Heat dissipation device and server

Abstract

The utility model relates to a heat dissipation device and a server. The heat dissipation device comprises internal memories, heat conduction structural parts, an internal memory support and a heat conduction filling part, the heat conduction structural parts and the internal memories are arranged in a one-to-one correspondence mode, and each heat conduction structural part comprises a heat conduction assembly attached to the side face of the corresponding internal memory and two attaching parts connected to the two opposite ends of the heat conduction assembly in the lengthwise direction of the internal memories. Each attaching part is attached to the memory support, and the heat conduction filling piece is filled between the attaching parts and the memory support. According to the heat dissipation device, the heat of the memories is converged and transmitted to the heat conduction filling piece through the attaching parts, then the heat of the memories is conducted to the memory support through the heat conduction filling piece, and therefore heat dissipation of the memories can be achieved only by conducting heat dissipation on the memory support; therefore, the structure for cooling the memory support and the memories can be independently disassembled, assembled and maintained, and the memories and the heat conduction structural parts are arranged in a one-to-one correspondence mode, so that the memories are easier to disassemble and assemble.

Description

Technical Field

[0001] This application relates to the technical field of server heat dissipation devices, and particularly to a heat dissipation device and a server. Background Art

[0002] Due to the increasing integration of servers in data centers, the power consumption of the memory in the server increases, and the heat dissipation amount increases. For this reason, in the related art, a heat dissipation device is provided. By attaching the sides of multiple memories to the heat dissipation device, the heat of the multiple memories is transferred to the heat dissipation device for heat dissipation.

[0003] However, the heat dissipation device in the related art is an integrated design and needs to be fixed on the device first. The dimensional accuracy requirements for multiple slots are extremely strict, and this structure and the memory are two independent components. When installing and disassembling the memory, it needs to be inserted and removed in the corresponding slots of the heat dissipation device, which is extremely likely to cause the risk of falling off of the power-on components of the memory and make the installation and disassembly of the memory inconvenient. Summary of the Invention

[0004] Based on this, in view of the problem that the installation and disassembly of the memory are inconvenient caused by the heat dissipation device in the related art, it is necessary to provide a heat dissipation device and a server that make the installation and disassembly of the memory easier.

[0005] According to the first aspect of the present application, a heat dissipation device is provided, including:

[0006] A memory;

[0007] A heat conduction structure member, which is provided corresponding to the memory one by one. Each heat conduction structure member includes a heat conduction component that fits against the side of the corresponding memory, and two fitting parts that are respectively connected to opposite ends of the heat conduction component along the longitudinal length direction of the memory;

[0008] A memory bracket, and each fitting part fits against the memory bracket; and

[0009] A heat conduction filling member, which is filled between the fitting part and the memory bracket;

[0010] Wherein, the heat dissipation device further includes a first heat conduction part that fits against the memory bracket, a second heat conduction part that is spaced apart from the first heat conduction part, and a first heat pipe that is connected between the first heat conduction part and the second heat conduction part;

[0011] Alternatively, the heat dissipation device further includes a first liquid cooling member that fits against the memory bracket, and a first connecting pipe with one end communicating with the first liquid cooling member.

[0012] In one embodiment, the heat dissipation device further includes a first liquid cooling member that fits against the memory bracket, and a first connecting pipe with one end communicating with the first liquid cooling member;

[0013] And the heat dissipation device further includes a second liquid cooling member communicated with one end of the first connecting pipe away from the first liquid cooling member.

[0014] In one embodiment, the first liquid cooling member is detachably connected to the memory bracket.

[0015] In one embodiment, the heat dissipation device further includes a first heat conducting part attached to the memory bracket, a second heat conducting part spaced from the first heat conducting part, and a first heat pipe connected between the first heat conducting part and the second heat conducting part;

[0016] The heat dissipation device further includes a second liquid cooling member attached to the second heat conducting part.

[0017] In one embodiment, the first heat conducting part is detachably connected to the memory bracket.

[0018] In one embodiment, the second heat conducting part is detachably connected to the second liquid cooling member.

