Vehicle-mounted controller device and vehicle

Abstract

The utility model discloses a vehicle-mounted controller device and a vehicle. The vehicle-mounted controller device comprises a circuit board assembly, a liquid cooling heat dissipation assembly and a fixing piece. The circuit board assembly comprises a circuit board and a heat source device fixedly arranged on the circuit board. The liquid cooling heat dissipation assembly comprises a heat dissipation surface facing the heat source device, and the heat source device is clamped between the heat dissipation surface and the circuit board. The circuit board assembly is clamped between the liquid cooling heat dissipation assembly and the fixing piece. The fixing piece comprises a supporting body and a plurality of connecting bodies fixedly arranged along the edge of the supporting body at intervals, and the fixing piece is fixedly connected with the circuit board and the liquid cooling heat dissipation assembly through the connecting bodies so that the heat source device can abut against the liquid cooling heat dissipation assembly. Therefore, the heat dissipation efficiency and the heat dissipation effect are improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation, and particularly to a vehicle-mounted controller device and a vehicle. Background Art

[0002] As vehicles become more and more intelligent, the integration degree of vehicle-mounted controllers is getting higher and higher. Chips in the controller will generate a large amount of heat during long-term operation, and too high temperature will lead to a decline in the operating stability of the chips, and in severe cases, it will affect the service life of the chips.

[0003] In the related art, usually a heat dissipation device is arranged in contact with the chip to dissipate heat from the chip. However, the heat dissipation device and the chip cannot achieve complete contact, and due to the bumps during vehicle driving, gaps will appear between the heat dissipation device and the chip, resulting in worse contact. This leads to a decrease in the heat conduction efficiency and a worse heat dissipation effect. Summary of the Utility Model

[0004] In view of this, the present disclosure provides a vehicle-mounted controller device and a vehicle, which can improve the heat dissipation efficiency and heat dissipation effect.

[0005] Specifically, the present disclosure is implemented through the following technical solutions.

[0006] According to a first aspect of an embodiment of the present disclosure, a vehicle-mounted controller device is provided, including a circuit board assembly, a liquid cooling heat dissipation assembly, and a fixing member. The circuit board assembly includes a circuit board and a heat source device fixed on the circuit board. The liquid cooling heat dissipation assembly includes a heat dissipation surface facing the heat source device, and the heat source device is clamped between the heat dissipation surface and the circuit board. The circuit board assembly is clamped between the liquid cooling heat dissipation assembly and the fixing member. The fixing member includes a support body and a plurality of connecting bodies fixedly arranged at intervals along the edge of the support body. The fixing member is fixedly connected to the circuit board and the liquid cooling heat dissipation assembly through the connecting bodies, so that the heat source device is pressed against the liquid cooling heat dissipation assembly.

[0007] The technical solutions provided by the embodiments of the present disclosure may include the following beneficial effects.

[0008] When the vehicle-mounted controller device works, the heat source device on the circuit board will generate heat. By clamping the heat source device between the heat dissipation surface of the liquid cooling heat dissipation assembly and the circuit board, the liquid cooling heat dissipation assembly dissipates heat from the heat source device through the heat dissipation surface. And by setting the fixing member, the fixing member is fixedly connected to the circuit board and the liquid cooling heat dissipation assembly through the connecting bodies, and the support body of the fixing member applies a pressing force to the circuit board, so that the heat source device on the circuit board is pressed against the liquid cooling heat dissipation assembly after being stressed, thereby enabling the heat source device to be more closely attached to the heat dissipation surface of the liquid cooling heat dissipation assembly, and avoiding gaps between the heat source device and the heat dissipation surface. Thus, the heat dissipation efficiency and heat dissipation effect of the heat dissipation surface on the heat source device are improved.

[0009] The technical solution of the present disclosure will be further described below.

[0010] In one embodiment, the support body is provided with an avoidance groove. The circuit board assembly further includes an electronic device. The electronic device is fixedly arranged on the circuit board, and the electronic device and the heat source device are respectively located on both sides of the circuit board. At least part of the electronic device is located in the avoidance groove.

[0011] In one embodiment, on the orthographic projection plane in the thickness direction of the heat source device, the heat source device is located in the avoidance groove.

[0012] In one embodiment, the vehicle-mounted controller device further includes a heat conduction layer, and the heat conduction layer is clamped between the heat dissipation surface and the heat source device.

