMS control circuit, a BMS component and a battery pack. Background Art

[0002] The existing BMS (Battery Management System) usually uses external sensors to monitor battery packs. The sensors are located outside the BMS and inside the battery pack. That is, the BMS and the sensor are designed as separate units, and the sensor is connected to the BMS through a wiring harness, resulting in a non-integrated connection between the BMS and the sensor. The wiring harness needs to be plugged in and out during installation and removal, making installation and removal more inconvenient, and requiring a one-to-one correspondence between the BMS and the sensor in terms of inventory, which increases management costs. At the same time, the external sensor is an independent component with a large size, which occupies more space inside the battery pack. In addition, the external sensor is a certain distance from the main chip inside the BMS. When the wiring harness is too long, there will be EMC (Electromagnetic Compatibility) problems, which reduces the anti-interference ability of the entire BMS. Utility Model Content

[0003] The main purpose of the utility model is to provide a BMS control circuit, a BMS component and a battery pack, aiming to solve the technical problems that the existing BMS monitoring battery pack sensors usually adopt external sensors, and the BMS and sensors are designed as separate parts, resulting in inconvenient installation and disassembly, high management costs, large space occupancy and low anti-interference ability.

[0004] In order to achieve the above-mentioned utility model object, the utility model proposes a BMS control circuit, including a power supply unit, and a CAN communication module, a control unit and a sensor module respectively connected to the power supply unit;

[0005] The power supply unit is used to provide power to the CAN communication module, the control unit and the sensor module respectively;

[0006] The CAN communication module is connected to the control unit, and the CAN communication module is used to establish a communication connection between the entire vehicle and the control unit;

[0007] The sensor module is connected to the control unit, and is used to collect sensor data of the battery pack of the entire vehicle in real time and send the sensor data to the control unit.

[0008] Furthermore, the sensor module includes a sensor chip and an alarm circuit;

[0009] The alarm circuit includes a first resistor, a first MOS tube and a first filter circuit, wherein the first end of the first resistor is connected to the sensor chip, the second end of the first resistor is connected to the gate of the first MOS tube, the drain of the first MOS tube is connected to the first end of the first filter circuit, and the second end of the first filter circuit is connected to the control unit and grounded.

[0010] Furthermore, the alarm circuit also includes a second resistor, a first end of the second resistor is connected to the power supply unit and connected to the source of the first MOS tube, and a second end of the second resistor is connected to the connection line between the second end of the first resistor and the gate of the first MOS tube.

[0011] Furthermore, the sensor module also includes a reset and wake-up circuit, and the reset and wake-up circuit includes a signal voltage divider circuit, a second MOS tube and a third resistor;

[0012] The first end of the signal voltage divider circuit is connected to the control unit, the second end of the signal voltage divider circuit is connected to the gate of the second MOS tube and grounded, the source of the second MOS tube is connected to the sensor chip, the first end of the third resistor is connected to the connection line between the source of the second MOS tube and the sensor chip, and the second end of the third resistor is connected to the power supply unit.

[0013] Furthermore, the sensor module further includes a sensor communication circuit, and the sensor communication circuit includes a first RC filter circuit and a second RC filter circuit;

[0014] The first end of the first RC filter circuit is connected to the control unit, the second end of the first RC filter circuit is connected to the sensor chip and grounded, the first end of the second RC filter circuit is connected to the control unit and connected to the second end of the first RC filter circuit and the grounded line, and the second end of the second RC filter circuit is connected to the sensor chip.

[0015] Furthermore, the sensing module also includes a power supply filtering circuit, which includes a fourth resistor and a capacitor network, the first end of the fourth resistor is connected to the power supply unit, the second end of the fourth resistor is connected to the first end of the capacitor network and connected to the sensor chip, and the second end of the capacitor network is grounded.

[0016] A BMS component includes the BMS control circuit described in any of the above embodiments, and also includes an upper shell, a lower shell and a circuit board, the circuit board is arranged between the upper shell and the lower shell, and the upper shell is connected to the lower shell, and a plurality of through holes are arranged on the upper shell, and the through holes correspond to the sensor module arranged on the circuit board.

[0017] Furthermore, a boss is provided at the edge of the through hole, the boss protrudes in a direction away from the lower shell, and the boss extends along the circumference direction of the through hole.

[0018] Furthermore, a plurality of reinforcing ribs are arranged in the lower shell, and the reinforcing ribs protrude toward the upper shell by a specified height.

