CWDM4 silicon optical module

Abstract

The utility model discloses a CWDM4 silicon optical module which comprises a packaging shell and a PCBA board, the PCBA board is located in the packaging shell, a TX silicon optical chip and an RX silicon optical chip are arranged on the PCBA board, a light emitting device, a backlight detector, a multiplexer and a spot size converter are integrated on the TX silicon optical chip, a light receiving device and a demultiplexer are integrated on the RX silicon optical chip, and the light emitting device, the backlight detector, the multiplexer and the spot size converter are integrated on the PCBA board. Two optical fiber array units are further arranged in the packaging shell, one optical fiber array unit is connected with the TX silicon optical chip, and the other optical fiber array unit is connected with the RX silicon optical chip. The structure is reasonable, optical devices are all placed on the silicon substrate, the steps of coupling and mounting of a collimating lens and coupling and mounting of a spot size converter are omitted, the cost is reduced, and the production efficiency is improved. The coupling process is simpler, and coupling can be completed only by aligning the optical fiber end face of the optical fiber array unit with the waveguide end face of the silicon optical chip.

Description

Technical Field

[0001] The utility model relates to the field of silicon photonic chips, and particularly relates to a CWDM4 silicon photonic optical module. Background Art

[0002] The CWDM4 silicon photonic optical module is a 100G transmission mode based on single-mode coarse wavelength division multiplexing (CWDM) technology. The CWDM4 optical module meeting this standard adopts a duplex LC interface and uses 4 central wavelengths of 1271nm, 1291nm, 1311nm, and 1331nm for optical signal transmission, with each band transmitting 25G. Through the coarse wavelength division multiplexing (CWDM) technology, the CWDM4 optical module can multiplex the above 4 central wavelengths onto a single-mode optical fiber for transmission. However, the existing CWDM4 optical module has more optical devices, and the chip mounting and coupling processes are relatively complex, resulting in low mass production efficiency. In view of the above problems, a solution is proposed below. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a CWDM4 silicon photonic optical module, which has the advantage of integrating all optical devices onto a silicon photonic chip.

[0004] The above technical purpose of the utility model is achieved through the following technical solutions:

[0005] A CWDM4 silicon photonic optical module includes a package shell and a PCBA board. The PCBA board is located inside the package shell. The PCBA board is provided with a TX silicon photonic chip and an RX silicon photonic chip. The TX silicon photonic chip is integrated with an optical emission device, a backlight detector, a multiplexer, and a mode spot converter. The RX silicon photonic chip is integrated with an optical reception device and a demultiplexer. Two fiber array units are further arranged inside the package shell. One of the fiber array units is connected to the TX silicon photonic chip, and the other fiber array unit is connected to the RX silicon photonic chip.

[0006] Preferably, the optical emission device is a laser, and the optical reception device is a photodiode.

[0007] Preferably, both the TX silicon photonic chip and the RX silicon photonic chip are fixed on the PCBA board. Two package covers are arranged on the PCBA board. There is a gap between the lower end of the package cover and the upper end surface of the PCBA board. One end of the TX silicon photonic chip with an optical transmitter is located below one of the package covers, and one end of the RX silicon photonic chip with an optical receiver is located below the other package cover.

[0008] Preferably, a bracket is fixedly arranged inside the package shell. Two support grooves are arranged on the bracket. A receiver is connected inside the two support grooves. The receiver is fixedly clamped with the bracket, and the receiver is connected to the fiber array unit through an optical fiber.

[0009] Preferably, a plurality of heat sinks are provided on the surface of the encapsulation case.

[0010] The beneficial effects of the present utility model are as follows: All the optical devices to be used are integrated on two silicon photonic chips. Compared with the existing process, the coupling and mounting steps of the collimating lens and the mode converter are omitted, making the coupling process simpler. It only requires aligning the fiber end face of the fiber array unit with the waveguide end face of the silicon photonic chip, which improves the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic structural diagram of the embodiment;

[0012] Figure 2 is a schematic structural diagram of the embodiment for showing the internal structure of the encapsulation case;

[0013] Figure 3 is a schematic diagram of the embodiment for showing the connection structure on the PCBA board;

[0014] Figure 4 is a connection block diagram of the silicon backlight detector of the embodiment.

[0015] Reference numerals: 1, encapsulation case; 2, PCBA board; 3, TX silicon photonic chip; 4, RX silicon photonic chip; 5, optical emission device; 6, backlight detector; 7, multiplexer; 8, mode converter; 9, optical receiving device; 10, demultiplexer; 11, encapsulation cover; 12, bracket; 13, receiver; 14, heat sink; 15, fiber array unit. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] The following is only the preferred embodiment of the present utility model, and the protection scope is not limited to this embodiment. All technical solutions within the idea of the present utility model should fall within the protection scope of the present utility model. The same components are denoted by the same reference numerals. It should be noted that the terms "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the drawings, and the terms "bottom" and "top", "inner" and "outer" refer to the directions towards or away from the geometric center of the specific component, respectively.

