Container type liquid cooling device and container type data center with liquid cooling system

Abstract

The utility model provides a container type liquid cooling device and a container type data center with a liquid cooling system, the liquid cooling system comprises at least one liquid cooling cabinet, the liquid cooling cabinet comprises a liquid cooling groove, a pillar, a top plate and a back plate, one end of the pillar is connected with the liquid cooling groove, and the other end of the pillar is connected with the top plate; the back plate is connected with the supporting columns and / or the top plate and is located at the back of the liquid cooling cabinet, and a hollow part is arranged between the bottom of the back plate and the top of the liquid cooling groove; the server is immersed in the liquid cooling tank; the PDU is fixed on the inner side of the backboard; the switch is fixed on one side, close to the liquid cooling tank, of the top plate; a wire passing hole penetrating through the back plate is formed in the position, close to the top plate, of the back plate. The wire passing hole is matched with the hollow part to provide a wiring channel, and a switch and a PDU line are connected with the server through the wiring channel. The container type liquid cooling device and the data center have the advantages of being reasonable in layout, convenient to disassemble, assemble and maintain and the like.

Description

Technical Field

[0001] The utility model relates to the field of data processing equipment, in particular to a containerized liquid cooling device and a containerized data center with a liquid cooling system. Background Art

[0002] With the rise and development of industries such as Internet virtual assets and artificial intelligence, in order to adapt to data processing and user needs, the scale of data center hardware facilities has continued to expand, hardware computing power has gradually increased, and data centers have consumed more and more electricity, which has brought huge challenges to the cooling needs of data centers.

[0003] Liquid cooling is a highly efficient cooling method and one of the common cooling methods in data centers. The data center injects coolant into the liquid cooling tank and then immerses the server in the coolant. The flowing coolant takes away the heat dissipated during the operation of the server, thereby achieving a cooling effect. Since the servers in the data center need to interact with other devices for power or data while immersed in the coolant, there are many lines between the server and other devices outside the liquid cooling tank. However, due to the unreasonable structural design of existing data centers, they are often prone to low space utilization, scattered lines, and a large workload for disassembly, assembly, and maintenance. Utility Model Content

[0004] Based on the above situation, the main purpose of the present invention is to provide a containerized liquid cooling device with a more reasonable layout and a containerized data center with a liquid cooling system.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0006] A containerized liquid cooling device, which is used to dissipate heat for a data processing system, the containerized liquid cooling device comprising a liquid cooling system and a power supply system, the liquid cooling system dissipates heat for the data processing system, and the power supply system at least supplies power to the data processing system;

[0007] The data processing system includes several servers and switches;

[0008] The power supply system includes a PDU;

[0009] The liquid cooling system comprises at least one liquid cooling cabinet, the liquid cooling cabinet comprising a liquid cooling tank, a pillar, a top plate and a back plate, one end of the pillar is connected to the liquid cooling tank, and the other end is connected to the top plate, the top plate is located directly above the liquid cooling tank; the back plate is connected to the pillar and / or the top plate and is located at the back of the liquid cooling cabinet, and a hollow portion is provided between the bottom of the back plate and the top of the liquid cooling tank;

[0010] The server is immersed in the liquid cooling tank containing the coolant; the PDU is fixed to the inner side of the backplane; the switch is fixed to one side of the top plate close to the liquid cooling tank;

[0011] A wire passing hole penetrating the backplane is provided at a position of the backplane close to the top plate; the wire passing hole cooperates with the hollow part to provide a wire routing channel, and the lines of the switch and the PDU are connected to the server through the wire routing channel.

[0012] Preferably, the liquid cooling tank includes an opening, and the liquid cooling system further includes a cover plate, and the cover plate covers the opening to relatively enclose the liquid cooling tank;

[0013] An inlet is provided at the back of the liquid cooling tank and close to the cover plate, and the lines of the switch and the PDU are connected to the server located in the liquid cooling tank through the inlet;

[0014] Or the size of the cover plate is smaller than the opening, and when the cover plate is closed, the opening close to the backplane is not blocked to form an inlet.

[0015] Preferably, a wire groove is provided at the bottom of the backplane, and the line of the switch passes through the wire passing hole, bypasses the backplane, and then passes through the hollow part and is fixed on the wire groove.

[0016] Preferably, an article placement position is formed on one side of the top plate away from the liquid cooling tank.