[0019] In one embodiment, the heat conducting component includes two heat conducting members respectively attached to opposite two sides of the memory, and one of the heat conducting members is respectively connected to the two attaching parts at opposite ends along the longitudinal length direction of the memory.

[0020] In one embodiment, the two heat conducting members include a first heat conducting member and a second heat conducting member. The first heat conducting member is respectively connected to the two attaching parts at opposite ends along the longitudinal length direction of the memory. The second heat conducting member includes a first plate body and a second plate body which are opposite to each other and spaced apart. The side edges on the same side of the first plate body and the second plate body are connected to each other. The first plate body is attached to the side of the corresponding memory away from the first heat conducting member, and the second plate body is attached to the side of the corresponding first heat conducting member away from the memory;

[0021] A first adhesive layer is provided between the first plate body and the corresponding memory, and a second adhesive layer is provided between the second plate body and the corresponding first heat conducting member.

[0022] In one embodiment, the heat conducting filler has a first plane on a side away from the memory bracket along the direction from the attaching part to the memory bracket, and the attaching part has a second plane attached to the first plane; or

[0023] The heat conducting filler is provided with a protruding part on a side away from the memory bracket along the direction from the attaching part to the memory bracket, and the attaching part is provided with a recessed part adapted to the protruding part.

[0024] According to a second aspect of the present application, a server is provided, including the heat dissipation device of any of the above embodiments.

[0025] For the above heat dissipation device, the heat of each memory is transferred to the fitting part through the corresponding heat conduction component, and the heat of multiple memories is converged and transferred to the heat conduction filling piece through multiple fitting parts, and then the heat of multiple memories is conducted to the memory bracket by means of the heat conduction filling piece. Therefore, only by dissipating the heat of the memory bracket can the heat of multiple memories be dissipated, and the structure for dissipating the heat of the memory bracket can be disassembled and maintained independently of each memory, thereby making the memory easier to disassemble and assemble. Also, since the memory and the heat conduction structure are arranged in one-to-one correspondence, the single memory and the corresponding heat conduction structure can be disassembled and assembled, further improving the disassembly and assembly convenience of the single memory. Description of the Drawings

[0026] Figure 1 It is a schematic structural diagram of a heat dissipation device in an embodiment of the present application.

[0027] Figure 2 It is an assembly schematic diagram of a heat conduction structure and a memory in an embodiment of the present application.

[0028] Figure 3 It is a partial schematic diagram of a heat dissipation device in another embodiment of the present application.

[0029] Figure 4 It is a schematic structural diagram of a heat dissipation device in an embodiment of the present application.

[0030] Explanation of the Reference Numerals in the Drawings:

[0031] 100, heat dissipation device;

[0032] 10, memory;

[0033] 20, heat conduction structure; 21, heat conduction component; 21a, heat conduction piece; 211, first heat conduction piece; 212, second heat conduction piece; 2121, first plate body; 2122, second plate body; 22, fitting part;

[0034] 30, memory bracket;

[0035] 41, first heat conduction part; 42, second heat conduction part; 43, first heat pipe;

[0036] 60, heat conduction filling piece; 61, first plane;

[0037] 71, first liquid cooling part; 72, first connecting pipe;

[0038] 110, second liquid cooling part;

[0039] 120, second connecting pipe. Detailed Embodiments

[0040] To make the above objects, features, and advantages of the present application more apparent and understandable, the following provides a detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings. Many specific details are set forth in the following description to facilitate a thorough understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0041] In the description of the present application, it should be understood that if terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the accompanying drawings. These are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present application.

[0042] In addition, if terms such as "first" and "second" appear, these terms are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0043] In the present application, unless otherwise clearly specified and limited, if terms such as "install", "connect", "couple", "fix", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0044] In this application, unless otherwise clearly defined and limited, if there is a description such as a first feature being "on" or "under" a second feature, its meaning can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or simply means that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower horizontal height than the second feature.

[0045] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If so, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.

[0046] Figure 1 It is a schematic structural diagram of a heat dissipation device in an embodiment of this application; Figure 2 It is an assembly schematic diagram of a heat conduction structure member and a memory in an embodiment of this application.

