Heat dissipation device and cooling system

Abstract

According to the heat dissipation device and the cooling system, heat dissipation is directly conducted on a first heating element through a liquid cooling module, heat of a second heating element is guided to the liquid cooling module through a first heat conduction module and a second heat conduction module, and therefore heat exchange with a cooling medium in the liquid cooling module is conducted; therefore, cooling and heat dissipation of the first heating element and the second heating element are achieved, and due to the fact that the cooling medium directly exchanges heat with the heating elements, the cooling efficiency is higher. And meanwhile, the method can also be suitable for server hosts with different layouts, and the compatibility is higher. Moreover, the second heating element adopts a mode that the heat conduction unit is used for guiding heat out to the liquid cooling module, so that a flow channel structure is reduced, the structure is simpler, and the operation reliability of the server and the cooling reliability of the heat dissipation device are improved; and the heat dissipation device does not occupy the internal space of the server excessively, so that the host layout of the server is facilitated, and the heat dissipation problem of the server is solved while high integration of the server is realized.

Description

Technical Field

[0001] This application relates to the technical field of servers, and particularly to a heat dissipation device and a cooling system. Background Art

[0002] Due to the low power consumption of chips and memory in traditional servers, the cooling method for chips and memory is air cooling. That is, multiple groups of fans are arranged inside the server to cool the chips and memory by forced convection, reducing the operating temperature of the chips and memory. Since the specific heat capacity of air is low, air cooling has problems such as low heat transfer efficiency, high operating power consumption, and high noise.

[0003] With the rapid development of data centers, there are more and more server applications as carriers, and the operating power consumption of server chips and memory in data centers is also getting higher and higher. Therefore, the existing heat dissipation devices have the problem of low cooling efficiency. Summary of the Utility Model

[0004] Based on this, in view of the problem of low cooling efficiency of the existing heat dissipation devices, it is necessary to provide a heat dissipation device.

[0005] A heat dissipation device is applied to a server. The heat dissipation device includes:

[0006] A liquid cooling module, the inside of which has a fluid channel for the cooling medium to flow through; the liquid cooling module is used to connect with the first heating element of the server to exchange heat with the first heating element.

[0007] A heat conduction unit, including a first heat conduction module and a second heat conduction module connected to the first heat conduction module; the first heat conduction module is used to connect with the second heating element of the server, and the second heat conduction module is connected to the liquid cooling module; the heat conduction unit is used to guide the heat generated by the second heating element to the liquid cooling module.

[0008] In one embodiment, the liquid cooling module is detachably connected to the first heating element; and / or

[0009] The first heat conduction module is detachably connected to the second heating element.

[0010] In one embodiment, the first heat conduction module includes two first heat conduction plates, and the two first heat conduction plates are respectively connected to both sides of the second heating element.

[0011] In one embodiment, the first heat conduction module further includes a first heat conduction pad, and the first heat conduction pad is connected between the first heat conduction plate and the second heating element.

[0012] In one embodiment, the first heat conduction module further includes a heat dissipation block, which has a first card slot, and the first heat conduction plate, the first heat conduction pad, and the second heating element are all clamped in the first card slot.

[0013] In one embodiment, the second heat conduction module includes a second heat conduction plate and a heat pipe connected to the second heat conduction plate; the second heat conduction plate is connected to the liquid cooling module.

[0014] In one embodiment, the second heat conduction plate is configured with a groove, and the heat pipe is located in the groove.

[0015] In one embodiment, a second heat conduction pad is connected between the first heat conduction module and the second heat conduction module; and / or

[0016] A third heat conduction pad is connected between the second heat conduction module and the liquid cooling module.

[0017] In one embodiment, the heat dissipation device further includes a first fastener, one end of the first fastener is connected to the second heat conduction module, and the other end of the first fastener is connected to the second heating element; and / or

[0018] The heat dissipation device further includes a second fastener, and the second fastener sequentially passes through the liquid cooling module and the second heating element.