[0017] Preferably, there are at least two liquid cooling cabinets included in the liquid cooling system, and at least two liquid cooling cabinets are arranged along the first direction;

[0018] The power supply system includes a power distribution cabinet, and the power distribution cabinet is arranged between two adjacent liquid cooling cabinets; the power distribution cabinet is electrically connected to the PDU.

[0019] Preferably, the liquid cooling system further includes a liquid inlet pipe, a liquid outlet pipe and a liquid path control system, and the liquid path control system is connected to the liquid inlet pipe and the liquid outlet pipe, and the liquid path control system controls the coolant in the liquid inlet pipe and the liquid outlet pipe to enter and discharge from the liquid cooling tank;

[0020] The liquid inlet pipe is connected to the bottom of the liquid cooling tank, and the liquid outlet pipe is connected to the top of the liquid cooling tank.

[0021] Preferably, the liquid cooling system includes a liquid path heat dissipation system, and the liquid path heat dissipation system is connected to the liquid inlet pipe and the liquid outlet pipe, and cools the coolant flowing out of the liquid outlet pipe and then sends it into the liquid inlet pipe;

[0022] The liquid circuit cooling system includes a first pipeline, a second pipeline, a plurality of coiled pipes and a cooling tower; the liquid outlet pipe is communicated with the first pipeline, the liquid inlet pipe is communicated with the second pipeline, the coiled pipes extend into the interior of the cooling tower, and the liquid inlet end of the coiled pipes is communicated with the first pipeline, and the liquid outlet end of the coiled pipes is communicated with the second pipeline;

[0023] The cooling tower is arranged on the back of the liquid cooling cabinet; the extending direction of the coiled pipes is consistent with the arrangement direction of the liquid cooling cabinets and the extending direction of the cooling tower;

[0024] The connection position of the liquid outlet pipe and the first pipeline is located at the bottom of the first pipeline, and the connection position of the liquid inlet pipe and the second pipeline is located at the top of the second pipeline.

[0025] Preferably, the liquid circuit cooling system further includes a cover body, and the cover body and the side surface of the cooling tower cooperate to enclose a first space, and the first pipeline and the second pipeline are located in the first space;

[0026] The length of the cooling tower in the arrangement direction of the liquid cooling cabinets is L, and the extending length of the coiled pipes in the cooling tower is greater than 85%*L;

[0027] The back of the containerized liquid cooling device is the air inlet surface of the cooling tower, the top surface of the containerized data center of the liquid cooling system is the air outlet surface of the cooling tower, and a fan is arranged at the air outlet surface; a water curtain is arranged on the air inlet surface, and the air inlet surface extends from the bottom to the top of the containerized liquid cooling device.

[0028] Preferably, the containerized liquid cooling device includes a housing, and the space enclosed by the housing includes a second space and a third space, and the second space is located at the end of the containerized liquid cooling device;

[0029] The liquid circuit control system is located in the second space, the liquid cooling cabinets are located in the third space, a maintenance door is opened on the end surface of the containerized liquid cooling device, and the second space communicates with the outside on the front or back of the containerized liquid cooling device, and the size of the front or back in the horizontal direction is greater than the size of the end surface in the horizontal direction.

[0030] Preferably, the number of the second space, the liquid cooling cabinets and the liquid circuit control system is two, and the second space, the liquid cooling cabinets and the liquid circuit control system are symmetrically arranged with respect to the midline of the containerized liquid cooling device.

[0031] The present invention also provides a containerized data center with a liquid cooling system, including the containerized liquid cooling device as described above and a data processing system, and the data processing system includes a plurality of servers and switches;

[0032] The server is immersed in the liquid cooling tank containing the coolant, and the switch is fixed on one side of the top plate close to the liquid cooling tank.

[0033] The integrated liquid cooling device provided by the present utility model and the integrated data center with a liquid cooling system include a liquid cooling cabinet. The PDU is arranged on the backplane of the liquid cooling cabinet, and the switch can be arranged on one side of the top plate close to the liquid cooling tank. A wire passing hole is arranged on the backplane, and a hollow part is arranged below the backplane. The wire passing hole and the hollow part cooperate to provide a wire routing channel. The circuit of the switch and the PDU is connected to the server through the wire routing channel. With such a design, the overall layout is optimized, which is convenient for wire routing and at the same time makes it more convenient for the staff to disassemble, assemble and maintain the server and its circuits, greatly reducing the maintenance workload.

