Board-to-board connector

Abstract

A board-to-board connector comprises an insulating body, a plurality of conductive terminals and a wave absorbing material. The wave absorbing material is fixed on the insulating body. The insulating body comprises a first outer side surface. The wave absorbing material comprises a first wave absorbing plate part covering at least part of the first outer side face. Compared with the prior art, the board-to-board connector of the board can absorb noise leaked out of the board-to-board connector when the conductive terminals transmit signals through the first wave absorbing board part, and improves the quality of signal transmission. Besides, the wave-absorbing material is arranged at the outer side of the board-to-board connector, so that the damage to the structural strength of the insulating body is reduced as much as possible, and the wave-absorbing material is suitable for a thin board-to-board connector.

Description

Technical Field

[0001] The utility model relates to a board-to-board connector, belonging to the technical field of connectors. Background Art

[0002] The board-to-board connectors in the related art generally include an insulating body and a plurality of conductive terminals fixed in the insulating body. Each conductive terminal includes a first contact elastic arm protruding from the insulating body and a second contact elastic arm protruding from the insulating body. The first contact elastic arm is configured to abut against a first circuit board to achieve electrical connection. The second contact elastic arm is configured to abut against a second circuit board to achieve electrical connection.

[0003] With the continuous improvement of the signal transmission requirements for board-to-board connectors, how to reduce the crosstalk between signals is a technical problem faced by those skilled in the art.

[0004] For this reason, in the related art, it is proposed to open a plurality of through slots in the insulating body and install ground isolation sheets in each slot. After installation, a ground isolation sheet is provided between two adjacent rows of conductive terminals to improve the ground shielding effect. However, considering problems such as terminal density and the structural strength of the insulating body, on the one hand, the insulating body in the related art may not have enough space to open slots; on the other hand, when the insulating body itself is already thin, the processing difficulty of opening the slots is large, and it is easy to cause substantial damage to the structural strength of the insulating body itself.

[0005] Therefore, how to optimize the board-to-board connectors in the related art is a technical problem that those skilled in the art need to solve. Summary of the Utility Model

[0006] The purpose of the utility model is to provide a board-to-board connector with an optimized structure.

[0007] To achieve the above purpose, the utility model adopts the following technical solutions: A board-to-board connector, which includes:

[0008] An insulating body, the insulating body includes a terminal installation area, the terminal installation area includes a first surface, a second surface facing away from the first surface in a first direction, and a first outer side surface;

[0009] A plurality of conductive terminals, the conductive terminals are arranged in the terminal installation area; the conductive terminals include a first contact elastic arm extending and protruding from the first surface and a second contact elastic arm extending and protruding from the second surface; the first contact elastic arm is configured to be electrically connected to a first circuit board; the second contact elastic arm is configured to be electrically connected to a second circuit board; and

[0010] Absorbing material, the absorbing material is disposed on the insulating body, the absorbing material includes a first absorbing plate portion covering at least a part of the first outer side surface, and the first absorbing plate portion is configured to be close to the grounding portion of the first circuit board and / or close to the grounding portion of the second circuit board.

[0011] As a further improved technical solution of the present invention, the absorbing material is fixed to the insulating body by injection molding.

[0012] As a further improved technical solution of the present invention, the insulating body includes a first extension portion connected to one side of the terminal installation area and a second extension portion connected to the other side of the terminal installation area; the first extension portion includes a first extension bump, the second extension portion includes a second extension bump, the insulating body includes a first accommodation space between the first extension bump and the second extension bump, and the first absorbing plate portion is accommodated in the first accommodation space.

[0013] As a further improved technical solution of the present invention, the first extension bump has a first upper surface and a first lower surface facing away from the first upper surface along the first direction;

[0014] The second extension bump has a second upper surface and a second lower surface facing away from the second upper surface along the first direction;

[0015] The first absorbing plate portion includes a first top surface and a first bottom surface facing away from the first top surface along the first direction;

[0016] The first upper surface is flush with the second upper surface to form a first mounting surface, the first mounting surface is configured to mount the first circuit board, and the first top surface is flush with the first mounting surface;

[0017] The first lower surface is flush with the second lower surface to form a second mounting surface, the second mounting surface is configured to mount the second circuit board, and the first bottom surface is flush with the second mounting surface.