[0019] In one embodiment, the heat dissipation device further includes a liquid cooling pipeline communicated with the fluid channel, and the liquid cooling pipeline is used for supplying a cooling medium to flow into or out of the fluid channel.

[0020] A cooling system includes the heat dissipation device as described above.

[0021] The above heat dissipation device includes a liquid cooling module and a heat conduction unit. The first heating element is directly cooled by the liquid cooling module, and the heat of the second heating element is guided to the liquid cooling module through the first heat conduction module and the second heat conduction module, so as to perform heat exchange with the cooling medium in the liquid cooling module, thereby realizing the cooling and heat dissipation of the first heating element and the second heating element. Since the cooling medium directly exchanges heat with the heating element, the cooling efficiency is higher. Moreover, the liquid cooling module and the heat conduction unit can be set according to the positions of different heating elements, effectively solving the problem of poor cooling efficiency caused by the need to cool multiple heating elements; at the same time, it can also be applied to server hosts with different layouts, and has stronger compatibility. Furthermore, the second heating element uses the heat conduction unit to export heat to the liquid cooling module, reducing the flow channel structure. Not only is the structure simpler, but the operating reliability of the server and the cooling reliability of the heat dissipation device are improved; and the heat dissipation device does not overly occupy the internal space of the server, which is beneficial to the layout of the server host, enabling the server to solve the heat dissipation problem while achieving high integration. Description of the Drawings

[0022] Figure 1 Schematic diagram of the heat dissipation device provided by an embodiment of the present application applied to a heating element.

[0023] Figure 2 For Figure 1 Exploded view of the heat dissipation device shown applied to a heating element.

[0024] Figure 3 For Figure 2 Partial exploded view of the heat dissipation device shown.

[0025] Figure 4 For Figure 2 Exploded view of the heat dissipation device shown.

[0026] Figure 5 For Figure 4 Exploded view of the second heat conduction module in the heat dissipation device shown.

[0027] Reference numerals in the drawings: 10, heat dissipation device; 100, heat conduction unit; 110, liquid cooling module; 120, first heat conduction module; 121, first heat conduction plate; 122, first heat conduction pad; 123, heat dissipation block; 130, second heat conduction module; 131, second heat conduction plate; 132, heat pipe; 133, groove; 140, second heat conduction pad; 150, third heat conduction pad; 161, first fastener; 162, support column; 163, second fastener; 170, liquid cooling pipeline; 180, quick connector; 210, first heating element; 220, second heating element. Detailed Description of the Embodiment

[0028] To make the above objects, features, and advantages of the present application more apparent and understandable, the following provides a detailed description of the specific embodiments of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description to facilitate a thorough understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0029] In the description of the present application, it should be understood that if terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the accompanying drawings. These are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0030] In addition, if terms such as "first" and "second" appear, these terms are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0031] In the present application, unless otherwise clearly specified and limited, if terms such as "install", "connect", "join", "fix", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0032] In this application, unless otherwise clearly specified and defined, when a first feature is described as being "on" or "under" a second feature or the like, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or simply indicates that the first feature has a lower horizontal height than the second feature.

[0033] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.

[0034] Referring to Figure 1 as shown and Figure 2 as shown, a heat dissipation device 10 applied to a server provided by an embodiment of the present application includes a liquid cooling module 110 and a heat conduction unit 100; the inside of the liquid cooling module 110 has a fluid channel for a cooling medium to flow through; the liquid cooling module 110 is used to connect to a first heating element 210 of the server to exchange heat with the first heating element 210; the heat conduction unit 100 includes a first heat conduction module 120 and a second heat conduction module 130 connected to the first heat conduction module 120; the first heat conduction module 120 is used to connect to a second heating element 220 of the server, and the second heat conduction module 130 is connected to the liquid cooling module 110; the heat conduction unit 100 is used to guide the heat generated by the second heating element 220 to the liquid cooling module 110.