[0019] A battery pack includes the BMS assembly described in any of the above embodiments, and also includes a box body and a BMS slave control, wherein a limiting groove is provided on the box body, and the BMS assembly 16 and the BMS slave control are spaced apart and arranged in the limiting groove.

[0020] Beneficial effects:

[0021] The utility model discloses a BMS control circuit, comprising a power supply unit, and a CAN communication module, a control unit and a sensor module respectively connected to the power supply unit; the power supply unit is used to provide power to the CAN communication module, the control unit and the sensor module respectively; the CAN communication module is connected to the control unit, and the CAN communication module is used to communicate with the control unit to connect the whole vehicle; the sensor module is connected to the control unit, and the sensor module is used to collect the sensor data of the battery pack of the whole vehicle in real time, and send the sensor data to the control unit, so by integrating the sensor module in the BMS control circuit, the cost is reduced. The need for external connection harnesses simplifies the installation and removal process of the battery system and reduces the risk of failure caused by harness connection problems. The integration of the sensor module and BMS makes inventory management simpler. There is no need to track the matching of the sensor module and BMS separately, which reduces management costs and the possibility of errors. At the same time, it reduces the space occupied inside the battery pack because there is no need to reserve additional space for external sensors, which can provide more space for batteries or other components. In addition, the integrated design of the sensor module and BMS reduces the length of the harness, thereby reducing the risk of electromagnetic interference and improving the electromagnetic compatibility (EMC) and anti-interference capabilities of the entire BMS. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is an overall schematic diagram of a BMS control circuit according to an embodiment of the utility model;

[0023] Figure 2 A partial schematic diagram of a sensor module according to an embodiment of the utility model;

[0024] Figure 3 This is a schematic diagram of a sensor communication circuit according to an embodiment of the present utility model;

[0025] Figure 4 This is a schematic diagram of the overall structure of a BMS component according to an embodiment of the utility model;

[0026] Figure 5 Another embodiment of the present utility model Figure 4 A local enlarged view of point A;

[0027] Figure 6 The figure is a schematic diagram of the overall structure of a battery pack according to an embodiment of the present invention.

[0028] in:

[0029] 100. Power supply unit

[0030] Q10, sensor chip; 1. Alarm circuit; 2. Reset and wake-up circuit; 3. Power supply filter circuit;

[0031] R96, first resistor; Q14, first MOS tube; R95, second resistor; Q13, second MOS tube; R94, third resistor; R90, fourth resistor;

[0032] 5. Upper shell; 6. Lower shell; 7. Circuit board; 8. Through hole; 9. Sensor module; 10. Control unit; 11. Boss; 12. Reinforcement rib; 13. Box; 14. BMS slave control; 15. Limiting groove; 16. BMS assembly.

[0033] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0034] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0035] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0036] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0037] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0038] Reference Figure 1 , this embodiment provides a BMS control circuit, including a power supply unit 100, and a CAN communication module, a control unit and a sensor module respectively connected to the power supply unit 100;

[0039] The power supply unit 100 is used to provide power to the CAN communication module, the control unit and the sensor module respectively;

[0040] The CAN communication module is connected to the control unit, and the CAN communication module is used to establish a communication connection between the entire vehicle and the control unit;

[0041] The sensor module is connected to the control unit, and is used to collect sensor data of the battery pack of the entire vehicle in real time and send the sensor data to the control unit.