[0047] Refer to Figure 1-2 , a heat dissipation device 100 provided in an embodiment of this application includes a memory 10, a heat conduction structure member 20, a memory bracket 30 and a heat conduction filler 60.

[0048] The heat conduction structure members 20 are arranged in one-to-one correspondence with the memories 10. Each heat conduction structure member 20 includes a heat conduction component 21 that fits against the side surface of the corresponding memory 10, and two fitting portions 22 that are respectively connected to opposite ends of the heat conduction component 21 along the longitudinal direction of the memory 10. Each fitting portion 22 fits against the memory bracket 30, and the heat conduction filler 60 is filled between the fitting portion 22 and the memory bracket 30.

[0049] The above heat dissipation device 100 is configured such that the heat conducting component 21 is attached to the side surface of the corresponding memory 10, enabling the heat of the memory 10 to be transferred to the corresponding heat conducting component 21. By providing two attachment portions 22 respectively connected to opposite ends of the heat conducting component 21 along the longitudinal direction of the memory 10, the heat of the memory 10 is transferred to the two attachment portions 22 respectively through the heat conducting component 21. By providing a heat conducting filler 60, each attachment portion 22 can contact the memory bracket 30 more fully with the aid of the heat conducting filler 60, and the heat of multiple memories 10 is respectively transferred to the heat conducting filler 60 through multiple attachment portions 22, and then the heat of multiple memories 10 is transferred to the memory bracket 30 with the aid of the heat conducting filler 60. Therefore, only by dissipating heat from the memory bracket 30 can the heat dissipation of multiple memories 10 be achieved, enabling the structure for dissipating heat from the memory bracket 30 to be disassembled, assembled, and maintained independently of each memory 10, thus making the memory 10 easier to disassemble and assemble. Moreover, since the memory bracket 30 is an integral structure, the structure for dissipating heat from the memory bracket 30 is easier to arrange in space and is easy to connect to the memory bracket 30. Also, since the heat conducting structure members 20 are provided in one-to-one correspondence with the memories 10, when disassembling and assembling the memory 10, a single memory 10 and the corresponding heat conducting structure member 20 can be inserted and removed together at the corresponding position of the server, thereby further improving the convenience of disassembling and assembling a single memory 10.

[0050] In addition, since multiple memories 10 can be inserted and removed independently, the requirement for the installation accuracy of each memory 10 and the corresponding heat conducting structure member 20 is reduced. And when a memory 10 or a heat conducting structure member 20 needs to be replaced, only the heat conducting structure member 20 corresponding to a single memory 10 needs to be replaced, making the replacement and maintenance convenient and reducing the cost.

[0051] Optionally, as Figure 2 shown, the heat conducting components 21 are respectively attached to opposite two side surfaces of the corresponding memories 10. In this way, by providing the heat conducting structure members 20 in one-to-one correspondence with the memories 10, different heat conducting structure members 20 can also adopt different settings to be applicable to different models of memories 10. For example, according to the thickness of the corresponding memory 10, the distance between the portions of the heat conducting component 21 for attaching to opposite two side surfaces of the memory 10 can be set. Therefore, the versatility of the heat dissipation device 100 for different models of memories 10 is improved, which is beneficial to reducing the heat dissipation cost of the server. In addition, since the distance between the side surfaces of two adjacent memories 10 is small, by providing two attachment portions 22 respectively connected to opposite ends of the heat conducting component 21 along the longitudinal direction of the memory 10, it is suitable for space requirements.

[0052] In some embodiments, as Figure 1As shown, the heat dissipation device 100 further includes a first heat conducting part 41 attached to the memory bracket 30, a second heat conducting part 42 spaced apart from the first heat conducting part 41, and a first heat pipe 43 connected between the first heat conducting part 41 and the second heat conducting part 42. In this way, by providing the first heat conducting part 41, the heat of the memory bracket 30 can be transferred to the first heat conducting part 41, and then the high thermal conductivity of the first heat pipe 43 is used to transfer the heat of the first heat conducting part 41 to the second heat conducting part 42, so as to achieve heat dissipation of the memory 10 by dissipating the heat of the second heat conducting part 42. Since the second heat conducting part 42 is spaced apart from the first heat conducting part 41, it is convenient to arrange a structure for dissipating the heat of the second heat conducting part 42.