[0018] As a further improved technical solution of the present invention, the first extension bump has a first outer surface, the second extension bump has a second outer surface, and the first absorbing plate portion includes a first outer side surface; wherein the first outer surface, the second outer surface and the first outer side surface are flush.

[0019] As a further improved technical solution of the present invention, the insulating body includes a plurality of first protrusions extending from the first outer side surface and protruding into the first accommodation space;

[0020] The first wave-absorbing plate portion is provided with a plurality of first through holes, and the first convex posts are inserted into the corresponding first through holes.

[0021] As a further improved technical solution of the present invention, the terminal installation area includes a second outer side surface facing away from the first outer side surface in a second direction; the second direction is perpendicular to the first direction;

[0022] The wave-absorbing material includes a second wave-absorbing plate portion covering at least part of the second outer side surface, and the second wave-absorbing plate portion is configured to be close to the grounding portion of the first circuit board and / or close to the grounding portion of the second circuit board.

[0023] As a further improved technical solution of the present invention, the first extension portion includes a third extension bump, the second extension portion includes a fourth extension bump, the insulating body includes a second receiving space between the third extension bump and the fourth extension bump, and the second wave-absorbing plate portion is received in the second receiving space.

[0024] As a further improved technical solution of the present invention, the terminal installation area further includes a second outer side surface, a third outer side surface, and a fourth outer side surface, wherein the second outer side surface faces away from the first outer side surface in a second direction, the fourth outer side surface faces away from the third outer side surface in a third direction, and the first direction, the second direction, and the third direction are perpendicular to each other in pairs;

[0025] The wave-absorbing material is in a frame shape, and it includes a second wave-absorbing plate portion covering at least part of the second outer side surface, a third wave-absorbing plate portion covering at least part of the third outer side surface, and a fourth wave-absorbing plate portion covering at least part of the fourth outer side surface.

[0026] As a further improved technical solution of the present invention, the wave-absorbing material has a flat upper surface and a flat lower surface, wherein the upper surface of the wave-absorbing material forms a first installation surface, the first installation surface is configured to install the first circuit board, the lower surface of the wave-absorbing material forms a second installation surface, the second installation surface is configured to install the second circuit board, the first installation surface protrudes upward from the first surface of the terminal installation area, and the second installation surface protrudes downward from the second surface of the terminal installation area.

[0027] Compared with the prior art, the terminal mounting area of the present utility model includes a first outer side surface. The board-to-board connector includes a wave-absorbing material, and the wave-absorbing material includes a first wave-absorbing plate portion covering at least a part of the first outer side surface. The first wave-absorbing plate portion is configured to be close to the grounding portion of the first circuit board and / or close to the grounding portion of the second circuit board. With such a setting, the board-to-board connector of the present utility model can absorb the noise leaked outside the board-to-board connector by the first wave-absorbing plate portion during signal transmission, improving the quality of signal transmission. In addition, the wave-absorbing material of the present utility model is located outside the board-to-board connector, thus minimizing the damage to the structural strength of the insulating body as much as possible, and is applicable to thin board-to-board connectors. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a perspective schematic view of the board-to-board connector of the present utility model in the first embodiment;

[0029] Figure 2 is Figure 1 a perspective schematic view from another angle;

[0030] Figure 3 is Figure 1 a top view;

[0031] Figure 4 is Figure 1 a bottom view;

[0032] Figure 5 is Figure 1 a partial perspective exploded view;

[0033] Figure 6 is Figure 5 a partial perspective exploded view from another angle;

[0034] Figure 7 is a cross-sectional schematic view along the B-B line in Figure 3 , and in addition, the first circuit board and the second circuit board are shown by dashed lines;

[0035] Figure 8 is when Figure 7 the first circuit board and the second circuit board in

[0036] Figure 9 is Figure 7 a partial enlarged view of the framed part C in

[0037] Figure 10 is Figure 8 a partial enlarged view of the framed part D in

[0038] Figure 11It is a perspective view of the board-to-board connector of the present utility model in the second embodiment;

[0039] Figure 12 It is Figure 11 A perspective view from another angle;

[0040] Figure 13 It is Figure 11 The top view of;