[0042] In the above embodiment, the BMS control circuit includes a power supply unit 100, a CAN communication module, a control unit and a sensor module, and the CAN communication module, the control unit and the sensor module are electrically connected to the power supply unit 100 respectively, wherein the power supply unit 100 is the core of the BMS control circuit, and the power supply unit 100 is responsible for providing stable power to all other modules. The power supply unit 100 includes a power supply module, namely a power management integrated circuit (PMIC, Power Management Integrated Circuit), which is used to obtain power from the battery pack and convert it into a voltage level suitable for the CAN (Controller Area Network) communication module, the control unit and the sensor module through the power chip in the power supply unit 100. The power supply unit 100 also includes overcurrent protection, short circuit protection and voltage monitoring functions to prevent power supply abnormalities from damaging the circuit, and the power supply module can also directly power the CAN communication module; the CAN communication module is connected to the control unit, wherein the control unit is an MCU (Microcontroller Unit), and the CAN communication module is a bridge for communication between the BMS and other electronic control units of the vehicle.It is based on the CAN bus protocol to achieve high-speed data exchange with the vehicle central control unit (VCU, Vehicle Control Unit), so that the CAN communication module is used to communicate and connect the whole vehicle with the MCU; the sensor module is connected to the control unit, wherein the sensor module is preferably an atmospheric pressure sensor, and the MCU is the brain of the BMS, responsible for processing the data from the atmospheric pressure sensor and executing the control algorithm to manage the battery pack. The MCU reads the sensor data through the internal ADC or through an external ADC connected to its I / O port. The atmospheric pressure sensor module is a key part of the BMS, which is used to monitor the pressure changes inside and outside the battery pack in real time, that is, the sensor module is used to collect the sensor data of the battery pack of the whole vehicle in real time and send the sensor data to the MCU. The atmospheric pressure sensor can sense tiny pressure changes and convert these changes into electrical signals. The sensor data is converted into digital signals through an analog-to-digital converter (ADC), and then sent to the MCU through a serial communication interface such as I2C or SPI; when the vehicle is started, the power supply unit 100 first provides a stable power supply for the CAN communication module, the MCU and the sensor module, and the MCU executes a self-test program, initializes the CAN communication module, and establishes a communication connection with the VCU (Vehicle Control Unit). Unit), the atmospheric pressure sensor starts to monitor the pressure changes of the battery pack in real time, and sends the collected data to the MCU. The MCU runs the battery management algorithm, such as SOC (State of Charge) estimation, SOH (State of Health) evaluation and balancing control. When the atmospheric pressure sensor detects an abnormal battery state or detects a potential safety hazard, the MCU immediately starts the protection mechanism, such as limiting the charging current, disconnecting the battery or triggering an alarm. Therefore, by integrating the sensor module on the BMS control circuit, the need for external connection harnesses is reduced, thereby simplifying the installation and removal process of the battery system and reducing the risk of failure caused by harness connection problems. In addition, due to the integration of the sensor module and the BMS, inventory management is simpler, and there is no need to track the matching of the sensor module and the BMS separately, reducing management costs and the possibility of errors. At the same time, the space occupied inside the battery pack is reduced, because there is no need to reserve additional space for the external sensor, which can provide more space for the battery or other components. In addition, the integrated design of the sensor module and the BMS reduces the length of the harness, thereby reducing the risk of electromagnetic interference and improving the electromagnetic compatibility (EMC) and anti-interference ability of the entire BMS.

[0043] Reference Figure 1 , Figure 2 In one embodiment, the sensor module includes a sensor chip Q10 and an alarm circuit 1;

[0044] The alarm circuit 1 includes a first resistor R96, a first MOS tube Q14 and a first filter circuit. The first end of the first resistor R96 is connected to the sensor chip Q10, the second end of the first resistor R96 is connected to the gate of the first MOS tube Q14, the drain of the first MOS tube Q14 is connected to the first end of the first filter circuit, and the second end of the first filter circuit is connected to the control unit and grounded.

[0045] In the above embodiment, the sensor module includes a sensor chip Q10 and an alarm circuit 1, wherein the alarm circuit 1 includes a first resistor R96, a first MOS tube Q14 and a first filter circuit. The model of the sensor chip Q10 is SNP805DL. The first end of the first resistor R96 is connected to the ALARM pin of the sensor chip Q10. The value of the first resistor R96 determines the conduction threshold of the first MOS tube Q14, that is, when the voltage output by the ALARM pin is higher than this threshold, the first MOS tube Q14 will be turned on. The second end of the first resistor R96 is connected to the gate of the first MOS tube Q14, and the drain of the first MOS tube Q14 is connected to the first end of the first filter circuit. The first MOS tube Q14 is used to control the output of the alarm signal. When the sensor chip Q10 detects abnormal pressure and outputs a high-level signal to the ALARM pin, the first MOS tube Q14 is turned on, thereby generating an alarm signal at its drain. The first filter circuit includes a resistor R 104, resistor R453 and capacitor C313, the function of the first filter circuit is to filter out the noise of the output signal of the drain of the first MOS tube Q14, to ensure that the signal transmitted to the MCU is clean and reliable, wherein the first end of the resistor R104 is connected to the drain of the first MOS tube Q14, the second end of the resistor R104 is grounded, the first end of the resistor R453 is connected to the connection line between the first end of the resistor R104 and the drain of the first MOS tube Q14, the second end of the resistor R453 is connected to the AI_BP_IN_WKUP pin of the MCU, the first end of the capacitor C313 is connected to the connection line between the second end of the resistor R453 and the AI_BP_IN_WKUP pin of the MCU, the second end of the capacitor C313 is grounded, the sensor module can not only monitor the pressure state of the battery pack in real time, but also can issue an alarm in time when an abnormal situation is detected, and effectively process it through the MCU, thereby ensuring the safe and reliable operation of the battery system;

