Novel radar sensor structure

Abstract

The utility model discloses a novel radar sensor structure which comprises an element circuit layer, the element circuit layer is fixedly laid on the bottom surface of a PCB substrate, an onboard antenna is fixed on the top surface of the PCB substrate and is electrically connected with an electrical element of the element circuit layer, and the onboard antenna, the PCB substrate and the element circuit layer are stacked to form a laminated structure. The metal column is connected to the bottom surface of the PCB substrate and is used for supporting the laminated structure, the fixing cover is provided with an accommodating cavity for completely accommodating the electrical components in the component circuit layer, and the fixing cover is buckled on the bottom surface of the PCB substrate and completely accommodates the electrical components in the accommodating cavity; according to the utility model, the onboard antenna, the PCB substrate and the element circuit layer are designed into a laminated structure, the size of the sensor is reduced, the sensor similar to a surface-mounted form is manufactured by planting the metal columns on the low-cost PCB substrate, the size of the sensor is reduced, the manufacturing cost of the radar sensor is also controlled, and the radar sensor is suitable for large-scale popularization and application. And the production of the product is facilitated.

Description

Technical Field

[0001] The utility model relates to the field of radar systems, and particularly to a novel radar sensor structure. Background Art

[0002] Traditional radar sensor modules are mainly divided into three categories. The first uses discrete components to design oscillators, mixers, and microstrip filter circuits, etc., which are typical distributed circuit characteristics, occupying a large volume and requiring a shielding structure for assembly, with a large volume and high cost. The second is the mainstream product on the market at present, which is based on semiconductor chips as the main circuit, with externally placed components and antennas with matching parameters, and most are produced by SMT patching. The product is in the form of PCBA, with a large volume, resulting in limited use of the product. The third is the AIP packaging form, which uses a silicon substrate or a ceramic substrate to carry on-board antennas and externally placed elements with matching parameters. The product is in the form of a chip, with a small volume and high integration, but the cost is very high. Summary of the Utility Model

[0003] The purpose of the utility model is to solve the problems of large volume and high cost of traditional radar sensors, and provide a novel radar sensor structure.

[0004] The purpose of the utility model is mainly achieved through the following technical solutions:

[0005] An embodiment of the present application provides a novel radar sensor structure, which includes:

[0006] An element circuit layer, which is fixedly laid on the bottom surface of the PCB substrate;

[0007] An on-board antenna, which is fixedly laid on the top surface of the PCB substrate and is electrically connected to the electrical components of the element circuit layer. The on-board antenna, the PCB substrate, and the element circuit layer are stacked to form a stacked structure;

[0008] Metal columns, which are connected to the bottom surface of the PCB substrate and are used to support the stacked structure.

[0009] Further, the on-board antenna is electrically connected to the electrical components of the element circuit layer by means of a feeder, a via, a capacitor, or a slot coupling.

[0010] Further, the PCB substrate is a multi-layer circuit board with a double-sided PCB board as the inner layer and two single-sided PCB boards as the outer layers.

[0011] Further, the metal columns are electrically connected to the circuit of the element circuit layer.

[0012] Further, a pad for connecting to the metal columns is also provided on one side of the PCB substrate, and the metal columns are connected to the circuit through the pads.

[0013] Furthermore, the composition of the radar sensor structure further includes:

[0014] A fixed cover, which has a receiving cavity for completely accommodating the electrical components in the component circuit layer and partially accommodating the metal posts. The fixed cover is buckled on the bottom surface of the PCB substrate, completely accommodating the electrical components in the receiving cavity and partially accommodating the metal posts in the receiving cavity.

[0015] Furthermore, an air pressure balance hole is also provided at the center of the cover plate of the fixed cover.

[0016] Furthermore, the fixed cover and the metal posts are of an integrally formed structure. One end of the metal post is accommodated in the receiving cavity and connected to the PCB substrate, and the other end penetrates through the fixed cover and extends to the outside of its cover surface.

[0017] Furthermore, an anti-slip pattern is provided at one end of the metal post extending to the outside of the fixed cover.

[0018] Furthermore, the metal post is a spherical metal post, a cubic metal post or a cylindrical metal post.

[0019] In summary, the advantages of this design scheme are:

[0020] (1) The present utility model innovatively adopts the method of laminated design, designing the board-mounted antenna, the PCB substrate and the component circuit layer into a laminated structure, reducing the volume of the sensor.