[0035] The above heat dissipation device 10 includes a liquid cooling module 110 and a heat conduction unit 100. The liquid cooling module 110 directly dissipates heat from the first heating element 210, and the heat of the second heating element 220 is guided to the liquid cooling module 110 through the first heat conduction module 120 and the second heat conduction module 130, so as to perform heat exchange with the cooling medium in the liquid cooling module 110, thereby realizing the cooling and heat dissipation of the first heating element 210 and the second heating element 220. Since the cooling medium directly exchanges heat with the heating element, the cooling efficiency is higher. Moreover, the liquid cooling module 110 and the heat conduction unit 100 can be set according to the positions of different heating elements, effectively solving the problem of poor cooling efficiency caused by the need to cool multiple heating elements; at the same time, it can also be applied to server hosts with different layouts, with stronger compatibility. In addition, the second heating element 220 uses the heat conduction unit 100 to export heat to the liquid cooling module 110, reducing the flow channel structure. Not only is the structure simpler, but the operation reliability of the server and the cooling reliability of the heat dissipation device 10 are improved; moreover, the heat dissipation device 10 does not overly occupy the internal space of the server, which is beneficial to the layout of the server host, enabling the server to solve the heat dissipation problem while achieving high integration.

[0036] In an actual application scenario, the first heating element 210 can be a CPU, and the liquid cooling module 110 can be a cold plate, that is, the cold plate directly dissipates heat from the CPU. The second heating element 220 can be a DIMM (Dual In-line Memory Module), that is, the DIMM transfers heat to the cold plate through the heat conduction unit 100, and the cold plate takes away the heat by exchanging heat with the cooling medium flowing in the cavity, realizing liquid cooling and heat dissipation. Among them, the number of CPUs and DIMMs can be multiple; correspondingly, the number of liquid cooling modules 110 and heat conduction units 100 can also be set multiple, which are specifically set according to actual usage requirements.

[0037] Refer to Figure 3 As shown, in one embodiment, the liquid cooling module 110 is detachably connected to the first heating element 210. Specifically, the liquid cooling module 110 is installed on the upper surface of the first heating element 210 through a second fastener 163. The heat generated by the first heating element 210 is transferred to the liquid cooling module 110, and then the liquid cooling module 110 exchanges heat with the cooling medium to take out the heat, achieving the purpose of heat dissipation. Further, refer to Figure 4 As shown, the first heat conduction module 120 is detachably connected to the second heating element 220. In this way, it is convenient to repair and replace the liquid cooling module 110 and the heat conduction unit 100; moreover, due to the detachable setting, for different models of servers, the size of the heat dissipation device 10 can be adaptively adjusted to meet its heat dissipation requirements without occupying the server space. The second fastener 163 can specifically be a screw, etc.

[0038] Refer to Figure 4 As shown, in one embodiment, the first heat conduction module 120 includes two first heat conduction plates 121, and the two first heat conduction plates 121 are respectively connected to both sides of the second heating element 220. By fitting and connecting the first heat conduction plate 121 with the second heating element 220, heat transfer is thus achieved.

[0039] Refer to Figure 4 As shown, in one embodiment, the first heat conduction module 120 further includes a first heat conduction pad 122, and the first heat conduction pad 122 is connected between the first heat conduction plate 121 and the second heating element 220. The first heat conduction plate 121 is in close fit with the second heating element 220 through the first heat conduction pad 122. By providing the first heat conduction pad 122, the heat transfer resistance between the first heat conduction plate 121 and the second heating element 220 is reduced.

[0040] Refer to Figure 4 As shown, in one embodiment, the first heat conduction module 120 further includes a heat dissipation block 123, and the heat dissipation block 123 has a first card slot, and the first heat conduction plate 121, the first heat conduction pad 122 and the second heating element 220 are clamped in the first card slot. By providing the heat dissipation block 123, on the one hand, it is convenient to collect and conduct heat, and on the other hand, it can protect the capacitor and inductor components in the second heating element 220, prevent the problem of scratching and falling off during installation and plugging, and greatly reduce the failure rate. The heat dissipation block 123 can specifically be a horse-shaped heat dissipation block. Both the first heat conduction module 120 and the second heat conduction module 130 can be made of aluminum material. Taking the second heating element 220 as a DIMM as an example, by using an independent first heat conduction module 120, it can be inserted and removed together with the DIMM, with strong commonality, low cost, and is applicable to different models of DIMM.