[0046] Further, the alarm circuit 1 also includes a second resistor R95. The first end of the second resistor R95 is connected to the power supply unit 100, and the first end of the second resistor R95 is also connected to the source of the first MOS tube Q14, ensuring that the source of the first MOS tube Q14 is connected to the power supply voltage when the first MOS tube Q14 is in the off state. The second end of the second resistor R95 is connected to the connection line between the second end of the first resistor R96 and the gate of the first MOS tube Q14, forming a voltage divider circuit from the power supply unit 100 to the gate of the first MOS tube Q14. The second resistor R95 and the first resistor R96 constitute a voltage divider. When the ALARM pin of the sensor chip Q10 outputs a high level, the gate voltage of the MOS tube Q14 will increase, that is, when the atmospheric pressure sensor alarms, the ALARM pin of the sensor chip Q10 will output a low level, and V_3.3_STBY of the power supply unit 100 is electrically The resistor R95 and the resistor R96 divide the voltage to the gate-source of the first MOSFET Q14. The voltage across the resistor R95 exceeds the threshold voltage between the gate and source of the first MOSFET Q14, so that the first MOSFET Q14 is turned on. The drain of the first MOSFET Q14 has a voltage of 3.3V, which is then filtered and transmitted to the AI_BP_IN_WKUP pin of the MCU through the resistor R453 and the capacitor C313. At this time, the MCU detects an alarm signal. The turn-on threshold of the first MOSFET Q14 can be accurately controlled through the voltage divider of the resistor R95 and the resistor R96, which means that the first MOSFET Q14 will be turned on only when the voltage output by the ALARM pin of the sensor chip Q10 reaches the set threshold, thereby avoiding false triggering. At the same time, in normal operation, the first MOSFET Q14 is in a closed state, which reduces the standby current and helps to reduce the power consumption of the entire system.

[0047] Reference Figure 1 , Figure 2 In one embodiment, the sensor module further includes a reset and wake-up circuit 2, and the reset and wake-up circuit 2 includes a signal voltage divider circuit, a second MOS tube Q13 and a third resistor R94;

[0048] A first end of the signal voltage divider circuit is connected to the control unit, a second end of the signal voltage divider circuit is connected to the gate of the second MOS tube Q13 and is grounded, a source of the second MOS tube Q13 is connected to the sensor chip Q10, a first end of the third resistor R94 is connected to the connection line between the source of the second MOS tube Q13 and the sensor chip Q10, and a second end of the third resistor R94 is connected to the power supply unit 100.

[0049] In the above embodiment, the sensor module also includes a reset and wake-up circuit 2, which includes a signal voltage divider circuit, a second MOS tube Q13 and a third resistor R94. The voltage divider circuit includes a resistor R100 and a resistor R103, which is used to reduce the output voltage of the MCU to a voltage level suitable for the WAKE pin of the sensor chip Q10. The first end of the resistor R100 is connected to the MCU through the DO_SNP805_WAKE pin, the second end of the resistor R100 is connected to the gate of the second MOS tube Q13, and the first end of the resistor R103 is connected to the gate of the second MOS tube Q13. The second end of the resistor R100 is connected to the connection line of the gate of the second MOS tube Q13, the second end of the resistor R103 is grounded, the source of the second MOS tube Q13 is connected to the WAKE pin of the sensor chip Q10, and is used to receive a reset or wake-up signal from the MCU. The drain of the second MOS tube Q13 is grounded to ensure that the WAKE pin of the sensor chip Q10 is pulled low when the second MOS tube Q13 is in the off state. The first end of the third resistor R94 is connected to the connection line of the source of the second MOS tube Q13 and the WAKE pin of the sensor chip Q10. Provide a certain resistance value for the signal to prevent the circuit from being impacted by transient current. The second end of the third resistor R94 is connected to the power supply unit 100 to ensure that when the second MOS tube Q13 is turned on, the WAKE pin of the sensor chip Q10 can receive enough voltage to wake up the sensor. The wake pin of the sensor chip Q10 is valid at a low level by default. When there is no alarm signal, the sensor chip Q10 is in monitoring mode by default, and the wake pin is high level and is pulled up to 3.3V by V_3.3_STBY through the third resistor R94R94. When there is an alarm signal When the alarm signal is detected, the MCU sends a high level signal through DO_SNP805_WAKE, and then through the resistor R100 to the gate of the second MOS tube Q13Q13. The voltage across the resistor R103 is greater than the threshold voltage of the gate-source of the second MOS tube Q13Q13, so that the second MOS tube Q13Q13 is turned on, and the wake pin of the sensor chip Q10 is pulled down to the ground. At this time, the sensor chip Q10 switches to the continuous working mode. By ensuring that the sensor chip Q10 can quickly switch to the continuous working mode when an alarm signal is detected, the safety of the entire system is improved.