[0021] (2) By implanting metal posts on a low-cost PCB substrate, a sensor in the form of component mounting similar to AIP packaging is manufactured. While reducing the size of the sensor, the manufacturing cost of this radar sensor is also controlled, facilitating the design, development and production of this product. Description of the Drawings

[0022] The drawings described herein are used to provide a further understanding of the embodiments of the present utility model, form a part of this application, and do not constitute a limitation to the embodiments of the present utility model. In the drawings:

[0023] Figure 1 It is a schematic diagram of the device when the metal post is a spherical metal post;

[0024] Figure 2 It is a schematic diagram of the device when the metal post is a cubic metal post or a cylindrical metal post;

[0025] Figure 3 It is a schematic diagram of the component circuit layer and the spherical metal post of the device;

[0026] Figure 4 It is a schematic diagram of the air pressure balance hole of the device.

[0027] The names corresponding to the reference numerals are:

[0028] 1 - On - board antenna; 2 - PCB substrate; 3 - Component circuit layer; 4 - Fixed cover; 5 - Metal; 6 - Air pressure balance hole. Specific implementation mode

[0029] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present utility model, and should not be construed as a limitation of the present utility model.

[0030] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model.

[0031] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, the meaning of "plurality" is two or more unless otherwise specifically defined.

[0032] In the present utility model, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0033] In the present utility model, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over" and "on the top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under" and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0034] In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions leads to contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope disclosed in the present utility model.

[0035] In the subsequent descriptions, the use of suffixes such as "module", "component", "assembly" or "unit" is only for the convenience of the description of the present utility model, and they have no specific meaning in themselves. Therefore, they can be used interchangeably.

[0036] The present utility model will be further described in detail below through specific embodiments in conjunction with the accompanying drawings.

[0037] According to an embodiment of the present utility model, as Figure 1 and Figure 3 shown, a novel radar sensor structure includes:

[0038] An element circuit layer 3, which is fixedly laid on the bottom surface of the PCB substrate 2; wherein, the element circuit layer 3 includes a circuit layer and small electronic components soldered thereon;

[0039] A board-mounted antenna 1, which is fixedly laid on the top surface of the PCB substrate 2 and is electrically connected to the electrical components of the element circuit layer 3. The board-mounted antenna 1, the PCB substrate 2 and the element circuit layer 3 are stacked to form a stacked structure;

[0040] A metal column 5, which is connected to the bottom surface of the PCB substrate 2 and is used to support the stacked structure.

[0041] In this embodiment, the PCB substrate 2 can adopt an FR-4 substrate, a Cem-1 substrate or an FR-2 substrate, etc.

[0042] Traditional radar sensor modules, such as pulsed radars, often require the use of a large number of discrete components, such as transistors, resistors, and capacitors. These components have relatively large physical sizes and usually occupy a large amount of space. At the same time, each discrete component is responsible for a specific function, resulting in a scattered and complex circuit design that must rely on more components to complete signal processing. Therefore, such radar sensors are relatively large in size and high in cost, which limits their applications in some fields. For phased array radars, due to the external matching components, antenna design requirements, increased PCB area, heat dissipation and protection measures, as well as the additional space occupied by modular design, the volume of such products is relatively large, facing certain limitations in space adaptation and affecting their applications in many scenarios. For microwave radars, in order to improve the performance of the radar, high-quality and high-cost silicon substrates or ceramic substrates are often used, which results in high costs and is not conducive to market promotion and popularization.

[0043] Based on years of industry experience and understanding of radar sensors, the inventors of the present application designed a new type of radar sensor on the basis of PCBA. By welding the on-board antenna 1 and the component circuit layer 3 to the bottom and top surfaces of the PCB substrate 2 respectively, a multi-layer circuit board stack structure is formed, integrating the miniaturized antenna and various electronic components closely. Compared with traditional pulsed radars and phased array radars, the volume of this radar structure is significantly reduced. At the same time, metal posts 5 are innovatively implanted on the low-cost PCB substrate 2, making the component circuit layer 3 directly serve as the mounting surface of the sensor, further reducing the overall size of the sensor while controlling its cost and facilitating the design, development, and production of the product.

[0044] According to an embodiment of the present invention, the on-board antenna 1 is electrically connected to the electrical components of the component circuit layer 3 through a feeder, via, capacitor, or slot coupling method.

[0045] In this embodiment, a small gap is left between the on-board antenna 1 and the component circuit layer 3. When the radio frequency signal propagates on the on-board antenna 1, an electromagnetic field will be generated, passing through the small gap to reach the component circuit layer 3, thereby inducing current or voltage in the electrical components in the component circuit layer 3, and then completing signal transmission and connection. Using the slot coupling connection method can avoid introducing additional connection lines or connectors, making use of the original structural space and making the overall structure of the radar sensor appear more compact.

