Compact inverter convenient for heat dissipation
By arranging the IGBT modules and radiators in parallel, and using the design of thermal conduction units and heat dissipation channels, the existing inverters are solved, and efficient heat dissipation of compact inverters is achieved.
Patent Information
- Application Number
- CN202421847221.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-01
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-08-01
AI Technical Summary
Due to the messy and unreasonable installation location of the existing inverters, the size is large and the internal heat dissipation effect is poor.
By arranging the IGBT module and the radiator in parallel with each other and setting a thermal conduction unit to achieve heat transfer, a rapid heat dissipation channel is formed by combining the heat dissipation hole, air duct baffle and heat dissipation chamber to optimize the heat dissipation effect.
The compact layout of the inverter is realized, the overall size is small, and the good internal heat dissipation effect is ensured, avoiding the problem of excessive local temperature.
Smart Images

Figure CN222996416U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of inverters, in particular to a compact inverter which is convenient for heat dissipation. Background Art
[0002] An inverter is a power conversion device that converts direct current into alternating current. It can be used in mobile power supply locations or to meet the needs of users in areas without electricity for AC power.
[0003] The existing inverter mainly includes a housing, an IGBT module (insulated gate bipolar transistor device module) and a heat sink, etc., especially a high-power inverter, which is equipped with multiple IGBT modules to increase power output, and multiple heat sinks to increase heat dissipation effect. However, due to the messy and unreasonable installation positions of the existing IGBT modules and heat sinks, the entire inverter is large in size and the internal heat dissipation effect is not good. Utility Model Content
[0004] Therefore, in order to solve the above problems, the utility model provides a compact inverter that is easy to dissipate heat and can reasonably utilize the internal space to ensure that the overall volume is small and has a good internal heat dissipation effect.
[0005] To achieve the above purpose, the technical solution provided by the utility model is as follows:
[0006] The utility model provides a compact inverter which is convenient for heat dissipation, comprising an inverter body, wherein an IGBT module and a radiator are respectively arranged in the inverter body, and the IGBT module and the radiator are arranged in parallel with each other to form a compact arrangement; a heat conduction unit is arranged between the radiator and the IGBT module, so that the heat generated by the IGBT module when working is transferred to the radiator through the heat conduction unit.
[0007] Furthermore, the outer wall of the inverter body is provided with heat dissipation holes, the radiator corresponds to the heat dissipation holes, and the IGBT module is located on a side of the radiator away from the heat dissipation holes.
[0008] Furthermore, the IGBT module is equipped with a heat dissipation cavity located in the inverter body, the IGBT module is assembled in the heat dissipation cavity, and the wall of the heat dissipation cavity has a heat dissipation grille; air duct baffles for blocking hot air are respectively arranged on both sides of the inverter body, the radiator is distributed at intervals and close to the heat dissipation holes, and the heat dissipation holes, the radiator, the air duct baffles and the heat dissipation cavity cooperate to form a heat dissipation channel for rapid heat dissipation.
[0009] Further, the number of the air duct baffles is four. Every two air duct baffles form a group. The two air duct baffles in the same group are arranged at an angle, and the two groups of air duct baffles are symmetrically arranged on both sides of the inverter body respectively, so that the heat dissipation channel dissipates heat in a horn shape.
[0010] Further, the heat conduction unit includes a heat conduction pipe assembly. One end of the heat conduction pipe assembly is connected to the IGBT module, and the other end is connected to the radiator.
[0011] Further, the heat conduction pipe assembly includes at least four heat conduction pipes.
[0012] Further, the IGBT modules are arranged in a straight line.
[0013] Further, the radiators are arranged in a straight line.
[0014] Further, a groove for facilitating the lifting of the machine is arranged on the outer wall of the inverter body.
[0015] Further, a raised rectangular step is arranged on the groove wall near the notch of the groove to form a handle.
[0016] Through the technical solution provided by the present utility model, the following beneficial effects are achieved:
[0017] By arranging the IGBT module and the radiator in parallel with each other, the assembly space in the inverter body is reasonably utilized to form a compact layout. Compared with the existing inverter, the overall volume of the inverter is ensured to be small.