[0050] Reference Figure 1 , Figure 3 In one embodiment, the sensor module further includes a sensor communication circuit, and the sensor communication circuit includes a first RC filter circuit and a second RC filter circuit;

[0051] The first end of the first RC filter circuit is connected to the control unit, the second end of the first RC filter circuit is connected to the sensor chip Q10 and grounded, the first end of the second RC filter circuit is connected to the control unit and connected to the second end of the first RC filter circuit and the grounded line, and the second end of the second RC filter circuit is connected to the sensor chip Q10.

[0052] In the above embodiment, the sensing module also includes a sensing communication circuit, which includes a first RC filter circuit and a second RC filter circuit, wherein the first RC filter circuit is composed of a resistor R109 and a capacitor C70, a resistor R112 and a capacitor C71, a resistor R113 and a capacitor C72, a first end of the resistor R109 is connected to the DO-BP-SCLK pin of the MCU, and a second end of the resistor R109 is connected to the BP-SCLK pin of the sensor chip Q10 for controlling the communication clock signal, and a first end of the capacitor C70 is connected to the connection line between the second end of the resistor R109 and the BP-SCLK pin of the sensor chip Q10. The second end of the capacitor C70 is grounded to filter out high-frequency noise on the SCLK line; the first end of the resistor R112 is connected to the DO-BP-MOSI pin of the MCU, and the second end of the resistor R112 is connected to the BP-MOSI pin of the sensor chip Q10 to transmit the data signal; the first pin of the capacitor C71 is connected to the connection line between the second end of the resistor R112 and the BP-MOSI pin of the sensor chip Q10, and the second pin of the capacitor C71 is connected to the second end of the capacitor C70 and the grounded line to filter out high-frequency noise on the MOSI line; the first end of the resistor R113 is connected to the DO-BP-C The first end of the capacitor C72 is connected to the connection line between the second end of the resistor R113 and the BP-CS pin of the sensor chip Q10, and the second end of the capacitor C72 is connected to the second pin of the capacitor C71 and the ground line to filter out high-frequency noise on the CS line; the second RC filter circuit is composed of a resistor R111 and a capacitor C73, the first end of the resistor R111 is connected to the DI-BP-MISO pin of the MCU, and the second end of the resistor R111 is connected to the BP-MISO pin of the sensor chip Q10, to control the chip select signal of the communication, the first end of the capacitor C72 is connected to the connection line between the second end of the resistor R113 and the BP-CS pin of the sensor chip Q10, and the second end of the capacitor C72 is connected to the second pin of the capacitor C71 and the ground line to filter out high-frequency noise on the CS line; the second RC filter circuit is composed of a resistor R111 and a capacitor C73, the first end of the resistor R111 is connected to the DI-BP-MISO pin of the MCU, and the second end of the resistor R111 is connected to the BP-MISO pin of the sensor chip Q10, to For receiving data signals, the first end of capacitor C73 is connected to the connection line between the first end of resistor R111 and the DI-BP-MISO pin of MCU, and the second end of capacitor C73 is connected to the second end of capacitor C72 and the ground line, so as to filter out high-frequency noise on the MISO line. In the process of the atmospheric pressure sensor and BMU communicating through SPI communication, resistor R109 and capacitor C70, resistor R111 and capacitor C73, resistor R112 and capacitor C71, resistor R113 and capacitor C72 form an RC filtering circuit, which can effectively filter out signal interference and ensure the stability and accuracy of the signal.