[0041] Figure 14 It is Figure 11 The bottom view of;

[0042] Figure 15 It is Figure 11 The partial three-dimensional exploded view of;

[0043] Figure 16 It is Figure 15 The partial three-dimensional exploded view from another angle;

[0044] Figure 17 It is a perspective view of the board-to-board connector of the present utility model in the third embodiment;

[0045] Figure 18 It is Figure 17 A perspective view from another angle;

[0046] Figure 19 It is Figure 17 The top view of;

[0047] Figure 20 It is Figure 17 The bottom view of;

[0048] Figure 21 It is Figure 17 The partial three-dimensional exploded view of;

[0049] Figure 22 It is Figure 21 The partial three-dimensional exploded view from another angle. Specific embodiments

[0050] The following will describe in detail the exemplary specific embodiments of the present utility model with reference to the accompanying drawings. If there are several specific embodiments, the features in these embodiments can be combined with each other without conflict. When the description involves the accompanying drawings, unless otherwise specified, the same numbers in different drawings represent the same or similar elements. The content described in the following exemplary specific embodiments does not represent all embodiments consistent with the present utility model; on the contrary, they are only examples of devices, products, and / or methods that are consistent with some aspects of the present utility model as recorded in the claims of the present utility model.

[0051] The terms used in the present utility model are for the purpose of describing specific embodiments only and are not intended to limit the protection scope of the present utility model. The singular forms of "a", "the", or "said" used in the description and claims of the present utility model are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0052] It should be understood that words such as "first", "second", and similar words used in the description and claims of the present utility model do not indicate any order, quantity, or importance, but are only used to distinguish the named features. Similarly, words such as "a" or "one" do not indicate a quantity limitation, but indicate the existence of at least one. Unless otherwise specified, words such as "front", "rear", "upper", "lower", etc. that appear in the present utility model are only for convenience of description and are not limited to a specific position or a spatial orientation. The expression "comprising" or "including" is an open-ended expression, meaning that the elements appearing before "comprising" or "including" cover the elements appearing after "comprising" or "including" and their equivalents, and this does not exclude that the elements appearing before "comprising" or "including" may also include other elements. If "several" appears in the present utility model, its meaning refers to two or more.

[0053] Please refer to Figures 1 to 22 As shown, the present utility model discloses a board-to-board connector 100, which includes an insulating body 1, a plurality of conductive terminals 2 provided on the insulating body 1, and an electromagnetic wave absorbing material 5 provided on the insulating body 1. The board-to-board connector 100 is used for electrically connecting a first circuit board 201 and a second circuit board 202 (as Figure 7 and Figure 8 shown). In an embodiment of the present utility model, the electromagnetic wave absorbing material 5 is fixed to the insulating body 1 by insert molding. In an embodiment of the present utility model, the conductivity of the material of the electromagnetic wave absorbing material 5 is 20 S·m -1 . In an embodiment of the present utility model, the electromagnetic wave absorbing material 5 is a plastic containing conductive particles such as metal and graphite, and the dielectric loss through the conductive path reaches a lower conductivity to absorb and attenuate the electromagnetic wave energy incident in space. The metal has a conductivity of 10 6 S·m -1 , and the designer can adjust the wave absorption ability and the wave absorption frequency band to be absorbed according to the structural dimensions and materials with a conductivity far lower than that of the metal. The types of materials of the electromagnetic wave absorbing material 5 include but are not limited to this.

[0054] Please combine Figure 5 and Figure 6As shown, in the illustrated embodiment of the present utility model, the insulating body 1 includes a terminal mounting area 1a. In the illustrated embodiment of the present utility model, the terminal mounting area 1a is generally rectangular parallelepiped-shaped. The terminal mounting area 1a includes a first surface 131 (e.g., the upper surface), a second surface 132 (e.g., the lower surface) facing away from the first surface 131 along a first direction A1-A1 (e.g., the up-down direction), a plurality of terminal mounting grooves 130 penetrating the first surface 131 and the second surface 132 along the first direction A1-A1, a first outer side surface 133, a second outer side surface 134, a third outer side surface 135, and a fourth outer side surface 136. The second outer side surface 134 faces away from the first outer side surface 133 along a second direction A2-A2. The fourth outer side surface 136 faces away from the third outer side surface 135 along a third direction A3-A3. The first direction A1-A1, the second direction A2-A2, and the third direction A3-A3 are perpendicular to each other in pairs.