[0046] According to an embodiment of the present invention, the PCB substrate is a multi-layer circuit board with a double-sided PCB board as the inner layer and two single-sided PCB boards as the outer layers.

[0047] In this embodiment, the inner layer of the double-sided PCB and the outer layers of two single-sided PCBs are thermally pressed and bonded together by a high-quality adhesive. The circuit connections with the on-board antenna 1 and the component circuit layer 3 are realized through the blind vias opened in the outer layer board of the PCB and the buried vias in the inner layer board of the PCB, which can effectively reduce the circuit complexity and improve the signal transmission speed. Compared with a multi-layer circuit board made entirely of double-sided PCBs, the PCB substrate 1 made in this combined way can reduce the manufacturing cost. In addition, using a double-sided PCB board as the inner layer can isolate heat from the external environment, which helps to improve the heat dissipation performance of the PCB substrate 1.

[0048] According to an embodiment of the present invention, as Figure 1 and Figure 3 shown, the metal column 5 is circuit-connected to the component circuit layer 3.

[0049] In this embodiment, the number of the metal columns 5 is preferably three, which are respectively welded at three diagonals of the PCB substrate 2. The metal columns 5 provide a transmission path for electrical signals between the component circuit layer 3 and other circuit boards, realizing the transmission and propagation of signals. The connection between the metal columns 5 and the component circuit layer 3 makes the component circuit layer 3 the mounting surface of the radar sensor, further realizing the miniaturization of the size of the sensor, so that the sensor can be more conveniently embedded and integrated into various application products.

[0050] As another implementation method, the number of the metal columns 5 can also be two or four. When the number of the metal columns 5 is two, they are respectively welded at two diagonals of the PCB substrate 2, saving materials while providing support for the stacked structure of the radar device and saving the design and manufacturing cost. When the number of the metal columns 5 is four, they are respectively welded at four inner corners of the PCB substrate 2, which can provide more stable support for the stacked structure of the radar device.

[0051] According to an embodiment of the present invention, a pad for connecting with the metal column 5 is further provided on one side of the PCB substrate 2, and the metal column 5 is connected to the circuit through the pad.

[0052] In this embodiment, pads are welded on the bottom layer of the PCB substrate 2. The pads are circuit-connected to the component circuit layer 3 through the copper conductors of the PCB substrate 2. By welding the metal columns 5 on the pads, the circuit connection between the metal columns 5 and the component circuit layer 5 is realized. The welding between the pads and the metal columns 5 can ensure the firm and reliable circuit connection between the metal columns 5 and the component circuit layer 3. In addition, connecting the pads to the metal columns 5 can make the connection between the component circuit layer 3 and other circuit boards more compact, effectively reducing the looseness of the layout and further saving the space of the radar sensor.

[0053] According to an embodiment of the present invention, as Figure 1 and Figure 2As shown, the radar sensor further includes:

[0054] A fixed cover 4, which is thermally pressed and bonded to the bottom surface of the PCB substrate 2, and completely houses the electrical components in the component circuit layer 3 within its cover. A part of the metal column 5 is within its cover, and the other part of the metal column 5 passes through the fixed cover 4 and is exposed outside the cover.

[0055] In this embodiment, the fixed cover 4 completely houses the electrical components in the accommodation cavity, which can provide protection to prevent the electrical components from being damaged by physical or environmental factors and extend the service life of the electrical components. In addition, the purpose that the fixed cover 4 does not completely house the metal column 5 in the accommodation cavity is that the part of the metal column 5 extending outside the fixed cover 4 is used to provide stable support for the radar sensor, and a small radar sensor in the form of component mounting similar to AIP packaging is produced.

[0056] According to an embodiment of the present invention, as Figure 4 shown, an air pressure balance hole 6 is also provided at the center of the cover plate of the fixed cover 4.

[0057] In this embodiment, the number of the air pressure balance holes 6 is preferably five. Four of them are distributed at the center positions of the four sides of the top surface of the fixed cover 4, and the remaining one is arranged at the center of the top surface of the fixed cover 4. The advantage of such a design is that it can not only stabilize the air pressure inside the radar sensor, but also prevent the performance fluctuation of the sensor caused by the change of the external air pressure.