[0013] In one embodiment, the heat conduction layer has elasticity. And / or, the pressing force of the heat source device is less than the rated bearing pressure of the heat source device.

[0014] In one embodiment, the liquid cooling heat dissipation assembly is provided with a flow channel and a liquid inlet and a liquid outlet communicated with the flow channel. The bottom wall of the flow channel is oppositely arranged with the heat dissipation surface along the thickness direction of the liquid cooling heat dissipation assembly. The flow channel is used for the circulation of the cooling liquid.

[0015] In one embodiment, on the orthographic projection plane in the thickness direction of the heat source device, the flow channel at least partially coincides with the heat source device.

[0016] In one embodiment, the liquid cooling heat dissipation assembly includes a contact wall provided with a heat dissipation surface. The contact wall is provided with an electromagnetic shielding cavity. The heat source device is arranged in the electromagnetic shielding cavity, and the heat source device is attached to the heat dissipation surface.

[0017] In one embodiment, the connecting body is provided with a first mounting hole. The circuit board is provided with a second mounting hole. The liquid cooling heat dissipation assembly is provided with a third mounting hole. The depth directions of the first mounting hole, the second mounting hole and the third mounting hole are the same. The vehicle-mounted controller device further includes a fastener, and the fastener is connected to the first mounting hole, the second mounting hole and the third mounting hole to fixedly connect the fixing member, the circuit board assembly and the liquid cooling heat dissipation assembly.

[0018] In one embodiment, the fastener includes a nut and a screw fixedly connected to the nut. The nut abuts against the connecting body, and the screw passes through the first mounting hole, the second mounting hole and the third mounting hole and is screwed and fixed to the nut.

[0019] In one embodiment, the heat source device at least includes a processor. The fixing member is fixedly connected to the circuit board and the liquid cooling heat dissipation assembly through the connecting body, so that the processor is pressed against the liquid cooling heat dissipation assembly.

[0020] According to a second aspect of the embodiments of the present disclosure, a vehicle is provided, which includes a vehicle body and the in-vehicle controller device in any of the above embodiments, and the in-vehicle controller device is disposed on the vehicle body.

[0021] The technical solutions provided by the embodiments of the present disclosure may include the following beneficial effects.

[0022] The vehicle applies the above in-vehicle controller device, and the in-vehicle controller device can improve the heat dissipation efficiency and heat dissipation effect, thereby improving the overall reliability of the vehicle.

[0023] The technical solutions of the present disclosure will be further described below.

[0024] In one embodiment, the vehicle includes a water cooling device. The liquid cooling heat dissipation component is provided with a flow channel and a liquid inlet and a liquid outlet communicated with the flow channel, and the liquid inlet and the liquid outlet are connected to the water cooling device so that the coolant flows in the flow channel.

[0025] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings forming a part of the present disclosure are used to provide a further understanding of the present disclosure. The schematic embodiments and descriptions thereof of the present disclosure are used to explain the present disclosure and do not constitute an improper limitation of the present disclosure.

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.

[0028] Figure 1 It is a schematic structural diagram of a vehicle shown in an embodiment.

[0029] Figure 2 For Figure 1 It is an exploded structural diagram of the in-vehicle controller device of the vehicle shown.

[0030] Figure 3 For Figure 2 It is a schematic structural diagram of a fixing member of the in-vehicle controller device shown.

[0031] Figure 4 For Figure 2 It is a schematic structural diagram of the liquid cooling heat dissipation component of the in-vehicle controller device shown.

[0032] Figure 5 For Figure 2Explosion structure schematic diagram of the fixing part and fastening part of the in-vehicle controller device shown

[0033] Explanation of reference numerals

[0034] 10. Vehicle; 100. In-vehicle controller device; 110. Circuit board assembly; 111. Circuit board; 112. Heat source device; 120. Liquid cooling heat dissipation assembly; 121. Heat dissipation surface; 122. Flow channel; 123. Liquid inlet; 124. Liquid outlet; 125. Electromagnetic shielding cavity; 130. Fixing part; 131. Support body; 132. Connecting body; 140. Heat conduction layer; 150. Fastening part; 101. Avoidance groove; 102. First mounting hole; 103. Second mounting hole; 104. Third mounting hole; 200. Vehicle body Detailed implementation manners

[0035] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present disclosure. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims

