High-frequency infrared multi-element analyzer

Abstract

The utility model relates to the technical field of infrared analyzers, and discloses a high-frequency infrared multi-element analyzer, which comprises a main body mechanism and an auxiliary mechanism, the auxiliary mechanism is arranged at the outer end of the main body mechanism, the main body mechanism comprises an analyzer body, a cooling box and an air outlet, the cooling box is fixedly arranged at the right end of the upper end of the analyzer body, and the air outlet is arranged at the right end of the upper end of the analyzer body. The air outlet is fixedly formed in the middle of the upper end of the cooling box; the main body mechanism further comprises a filter element, a sealing ring, mounting plates, an electric push rod and a clamping plate, the filter element is movably mounted at the outer end of the air outlet, the sealing ring is fixedly mounted at the lower end of the filter element and movably connected with the air outlet, and the mounting plates are fixedly mounted at the front end and the rear end of the upper end of the cooling box. According to the high-frequency infrared multi-element analyzer, by installing the main body mechanism, high-temperature harmful gas can be conveniently filtered and cooled, the working environment is protected, the safety is improved, the health of workers is guaranteed, the functionality is improved, and the practicability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of infrared analyzers, in particular to a high-frequency infrared multi-element analyzer. Background Technique

[0002] The analyzer uses infrared rays for gas analysis. Based on the different concentrations of the components to be analyzed, the absorbed radiant energy is different. The remaining radiant energy causes different temperature increases in the detector, and different pressures are applied on both sides of the moving film, thereby generating an electrical signal of a capacitance detector, and the concentration of the component to be analyzed can be indirectly measured.

[0003] In the prior art patent document with the publication number CN212646473U, a high-frequency infrared multi-element analyzer is disclosed. An optical waveguide is installed on the front side of the analyzer main body, an infrared lamp is installed on the upper side of the optical waveguide, a receiving sensor is installed on the lower side of the optical waveguide, a heat-conducting pad is sleeved on the circumferential side of the optical waveguide, an upper heat-insulating cover is installed on the upper side of the heat-conducting pad, a lower heat-insulating cover is installed on the lower side of the upper heat-insulating cover, a heat-insulating fixing shell is installed between the upper heat-insulating cover and the lower heat-insulating cover, an electric heating tube is installed inside the heat-insulating fixing shell, a protective sleeve is fixed on the right side of the circumferential side of the heat-insulating fixing shell, and an electrode is installed inside the protective sleeve. This design solves the problem that the original high-frequency infrared multi-element analyzer cannot be heat-insulated. The utility model has a reasonable structure, is convenient for combined installation, and has a good heat-insulating effect.

[0004] However, in the prior art of the patent CN212646473U, some samples will generate high-temperature and harmful gases during the analysis process. The prior art is not convenient for filtering and cooling the high-temperature and harmful gases, not convenient for protecting the health of the staff, and has low functionality and low practicability. Content of the Utility Model

[0005] The purpose of the utility model is to provide a high-frequency infrared multi-element analyzer to solve the problem of inconvenient filtering and cooling of high-temperature and harmful gases proposed in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A high-frequency infrared multi-element analyzer includes a main body mechanism and an auxiliary mechanism. The auxiliary mechanism is located at the outer end of the main body mechanism. The main body mechanism includes an analyzer main body, a cooling box and an air outlet. The cooling box is fixedly installed at the right end of the upper end of the analyzer main body, and the air outlet is fixedly arranged in the middle of the upper end of the cooling box;

[0007] The main body mechanism further includes a filter element, a sealing ring, a mounting plate, an electric push rod, and a clamping plate. The filter element is movably installed at the outer end of the air outlet. The sealing ring is fixedly installed at the lower end of the filter element. The sealing ring is movably connected to the air outlet. The mounting plate is fixedly installed at the front and rear ends of the upper end of the cooling box. The electric push rod is fixedly installed in the middle of the mounting plate. The clamping plate is fixedly installed in the middle of the transmission end of the electric push rod. The clamping plate is located at the front and rear ends of the filter element. The clamping plate is movably connected to the filter element.

[0008] Preferably, the auxiliary mechanism includes a ventilation opening, a ventilation metal plate, a semiconductor refrigeration chip, heat dissipation fins, a display panel, control buttons, an air inlet, a bottom plate, and support feet. The ventilation opening is fixedly arranged at the lower end of the cooling box, which improves the practicability.

[0009] Preferably, the ventilation metal plate is fixedly installed in the middle of the inner end of the cooling box. The semiconductor refrigeration chip is fixedly installed on the upper end of the ventilation metal plate, which is convenient for refrigerating the ventilation metal plate to keep it in a low-temperature state, improving the cooling effect of the ventilation metal plate on high-temperature and harmful gases.

[0010] Preferably, the heating end of the semiconductor refrigeration chip extends to the left side of the cooling box. The heat dissipation fins are fixedly installed at the upper and lower ends of the heating end of the semiconductor refrigeration chip, which is convenient for dissipating heat from the heating end of the semiconductor refrigeration chip, increasing the contact area with the air, improving the heat dissipation efficiency, and enhancing the refrigeration effect.