[0055] In the first embodiment illustrated by the present utility model, the wave-absorbing material 5 is in a frame shape so as to achieve a better noise absorption effect. The wave-absorbing material 5 includes a first wave-absorbing plate portion 51 covering at least part of the first outer side surface 133, a second wave-absorbing plate portion 52 covering at least part of the second outer side surface 134, a third wave-absorbing plate portion 53 covering at least part of the third outer side surface 135, and a fourth wave-absorbing plate portion 54 covering at least part of the fourth outer side surface 136. The first wave-absorbing plate portion 51 is configured to be close to the grounding portion of the first circuit board 201 and / or close to the grounding portion of the second circuit board 202. The first wave-absorbing plate portion 51 can be arranged to be in contact with the grounding portion of the first circuit board 201 and / or the grounding portion of the second circuit board 202, or be spaced apart from the grounding portion of the first circuit board 201 and / or the grounding portion of the second circuit board 202 by a certain distance. The second wave-absorbing plate portion 52 is configured to be close to the grounding portion of the first circuit board 201 and / or close to the grounding portion of the second circuit board 202. The second wave-absorbing plate portion 52 can be arranged to be in contact with the grounding portion of the first circuit board 201 and / or the grounding portion of the second circuit board 202, or be spaced apart from the grounding portion of the first circuit board 201 and / or the grounding portion of the second circuit board 202 by a certain distance. The third wave-absorbing plate portion 53 is configured to be close to the grounding portion of the first circuit board 201 and / or close to the grounding portion of the second circuit board 202. The third wave-absorbing plate portion 53 can be arranged to be in contact with the grounding portion of the first circuit board 201 and / or the grounding portion of the second circuit board 202, or be spaced apart from the grounding portion of the first circuit board 201 and / or the grounding portion of the second circuit board 202 by a certain distance. The fourth wave-absorbing plate portion 54 is configured to be close to the grounding portion of the first circuit board 201 and / or close to the grounding portion of the second circuit board 202. The fourth wave-absorbing plate portion 54 can be arranged to be in contact with the grounding portion of the first circuit board 201 and / or the grounding portion of the second circuit board 202, or be spaced apart from the grounding portion of the first circuit board 201 and / or the grounding portion of the second circuit board 202 by a certain distance. Those skilled in the art can understand that the grounding portion of the first circuit board 201 and / or the grounding portion close to the second circuit board 202 can be a grounding layer or a grounding sheet, and the present utility model will not elaborate on this.

[0056] Please refer to Figures 1 to 10As shown, in the first embodiment illustrated in the present utility model, the absorbing material 5 has a flat upper surface 501 and a flat lower surface 502. The upper surface 501 of the absorbing material 5 forms a first mounting surface 11, and the first mounting surface 11 is configured to mount the first circuit board 201; the lower surface 502 of the absorbing material 5 forms a second mounting surface 12, and the second mounting surface 12 is configured to mount the second circuit board 202. The first mounting surface 11 protrudes upward from the first surface 131 of the terminal mounting area 1a, and the second mounting surface 12 protrudes downward from the second surface 132 of the terminal mounting area 1a. Those skilled in the art can understand that by setting the first surface 131 of the terminal mounting area 1a to be lower than the first mounting surface 11, that is, the first surface 131 does not contact the first circuit board 201, the coplanarity problem that may be caused by the relatively large overall area of the first mounting surface 11 can be reduced. Similarly, by setting the second surface 132 of the terminal mounting area 1a to be higher than the second mounting surface 12, that is, the second surface 132 does not contact the second circuit board 202, the coplanarity problem that may be caused by the relatively large overall area of the second mounting surface 12 can be reduced.

[0057] In the embodiment illustrated in the present utility model, the plurality of conductive terminals 2 are arranged in a matrix. Each conductive terminal 2 includes a fixing portion 20 fixed in the terminal mounting groove 130, a first contact spring arm 21 extending and protruding from the first mounting surface 11, and a second contact spring arm 22 extending and protruding from the second mounting surface 12. The first contact spring arm 21 includes a first contact surface 211 configured to abut against the first circuit board 201, and the second contact spring arm 22 includes a second contact surface 221 configured to abut against the second circuit board 202. In the embodiment illustrated in the present utility model, both the first contact surface 211 and the second contact surface 221 are arc-shaped surfaces to reduce scratching of the circuit board.