[0036] The terms used in the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The singular forms "a" and "the" used in the present disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and includes any or all possible combinations of one or more of the associated listed items

[0037] It should be understood that although the terms first, second, third, etc. may be used in the present disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present disclosure, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "when" or "while" or "in response to determining"

[0038] Currently, vehicles such as sedans, sport utility vehicles (SUVs), multi-purpose vehicles, off-road vehicles, buses, and motorhomes bring many conveniences to people's lives, work, study, etc. and occupy an important position in people's travel and life. With a wide variety of vehicle types and brands, there are many vehicles available for people to choose from. How to gain people's favor and enhance product competitiveness has become an issue that vehicle manufacturers pay more and more attention to

[0039] As vehicles become more and more intelligent, the integration of in-vehicle controllers is getting higher and higher. The chips in the controller will generate a large amount of heat during long-term operation, and too high temperature will lead to a decrease in the operating stability of the chips. Seriously, it will affect the service life of the chips.

[0040] In the related art, usually a heat dissipation device is set to be attached to the chip to dissipate heat from the chip. However, the heat dissipation device and the chip cannot be completely attached, and due to the bumps during the vehicle's driving, a gap appears between the heat dissipation device and the chip, resulting in a worse fit. This leads to a decrease in the heat conduction efficiency and a worse heat dissipation effect.

[0041] Based on this, the present disclosure provides an in-vehicle controller device and a vehicle. This in-vehicle controller device can improve the heat dissipation efficiency and heat dissipation effect, thereby improving the reliability of the vehicle applying this in-vehicle controller device and the user experience.

[0042] As Figure 1 shown, a vehicle 10 is provided, including an in-vehicle controller device 100 and a vehicle body 200. The in-vehicle controller device 100 is arranged on the vehicle body 200.

[0043] Specifically, as Figure 2 and Figure 3 shown, the in-vehicle controller device 100 includes a circuit board assembly 110, a liquid cooling heat dissipation assembly 120, and a fixing member 130. The circuit board assembly 110 includes a circuit board 111 and a heat source device 112 fixed on the circuit board 111. The liquid cooling heat dissipation assembly 120 includes a heat dissipation surface 121 facing the heat source device 112, and the heat source device 112 is clamped between the heat dissipation surface 121 and the circuit board 111. The circuit board assembly 110 is clamped between the liquid cooling heat dissipation assembly 120 and the fixing member 130. The fixing member 130 includes a support body 131 and a plurality of connecting bodies 132 fixedly arranged at intervals along the edge of the support body 131. The fixing member 130 is fixedly connected to the circuit board 111 and the liquid cooling heat dissipation assembly 120 through the connecting bodies 132, so that the heat source device 112 is pressed against the liquid cooling heat dissipation assembly 120.

[0044] Thus, during the operation of the vehicle 10, when the in-vehicle controller device 100 is powered on, the heat source device 112 on the circuit board 111 generates heat. By clamping the heat source device 112 between the heat dissipation surface 121 of the liquid cooling heat dissipation assembly 120 and the circuit board 111, the liquid cooling heat dissipation assembly 120 dissipates heat from the heat source device 112 through the heat dissipation surface 121. And by setting the fixing member 130, the fixing member 130 is fixedly connected to the circuit board 111 and the liquid cooling heat dissipation assembly 120 through the connecting body 132, and the support body 131 of the fixing member 130 applies a pressing force to the circuit board 111, so that the heat source device 112 on the circuit board 111 is pressed against the liquid cooling heat dissipation assembly 120 after being stressed, thereby enabling the heat source device 112 to fit more closely to the heat dissipation surface 121 of the liquid cooling heat dissipation assembly 120, and avoiding gaps between the heat source device 112 and the heat dissipation surface 121. Thus, the heat dissipation efficiency and effect of the heat dissipation surface 121 on the heat source device 112 are improved. The operating performance and driving safety of the vehicle 10 are improved.

[0045] It should be noted that the heat source device 112 includes electronic devices that generate heat, such as chips, processors, resistors, etc.

[0046] As Figure 2 shown, in one example, the heat source device 112 includes at least a processor, and the fixing member 130 is fixedly connected to the circuit board 111 and the liquid cooling heat dissipation assembly 120 through the connecting body 132, so that the processor is pressed against the liquid cooling heat dissipation assembly 120. Thus, the in-vehicle controller device 100 controls the overall operation through the processor, and the processor is dissipated heat by the liquid cooling heat dissipation assembly 120, so that the processor runs reliably.