[0053] Optionally, the first heat conducting part 41 is detachably connected to the memory bracket 30 to facilitate separation of the first heat conducting part 41 from the memory bracket 30, thereby facilitating independent disassembly, assembly and maintenance of the components.

[0054] Specifically, the first heat conducting part 41 is detachably connected to the memory bracket 30 by fasteners such as screws.

[0055] In some embodiments, the first heat conducting part 41 and the second heat conducting part 42 include a metal plate, a metal block or a temperature balancing plate.

[0056] It should be noted that the structures of the first heat conducting portion 41 and the second heat conducting portion 42 can be selected according to the power consumption of the memory 10 .

[0057] In some embodiments, Figure 1 As shown, the heat dissipation device 100 further includes a second liquid cooling member 110 attached to the second heat conducting portion 42. In this way, the cooling medium in the second liquid cooling member 110 can exchange heat with the second heat conducting portion 42 to remove the heat of the second heat conducting portion 42.

[0058] Optionally, the second heat conducting portion 42 is detachably connected to the second liquid cooling member 110 , so as to facilitate separation of the second heat conducting portion 42 from the second liquid cooling member 110 , thereby facilitating independent disassembly, assembly and maintenance of the components.

[0059] Specifically, the second heat conducting part 42 and the second liquid cooling member 110 are detachably connected via fasteners such as screws.

[0060] In other embodiments, Figure 3As shown, the heat dissipation device 100 further includes a first liquid cooling member 71 attached to the memory bracket 30, and a first connecting pipe 72 with one end communicating with the first liquid cooling member 71. In this way, the cooling medium in the first liquid cooling member 71 exchanges heat with the memory bracket 30 to take away the heat of the memory bracket 30, and through the first connecting pipe 72 communicating with the first liquid cooling member 71, the cooling medium flowing through the first liquid cooling member 71 is guided through the first connecting pipe 72 to other positions, so as to cool the cooling medium flowing out of the first liquid cooling member 71 through the first connecting pipe 72.

[0061] Optionally, the first liquid cooling member 71 is detachably connected to the memory bracket 30, so as to facilitate the separation of the first liquid cooling member 71 from the memory bracket 30, thereby facilitating the independent maintenance, disassembly and assembly of components.

[0062] Specifically, the first liquid cooling member 71 and the memory bracket 30 are detachably connected by fasteners such as screws.

[0063] In this embodiment, as Figure 3 shown, the heat dissipation device 100 further includes a second liquid cooling member 110 communicating with the end of the first connecting pipe 72 away from the first liquid cooling member 71. In this way, the first liquid cooling member 71 and the second liquid cooling member 110 are connected in series through the first connecting pipe 72, so that after the cooling medium exchanges heat with the memory bracket 30 in the first liquid cooling member 71, the cooling medium can flow from the first liquid cooling member 71 through the first connecting pipe 72 to the second liquid cooling member 110, so as to cool the cooling medium in the second liquid cooling member 110.

[0064] In some embodiments, as Figure 2 shown, the heat conduction assembly 21 includes two heat conduction members 21a respectively attached to the opposite two side surfaces of the memory 10, and one of the heat conduction members 21a is respectively connected to the two attachment portions 22 at the opposite ends along the longitudinal direction of the memory 10.

[0065] During the actual assembly process, first attach the two heat conduction members 21a to the opposite two side surfaces of the memory 10 respectively, and then insert the memory 10 and the corresponding heat conduction structure member 20 as a whole into the corresponding position of the server. When disassembling the memory 10, pull out the single memory 10 and the corresponding heat conduction structure member 20 together from the corresponding position of the server, and then separate the memory 10 from the corresponding two heat conduction members 21a.