[0058] Please refer to Figures 11 to 16 As shown, the board-to-board connector 100 in the second embodiment of the present utility model is substantially the same as the board-to-board connector 100 in the first embodiment of the present utility model, where the same reference numerals represent the same or corresponding technical features. Only the main differences between the two will be described below.

[0059] Please refer to Figure 15 and Figure 16As shown, in the second embodiment illustrated in the present utility model, the insulating body 1 includes a terminal mounting area 1a, a first extension portion 1b connected to one side of the terminal mounting area 1a, and a second extension portion 1c connected to the other side of the terminal mounting area 1a. In the embodiment illustrated in the present utility model, the terminal mounting area 1a, the first extension portion 1b, and the second extension portion 1c are integrally formed.

[0060] In the embodiment illustrated in the present utility model, the terminal mounting area 1a includes a first surface 131 (for example, the upper surface), a second surface 132 (for example, the lower surface) facing away from the first surface 131 along a first direction A1-A1 (for example, the up-down direction), a plurality of terminal mounting grooves 130 penetrating the first surface 131 and the second surface 132 along the first direction A1-A1, a first outer side surface 133, and a second outer side surface 134 facing away from the first outer side surface 133. In the embodiment illustrated in the present utility model, the plurality of terminal mounting grooves 130 are arranged in a matrix along a second direction A2-A2 (for example, the left-right direction) and a third direction A3-A3 (for example, the front-back direction). The first direction A1-A1, the second direction A2-A2, and the third direction A3-A3 are perpendicular to each other in pairs. In the first embodiment illustrated in the present utility model, the first outer side surface 133 and the second outer side surface 134 are located outside the terminal mounting area 1a along the second direction A2-A2.

[0061] The wave-absorbing material 5 includes a first wave-absorbing plate portion 51 covering at least a part of the first outer side surface 133 and a second wave-absorbing plate portion 52 covering at least a part of the second outer side surface 134, wherein the first wave-absorbing plate portion 51 and the second wave-absorbing plate portion 52 are two separate parts.

[0062] In the second embodiment illustrated in the present utility model, the first extension portion 1b and the second extension portion 1c are respectively close to both ends of the terminal mounting area 1a along the third direction A3-A3. The first extension portion 1b and the second extension portion 1c protrude upward and downward from the terminal mounting area 1a along the first direction A1-A1.

[0063] Please refer to Figure 15 and Figure 16 As shown, in the second embodiment illustrated in the present utility model, the first extension portion 1b includes a first extension bump 1b1, the second extension portion 1c includes a second extension bump 1c1, and the insulating body 1 includes a first receiving space 1330 located between the first extension bump 1b1 and the second extension bump 1c1. The first wave-absorbing plate portion 51 is received in the first receiving space 1330.

[0064] The first extended bump 1b1 is provided with a first upper surface 111 and a first lower surface 112 facing away from the first upper surface 111 along the first direction A1-A1. The second extended bump 1c1 is provided with a second upper surface 121 and a second lower surface 122 facing away from the second upper surface 121 along the first direction A1-A1. The first wave-absorbing plate portion 51 includes a first top surface 511 and a first bottom surface 512 facing away from the first top surface 511 along the first direction A1-A1. The first upper surface 111 and the second upper surface 121 are flush to form a first mounting surface 11, and the first mounting surface 11 is configured to mount the first circuit board 201. The first top surface 511 is flush with the first mounting surface 11 to reduce the gap through which noise can leak. The first lower surface 112 and the second lower surface 122 are flush to form a second mounting surface 12, and the second mounting surface 12 is configured to mount the second circuit board 202. The first bottom surface 512 is flush with the second mounting surface 12 to reduce the gap through which noise can leak.

[0065] In addition, the first extended bump 1b1 is provided with a first outer surface 113, the second extended bump 1c1 is provided with a second outer surface 123, and the first wave-absorbing plate portion 51 includes a first outer side surface 513; wherein the first outer surface 113, the second outer surface 123, and the first outer side surface 513 are flush.