[0047] At this time, the in-vehicle controller device 100 can be an electronic controller, and the vehicle 10 realizes the control of each module of the vehicle 10 through the electronic controller. With the development of vehicle intelligence, the performance requirements for the processor of the vehicle 10 are getting higher and higher, and thus the heat generation of the processor is also getting larger and larger. To ensure the performance of the processor, good heat dissipation performance is required, and the processor is dissipated heat by the liquid cooling heat dissipation assembly 120, so as to ensure the stable operation performance of the vehicle 10 and the reliable driving safety of the vehicle 10.

[0048] It should be noted that the processor can be a micro-control unit (MCU), a central processing unit (CPU), a digital signal processor (DSP), etc.

[0049] It should be noted that there can be various specific implementation manners of the support body 131 and the connecting body 132, including but not limited to integral molding manufacturing or split manufacturing and then reassembly, etc.

[0050] It should be noted that the fixing member 130 can be obtained by die casting, forging, stamping, rolling, etc., and can also be processed by lathe, milling machine, etc., which is not limited herein.

[0051] In one example, as Figure 3 shown, the support body 131 and the connecting body 132 are integrally formed. In this way, the assembly process can be reduced, and the overall assembly efficiency of the vehicle-mounted controller device 100 can be improved.

[0052] As Figure 2 and Figure 3 shown, in some embodiments, the support body 131 is provided with an avoidance groove 101. The circuit board assembly 110 further includes electronic devices. The electronic devices are fixed on the circuit board 111, and the electronic devices and the heat source device 112 are respectively located on both sides of the circuit board 111. At least part of the electronic devices are located in the avoidance groove 101. In this way, by providing the avoidance groove 101 in the support body 131 and making the electronic devices located on the other side of the circuit board 111 be located in the avoidance groove 101, when the fixing member 130 is fixedly connected to the circuit board 111 and the liquid cooling heat dissipation assembly 120 and presses the heat source device 112 against the heat dissipation surface 121, the influence of the fixing member 130 on the electronic devices of the circuit board assembly 110 is reduced, so that the heat source device 112 can be more closely attached to the heat dissipation surface 121 of the liquid cooling heat dissipation assembly 120 without affecting the use reliability of the vehicle-mounted controller device 100, and the gap between the heat source device 112 and the heat dissipation surface 121 is avoided. Thus, the heat dissipation efficiency and heat dissipation effect of the heat dissipation surface 121 on the heat source device 112 are improved.

[0053] It can be understood that the specific shape of the support body 131 can be changed according to the distribution of the electronic devices on the circuit board 111. For example, the support body 131 can be a rectangular body, a circular body, an elliptical body, etc. This is not limited herein.

[0054] As Figure 2 shown, in some embodiments, in order to avoid the support body 131 directly applying a pressing force to the heat source device 112 when the fixing member 130 is fixedly connected to the circuit board 111 and the liquid cooling heat dissipation assembly 120, which may cause the heat source device 112 to be easily damaged. On the positive projection plane in the thickness direction of the heat source device 112, the heat source device 112 is located in the avoidance groove 101. So that the support body 131 applies a force to the circuit board 111, and the circuit board 111 then applies a pressing force to the heat source device 112. The heat source device 112 is prevented from being easily damaged, thereby improving the overall reliability of the vehicle-mounted controller device 100.

[0055] It should be noted that, as Figure 2 shown, the thickness direction of the heat source device 112 is the Z direction shown in the figure.

[0056] As shown Figure 2 in FIG. 1, in some embodiments, the vehicle-mounted controller device 100 further includes a heat-conducting layer 140, and the heat-conducting layer 140 is sandwiched between the heat-dissipating surface 121 and the heat source device 112. In this way, by sandwiching the heat-conducting layer 140 between the heat source device 112 and the heat-dissipating surface 121, the heat generated by the heat source device 112 can be better transferred to the liquid-cooling heat-dissipating component 120 through the heat-conducting layer 140, thereby improving the heat-dissipating efficiency and heat-dissipating effect of the heat source device 112.