[0053] Reference Figure 1 , Figure 2In one embodiment, the sensor module also includes a power supply filter circuit 3, the power supply filter circuit 3 includes a fourth resistor R90 and a capacitor network, the first end of the fourth resistor R90 is connected to the power supply unit 100, the second end of the fourth resistor R90 is connected to the first end of the capacitor network and connected to the sensor chip Q10, and the second end of the capacitor network is grounded.

[0054] In the above embodiment, the sensor module also includes a power supply filter circuit 3, which includes a fourth resistor R90 and a capacitor network. The first end of the fourth resistor R90 is connected to the power supply unit 100. The capacitor network is composed of a capacitor C60, a capacitor C61, a capacitor C62 and a capacitor C63, and the capacitors C60, C61, C62 and C63 are connected in parallel. The second end of the fourth resistor R90 is connected to the first end of the capacitor C60, and the second end of the fourth resistor R90 is connected to the VDD pin of the sensor chip Q10 through the first end of the capacitor C60 to power the sensor chip Q10. The second end of the capacitor C60 is grounded, and the first end of the capacitor C61 is connected to the connection line between the first end of the capacitor C60 and the VDD pin of the sensor chip Q10. The second end of the capacitor C61 is connected to the second end of the capacitor C60 and the grounded line to form a primary filter. The first end of the capacitor C62 is connected to the first end of the capacitor C61 and the sensor chip Q10. The second end of capacitor C62 is connected to the connection line of the VDD pin of the sensor chip Q10, the second end of capacitor C61 is connected to the ground line to form a secondary filter, the first end of capacitor C63 is connected to the VREF1 pin of the sensor chip Q10, the second end of capacitor C63 is connected to the second end of capacitor C62 and the ground line to provide a stable ground line for the reference voltage, the power supply unit 100 provides a stable voltage to the VDD pin of the sensor chip Q10 through the fourth resistor R90, each capacitor in the capacitor network acts as a local filter, they are connected in parallel, and can effectively filter out high-frequency noise on the power line, when noise appears on the power line, the capacitor network absorbs the noise through the process of charging and discharging, and keeps the power supply of the sensor chip Q10 stable, the fourth resistor R90 limits the sudden change of current, prevents voltage fluctuations, ensures that the voltages of the VDD pin and VREF1 pin of the sensor chip Q10 are stable, and improves the signal quality of the sensor chip Q10 by filtering out the noise on the power line.

[0055] Reference Figure 4 The utility model further proposes a BMS component 16, comprising the BMS control circuit described in any of the above embodiments, and also comprising an upper shell 5, a lower shell 6 and a circuit board 7, wherein the circuit board 7 is arranged between the upper shell 5 and the lower shell 6, and the upper shell 5 is connected to the lower shell 6, and a plurality of through holes 8 are arranged on the upper shell 5, and the through holes 8 correspond to the sensor module 9 arranged on the circuit board 7.

[0056] In the above embodiment, the BMS component 16 includes an upper shell 5, a lower shell 6 and a circuit board 7, and also includes a BMS control circuit, that is, the BMS component 16 is a device for using a BMS control circuit, and the BMS control circuit is formed on the circuit board 7, and the circuit board 7 is preferably a PCB (Printed Circuit Board) board. When the circuit board 7 is rectangular, the circuit board 7 is arranged between the upper shell 5 and the lower shell 6, and a snap-on structure is arranged on the long sides of the upper shell 5 and the lower shell 6, so that the upper shell 5 and the lower shell 6 are snap-connected to each other, ensuring that the circuit board 7 is firmly arranged between the upper shell 5 and the lower shell 6. In addition, at least two interfaces are formed at the short sides of the upper shell 5, wherein the interfaces are preferably power supply ports, relay interfaces, communication ports and high-voltage collection ports, and the power supply ports, relay interfaces, communication ports and high-voltage collection ports are symmetrically arranged on the upper shell 5. On the short sides of both sides, plug interfaces corresponding to the power supply port, relay interface, communication port and high-voltage collection port are arranged on the circuit board 7 to ensure that the wiring harness is connected to the plug interface of the circuit board 7 through the interface. The snap-fit ​​structure between the upper shell 5 and the lower shell 6 can ensure that the circuit board 7 is firmly arranged between the two, providing mechanical strength and stability to prevent the circuit board 7 from being displaced or damaged due to vibration or impact. At the same time, the interface design at the short sides of the upper shell 5 makes it easy to access interfaces such as power supply, relay, communication and high-voltage collection, which is convenient for maintenance, upgrading or replacement of wiring harnesses.