[0041] Refer to Figure 4 and Figure 5 As shown, in one embodiment, the second heat conduction module 130 includes a second heat conduction plate 131 and a heat pipe 132 connected to the second heat conduction plate 131; the second heat conduction plate 131 is connected to the liquid cooling module 110. By combining the heat pipe 132 with the second heat conduction plate 131, the diameter and length of the heat pipe 132 can be determined according to the actual heat dissipation requirements, so as to better meet the heat conduction requirements of the second heating element 220. The second heat conduction plate 131 is in a plate shape and can cover the second heating element 220 in a large area to achieve the overall heat dissipation of the second heating element 220.

[0042] Refer to Figure 5As shown, in one embodiment, the second heat conducting plate 131 is configured with a groove 133, and the heat pipe 132 is located within the groove 133. The heat pipe 132 can be embedded within the groove 133 by means such as welding. Utilizing the high heat conductivity coefficient of the heat pipe 132, the heat of the second heating element 220 can be rapidly transferred to the liquid cooling module 110.

[0043] Referring to Figure 2 and Figure 4 As shown, in one embodiment, a second heat conducting pad 140 is connected between the first heat conducting module 120 and the second heat conducting module 130 to reduce the heat transfer resistance between the first heat conducting module 120 and the second heat conducting module 130, enhance the heat conduction effect, and ensure the heat dissipation efficiency. Among them, the contact surfaces between the second heat conducting plate 131 and the second heat conducting pad 140 are all flat surfaces to ensure the heat conduction effect. Further, a third heat conducting pad 150 is connected between the second heat conducting module 130 and the liquid cooling module 110 to enhance the heat conduction effect and ensure the heat dissipation efficiency. In other embodiments, heat conducting silicone grease, compressible heat conducting materials, etc. can also be provided between the second heat conducting module 130 and the liquid cooling module 110 to enhance the heat conduction effect.

[0044] Referring to Figure 2 As shown, in one embodiment, the heat dissipation device 10 further includes a first fastener 161. One end of the first fastener 161 is connected to the second heat conducting module 130, and the other end of the first fastener 161 is connected to the second heating element 220. Specifically, the heat dissipation device 10 further includes a support post 162 mounted on the server motherboard. One end of the first fastener 161 is connected to the second heat conducting module 130, and the other end is connected to the support post 162. That is, the second heat conducting module 130 is locked to the support post 162 through the first fastener 161, providing a certain compressive force for the second heat conducting pad 140 and the third heat conducting pad 150, so that the second heat conducting module 130 is tightly connected to the liquid cooling module 110.

[0045] Referring to Figure 2 As shown, in one embodiment, the heat dissipation device 10 further includes a liquid cooling pipeline 170 communicating with the fluid channel. The liquid cooling pipeline 170 is used for allowing a cooling medium to flow into or out of the fluid channel. It can be understood that the liquid cooling pipeline 170 includes an inlet pipeline and an outlet pipeline. The materials of the inlet pipeline and the outlet pipeline can be polytetrafluoroethylene, fluorinated ethylene propylene copolymer, polyvinylidene fluoride, etc. To ensure that the inlet pipeline and the outlet pipeline can achieve a relatively large bending radius, the outer surfaces of the inlet pipeline and the outlet pipeline can be corrugated.

[0046] Further, referring to Figure 2As shown, the end of the liquid cooling pipeline 170 is connected with a quick connector 180, which is a blind plug type, convenient for connecting to the external liquid supply pipeline of the server, and can be quickly connected and disconnected to achieve liquid disconnection maintenance of a single server. Correspondingly, the quick connector 180 includes a liquid inlet connector connected to the liquid inlet pipeline and a liquid outlet connector connected to the liquid outlet pipeline. The liquid inlet connector and the liquid outlet connector have the same structural dimensions. The liquid inlet connector and the liquid outlet connector are connected to the external liquid supply pipeline, so that the cooling medium circulates in the liquid cooling module 110, taking away the heat generated by the first heating element 210 and the second heating element 220.