[0057] In order to avoid damage to the heat source device 112 due to excessive force during the pressing process of the heat source device 112. In some embodiments, the heat-conducting layer 140 has elasticity. In this way, the heat-conducting layer 140 having elasticity can play a buffering role for the heat source device 112. It can also further make the contact between the heat source device 112 and the heat-conducting layer 140 and between the heat-conducting layer 140 and the heat-dissipating surface 121 closer, thereby facilitating the improvement of the heat-conducting efficiency, enabling the heat generated by the heat source device to be quickly transferred to the heat-dissipating surface through the heat-conducting layer for heat dissipation. Thus, the operating stability of the heat source device is improved.

[0058] It should be noted that there are various specific implementation manners of the heat-conducting layer 140, including heat-conducting silica gel, heat-conducting silicone grease, and the like.

[0059] In one example, the heat-conducting layer is heat-conducting silica gel. In this way, the heat-conducting silica gel can not only improve the efficiency of conducting heat from the heat source device 112 to the heat-dissipating surface. It can also play a role in buffering and protecting the heat source device 112.

[0060] Certainly, in some other embodiments, the pressing force on the heat source device 112 is less than the rated bearing pressure of the heat source device 112. Such a design can ensure that the pressing force on the heat source device 112 will not cause damage to itself, thereby ensuring the functional reliability of the heat source device 112, and further improving the reliability of the vehicle-mounted controller device 100.

[0061] It should be noted that the rated bearing pressure of the heat source device 112 can be determined according to the material of the heat source device, etc. The rated bearing pressure of the heat source device 112 can be selected according to actual needs and is not limited here.

[0062] As shown Figure 2As shown, in some embodiments, the liquid cooling heat dissipation component 120 is provided with a flow channel 122 and a liquid inlet 123 and a liquid outlet 124 connected to the flow channel 122, and the bottom wall of the flow channel 122 and the heat dissipation surface 121 are arranged relative to each other along the thickness direction of the liquid cooling heat dissipation component 120. The flow channel 122 is used for the circulation of the coolant. In this way, the coolant enters the flow channel 122 through the liquid inlet 123 and flows in the flow channel 122, and then flows out from the liquid outlet 124. During the flow of the coolant, the coolant can take away the heat generated by the heat source device 112, thereby dissipating the heat of the heat source device 112.

[0063] It should be noted that there are many specific ways to implement the flow channel 122, including but not limited to obtaining it through a lathe, a milling machine, etc., which is not limited here.

[0064] It should be noted that there are many specific ways to implement the coolant, including water and the like.

[0065] Furthermore, the vehicle-mounted controller device 100 of the present disclosure can be installed on a vehicle 10. In some embodiments, the vehicle 10 also includes a water cooling device. The liquid cooling heat dissipation component 120 is connected to the water cooling device, that is, the liquid inlet 123 and the liquid outlet 124 are connected to the water cooling device, so that the water cooling device provides coolant to flow in the flow channel 122. In this way, by connecting the liquid cooling heat dissipation component 120 to the water cooling device of the vehicle 10, there is no need to add a new device for providing coolant, thereby saving the space occupied by the vehicle-mounted controller device 100 on the vehicle 10 and reducing the production cost.

[0066] like Figure 2 As shown, in some embodiments, on the orthographic projection surface in the thickness direction of the heat source device 112, the flow channel 122 overlaps with at least a portion of the heat source device 112. That is, on the orthographic projection surface in the thickness direction of the heat source device 112, at least a portion of the heat source device 112 is in contact with the flow channel 122, so that the heat generated by the heat source device 112 is transferred to the flow channel 122, and when the coolant flows in the flow channel 122, the heat is better taken away, thereby improving the heat dissipation speed of the heat source device 112.

[0067] According to relevant regulations, electrical products and electronic equipment must meet the requirements of the equipment or system operating in its electromagnetic environment during the circulation and use stages, and must not produce intolerable electromagnetic interference to any equipment in its environment, that is, meet the electromagnetic compatibility requirements.

[0068] Therefore, electronic components that may cause electromagnetic interference need to be electromagnetically shielded. Figure 4As shown, in some embodiments, the liquid cooling heat dissipation component 120 includes an abutting wall provided with a heat dissipation surface 121. The abutting wall is provided with an electromagnetic shielding cavity 125. The heat source device 112 is disposed in the electromagnetic shielding cavity 125, and the heat source device 112 is in contact with the heat dissipation surface 121. In this way, the heat source device 112 is disposed in the electromagnetic shielding cavity 125 to play an electromagnetic shielding role on the heat source device 112 through the electromagnetic shielding cavity 125, so that the electromagnetic interference generated by the heat source device 112 during normal operation does not exceed a certain limit value for the surrounding environment, and has a certain degree of immunity to the electromagnetic interference existing in the surrounding environment, thereby meeting the electromagnetic compatibility requirements.