[0058] As other implementation manners, the number of the air pressure balance holes 6 can also be set according to specific requirements. For example, in a radar sensor with higher sealing requirements, the number of the air pressure balance holes 6 can also be set to four, which are respectively opened at the center positions of the four side surfaces of the fixed cover 4. The advantage of such a design is that in some radar sensors with higher sealing requirements, removing the air pressure balance hole at the center of the fixed cover 4 can prevent external dust or moisture from entering the radar sensor through this hole; and opening the air pressure balance holes 6 at the center positions of the four side surfaces of the fixed cover 4 can balance the air pressure inside and outside the radar device evenly while preventing the invasion of external foreign matters.

[0059] According to an embodiment of the present invention, as Figure 2 shown, the fixed cover 4 and the metal column 5 are of an integrally formed structure. One end of the metal column 5 is housed in the accommodation cavity and connected to the PCB substrate 2, and the other end passes through the fixed cover 4 and extends to the outside of its cover surface.

[0060] In this embodiment, the fixed cover 4 and the metal post 5 are integrally formed by precision injection molding or die-casting in a metal cavity. This integrally formed design not only protects and houses the electrical components in the accommodation cavity of the fixed cover 4 from external influences, but also enables the metal post 5 to be firmly connected to the fixed cover 4 and stably connected to the PCB substrate 2. This design helps the metal post 5 to stably support the radar sensor, preventing loosening or displacement during use and ensuring the stability of the sensor.

[0061] According to an embodiment of the present invention, as Figure 1 , Figure 2 and Figure 3 shown, the metal post 5 can be a spherical metal post 5, a cubic metal post 5 or a cylindrical metal post 5, and an anti-slip pattern is provided at one end extending to the outside of the fixed cover 4.

[0062] In this embodiment, a suitable metal post 5 can be selected in different scenarios to provide stable support for the radar sensor structure. The spherical metal post 5 is suitable for variable terrains and irregular surfaces, and can withstand pressure at different angles, which is beneficial to maintaining stability; while the cubic metal post 5 is applicable to fixed or highly structured environments such as buildings or mechanical equipment; and the cylindrical metal post 5 is suitable for use in automobiles, aviation or other mobile platforms and can withstand radial and axial loads; and by providing an anti-slip pattern at the support end of the metal post 4, the friction between the support end and the support surface can be increased, making the metal post 4 more firmly fixed on the support surface and improving the stability and safety of the support.

[0063] The specific embodiments described above further elaborate on the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A new radar sensor structure, characterized in that It includes a component circuit layer, wherein the component circuit layer is fixedly laid on the bottom surface of the PCB substrate; An onboard antenna, which is fixedly laid on the top surface of the PCB substrate and electrically connected to the electrical components of the component circuit layer, and the onboard antenna, the PCB substrate and the component circuit layer are stacked to form a laminated structure; A metal column is connected to the bottom surface of the PCB substrate and is used to support the stacked structure.

2. A novel radar sensor structure according to claim 1, characterized in that: The onboard antenna is electrically connected to the electrical components in the component circuit layer by means of a feeder, a via, a capacitor or a slot coupling.

3. According to claim 1, the novel radar sensor structure is characterized in that: The PCB substrate is a multi-layer circuit board with a double-sided PCB board as an inner layer and two single-sided PCB boards as outer layers.

4. According to the novel radar sensor structure of claim 1, it is characterized in that: The metal column is connected to the circuit of the component circuit layer.

5. A novel radar sensor structure according to claim 4, characterized in that: A pad for connecting to the metal column is also provided on one side of the PCB substrate, and the metal column is connected to the circuit via the pad.

6. A novel radar sensor structure according to claim 5, characterized in that: The radar sensor structure also includes a fixed cover, which has a receiving cavity for completely receiving the electrical components in the component circuit layer and partially receiving the metal column. The fixed cover is buckled onto the bottom surface of the PCB substrate to completely receive the electrical components in the receiving cavity and partially receive the metal column in the receiving cavity.

7. A novel radar sensor structure according to claim 6, characterized in that: An air pressure balance hole is also provided at the center of the cover plate of the fixed cover.

8. The novel radar sensor structure according to claim 6, characterized in that: The fixing cover and the metal column are an integrally formed structure. One end of the metal column is accommodated in the accommodation cavity and connected to the PCB substrate, and the other end passes through the fixing cover and extends to the outside of the cover surface.

9. A novel radar sensor structure according to claim 8, characterized in that: One end of the metal column extending to the outside of the fixing cover is provided with anti-slip grooves.

10. The novel radar sensor structure according to claim 1, characterized in that: The metal column is a spherical metal column, a cubic metal column or a cylindrical metal column.

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