[0057] Furthermore, a plurality of through holes 8 are provided on the top plate of the upper housing 5. In addition, a sensor module 9 in the BMS control circuit, namely, an atmospheric pressure sensor, is provided on the circuit board 7, so that the atmospheric pressure sensor is electrically connected to a control unit 10 of the circuit board 7 through the BMS control circuit diagram on the circuit board 7. At the same time, the position of the atmospheric pressure sensor on the circuit board 7 corresponds to the position of the through hole 8 on the top plate of the upper housing 5, ensuring that the through hole 8 is located directly above the atmospheric pressure sensor, thereby maintaining the pressure value inside the BMS component 16 consistent with the pressure value outside the BMS, ensuring the accuracy of the detected pressure value, ensuring that the atmospheric pressure sensor is directly exposed to the external environment, providing accurate and reliable pressure measurement values, and not being affected by The influence of internal pressure changes of the BMS component 16; in addition, a boss 11 is provided on the edge of the through hole 8, and the boss 11 protrudes a certain height in the direction away from the lower shell 6, and the boss 11 extends along the entire circumference of the through hole 8. When the ambient temperature changes between high and low temperatures, the air liquefies, and there is a small probability that tiny dew will form on the upper shell 5. An anti-condensation design is formed at the edge of the through hole 8 by the boss 11. The plane of the boss 11 is higher than the plane of the upper shell 5, ensuring that tiny dew is not easy to flow into the inside of the BMS, reducing the risk of circuit short circuit or damage caused by condensation, and protecting internal electronic components such as MCU, sensors and other circuits, thereby improving the reliability of the entire BMS component 16.

[0058] Reference Figure 4 In one embodiment, a plurality of reinforcing ribs 12 are provided in the lower shell 6 , and the reinforcing ribs 12 protrude toward the upper shell 5 by a specified height.

[0059] In the above embodiment, a plurality of reinforcing ribs 12 are arranged on the bottom plate of the lower shell 6. The reinforcing ribs 12 are preferably regular hexagons, and the regular hexagonal reinforcing ribs 12 are arranged in an array in the lower shell 6. At the same time, the reinforcing ribs 12 protrude toward the upper shell 5 at a specified height. In addition, reinforcing ribs corresponding to the reinforcing ribs 12 can also be arranged inside the upper shell 5, so that the reinforcing ribs 12 have a certain height on the lower shell 6. At the same time, a plurality of limiting columns connected to the reinforcing ribs 12 are arranged on the bottom plate of the lower shell 6. The limiting columns are used to pass through the circuit board 7 so that the circuit board 7 is positioned on the lower shell 6 through the limiting columns, ensuring that when the circuit board 7 is placed on the lower shell 6, the circuit board 7 passes through the specified height of the reinforcing ribs 12, which can effectively avoid the circuit board 7 from directly contacting the bottom plate of the lower shell 6, thereby reducing the risk of short circuit or damage caused by contact, and the reinforcing ribs 12 provide additional surface area, which helps to disperse the heat of the circuit board 7 and improve the heat dissipation conditions of the circuit board 7.

[0060] Reference Figure 4-Figure 6 The utility model further proposes a battery pack, comprising the BMS assembly 16 described in any of the above embodiments, and also comprising a box body 13 and a BMS slave control 14, wherein a limiting groove 15 is arranged on the box body 13, and the BMS assembly 16 and the BMS slave control 14 are spaced apart in the limiting groove 15.

[0061] In the above embodiment, the battery pack includes a BMS component 16, a box body 13 and a BMS slave control 14, wherein a limiting groove 15 is provided on the box body 13, and the limiting groove is a limiting space that can be given to the BMS in the battery pack. The BMS component 16 and the BMS slave control 14 are fixedly connected in the limiting groove 15, and the fixed connection method is preferably installed by screws, buckles or other appropriate fixing mechanisms, and the BMS component 16 and the BMS slave control 14 are arranged at intervals to ensure that there is enough space between them for heat dissipation and maintenance. In addition, the BMS slave control 14 can also be a battery The pack can provide other products in the limited space of the BMS. The BMS component 16 serves as the master control of the BMS, and the BMS slave control 14 is used to assist the BMS component 16 in managing and controlling the battery pack. It can be an additional monitoring device, data recorder or other auxiliary control unit 10. When the BMS is needed to detect the status inside the battery pack, the BMS component 16 and the slave control are placed in the given space limiting slot 15 of the battery pack case 13 to detect the status inside the battery pack. Through the precisely designed limiting slot 15, the space inside the battery pack can be effectively utilized.