[0034] Other beneficial effects of the present utility model will be elaborated in the specific implementation manners through the introduction of specific technical features and technical solutions. Those skilled in the art should be able to understand the beneficial technical effects brought by the technical features and technical solutions through these introductions. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The following will describe the preferred embodiments of the integrated data center with a liquid cooling system according to the present utility model with reference to the drawings. In the figures:

[0036] Figure 1 and Figure 2 are the three-dimensional structure diagrams of the integrated data center with a liquid cooling system according to the present utility model at different angles.

[0037] Figure 3 and Figure 4 are the three-dimensional structure diagrams of the integrated data center with a liquid cooling system according to the present utility model after removing the housing.

[0038] Figure 5 are the three-dimensional structure diagrams of the integrated data center with a liquid cooling system according to the present utility model after removing the front part of the housing.

[0039] Figure 6 and Figure 7 are the three-dimensional structure diagrams of the liquid cooling cabinet included in the integrated data center with a liquid cooling system according to the present utility model.

[0040] Figure 8 are the three-dimensional structure diagrams of the integrated data center with a liquid cooling system according to the present utility model after removing the housing and the cover.

[0041] Figure 9 is Figure 8 the enlarged structure diagram at position A in

[0042] Figure 10Schematic diagram of the extended structure of the coil in the cooling tower of the containerized data center with a liquid cooling system according to the present utility model.

[0043] Description of reference numerals:

[0044] 10. Containerized data center with a liquid cooling system; 10a. Front; 10b. Back; 10c. First end face; 10d. Second end face; 10e. Top face; 10f. Bottom face; 11. Housing; 112. Second space; 113. Third space; 114. Maintenance door; 115. Hollow structure; 116. Entrance door; 12. Liquid cooling system; 121. Liquid cooling cabinet; 1211. Liquid cooling tank; 1211a. Opening; 1212. Support pillar; 1213. Top plate; 1231a. Item placement position; 1214. Back plate; 1213b. Concave structure; 1241a. Wire passing hole; 1216. Hollow part; 1217. Inlet; 122. Liquid inlet pipe; 123. Liquid outlet pipe; 124. Control box; 125. Liquid circuit control system; 126. Liquid circuit heat dissipation system; 1261. First pipe; 1262. Second pipe; 1263. Cover; 1264. Coil; 1264a. Liquid inlet end; 1264b. Liquid outlet end; 1265. Cooling tower; 1266. Inlet air surface; 1267. Outlet air surface; 1268. Fan; 13. Power supply system; 131. Power distribution cabinet; 132. PDU. Detailed implementation manners

[0045] The present utility model is described below based on embodiments, but the present utility model is not limited to these embodiments. In the following detailed description of the present utility model, some specific details are described in detail. In order to avoid obscuring the essence of the present utility model, well-known methods, processes, procedures, and components are not described in detail.

[0046] In addition, those of ordinary skill in the art should understand that the drawings provided herein are for illustrative purposes only, and the drawings are not necessarily drawn to scale.

[0047] Unless the context clearly requires otherwise, the words "including", "comprising", and similar words throughout the specification and claims should be construed in an inclusive sense rather than an exclusive or exhaustive sense; that is, the meaning of "including but not limited to".

[0048] In the description of the present utility model, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and cannot be construed as indicating or implying relative importance. In addition, in the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more.

[0049] A containerized liquid cooling device is used for dissipating heat from a data processing system. The containerized liquid cooling device includes a liquid cooling system and a power supply system. The liquid cooling system dissipates heat from the data processing system, and the power supply system supplies power to at least the data processing system;

[0050] The data processing system includes a number of servers and switches;

[0051] The power supply system includes a PDU;

[0052] The liquid cooling system includes at least one liquid cooling cabinet. The liquid cooling cabinet includes a liquid cooling tank, columns, a top plate and a back plate. One end of the column is connected to the liquid cooling tank, and the other end is connected to the top plate. The top plate is located directly above the liquid cooling tank; The back plate is connected to the column and / or the top plate and is located at the back of the liquid cooling cabinet. There is a hollow portion between the bottom of the back plate and the top of the liquid cooling tank;

[0053] The servers are immersed in the liquid cooling tank containing the coolant; The PDU is fixed inside the back plate; The switch is fixed on one side of the top plate close to the liquid cooling tank;

[0054] A wire passing hole penetrating the back plate is provided at a position of the back plate close to the top plate; The wire passing hole cooperates with the hollow portion to provide a wire routing channel, and the lines of the switch and the PDU are connected to the servers through the wire routing channel.