[0011] Preferably, the display panel is fixedly installed at the left end of the front end of the analyzer body. The control buttons are movably installed at the lower end of the left end of the front end of the analyzer body, which is convenient for the staff to use.

[0012] Preferably, the air inlet is fixedly arranged at the right end of the front end of the analyzer body. The bottom plate is fixedly installed at the lower end of the analyzer body. The support feet are fixedly installed at the lower end of the bottom plate, which improves the practicability.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] 1. For this high-frequency infrared multi-element analyzer, by installing the main body mechanism, it is convenient to filter and cool high-temperature and harmful gases, protecting the working environment, improving safety, ensuring the health of the staff, enhancing functionality, and improving practicability.

[0015] 2. For this high-frequency infrared multi-element analyzer, by installing the auxiliary mechanism, the semiconductor refrigeration chip is convenient for refrigerating the ventilation metal plate to keep it in a low-temperature state, improving the cooling effect of the ventilation metal plate on high-temperature and harmful gases. The heat dissipation fins are convenient for dissipating heat from the heating end of the semiconductor refrigeration chip, increasing the contact area with the air, improving the heat dissipation efficiency, and enhancing the refrigeration effect. Brief Description of the Drawings

[0016] Figure 1 This is a three-dimensional structural schematic diagram of the present utility model;

[0017] Figure 2 This is a partial structural schematic diagram of the auxiliary mechanism of the present utility model;

[0018] Figure 3 This is a sectional structural schematic diagram of the present utility model;

[0019] Figure 4 This is the present utility model Figure 1 Partial detailed enlarged structural schematic diagram.

[0020] In the figure: 1. Main body mechanism; 101. Analyzer body; 102. Cooling box; 103. Air outlet; 104. Filter element; 105. Sealing ring; 106. Mounting plate; 107. Electric push rod; 108. Clamping plate; 2. Auxiliary mechanism; 201. Ventilation opening; 202. Ventilation metal plate; 203. Thermoelectric cooler; 204. Heat dissipation fins; 205. Display panel; 206. Control button; 207. Air inlet; 208. Bottom plate; 209. Support feet. Detailed Description of the Preferred Embodiment

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0022] Please refer to Figures 1-4 , the present utility model provides a technical solution: a high-frequency infrared multi-element analyzer, including a main body mechanism 1 and an auxiliary mechanism 2. The auxiliary mechanism 2 is located at the outer end of the main body mechanism 1. The main body mechanism 1 includes an analyzer body 101, a cooling box 102 and an air outlet 103. The cooling box 102 is fixedly installed at the right end of the upper end of the analyzer body 101, and the air outlet 103 is fixedly arranged in the middle of the upper end of the cooling box 102;

[0023] The main body mechanism 1 further includes a filter element 104, a sealing ring 105, a mounting plate 106, an electric push rod 107 and a clamping plate 108. The filter element 104 is movably installed at the outer end of the air outlet 103. The sealing ring 105 is fixedly installed at the lower end of the filter element 104. The sealing ring 105 is movably connected to the air outlet 103. The mounting plate 106 is fixedly installed at the front and rear ends of the upper end of the cooling box 102. The electric push rod 107 is fixedly installed in the middle of the mounting plate 106. The clamping plate 108 is fixedly installed in the middle of the transmission end of the electric push rod 107. The clamping plate 108 is located at the front and rear ends of the filter element 104. The clamping plate 108 is movably connected to the filter element 104. The harmful gas after being discharged will pass through the filter element 104, and the filter element 104 filters the harmful gas to avoid polluting the environment. After long-term use, the staff needs to replace the filter element 104. The electric push rod 107 drives the clamping plate 108 to move to both sides to loosen the filter element 104, and the staff can replace the filter element 104. After putting the filter element 104 back in place, the electric push rod 107 pushes the clamping plate 108 to clamp and fix the filter element 104 to improve the placement stability. The sealing ring 105 improves the sealing performance of the connection between the filter element 104 and the air outlet 103.

[0024] The auxiliary mechanism 2 includes a ventilation port 201, a ventilation metal plate 202, a semiconductor refrigeration chip 203, heat dissipation fins 204, a display panel 205, control buttons 206, an air inlet 207, a bottom plate 208 and support feet 209. The ventilation port 201 is fixedly arranged at the lower end of the cooling box 102. The ventilation metal plate 202 is fixedly installed in the middle of the inner end of the cooling box 102. The semiconductor refrigeration chip 203 is fixedly installed on the upper end of the ventilation metal plate 202. The heating end of the semiconductor refrigeration chip 203 extends to the left side of the cooling box 102. The heat dissipation fins 204 are fixedly installed at the upper and lower ends of the heating end of the semiconductor refrigeration chip 203. The display panel 205 is fixedly installed at the left end of the front end of the analyzer body 101. The control buttons 206 are movably installed at the lower end of the left end of the front end of the analyzer body 101. The air inlet 207 is fixedly arranged at the right end of the front end of the analyzer body 101. The bottom plate 208 is fixedly installed at the lower end of the analyzer body 101. The support feet 209 are fixedly installed at the lower end of the bottom plate 208. During the analysis process, some samples will generate high-temperature and harmful gases. The high-temperature and harmful gases enter the cooling box 102 through the ventilation port 201. The refrigeration end of the semiconductor refrigeration chip 203 cools the ventilation metal plate 202 to keep it in a low-temperature state. The heating end of the semiconductor refrigeration chip 203 is located outside the cooling box 102 and does not affect the refrigeration effect. Moreover, the heat dissipation fins 204 increase the contact area with the air to dissipate heat for the heating end of the semiconductor refrigeration chip 203. The high-temperature and harmful gases pass through the ventilation metal plate 202 and then are discharged through the air outlet 103 after the temperature drops.