[0069] It should be noted that there are various processing methods for the electromagnetic shielding cavity 125 disposed on the abutting wall, including but not limited to processing by a lathe, a milling machine, etc.

[0070] As Figure 2 shown, in some embodiments, the fixing member 130 is fixedly connected to the circuit board assembly 110 and the liquid cooling heat dissipation component 120, so that the heat source device 112 is fixed and attached to the heat dissipation surface 121 of the liquid cooling heat dissipation component 120, thereby improving the heat dissipation efficiency and heat dissipation effect of the heat source device 112.

[0071] It should be noted that there are various specific implementation methods for the fixing member 130 to be fixedly connected to the circuit board assembly 110 and the liquid cooling heat dissipation component 120, including but not limited to non-detachable fixed connection (such as soldering and fixing by soldering process, etc.) or detachable fixed connection (such as screwing and fixing, clamping and fixing, riveting and fixing, etc.).

[0072] As Figures 2 to 4 shown, in some embodiments, the connecting body 132 is provided with a first mounting hole 102. The circuit board 111 is provided with a second mounting hole 103. The liquid cooling heat dissipation component 120 is provided with a third mounting hole 104. The depth directions of the first mounting hole 102, the second mounting hole 103, and the third mounting hole 104 are the same. The vehicle-mounted controller device 100 further includes a fastener 150. The fastener 150 is connected to the first mounting hole 102, the second mounting hole 103, and the third mounting hole 104 to fixedly connect the fixing member 130, the circuit board assembly 110, and the liquid cooling heat dissipation component 120. In this way, by connecting the first mounting hole 102, the second mounting hole 103, and the third mounting hole 104 with the fastener 150, the fixing member 130, the circuit board assembly 110, and the liquid cooling heat dissipation component 120 are fixedly connected. The method of connecting by the fastener 150 is simple and can reduce the production and manufacturing cost.

[0073] In one example, the fastener 150 includes a nut and a screw rod fixedly connected to the nut. The nut abuts against the connecting body 132, and the screw rod passes through the first mounting hole 102, the second mounting hole 103, and the third mounting hole 104 and is screwed and fixed to the nut. In this way, the fixing member 130, the circuit board assembly 110, and the liquid cooling heat dissipation assembly 120 are fixedly connected by screwing and fixing the screw rod and the nut, realizing their detachable fixation, which is convenient for maintenance and replacement.

[0074] As Figures 2 to 4 shown, in another example, the fastener 150 includes a screw rod provided with an external thread, and the third mounting hole 104 is provided with an internal thread adapted to the external thread. The screw rod sequentially passes through the first mounting hole 102, the second mounting hole 103, and the third mounting hole 104 to fixedly connect the fixing member 130, the circuit board assembly 110, and the liquid cooling heat dissipation assembly 120. In this way, the use of a nut can be avoided by this method, reducing the occupied space of the nut. And the assembly efficiency is improved.

[0075] It should be noted that the above embodiments can be complementary to each other without conflict.

[0076] The components included in the "assembly", "device", and "equipment" of the present disclosure can be flexibly combined, that is, modular production can be carried out according to the actual situation and assembled modularly as an independent module; they can also be assembled separately to form a module in this device.

[0077] The division of the above components in the present disclosure is only one embodiment for the convenience of reading, rather than a limitation on the protection scope of the present disclosure. As long as the above components are included and have the same function, it should be understood as an equivalent technical solution of the present disclosure. In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0078] In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0079] In this disclosure, unless otherwise clearly defined, terms such as "installed", "connected", "linked", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this disclosure can be understood according to specific circumstances.

[0080] In this disclosure, unless otherwise clearly defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0081] It should be noted that when an element is referred to as being "fixed to", "arranged on", "secured to" or "mounted on" another element, it may be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intermediate element at the same time. Further, when an element is considered to be "fixedly connected" to another element, the two may be fixed in a detachable connection manner or a non-detachable connection manner, such as socket connection, snap connection, integral molding fixation, welding, etc., which can be achieved in traditional technologies and will not be elaborated here.