[0018] Furthermore, through the heat conduction unit, the heat generated when the IGBT module works is transferred to the radiator, so as to ensure that a large amount of heat in the inverter body is timely transferred to the radiator and then dissipated outside the inverter body, so as to ensure that the inverter of the present utility model has a good internal heat dissipation effect. Description of the Drawings
[0019] Figure 1 Shown is a cross-sectional view of the first perspective of a compact inverter for facilitating heat dissipation;
[0020] Figure 2 Shown is a cross-sectional view of the second perspective of a compact inverter for facilitating heat dissipation;
[0021] Figure 3 Shown is Figure 2 an enlarged schematic view of area A in Detailed Embodiment
[0022] To further illustrate the various embodiments, the present invention provides drawings. These drawings are part of the disclosure of the present invention, which are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, a person of ordinary skill in the art should be able to understand other possible implementations and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.
[0023] The utility model is now further described in conjunction with the accompanying drawings and specific implementation methods.
[0024] Reference Figure 1 As shown, this embodiment provides a compact inverter (hereinafter referred to as the inverter) that is easy to dissipate heat. The inverter includes an inverter body. An IGBT module 1 and a heat sink 2 are respectively arranged in the inverter body. The IGBT module 1 and the heat sink 2 are arranged in parallel with each other to form a compact arrangement. A heat conduction unit 3 is arranged between the heat sink 2 and the IGBT module 1 so that the heat generated by the IGBT module 1 during operation is transferred to the heat sink 2 through the heat conduction unit 3.
[0025] In this embodiment, the outer wall of the inverter body is provided with heat dissipation holes 5 and air inlet holes 6 corresponding to the heat dissipation holes 5, and a fan for ventilation is generally installed in the inverter body. With the cooperation of the fan, the outside air is sucked in from the air inlet holes 6, and flows through the IGBT module 1 and the radiator 2 in the inverter body in turn, and finally blown out from the heat dissipation holes 5, so as to actively take away a large amount of heat in the inverter body to achieve a heat dissipation effect.
[0026] The radiator 2 corresponds to the heat dissipation hole 5 to ensure that the heat dissipated by the radiator 2 after absorbing or being heated can be blown out of the heat dissipation hole 5 in time, and the IGBT module 1 is located on the other side of the radiator 2 away from the heat dissipation hole 5, that is, the IGBT module 1 is arranged in the middle area of the inverter body.
[0027] There are six IGBT modules 1 arranged in a straight line, so that the heat generated by each IGBT module 1 can be evenly and dispersedly dissipated and evenly transferred to the heat sink 2, thereby ensuring that there is no local over-temperature phenomenon in the inverter body.
[0028] There are three radiators 2 arranged in a straight line to further ensure uniformity of the heat dissipation effect and timely heat dissipation. The radiator 2 of this embodiment belongs to the prior art and has multiple heat dissipation fins.
[0029] By arranging the IGBT module 1 and the heat sink 2 in parallel with each other, the assembly space in the inverter body can be reasonably utilized and a compact arrangement can be formed, thereby ensuring that the overall volume of the inverter is smaller than that of the existing inverter.
[0030] Then, through the heat conduction unit 3, the heat generated when the IGBT module 1 works is transferred to the radiator 2, so as to ensure that a large amount of heat inside the inverter is timely transferred to the radiator 2 and then dissipated outside the inverter body, so as to ensure that the inverter in this embodiment has a good internal heat dissipation effect.
[0031] In another preferred embodiment, the IGBT module 1 is provided with a heat dissipation cavity 8 inside the inverter body. The IGBT module 1 is assembled in the heat dissipation cavity 8 in a linear arrangement. The wall of the heat dissipation cavity 8 has heat dissipation grilles 7 respectively facing the air inlet hole 6 and the heat dissipation hole 5. Air duct baffles 4 for blocking hot air are respectively arranged on both sides inside the inverter body. The radiators 2 are distributed at intervals and are close to the heat dissipation holes 5. The heat dissipation holes 5, the radiators 2, the air duct baffles 4 and the heat dissipation cavity 8 cooperate together to form a heat dissipation channel for rapid heat dissipation.
[0032] During specific implementation, the number of the air duct baffles 4 is 4. Every two air duct baffles 4 form a group. An included angle is arranged between the two air duct baffles 4 in the same group. For example, the specific included angle can be Figure 1 30 to 50 degrees as shown, or other angles.