[0055] The present invention also provides a containerized data center with a liquid cooling system, including the containerized liquid cooling device and the data processing system as described above. The data processing system includes a number of servers and switches;

[0056] The servers are immersed in the liquid cooling tank containing the coolant, and the switch is fixed on one side of the top plate close to the liquid cooling tank.

[0057] Please refer to Figure 1 and Figure 2 , the present invention provides a containerized data center 10 with a liquid cooling system. It can be understood that the containerized data center 10 is a device that can perform data operation processing, and its specific structure, form, integration degree, etc. are not limited.

[0058] The containerized data center 10 with a liquid cooling system provided in the present utility model is in the shape of a cuboid, which has a front face 10a, a back face 10b, a first end face 10c, a second end face 10d, a top face 10e and a bottom face 10f. Among them, the front face 10a is opposite to the back face 10b, the first end face 10c is opposite to the second end face 10d, and the top face 10e is opposite to the bottom face 10f. In order to facilitate the description of the relative position relationship of each component / device included in the containerized data center 10, the above-mentioned position words will be used to describe the relative position relationship of each component / device in the following introduction. It can be understood that position words such as the front face 10a, the back face 10b, the top face 10e and the bottom face 101f refer to the relative position relationship between components, rather than the absolute position relationship. It can be understood that the shape of the containerized data center 10 is not limited, and it can be in the shape of a cuboid, a cube or other regular or irregular shapes.

[0059] As an embodiment, the containerized data center 10 has standard container dimensions, such as a 20-foot standard container or a high-cube container, a 40-foot standard container or a high-cube container, or it can also be any other size, which can be determined according to actual needs.

[0060] Please refer to Figure 3 , the containerized data center 10 includes a liquid cooling system 12, a data processing system and a power supply system 13. The liquid cooling system 12 dissipates heat for the data processing system, and the power supply system 13 supplies power to at least the data processing system.

[0061] As an embodiment, the data processing system (not shown) includes servers and switches. The servers are connected to the switches by lines, and the signals provided by the switches to the servers include but are not limited to network signals. In this embodiment, the containerized data center 10 includes a number of servers, and the number of switches is at least one. It can be understood that the number of servers and switches is not limited, and can be specifically adjusted according to the data processing requirements of the containerized data center 10. As an embodiment, each server includes at least one computing power board (not shown), and there are hundreds or even thousands of chips arranged on the computing power board. Among them, the number of serially connected chips is more than 100. It can be understood that the number of chips on the computing power board can be adjusted according to the computing power requirements.

[0062] As an embodiment, the power supply system 13 includes a power distribution cabinet 131 and a PDU 132. The power distribution cabinet 131 is connected to an external power source to provide electrical energy. The PDU 132 is electrically connected to the power distribution cabinet 131 to facilitate the supply of electrical energy to the data processing system. At least some devices in the data processing system can obtain power from the PDU 132 instead of directly connecting to the power distribution cabinet 131 through lines. Such a design makes the lines neater and the disassembly and assembly of the lines more convenient.

[0063] As an embodiment, the power supply system 13 can not only supply power to the data processing system, but also supply power to the liquid cooling system 12 through the power distribution cabinet 131 or the PDU 132.

[0064] Please refer to Figure 3 , as an embodiment, the liquid cooling system 12 includes a liquid cooling cabinet 121, a liquid inlet pipe 122, a liquid outlet pipe 123, a liquid path control system 125, a liquid path heat dissipation system 126, and a control box 124. Among them, both the liquid inlet pipe 122 and the liquid outlet pipe 123 are connected to the liquid cooling cabinet 121. After the coolant in the liquid cooling cabinet 121 enters the liquid cooling cabinet 121 from the liquid inlet pipe 122, it then flows out from the liquid outlet pipe 123. The liquid path control system 125 provides power to drive the coolant to flow into the liquid inlet pipe 122 and the liquid outlet pipe 123. The coolant flowing out from the liquid outlet pipe 123 enters the liquid path heat dissipation system 126 for cooling and then enters the liquid inlet pipe 122.

[0065] As an embodiment, the liquid path control system 125 includes, but is not limited to, one or more of an oil pump, a degassing tank, a flow rate detector, a temperature detector, etc. It can be understood that the specific devices included in the liquid path control system 125 are not limited, as long as they can drive the coolant to flow into the liquid inlet pipe 122 and the liquid outlet pipe 123. As an embodiment, the control box 124 serves as the control center of the liquid path control system 125 and can control the start, stop, and working mode of devices such as the oil pump according to a pre-established program or the data returned by the liquid path control system 125.

