Fingerprint module and fingerprint electronic equipment

Abstract

The utility model discloses a fingerprint module and fingerprint electronic equipment. The fingerprint module comprises a fingerprint identification assembly and an FPC, wherein the fingerprint identification assembly is used for collecting and identifying fingerprint information. Wherein the FPC comprises a chip connecting end which is used for being electrically connected with a fingerprint sensing chip in the fingerprint identification assembly; the mainboard connecting end is used for being electrically connected with a corresponding complete machine mainboard; the FPC connecting main body is arranged between the chip connecting end and the mainboard connecting end and comprises an insulating layer on the surface and a conductive layer inside; the anti-static structure is a protruding part arranged on the side edge of the FPC connecting body, a conducting layer in the protruding part is exposed out of the back face of the FPC, and the conducting layer is electrically connected with a whole machine mainboard through conducting resin to form grounding. According to the fingerprint module, the static electricity of the fingerprint module can be effectively led out, so that the performance of the module is improved, the fingerprint recognition precision is ensured, damage to the fingerprint module caused by the static electricity can be avoided, and the service life of the module is prolonged.

Description

Technical Field

[0001] This application relates to the technical field of fingerprint recognition, and particularly to a fingerprint module and a fingerprint electronic device. Background Art

[0002] Fingerprint modules are widely used in various electronic devices. They perform fingerprint recognition by contacting with fingers for encryption or unlocking. However, when a finger contacts a fingerprint module, static electricity is easily generated, which may not only interfere with the module circuit and affect the fingerprint recognition accuracy, but also cause damage to the fingerprint module and reduce its service life.

[0003] Based on this, how to design a fingerprint module that can effectively prevent static electricity has become an urgent technical problem in the industry. Summary of the Invention

[0004] In order to solve at least one problem existing in the prior art, the purpose of this application is to provide a fingerprint module and a fingerprint electronic device, which can effectively lead out the static electricity of the fingerprint module, thereby not only helping to improve the module performance, ensuring the fingerprint recognition accuracy, but also avoiding damage to the fingerprint module caused by static electricity, and being beneficial to extending the service life of the module. In addition, by bonding the protruding part to the main board of the whole machine, the FPC connection body can be closely attached to the main board to avoid warping and improve the stability.

[0005] To achieve the above purpose, the fingerprint module provided by this application includes a fingerprint recognition component and an FPC for collecting and identifying fingerprint information;

[0006] Among them, the FPC includes:

[0007] A chip connection end for electrically connecting the fingerprint sensing chip in the fingerprint recognition component;

[0008] A main board connection end for electrically connecting to the corresponding main board of the whole machine;

[0009] The FPC connection body between the chip connection end and the main board connection end includes an insulating layer on the surface and a conductive layer inside; and,

[0010] An anti-static structure, which is a protruding part provided on the side of the FPC connection body. The conductive layer in the protruding part is exposed on the back of the FPC; and, the conductive layer is electrically connected to the main board of the whole machine through a conductive adhesive to form a ground connection.

[0011] Optionally, the protruding part includes a first protruding part; the first protruding part is arranged close to the chip connection end.

[0012] Further optionally, the protruding part further includes a second protruding part; the second protruding part is arranged close to the main board connection end.

[0013] Optionally, the above-mentioned protruding parts are respectively provided on two side edges of the FPC connection body.

[0014] Optionally, the length and / or width range of the exposed conductive layer of the protruding part is 2 mm - 5 mm.

[0015] Optionally, the conductive layer is electrically bonded to the main board of the whole machine through a conductive double-sided adhesive to form the ground connection.

[0016] Optionally, the conductive layer is bonded to the metal outer frame of the main board of the whole machine through a conductive double-sided adhesive.

[0017] Optionally, the conductive layer is also electrically connected to the ground terminal of the FPC.

[0018] Optionally, the fingerprint recognition component includes

[0019] a fingerprint sensing chip for collecting and identifying fingerprint information;

[0020] an insulating cover plate covering and fixed on the upper surface of the fingerprint sensing chip;

[0021] a conductive outer ring sleeved and fixed on the outer periphery of the fingerprint sensing chip and the insulating cover plate.

[0022] To achieve the above object, the fingerprint electronic device provided by the present application further includes the fingerprint module as described above.