[0066] Similarly, the first extension portion 1b includes a third extended bump 1b2, the second extension portion 1c includes a fourth extended bump 1c2, the insulating body 1 includes a second receiving space 1340 between the third extended bump 1b2 and the fourth extended bump 1c2, and the second wave-absorbing plate portion 52 is received in the second receiving space 1340. Please refer to Figures 17 to 22 As shown, the board-to-board connector 100 in the third embodiment of the present invention is substantially the same as the board-to-board connector 100 in the second embodiment of the present invention, where the same reference numerals represent the same or corresponding technical features. Only the main differences between the two will be described below.

[0067] In the third embodiment of the board-to-board connector 100 of the present utility model, the insulating body 1 includes a plurality of first protruding columns 1331 extending from the first outer side surface 133 and protruding into the first receiving space 1330, and a plurality of second protruding columns 1341 extending from the second outer side surface 134 and protruding into the second receiving space 1340. The first wave-absorbing plate portion 51 is provided with a plurality of first through holes 514, and the first protruding columns 1331 are inserted into the corresponding first through holes 514. The second wave-absorbing plate portion 52 is provided with a plurality of second through holes 524, and the second protruding columns 1341 are inserted into the corresponding second through holes 524. The first protruding columns 1331 are inserted into the corresponding first through holes 514 to achieve positioning. The second protruding columns 1341 are inserted into the corresponding second through holes 524 to achieve positioning.

[0068] Compared with the prior art, the terminal installation area 1a of the present utility model includes the first outer side surface 133. The board-to-board connector 100 includes a wave-absorbing material 5, the wave-absorbing material 5 is fixed to the insulating body 1, and the wave-absorbing material 5 includes a first wave-absorbing plate portion 51 covering at least part of the first outer side surface 133. With such a setting, the board-to-board connector 100 of the present utility model can achieve a grounding shielding effect. In addition, the insulating body 1 of the present utility model does not provide a slot that penetrates the insulating body 1 along the first direction A1-A1 and is used for installing the first wave-absorbing plate portion 51 between two adjacent rows of conductive terminals 2 (that is, inside the insulating body 1), thereby minimizing the damage to the structural strength of the insulating body 1 and being applicable to thin board-to-board connectors 100.

[0069] The terminal installation area 1a of the present utility model includes the second outer side surface 134, and the wave-absorbing material 5 includes a second wave-absorbing plate portion 52 covering at least part of the second outer side surface 134. With such a setting, the board-to-board connector 100 of the present utility model can achieve a grounding shielding effect. In addition, the insulating body 1 of the present utility model does not provide a slot that penetrates the insulating body 1 along the first direction A1-A1 and is used for installing the second wave-absorbing plate portion 52 between two adjacent rows of conductive terminals 2 (that is, inside the insulating body 1), thereby minimizing the damage to the structural strength of the insulating body 1 and being applicable to thin board-to-board connectors 100. Those skilled in the art can understand that the slot is a through long slot with a length greater than four times the thickness of the insulating body 1 along the first direction A1-A1. The design of such a long slot is likely to significantly weaken the structural strength of the insulating body 1.

[0070] In addition, the board-to-board connector 100 of the present utility model can absorb the noise leaked outside the board-to-board connector 100 by the conductive terminal 2 during signal transmission through the wave-absorbing material 5, improving the quality of signal transmission. In addition, the wave-absorbing material 5 of the present utility model is located outside the board-to-board connector 100, thereby minimizing the damage to the structural strength of the insulating body 1 as much as possible and being applicable to thin board-to-board connectors.

[0071] The above embodiments are only used to illustrate the present utility model and do not limit the technical solutions described in the present utility model. The understanding of the present utility model should be based on those skilled in the art. Although this specification has described the present utility model in detail with reference to the above embodiments, those of ordinary skill in the art should understand that those skilled in the art can still modify or equivalently replace the present utility model, and all technical solutions and their improvements that do not depart from the spirit and scope of the present utility model should be covered within the scope of the claims of the present utility model.