[0062] Furthermore, when the BMS component 16 is fixedly connected in the limiting groove 15, the overall height of the BMS component 16 is less than or equal to the depth of the limiting groove 15, and when the BMS slave control 14 is fixedly connected in the limiting groove 15, the overall height of the BMS slave control 14 is less than or equal to the depth of the limiting groove 15, ensuring that the BMS component 16 and the BMS slave control 14 are compactly installed in the battery pack, maximizing the use of limited space, and helping to reduce the overall size and weight of the battery pack. By ensuring that the component height matches the depth of the limiting groove 15, the stability of the installation can be improved and displacement or damage caused by vibration or impact during transportation and use can be reduced.

[0063] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A BMS control circuit, characterized in that: It includes a power supply unit, and a CAN communication module, a control unit and a sensor module respectively connected to the power supply unit; The power supply unit is used to provide power to the CAN communication module, the control unit and the sensor module respectively; The CAN communication module is connected to the control unit, and the CAN communication module is used to establish a communication connection between the entire vehicle and the control unit; The sensor module is connected to the control unit, and is used to collect sensor data of the battery pack of the entire vehicle in real time and send the sensor data to the control unit.

2. The BMS control circuit according to claim 1, characterized in that: The sensor module includes a sensor chip and an alarm circuit; The alarm circuit includes a first resistor, a first MOS tube and a first filter circuit, wherein the first end of the first resistor is connected to the sensor chip, the second end of the first resistor is connected to the gate of the first MOS tube, the drain of the first MOS tube is connected to the first end of the first filter circuit, and the second end of the first filter circuit is connected to the control unit and grounded.

3. The BMS control circuit according to claim 2, characterized in that: The alarm circuit also includes a second resistor, a first end of which is connected to the power supply unit and to the source of the first MOS tube, and a second end of the second resistor is connected to a connection line between the second end of the first resistor and the gate of the first MOS tube.

4. The BMS control circuit according to claim 2, characterized in that: The sensor module also includes a reset and wake-up circuit, which includes a signal voltage divider circuit, a second MOS tube and a third resistor; The first end of the signal voltage divider circuit is connected to the control unit, the second end of the signal voltage divider circuit is connected to the gate of the second MOS tube and grounded, the source of the second MOS tube is connected to the sensor chip, the first end of the third resistor is connected to the connection line between the source of the second MOS tube and the sensor chip, and the second end of the third resistor is connected to the power supply unit.

5. The BMS control circuit according to claim 2, characterized in that: The sensing module further includes a sensing communication circuit, and the sensing communication circuit includes a first RC filter circuit and a second RC filter circuit; The first end of the first RC filter circuit is connected to the control unit, the second end of the first RC filter circuit is connected to the sensor chip and grounded, the first end of the second RC filter circuit is connected to the control unit and connected to the second end of the first RC filter circuit and the grounded line, and the second end of the second RC filter circuit is connected to the sensor chip.

6. The BMS control circuit according to claim 2, characterized in that: The sensing module also includes a power supply filtering circuit, which includes a fourth resistor and a capacitor network. The first end of the fourth resistor is connected to the power supply unit, the second end of the fourth resistor is connected to the first end of the capacitor network and the sensor chip, and the second end of the capacitor network is grounded.

7. A BMS component, comprising the BMS control circuit according to any one of claims 1 to 6, characterized in that: It also includes an upper shell, a lower shell and a circuit board, wherein the circuit board is arranged between the upper shell and the lower shell, and the upper shell is connected to the lower shell, a plurality of through holes are arranged on the upper shell, and the through holes correspond to the sensor module arranged on the circuit board.

8. The BMS assembly according to claim 7, characterized in that: A boss is arranged at the edge of the through hole, the boss protrudes in a direction away from the lower shell, and the boss extends along the circumference direction of the through hole.

9. The BMS assembly according to claim 7, characterized in that: A plurality of reinforcing ribs are arranged in the lower shell, and the reinforcing ribs protrude toward the upper shell by a specified height.

10. A battery pack, comprising the BMS assembly according to any one of claims 7 to 9, characterized in that: It also includes a box body and a BMS slave control, wherein a limiting groove is arranged on the box body, and the BMS component and the BMS slave control are spaced apart and arranged in the limiting groove.

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