[0082] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0083] The above embodiments only represent several implementation manners of this disclosure, and the description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the inventive concept of this disclosure, several modifications and improvements can still be made, and these all belong to the protection scope of this disclosure.

Claims

1. A vehicle-mounted controller device, characterized in that, Comprising: A circuit board assembly, which includes a circuit board and a heat source device fixedly arranged on the circuit board; A liquid cooling heat dissipation assembly, including a heat dissipation surface facing the heat source device, and the heat source device is clamped between the heat dissipation surface and the circuit board; And A fixing member, with the circuit board assembly clamped between the liquid cooling heat dissipation assembly and the fixing member; the fixing member includes a support body and a plurality of connecting bodies fixedly arranged at intervals along the edge of the support body, and the fixing member is fixedly connected to the circuit board and the liquid cooling heat dissipation assembly through the connecting bodies, so that the heat source device presses against the liquid cooling heat dissipation assembly.

2. The vehicle-mounted controller device according to claim 1, characterized in that, The support body is provided with an avoidance groove, the circuit board assembly further includes an electronic device, the electronic device is fixedly arranged on the circuit board, and the electronic device and the heat source device are respectively located on both sides of the circuit board; at least part of the electronic device is located in the avoidance groove.

3. The vehicle-mounted controller device according to claim 2, characterized in that, On the orthographic projection plane in the thickness direction of the heat source device, the heat source device is located in the avoidance groove.

4. The vehicle-mounted controller device according to claim 1, characterized in that, The vehicle-mounted controller device further includes a heat conducting layer, and the heat conducting layer is clamped between the heat dissipation surface and the heat source device.

5. The vehicle-mounted controller device according to claim 4, characterized in that, The heat conducting layer has elasticity; and / or, the pressing force of the heat source device is less than the rated bearing pressure of the heat source device.

6. The vehicle-mounted controller device according to claim 1, characterized in that, The liquid cooling heat dissipation assembly is provided with a flow channel and a liquid inlet and a liquid outlet communicated with the flow channel, and the bottom wall of the flow channel is arranged opposite to the heat dissipation surface along the thickness direction of the liquid cooling heat dissipation assembly; the flow channel is used for the circulation of the cooling liquid.

7. The vehicle-mounted controller device according to claim 6, characterized in that, On the orthographic projection plane in the thickness direction of the heat source device, the flow channel at least partially coincides with the heat source device.

8. The vehicle-mounted controller device according to claim 1, characterized in that, The liquid cooling heat dissipation assembly includes an abutting wall provided with the heat dissipation surface, the abutting wall is provided with an electromagnetic shielding cavity, the heat source device is arranged in the electromagnetic shielding cavity, and the heat source device is in contact with the heat dissipation surface.

9. The vehicle-mounted controller device according to claim 1, characterized in that, The connecting body is provided with a first mounting hole; the circuit board is provided with a second mounting hole; the liquid cooling heat dissipation assembly is provided with a third mounting hole; the depth directions of the first mounting hole, the second mounting hole and the third mounting hole are the same; the vehicle-mounted controller device further includes a fastener, and the fastener is connected to the first mounting hole, the second mounting hole and the third mounting hole to fixedly connect the fixing member, the circuit board assembly and the liquid cooling heat dissipation assembly.

10. The vehicle-mounted controller device according to claim 9, characterized in that, The fastener includes a nut and a screw fixedly connected to the nut; the nut abuts against the connecting body, and the screw passes through the first mounting hole, the second mounting hole and the third mounting hole and is screwed and fixed with the nut.

11. The vehicle-mounted controller device according to any one of claims 1 to 10, characterized in that, The heat source device at least includes a processor, and the fixing member is fixedly connected to the circuit board and the liquid cooling heat dissipation assembly through the connecting body, so that the processor presses against the liquid cooling heat dissipation assembly.

12. A vehicle, characterized in that, Comprising a vehicle body and the vehicle-mounted controller device according to any one of claims 1 to 11, and the vehicle-mounted controller device is arranged on the vehicle body.

13. The vehicle according to claim 12, characterized in that, The vehicle includes a water cooling device; the liquid cooling heat dissipation assembly is provided with a flow channel and a liquid inlet and a liquid outlet communicated with the flow channel, and the liquid inlet and the liquid outlet are connected to the water cooling device so that the cooling liquid flows in the flow channel.

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