[0017] As Figures 1 to 4 shown, a CWDM4 silicon photonic optical module includes an encapsulation case 1 and a PCBA board 2. The PCBA board 2 is installed inside the encapsulation case 1, and the encapsulation case 1 protects the PCBA board 2 and the components located on the PCBA board 2. One end of the PCBA board 2 is exposed outside the encapsulation case 1 for convenient connection with external devices. A plurality of heat sinks 14 are provided on the encapsulation case 1, and the heat sinks 14 can accelerate the heat dissipation on the surface of the encapsulation case 1, thereby reducing the temperature inside the encapsulation case 1.

[0018] A bracket 12 is fixedly installed inside the encapsulation shell 1. There are two support grooves on the bracket 12. Receivers 13 are arranged in both of the two support grooves. The receivers 13 are fixedly connected to the support grooves in a snap-fit manner. The support grooves support the receivers 13, so that the receivers 13 will not shake.

[0019] A TX silicon optical chip 3 and an RX silicon optical chip 4 are arranged on the PCBA board 2. Both the TX silicon optical chip 3 and the RX silicon optical chip 4 are connected to the fiber array unit 15 (FAU). An optical emission device 5, a backlight detector 6 (MPD), a multiplexer 7 (MUX), and a mode spot converter 8 (SSC) are integrated on the TX silicon optical chip 3. In this application, the optical emission device 5 is a laser. One of the receivers 13 is connected to the fiber array unit 15 (FAU) on the TX silicon optical chip 3 through an optical fiber.

[0020] An optical receiving device 9 and a demultiplexer 10 (DEMUX) are integrated on the RX silicon optical chip 4. The optical receiving device 9 in this application is a photodiode. The other receiver 13 is connected to the fiber array unit 15 (FAU) on the RX silicon optical chip 4 through an optical fiber.

[0021] Both the TX silicon optical chip 3 and the RX silicon optical chip 4 are fixed on the PCBA board 2. There are two encapsulation covers 11 arranged on the PCBA board 2. There is a gap between the lower end of the encapsulation cover 11 and the upper end surface of the PCBA board 2. The end of the TX silicon optical chip 3 equipped with the optical transmitter is located below one of the encapsulation covers 11. The end of the RX silicon optical chip 4 provided with the receiver 13 is located below the other encapsulation cover 11. The encapsulation cover 11 can make the optical transmitter and the receiver 13 be in a dark environment and prevent the influence of external light.

[0022] In the present invention, passive optical devices such as the multiplexer 7 (MUX), the demultiplexer 10 (DEMUX), and the mode spot converter 8 (SSC) are all integrated on the silicon substrate, reducing the optical device chip mounting steps, and the coupling does not require separate coupling of 4 channels. Only the optical output of the silicon waveguide needs to be coupled, reducing the coupling process.

[0023] In the above specific embodiments, the technical problems solved, the technical solutions, and the beneficial effects of the present utility model are further described in detail. It should be understood that the above are only specific embodiments of the present utility model and are not used to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A CWDM4 silicon photonic module, comprising a packaging shell (1) and a PCBA board (2), characterized in that: The PCBA board (2) is located in the packaging shell (1); a TX silicon photonic chip (3) and an RX silicon photonic chip (4) are provided on the PCBA board (2); a light emitting device (5), a backlight detector (6), a multiplexer (7) and a pattern spot converter (8) are integrated on the TX silicon photonic chip (3); a light receiving device (9) and a demultiplexer (10) are integrated on the RX silicon photonic chip (4); and two optical fiber array units (15) are also provided in the packaging shell (1); one of the optical fiber array units (15) is connected to the TX silicon photonic chip (3), and the other of the optical fiber array units (15) is connected to the RX silicon photonic chip (4).

2. A CWDM4 silicon photonics module according to claim 1, characterized in that: The light emitting device (5) is a laser, and the light receiving device (9) is a photodiode.

3. A CWDM4 silicon photonics module according to claim 2, characterized in that: The TX silicon photonic chip (3) and the RX silicon photonic chip (4) are both fixed on a PCBA board (2); two packaging covers (11) are provided on the PCBA board (2); a gap is provided between the lower end of the packaging cover (11) and the upper end surface of the PCBA board (2); one end of the TX silicon photonic chip (3) equipped with a light transmitter is located below one of the packaging covers (11); and one end of the RX silicon photonic chip (4) equipped with a light receiver (13) is located below the other packaging cover (11).

4. A CWDM4 silicon photonics module according to claim 3, characterized in that: A bracket (12) is fixedly arranged in the packaging shell (1), the bracket (12) is provided with two branch grooves, a receiver (13) is connected in the two branch grooves, the receiver (13) is fixedly connected to the bracket (12), and the receiver (13) is connected to the optical fiber array unit (15) via an optical fiber.

5. The CWDM4 silicon photonics module according to claim 1, characterized in that: A plurality of heat sinks (14) are provided on the surface of the packaging shell (1).

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