[0066] In some embodiments, as Figure 2As shown, the two heat conducting members 21a include a first heat conducting member 211 and a second heat conducting member 212. The two opposite ends of the first heat conducting member 211 in the longitudinal direction of the memory 10 are respectively connected to the two fitting portions 22. The second heat conducting member 212 includes a first plate body 2121 and a second plate body 2122 which are opposite to each other and spaced apart. The side edges on the same side of the first plate body 2121 and the second plate body 2122 are connected to each other. The first plate body 2121 is attached to the side surface of the corresponding memory 10 away from the first heat conducting member 211, and the second plate body 2122 is attached to the side surface of the corresponding first heat conducting member 211 away from the memory 10. A first adhesive layer is provided between the first plate body 2121 and the corresponding memory 10, and a second adhesive layer (not shown in the figure) is provided between the second plate body 2122 and the corresponding first heat conducting member 211.

[0067] In this way, by providing that the second heat conducting member 212 includes the first plate body 2121 and the second plate body 2122, the heat on the side surface of the memory 10 attached to the first plate body 2121 can be transferred to the second plate body 2122, and then the heat is transferred to the side surface of the first heat conducting member 211 away from the memory 10 through the second plate body 2122, and then the heat is transferred to the two fitting portions 22 through the first heat conducting member 211. By providing the first adhesive layer, the first plate body 2121 is fixed relative to the memory 10, and the first plate body 2121 is attached to the memory 10 by means of the first adhesive layer to transfer heat. By providing the second adhesive layer, the second plate body 2122 is fixed relative to the first heat conducting member 211, and the second plate body 2122 is attached to the first heat conducting member 211 by means of the second adhesive layer to transfer heat. Since the adhesive connection is realized by using the first adhesive layer and the second adhesive layer, it is beneficial to further reduce the thickness of the second heat conducting member 212, and thus it is beneficial to further reduce the overall thickness after the heat conducting structural member 20 and the corresponding memory 10 are assembled.

[0068] Optionally, both the first adhesive layer and the second adhesive layer can be made of double-sided tape.

[0069] In some embodiments, the second heat conducting member 212 can be made of an insulating graphite sheet to more effectively transfer the heat on the side surface of the memory 10 attached to the second heat conducting member 212 to the fitting portion 22 by utilizing the advantage of high thermal conductivity in the plane of the insulating graphite sheet. And because the insulating graphite sheet also has the advantage of high flexibility, the second heat conducting member 212 can extend out of the memory 10 along its longitudinal direction and be respectively attached to the two fitting portions 22, and the second heat conducting member 212 can also include the first plate body 2121 and the second plate body 2122 which are opposite to each other.

[0070] In some other embodiments, the second heat conducting member 212 can also be made of a metal sheet, so that the second heat conducting member 212 has high thermal conductivity and allows the second heat conducting member 212 to have a smaller thickness.

[0071] It should be noted that since the memory 10 can transfer part of the heat on the side in contact with the second heat conducting member 212 to the side in contact with the first heat conducting member 211, when the power of the memory 10 is low, other materials with lower thermal conductivity can also be used for the second heat conducting member 212, as long as the second heat conducting member 212 has a small thickness and can provide a protective effect for the memory 10.

[0072] It can be understood that the structure of the first heat conducting member 211 can also be set according to the power consumption of the memory 10, so that the thermal conductivity coefficient of the first heat conducting member 211 is suitable for the heat dissipation requirements of the memory 10.

[0073] Optionally, as Figure 1 shown, in two adjacent heat conducting structural members 20, the first heat conducting member 211 of one of the heat conducting structural members 20 can face the second heat conducting member 212 of the other heat conducting structural member 20. In this way, since the thickness of the second heat conducting member 212 is small, it allows the first heat conducting member 211 to adopt a structure with a higher thermal conductivity coefficient, and in terms of design, it allows a smaller spacing between the sides of two adjacent memories 10.