[0033] The two groups of air duct baffles 4 are symmetrically arranged on both sides inside the inverter body. Among them, one end of one of the air duct baffles 4 in the same group is connected to the outermost radiator 2, and the other end is connected to the wall of the heat dissipation cavity 8 close to the inner wall of the inverter body. And one end of the other air duct baffle 4 is also connected to the outermost radiator 2, and the other end is connected to the inner wall of the inverter body, and a wind guiding channel with two flare openings is formed. And the two flare openings are arranged oppositely to block hot air and at the same time play a guiding effect to guide hot air to flow toward the radiator 2 side, so as to ensure that the heat dissipation channel dissipates heat in a flare shape and further increase the heat dissipation effect.
[0034] Further preferably, the heat conduction unit 3 includes a heat conduction pipe assembly. One end of the heat conduction pipe assembly is connected to the IGBT module 1, and the other end is connected to the radiator 2. The heat conduction pipe assembly includes 4 heat conduction pipes. Of course, the number of the heat conduction pipes can also be 1, 2, 3 or more than 5.
[0035] In order to ensure sufficient heat dissipation effect, each IGBT module 1 is provided with 4 heat conduction pipes to fully transfer a large amount of heat generated when each IGBT module 1 works to the radiator 2 side, so as to inhibit the temperature at the position where the IGBT module 1 is located from continuing to rise.
[0036] In another preferred embodiment, as Figure 2 and Figure 3 shown, a groove 9 for facilitating the lifting of the machine is arranged on the outer wall of the inverter body.
[0037] More specifically, a raised rectangular step 91 is provided on the groove wall of the groove 9 near its notch to form a handle. The number of grooves 9 is at least two and they are symmetrically distributed on both sides of the inverter body. In this way, the space of the inverter body itself can be fully utilized, and the grooves 9 provided on the outer wall of the inverter body will not affect the overall appearance, but also can increase the aesthetic feeling. At the same time, the contact area for applying force with both hands during lifting is increased to ensure the comfort of both hands during the lifting process.
[0038] Although the present invention has been specifically shown and described in conjunction with the preferred embodiments, those skilled in the art should understand that various changes can be made to the present invention in terms of form and details without departing from the spirit and scope of the present invention defined by the appended claims, and all such changes are within the protection scope of the present invention.
Claims
1. A compact inverter for heat dissipation, comprising an inverter body, wherein an IGBT module and a heat sink are respectively arranged in the inverter body, and characterized in that: The IGBT module and the heat sink are arranged in parallel with each other to form a compact arrangement; A heat conduction unit is provided between the heat sink and the IGBT module, so that the heat generated by the IGBT module when working is transferred to the heat sink through the heat conduction unit; The outer wall of the inverter body is provided with a heat dissipation hole, the radiator corresponds to the heat dissipation hole, and the IGBT module is located on a side of the radiator away from the heat dissipation hole; The IGBT module is equipped with a heat dissipation cavity located in the inverter body, the IGBT module is assembled in the heat dissipation cavity, and the wall of the heat dissipation cavity has a heat dissipation grille; air duct baffles for blocking hot air are respectively arranged on both sides of the inverter body, the radiators are distributed at intervals and close to the heat dissipation holes, and the heat dissipation holes, the radiator, the air duct baffles and the heat dissipation cavity cooperate to form a heat dissipation channel for rapid heat dissipation.
2. The compact inverter for heat dissipation according to claim 1, characterized in that: The number of the air duct baffles is 4, and each two air duct baffles form a group. The two air duct baffles in the same group are arranged at an angle, and the two groups of air duct baffles are symmetrically arranged on both sides of the inverter body, so that the heat dissipation channel dissipates heat in a trumpet shape.
3. The compact inverter for heat dissipation according to claim 1 or 2, characterized in that: The heat conduction unit comprises a heat conduction pipe assembly, one end of the heat conduction pipe assembly is connected to the IGBT module, and the other end is connected to the radiator.
4. The compact inverter for heat dissipation according to claim 3, characterized in that: The heat conducting pipe assembly includes at least four heat conducting pipes.
5. The compact inverter for heat dissipation according to claim 1 or 2, characterized in that: The IGBT modules are arranged in a straight line.
6. The compact inverter for heat dissipation according to claim 5, characterized in that: The radiators are arranged in a straight line.
7. The compact inverter for heat dissipation according to claim 1 or 2, characterized in that: The outer wall of the inverter body is provided with a groove for facilitating lifting the inverter.
8. The compact inverter for heat dissipation according to claim 7, characterized in that: The groove wall of the groove close to its groove opening is provided with a raised rectangular step to form a handle arrangement.