[0047] One embodiment of the present application also provides a cooling system (not shown), including the heat sink 10 as described above. The cooling system is used to dissipate heat from the server. The cooling efficiency of the cooling system is higher, and the liquid cooling module and the heat conduction unit can be set according to the positions of different heating elements, effectively solving the problem of poor cooling efficiency caused by the need to cool multiple heating elements; at the same time, it can also be applied to server hosts with different layouts, with stronger compatibility; and the heat conduction unit is used to export heat to the liquid cooling module, which reduces the flow channel structure, not only making the structure simpler, but also improving the operating reliability of the server and the cooling reliability of the heat sink; and the heat sink will not excessively occupy the internal space of the server, which is beneficial to the layout of the server host, so that the server can achieve high integration while solving the heat dissipation problem of the server.

[0048] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0049] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A heat dissipation device, characterized in that: Applied to a server, the heat dissipation device comprises: A liquid cooling module (110), wherein the interior of the liquid cooling module (110) has a fluid channel for circulating a cooling medium; the liquid cooling module (110) is used to be connected to a first heating element (210) of the server to exchange heat with the first heating element (210); A heat conduction unit (100) comprises a first heat conduction module (120) and a second heat conduction module (130) connected to the first heat conduction module (120); the first heat conduction module (120) is used to connect to a second heating element (220) of the server, and the second heat conduction module (130) is connected to the liquid cooling module (110); the heat conduction unit (100) is used to guide heat generated by the second heating element (220) to the liquid cooling module (110).

2. The heat dissipation device according to claim 1, characterized in that: The liquid cooling module (110) is detachably connected to the first heating element (210); and / or The first heat conduction module (120) is detachably connected to the second heating element (220).

3. The heat dissipation device according to claim 2, characterized in that: The first heat conduction module (120) comprises two first heat conduction plates (121), and the two first heat conduction plates (121) are respectively connected to two sides of the second heating element (220).

4. The heat dissipation device according to claim 3, characterized in that: The first heat-conducting module (120) further comprises a first heat-conducting pad (122), wherein the first heat-conducting pad (122) is connected between the first heat-conducting plate (121) and the second heating element (220).

5. The heat dissipation device according to claim 4, characterized in that: The first heat conduction module (120) further comprises a heat dissipation block (123), the heat dissipation block (123) having a first card slot, and the first heat conduction plate (121), the first heat conduction pad (122) and the second heating element (220) are all card-connected to the first card slot.

6. The heat dissipation device according to claim 1, characterized in that: The second heat conduction module (130) comprises a second heat conduction plate (131) and a heat pipe (132) connected to the second heat conduction plate (131); the second heat conduction plate (131) is connected to the liquid cooling module (110).

7. The heat dissipation device according to claim 6, characterized in that: The second heat conducting plate (131) is provided with a groove (133), and the heat pipe (132) is located in the groove (133).

8. The heat dissipation device according to claim 1, characterized in that: A second thermal conductive pad (140) is connected between the first thermal conductive module (120) and the second thermal conductive module (130); and / or A third thermal conductive pad (150) is connected between the second thermal conductive module (130) and the liquid cooling module (110).

9. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device further comprises a first fastener (161), one end of the first fastener (161) being connected to the second heat conduction module (130), and the other end of the first fastener (161) being connected to the second heating element (220); and / or The heat dissipation device further comprises a second fastener (163), the second fastener (163) being sequentially disposed through the liquid cooling module (110) and the second heating element (220); and / or The heat dissipation device further comprises a liquid cooling pipeline (170) in communication with the fluid channel, the liquid cooling pipeline (170) being used for allowing cooling medium to flow into the fluid channel or flow out of the fluid channel.

10. A cooling system, characterized in that: The invention comprises a heat dissipation device as claimed in any one of claims 1 to 9.

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