[0074] Therefore, in the above heat dissipation device 100, the heat on the opposite two sides of the memory 10 is respectively transferred to the fitting part 22 through the first heat conducting member 211 and the second heat conducting member 212, and then the heat is transferred to the heat conducting filler 60 through the fitting part 22, so as to transfer the heat to the memory bracket 30 by means of the heat conducting filler 60. In this way, the heat of multiple memories 10 is converged and transferred to the memory bracket 30 through the heat conducting filler 60, which is convenient for disassembling and assembling and maintaining the memories 10 and the structure for dissipating heat from the memory bracket 30 respectively. And since the memory bracket 30 is an integral structure, compared with directly dissipating heat from multiple memories 10, it is easier to achieve heat dissipation for the memory bracket 30 in terms of connection and space layout.

[0075] In some embodiments, as Figure 1 shown, the heat conducting filler 60 has a first plane 61 on the side away from the memory bracket 30 along the direction from the fitting part 22 to the memory bracket 30, and the fitting part 22 has a second plane (not shown in the figure) that fits with the first plane 61. In this way, through the fitting of the first plane 61 and the second plane, the heat on the second plane of the fitting part 22 is transferred to the first plane 61 of the heat conducting filler 60.

[0076] In some other embodiments, the heat conducting filler 60 is provided with a protruding part on the side away from the memory bracket 30 along the direction from the fitting part 22 to the memory bracket 30, and the fitting part 22 is provided with a recessed part adapted to the protruding part (not shown in the figure). In this way, by setting the protruding part and the recessed part adapted to the protruding part, the contact area between the heat conducting filler 60 and the fitting part 22 is increased, and the heat transfer efficiency between the heat conducting filler 60 and the fitting part 22 is improved.

[0077] In some embodiments, the heat-conducting filler 60 includes a heat-conducting gasket, a graphite sheet, a heat-conducting gel, or thermal grease.

[0078] In some embodiments, the heat dissipation device 100 further includes a first connecting member and a first elastic member (not shown in the figure) that respectively correspond to the attaching portions 22 one by one. The first connecting member includes a first rod body that respectively passes through the attaching portion 22 and the memory bracket 30, and a first head portion provided at one end of the first rod body that extends out of the attaching portion 22. The first elastic member is sleeved on the first rod body and is connected between the first head portion and the attaching portion 22. The first elastic member is configured to be able to provide an elastic force that causes the corresponding attaching portion 22 to move toward the side close to the memory bracket 30. Thus, by providing the first connecting member, the attaching portion 22 is fixed relative to the memory bracket 30. By providing the first elastic member, the elastic force of the first elastic member is used to press and attach the attaching portion 22 to the memory bracket 30, so as to provide a greater compressive force for the heat-conducting filler 60, and further reduce the contact thermal resistance between the attaching portion 22 and the memory bracket 30. During actual use, when it is necessary to insert or remove a single memory 10, only the two first connecting members corresponding to the single memory 10 need to be removed, and then the memory 10 can be inserted or removed, making the operation simple.

[0079] It should be noted that the multiple first elastic members are configured to be able to provide the same elastic force for each attaching portion 22. Specifically, the elastic force provided by the first elastic member to the attaching portion 22 is set by the compression stroke and elastic coefficient of the first elastic member.

[0080] In some other embodiments, as Figure 1 shown, the heat dissipation device 100 further includes a plurality of pressing members respectively corresponding to the plurality of attaching portions 22, and a second elastic member corresponding to the attaching portion 22 one by one. Each pressing member is provided on the side of the corresponding plurality of attaching portions 22 away from the memory bracket 30 and is detachably connected to the memory bracket 30. Each second elastic member is connected between the corresponding attaching portion 22 and the pressing member. The second elastic member is configured to be able to provide an elastic force that causes the corresponding attaching portion 22 to move toward the side close to the memory bracket 30. Thus, by providing the pressing member detachably connected to the memory bracket 30, the attaching portion 22 located between the pressing member and the memory bracket 30 is fixed relative to the memory bracket 30, and by providing the second elastic member connected between the attaching portion 22 and the pressing member, the elastic force of the second elastic member is used to press and attach the attaching portion 22 to the memory bracket 30, so as to provide a greater compressive force for the heat-conducting filler 60, and further reduce the contact thermal resistance between the attaching portion 22 and the memory bracket 30.