[0023] In a fingerprint module and a fingerprint electronic device of the present application, by providing a special protruding part on the FPC connection body, exposing the conductive layer in the protruding part on the back of the FPC, and electrically connecting the conductive layer to the main board of the whole machine through a conductive adhesive to form a ground connection. Thus, the static electricity of the fingerprint module can be effectively led out, which not only helps to improve the module performance, ensure the fingerprint recognition accuracy, but also can avoid the damage of the fingerprint module caused by static electricity, and is beneficial to extending the service life of the module. In addition, by bonding the protruding part to the main board of the whole machine, the FPC connection body can be closely attached to the main board, avoiding warping and improving the stability.

[0024] Other features and advantages of the present application will be described in the following specification, and, in part, will be obvious from the specification, or will be understood by implementing the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings are used to provide a further understanding of the present application, and constitute a part of the specification, and together with the embodiments of the present application, are used to explain the present application, and do not constitute a limitation to the present application. In the drawings:

[0026] Figure 1Schematic diagram showing the back side of the FPC for the fingerprint module according to an embodiment of the present application;

[0027] Figure 2 is Figure 1 Schematic diagram showing the front side of the FPC for the fingerprint module in

[0028] Among them, the specific reference numerals include the following:

[0029] Fingerprint module 100; fingerprint recognition component 20; FPC 30; chip connection end 31; main board connection end 32; FPC connection body 33; insulating layer 331; conductive layer 332; anti-static structure 34; back side of FPC 35; front side of FPC 36; first protruding portion 37; second protruding portion 38. Detailed implementation manners

[0030] Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although some embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. On the contrary, these embodiments are provided to more thoroughly and completely understand the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not used to limit the protection scope of the present application.

[0031] As used herein, the term "including" and its variants are open-ended, that is, "including but not limited to". The term "based on" is "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the following description.

[0032] Next, embodiments of the present application will be described in detail with reference to the drawings.

[0033] As Figure 1 - Figure 2 shown, the fingerprint module 100 includes a fingerprint recognition component 20 and an FPC 30 for collecting and recognizing fingerprint information. Among them, the FPC 30 includes a chip connection end 31, a main board connection end 32, an FPC connection body 33, and an anti-static structure 34.

[0034] Among them, the chip connection end 31 is used to electrically connect the fingerprint sensing chip in the fingerprint recognition component 20. The main board connection end 32 is used to electrically connect to the corresponding main board of the whole machine. The FPC connection body 33 between the chip connection end 31 and the main board connection end 32 includes an insulating layer 331 on the surface and a conductive layer 332 inside.

[0035] In a specific example, the FPC connection body 33 is a multi-layer structure formed by cross-laminating an insulating layer 331 and a conductive layer 332. The material of the insulating layer 331 is PI (Polyimide) or PET (Polyethylene terephthalate); the conductive layer 332 is a copper foil.

[0036] The anti-static structure 34 is a protruding portion provided on the side of the FPC connection body 33. The conductive layer 332 inside the protruding portion is exposed on the back surface 35 of the FPC. In a specific embodiment, it can be a copper exposure design. And, the conductive layer 332 is electrically connected to the main board of the whole machine through a conductive adhesive to form a ground connection.

[0037] Specifically, the conductive layer 332 can be bonded to the metal outer frame of the main board of the whole machine through a conductive adhesive to form a ground connection. In a specific example, the conductive adhesive is preferably a conductive double-sided adhesive.

[0038] It should be noted that, in a specific example, the protruding portion on the front surface of the FPC is not provided with copper exposure to avoid introducing static electricity.

[0039] It can be understood that the number of the protruding portions can be one or more; it can be located on one side of the FPC connection body or distributed on two sides of the FPC connection body. The present application does not make specific restrictions on this.

[0040] According to the fingerprint module of the embodiment of the present application, by providing a special protruding portion on the FPC connection body, and exposing the conductive layer in the protruding portion on the back surface of the FPC, and electrically connecting the conductive layer to the main board of the whole machine through a conductive adhesive to form a ground connection. Thus, the static electricity of the fingerprint module can be effectively led out, which not only helps to improve the module performance, ensure the fingerprint recognition accuracy, but also can avoid the damage of the fingerprint module caused by static electricity, and is beneficial to extending the service life of the module. In addition, by bonding the protruding portion to the main board of the whole machine, the FPC connection body can be closely attached to the main board, avoiding warping and improving the stability.

[0041] In the embodiment of the present application, the protruding portion includes a first protruding portion 37, and the first protruding portion 37 is arranged close to the chip connection end 31 to release the static electricity in front of the chip. Further, the protruding portion preferably further includes a second protruding portion 38, and the second protruding portion 38 is arranged close to the main board connection end 32 to facilitate the full release of the static electricity.