Claims

1. A board-to-board connector, characterized in that: include: An insulating body, the insulating body comprising a terminal mounting area, the terminal mounting area comprising a first surface, a second surface opposite to the first surface along a first direction, and a first outer side surface; A plurality of conductive terminals, wherein the conductive terminals are arranged in the terminal mounting area; The conductive terminal comprises a first contact elastic arm extending and protruding from the first surface and a second contact elastic arm extending and protruding from the second surface; The first contact elastic arm is configured to be electrically connected to the first circuit board; the second contact elastic arm is configured to be electrically connected to the second circuit board; as well as The absorbing material is arranged on the insulating body, and the absorbing material includes a first absorbing plate portion covering at least a portion of the first outer surface, and the first absorbing plate portion is configured to be close to the grounding portion of the first circuit board and / or close to the grounding portion of the second circuit board.

2. The board-to-board connector according to claim 1, wherein: The wave absorbing material is fixed to the insulating body by injection molding.

3. The board-to-board connector according to claim 1, wherein: The insulating body includes a first extension portion connected to one side of the terminal mounting area and a second extension portion connected to the other side of the terminal mounting area; the first extension portion includes a first extension protrusion, and the second extension portion includes a second extension protrusion. The insulating body includes a first receiving space located between the first extension protrusion and the second extension protrusion, and the first absorbing plate portion is received in the first receiving space.

4. The board-to-board connector according to claim 3, wherein: The first extending protrusion is provided with a first upper surface and a first lower surface opposite to the first upper surface along the first direction; The second extending protrusion is provided with a second upper surface and a second lower surface opposite to the second upper surface along the first direction; The first wave absorbing plate portion includes a first top surface and a first bottom surface opposite to the first top surface along the first direction; The first upper surface is flush with the second upper surface to form a first mounting surface, the first mounting surface is configured to mount the first circuit board, and the first top surface is flush with the first mounting surface; The first lower surface is flush with the second lower surface to form a second mounting surface, the second mounting surface is configured to mount the second circuit board, and the first bottom surface is flush with the second mounting surface.

5. The board-to-board connector according to claim 4, wherein: The first extending protrusion is provided with a first outer surface, the second extending protrusion is provided with a second outer surface, and the first absorbing plate portion includes a first outer surface; wherein the first outer surface, the second outer surface and the first outer surface are flush.

6. The board-to-board connector according to claim 3, wherein: The insulating body includes a plurality of first protruding columns extending from the first outer side surface and protruding into the first receiving space; The first wave absorbing plate portion is provided with a plurality of first through holes, and the first protruding columns are inserted into corresponding first through holes.

7. The board-to-board connector according to claim 3, wherein: The terminal mounting area includes a second outer side surface opposite to the first outer side surface along a second direction; the second direction is perpendicular to the first direction; The absorbing material includes a second absorbing plate portion covering at least a portion of the second outer side, and the second absorbing plate portion is configured to be close to a grounding portion of the first circuit board and / or close to a grounding portion of the second circuit board.

8. The board-to-board connector according to claim 7, wherein: The first extension portion includes a third extension protrusion, the second extension portion includes a fourth extension protrusion, the insulating body includes a second receiving space between the third extension protrusion and the fourth extension protrusion, and the second absorbing plate portion is received in the second receiving space.

9. The board-to-board connector according to claim 1, wherein: The terminal mounting area further comprises a second outer side surface, a third outer side surface and a fourth outer side surface, wherein the second outer side surface is opposite to the first outer side surface along a second direction, the fourth outer side surface is opposite to the third outer side surface along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other; The absorbing material is in a frame shape and includes a second absorbing plate portion covering at least a portion of the second outer surface, a third absorbing plate portion covering at least a portion of the third outer surface, and a fourth absorbing plate portion covering at least a portion of the fourth outer surface.

10. The board-to-board connector according to claim 9, wherein: The absorbing material is provided with a flat upper surface and a flat lower surface, wherein the upper surface of the absorbing material forms a first mounting surface, the first mounting surface is configured to mount the first circuit board, the lower surface of the absorbing material forms a second mounting surface, the second mounting surface is configured to mount the second circuit board, the first mounting surface protrudes upward from the first surface of the terminal mounting area, and the second mounting surface protrudes downward from the second surface of the terminal mounting area.

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