[0025] Working principle: First, when using the high-frequency infrared multi-element analyzer, the staff puts the sample to be detected into the analyzer body 101. During the analysis process, some samples will generate high-temperature and harmful gases. The high-temperature and harmful gases enter the cooling box 102 through the ventilation port 201. The cooling end of the semiconductor refrigeration sheet 203 cools the ventilation metal plate 202 to keep it in a low-temperature state. The heating end of the semiconductor refrigeration sheet 203 is located outside the cooling box 102 and does not affect the refrigeration effect. Moreover, the heat dissipation fins 204 increase the contact area with the air to dissipate heat for the heating end of the semiconductor refrigeration sheet 203. After the temperature of the high-temperature and harmful gases becomes lower after passing through the ventilation metal plate 202, they are discharged through the air outlet 103. The discharged harmful gases will pass through the filter element 104, and the filter element 104 filters the harmful gases to avoid environmental pollution by harmful gases. After long-term use, the staff needs to replace the filter element 104. The electric push rod 107 drives the clamping plate 108 to move to both sides to loosen the filter element 104, and the staff can then replace the filter element 104. After putting the filter element 104 back in place, the electric push rod 107 pushes the clamping plate 108 to clamp and fix the filter element 104 to improve the placement stability. The sealing ring 105 improves the sealing performance of the connection between the filter element 104 and the air outlet 103.

[0026] Finally, it should be noted that the above content is only used to illustrate the technical solution of the present invention, rather than a limitation on the protection scope of the present invention. Any simple modification or equivalent replacement made by those of ordinary skill in the art to the technical solution of the present invention shall not depart from the essence and scope of the technical solution of the present invention.

Claims

1. A high-frequency infrared multi-element analyzer, comprising a main mechanism (1) and an auxiliary mechanism (2), characterized in that: The auxiliary mechanism (2) is located at the outer end of the main mechanism (1); the main mechanism (1) comprises an analyzer body (101), a cooling box (102) and an air outlet (103); the cooling box (102) is fixedly mounted at the right end of the upper end of the analyzer body (101); and the air outlet (103) is fixedly arranged at the middle of the upper end of the cooling box (102); The main body mechanism (1) further comprises a filter element (104), a sealing ring (105), a mounting plate (106), an electric push rod (107) and a clamping plate (108); the filter element (104) is movably mounted on the outer end of the air outlet (103); the sealing ring (105) is fixedly mounted on the lower end of the filter element (104); the sealing ring (105) is movably connected to the air outlet (103); the mounting plate (106) is fixedly mounted on the front and rear ends of the upper end of the cooling box (102); the electric push rod (107) is fixedly mounted on the middle part of the mounting plate (106); the clamping plate (108) is fixedly mounted on the middle part of the transmission end of the electric push rod (107); the clamping plate (108) is located on the front and rear ends of the filter element (104); and the clamping plate (108) is movably connected to the filter element (104).

2. A high frequency infrared multi-element analyzer according to claim 1, characterized in that: The auxiliary mechanism (2) comprises a vent (201), a ventilation metal plate (202), a semiconductor cooling sheet (203), a heat dissipation fin (204), a display panel (205), a control button (206), an air inlet (207), a bottom plate (208) and a support foot (209); the vent (201) is fixedly arranged at the lower end of the cooling box (102).

3. A high frequency infrared multi-element analyzer according to claim 2, characterized in that: The ventilation metal plate (202) is fixedly mounted at the middle of the inner end of the cooling box (102), and the semiconductor cooling sheet (203) is fixedly mounted at the upper end of the ventilation metal plate (202).

4. A high frequency infrared multi-element analyzer according to claim 3, characterized in that: The heating end of the semiconductor refrigeration plate (203) extends to the left side of the cooling box (102), and the heat dissipation fins (204) are fixedly mounted on the upper and lower ends of the heating end of the semiconductor refrigeration plate (203).

5. A high frequency infrared multi-element analyzer according to claim 4, characterized in that: The display panel (205) is fixedly mounted on the left end of the front end of the analyzer body (101), and the control button (206) is movably mounted on the lower end of the left end of the front end of the analyzer body (101).

6. A high frequency infrared multi-element analyzer according to claim 5, characterized in that: The air inlet (207) is fixedly arranged at the right end of the front end of the analyzer body (101), the bottom plate (208) is fixedly installed at the lower end of the analyzer body (101), and the supporting foot (209) is fixedly installed at the lower end of the bottom plate (208).

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