[0042] It should be noted that the concepts such as "first" and "second" mentioned in the present application are only used to distinguish different structures, and are not used to limit the order of the functions performed by these structures or the interdependence or relative importance.

[0043] Optionally, the above-mentioned protruding parts are respectively provided on two sides of the FPC connection body 33, which can further improve the stability.

[0044] In the embodiment of the present application, the length range of the exposed conductive layer 332 of the protruding part is 2 mm - 5 mm. Or, the width range of the exposed conductive layer 332 of the protruding part is 2 mm - 5 mm. Or, both the length range and the width range of the exposed conductive layer 332 of the protruding part are 2 mm - 5 mm.

[0045] Preferably, the conductive layer 332 is also electrically connected to the ground terminal of the FPC 30 to facilitate the full release of static electricity.

[0046] Optionally, the fingerprint recognition component 20 includes a fingerprint sensing chip, an insulating cover plate, and a conductive outer ring. Among them, the fingerprint sensing chip is used to collect and identify fingerprint information; the insulating cover plate covers and fixes the upper surface of the fingerprint sensing chip; the conductive outer ring is sleeved and fixed on the outer periphery of the fingerprint sensing chip and the insulating cover plate.

[0047] The embodiment of the present application also provides a fingerprint electronic device, including the fingerprint module in the above-mentioned embodiment.

[0048] It should be noted that the modifications of "one" and "multiple" mentioned in the present application are illustrative rather than restrictive. Those skilled in the art should understand that unless otherwise clearly specified in the context, it should be understood as "one or more"; "multiple" should be understood as two or more.

[0049] In the description of the present application, it should be noted that the relationship between the structures should be understood in a broad sense. For example, the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0050] And, unless otherwise clearly specified and limited, the terms "connected" and "connected" can be mechanical connections or electrical connections; they can be fixed connections or detachable connections; they can be directly connected or indirectly connected through an intermediate medium, and can also be the internal communication of two elements.

[0051] It should be noted that in the drawings, for clarity, the dimensions of layers, regions, components, and their relative dimensions may be exaggerated. Where the same or similar reference numerals represent the same or similar components or components with the same or similar functions throughout.

[0052] Those of ordinary skill in the art can understand that the above are only the preferred embodiments of the present application and are not used to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A fingerprint module, characterized in that: Including, a fingerprint recognition component and FPC for collecting and identifying fingerprint information; Wherein, the FPC includes: A chip connection terminal, used for electrically connecting to a fingerprint sensing chip in the fingerprint recognition component; Mainboard connection terminal, used for electrically connecting to the corresponding whole machine mainboard; The FPC connection body between the chip connection end and the mainboard connection end includes an insulating layer on the surface and a conductive layer inside; and The antistatic structure is a protrusion arranged on the side of the FPC connecting body, and the conductive layer in the protrusion is exposed on the back of the FPC; and the conductive layer is electrically connected to the whole machine mainboard through conductive glue to form grounding.

2. The fingerprint module according to claim 1, characterized in that: The protrusions include a first protrusion; the first protrusion is arranged close to the chip connection end.

3. The fingerprint module according to claim 2, characterized in that: The protrusion also includes a second protrusion; the second protrusion is arranged close to the mainboard connection end.

4. The fingerprint module according to claim 1, characterized in that: The above-mentioned protrusions are respectively provided on the two side edges of the FPC connection body.

5. The fingerprint module according to claim 1, characterized in that: The length and / or width of the conductive layer exposed on the protruding portion ranges from 2 mm to 5 mm.

6. The fingerprint module according to claim 1, characterized in that: The conductive layer is electrically bonded to the whole machine mainboard through a conductive double-sided adhesive to form the grounding.

7. The fingerprint module according to claim 1, characterized in that: The conductive layer is bonded to the metal outer frame of the whole machine mainboard through conductive double-sided adhesive.

8. The fingerprint module according to claim 1, characterized in that: The conductive layer is also electrically connected to the ground terminal of the FPC.

9. The fingerprint module according to claim 1, characterized in that: The fingerprint recognition component comprises: Fingerprint sensor chip, used to collect and identify fingerprint information; An insulating cover plate, covering and fixed to the upper surface of the fingerprint sensor chip; The conductive outer ring is sleeved and fixed on the outer periphery of the fingerprint sensing chip and the insulating cover plate.

10. A fingerprint electronic device, characterized in that: Including the fingerprint module as described in any one of claims 1-9.

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