[0081] It should be noted that multiple second elastic members are configured to be able to provide the same elastic force for each fitting portion 22. Specifically, the elastic force provided by the second elastic member to the fitting portion 22 is controlled by the compression stroke and elastic coefficient of the second elastic member.

[0082] In some embodiments, as Figure 1 shown, the second elastic member includes a spring.

[0083] In other embodiments, the second elastic member includes a shrapnel (not shown in the figure).

[0084] In some embodiments, as Figure 1 shown, the pressing member extends longitudinally along the arrangement direction of the corresponding multiple fitting portions 22. One end of the pressing member extends out of one side of the corresponding multiple fitting portions 22 and is rotatably connected to the memory bracket 30. The other end of the pressing member extends out of the other side of the corresponding multiple fitting portions 22 and is detachably connected to the memory bracket 30. In this way, when it is necessary to insert or remove the memory 10, only the detachable end of the pressing member and the memory bracket 30 needs to be released, and then the pressing member is rotated relative to the memory bracket 30 around its other end, and then the memory 10 can be inserted or removed, which is further convenient for operation.

[0085] Optionally, as Figure 1 shown, the heat dissipation device 100 further includes a plurality of third connectors corresponding to the plurality of pressing members respectively. Each third connector is respectively passed through one end of the corresponding pressing member and the memory bracket 30, so that one end of the pressing member is detachably connected to the memory bracket 30. During actual use, when it is necessary to insert or remove the memory 10, only the third connector on the corresponding pressing member needs to be removed, and then the corresponding pressing member is rotated relative to the memory bracket 30, and then the memory 10 can be inserted or removed.

[0086] Specifically, as Figure 1 shown, the arrangement direction of the plurality of memories 10 is perpendicular to the longitudinal extension direction of the memories 10, so that the fitting portions 22 corresponding to the plurality of memories 10 are located at the same end of the plurality of memories 10, which is convenient for the arrangement of the pressing members.

[0087] In other embodiments, a first connector and a first elastic member are provided at one of the fitting portions 22 corresponding to the same memory 10, and a pressing member and a second elastic member are provided at the other of the fitting portions 22 corresponding to the same memory 10.

[0088] In some embodiments, the memory bracket 30 includes a metal plate, a heat pipe or a heat spreader, so that the memory bracket 30 has a high thermal conductivity.

[0089] In some embodiments, as Figure 1As shown, the memory bracket 30 includes two spaced apart from each other along the longitudinal direction of the memory 10, and two fitting portions 22 of the same heat conduction structure member 20 are respectively fitted to the two memory brackets 30.

[0090] In some embodiments, the heat dissipation device 100 further includes a central processing unit (CPU) (not shown in the figure), and the second liquid cooling member 110 is a CPU cooler fitted to the central processing unit. In this way, the second liquid cooling member 110 can dissipate heat from the central processing unit and the memory 10 respectively, so that the water channel design for dissipating heat from the memory 10 can be reduced, making the design of the heat dissipation device 100 more concise and highly reliable.

[0091] Specifically, the second liquid cooling member 110 is detachably connected to the central processing unit. In this way, the memory 10 and the central processing unit can be maintained, disassembled and assembled independently of each other.

[0092] Optionally, the second liquid cooling member 110 can adopt a cold plate.

[0093] Figure 4 This is a schematic structural diagram of the heat dissipation device 100 in an embodiment of the present application.

[0094] In some embodiments, as Figure 4 shown, the heat dissipation device 100 further includes a second connecting pipe 120 with one end communicating with the second liquid cooling member 110, and a heat dissipation mechanism (not shown in the figure) connected to the other end of the second connecting pipe 120. In this way, the cooling medium can flow from the second liquid cooling member 110 through the second connecting pipe 120 to the heat dissipation mechanism, so as to cool the cooling medium through the heat dissipation mechanism.

[0095] In the heat dissipation device 100 provided by the present application, during actual use, the heat generated by the memory 10 is transferred to the first heat conduction member 211 and the second heat conduction member 212, and then transferred to the fitting portion 22 through the first heat conduction member 211 and the second heat conduction member 212. The multiple fitting portions 22 converge and transfer the heat of the multiple memories 10 to the heat conduction filling member 60, and then transfer it to the memory bracket 30 through the heat conduction filling member 60. The heat of the memory bracket 30 is taken away by the cooling medium in the first liquid cooling member 71, and the cooling medium heated at the first liquid cooling member 71 flows to the second liquid cooling member 110 through the first connecting pipe 72, or the heat of the memory bracket 30 is transferred to the second liquid cooling member 110 through the first heat conduction portion 41, the first heat pipe 43 and the second heat conduction portion 42, so as to achieve the purpose of heat dissipation.

[0096] According to another aspect of the present application, a server is provided, including the heat dissipation device 100 described in any one of the above embodiments.

[0097] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0098] The above-described embodiments merely represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A heat dissipation device, characterized in that: include: Memory; Heat-conducting structural members are arranged one by one corresponding to the memory, and each of the heat-conducting structural members includes a heat-conducting component affixed to the side surface of the corresponding memory, and two affixed portions respectively connected to opposite ends of the heat-conducting component along the longitudinal direction of the memory; A memory bracket, each of the fitting portions being fitted with the memory bracket; as well as A heat-conducting filling piece, filled between the fitting portion and the memory bracket; Wherein, the heat dissipation device further includes a first heat conducting portion attached to the memory bracket, a second heat conducting portion spaced apart from the first heat conducting portion, and a first heat pipe connected between the first heat conducting portion and the second heat conducting portion; Alternatively, the heat dissipation device further includes a first liquid cooling member attached to the memory bracket, and a first connecting pipe having one end connected to the first liquid cooling member.

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device further includes a first liquid cooling member attached to the memory bracket, and a first connecting pipe having one end connected to the first liquid cooling member; The heat dissipation device further includes a second liquid cooling element connected to an end of the first connecting pipe away from the first liquid cooling element.

3. The heat dissipation device according to claim 2, characterized in that: The first liquid cooling component is detachably connected to the memory bracket.

4. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device further includes a first heat conducting portion attached to the memory bracket, a second heat conducting portion spaced apart from the first heat conducting portion, and a first heat pipe connected between the first heat conducting portion and the second heat conducting portion; The heat dissipation device further includes a second liquid cooling member attached to the second heat conducting portion.

5. The heat dissipation device according to claim 4, characterized in that: The first heat conducting part is detachably connected to the memory bracket.

6. The heat dissipation device according to claim 4, characterized in that: The second heat conducting portion is detachably connected to the second liquid cooling member.

7. The heat dissipation device according to claim 1, characterized in that: The heat-conducting assembly includes two heat-conducting parts respectively attached to two opposite side surfaces of the memory, wherein two opposite ends of one of the heat-conducting parts along the longitudinal direction of the memory are respectively connected to the two attaching portions.

8. The heat dissipation device according to claim 7, characterized in that: The two heat-conducting members include a first heat-conducting member and a second heat-conducting member, the first heat-conducting member is connected to the two bonding portions at opposite ends along the longitudinal direction of the memory, the second heat-conducting member includes a first plate body and a second plate body that are opposite to each other and spaced apart, the side edges of the first plate body and the second plate body on the same side are connected to each other, the first plate body is bonded to the side of the corresponding memory away from the first heat-conducting member, and the second plate body is bonded to the side of the corresponding first heat-conducting member away from the memory; A first adhesive layer is provided between the first plate body and the corresponding memory, and a second adhesive layer is provided between the second plate body and the corresponding first heat conducting member.

9. The heat dissipation device according to claim 1, characterized in that: The thermal conductive filler has a first plane on a side away from the memory holder along a direction in which the fitting portion points to the memory holder, and the fitting portion has a second plane fitted with the first plane; or The heat conductive filling piece is provided with a protruding portion on a side away from the memory bracket along a direction from the fitting portion to the memory bracket, and the fitting portion is provided with a recessed portion matched with the protruding portion.

10. A server, characterized in that: The invention comprises a heat dissipation device as claimed in any one of claims 1 to 9.

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