[0066] As an embodiment, the control box 124 can be set (such as integrated or placed) together with the liquid path control system 125 or the power distribution cabinet 131.

[0067] Please refer to Figure 4 , as an embodiment, the liquid cooling cabinet 121 includes a liquid cooling tank 1211, a support column 1212, a top plate 1213, and a back plate 1214. The liquid cooling tank 1211 is a cuboid with an opening 1211a at the top, and its interior can accommodate the coolant for submerging the server. Support columns 1212 are provided at the top and / or corners of the liquid cooling tank 1211, and a top plate 1213 is fixed to the top of the support columns 1212. The top plate 1213 is located directly above the liquid cooling tank 1211. The back plate 1214 is located at the back of the liquid cooling cabinet 121. Specifically, it is fixed to the top plate 1213 and / or the support columns 1212, and a hollow portion 1216 is provided between the bottom of the back plate 1214 and the top of the liquid cooling tank 1211.

[0068] It can be understood that the back plate 1214 can be directly fixed to the top plate 1213, or can be fixed to the struts 1212 on the back, or can be connected to both the struts 1212 on the back and the top plate 1213 at the same time, as long as it is ensured that the back plate 1214 is fixed to the back of the liquid cooling cabinet 121, and there is a hollow part 1216 reserved between the bottom of the back plate 1214 and the top of the liquid cooling tank 1211.

[0069] It can be understood that the struts 1212 can also be independent of the liquid cooling tank 1211 and extend from the bottom of the liquid cooling cabinet 121 to the top of the liquid cooling cabinet 121. The struts 1212 and the liquid cooling tank 1211 can be fixed together or relatively independent. Preferably, the struts 1212 are fixedly connected to the liquid cooling tank 1211. As long as the struts 1212 can fix the top plate 1213 directly above the liquid cooling tank 1211.

[0070] It can be understood that the shape of the liquid cooling tank 1211 is not limited. It can be a regular shape such as a normal body or a spherical body, or other regular or irregular shapes, as long as it has a certain capacity inside to accommodate the coolant for submerging the server.

[0071] As an embodiment, the back plate 1214 has a certain load-bearing strength, and a PDU 132 is fixed on it. Specifically, the PDU 132 is fixed on the front side of the back plate 1214 close to the liquid cooling cabinet 121, that is, fixed on the inner side of the back plate 1214.

[0072] It can be understood that the top plate 1213 has a certain supporting strength to facilitate fixing a switch on the side of the top plate 1213 close to the liquid cooling tank 1211, and an article placement position 1231a is formed on the side of the top plate 1213 away from the liquid cooling tank 1211. As an embodiment, the top plate 1213 is a complete plate-like structure, and articles such as a control box 124 can be placed on its top surface 10e.

[0073] As an embodiment, a concave structure 1213b is formed on the side of the top plate 1213 close to the liquid cooling tank 1211. The switch can be accommodated in the concave structure 1213b, providing more working space below the top plate 1213 and also being beneficial to protecting the switch.

[0074] As an embodiment, a wire passing hole 1241a penetrating the back plate 1214 is provided at a position of the back plate 1214 close to the top plate 1213. The wire passing hole 1241a cooperates with the hollow part 1216 to provide a wire routing channel. The lines of the switch and the PDU 132 are connected to the server through the wire routing channel.

[0075] As an embodiment, an inlet 1217 is provided on the liquid cooling tank 1211. The inlet 1217 may be formed as a part of the top opening 1211a of the liquid cooling tank 1211. That is, the lines led out from the PDU 132 and the switch enter the liquid cooling tank 1211 through the opening 1211a and are connected to the server.

[0076] As another embodiment, the liquid cooling cabinet 121 includes a cover plate (not shown in the figure). The cover plate is used to cover the opening 1211a to relatively enclose the liquid cooling tank 1211 and prevent sundries from falling into the liquid cooling tank 1211. It can be understood that in some embodiments, the cover plate can be omitted. In the embodiments with a cover plate, an inlet 1217 is provided on the back of the liquid cooling tank 1211 and near the cover plate (that is, at the top position of the back of the liquid cooling tank 1211). That is, the inlet 1217 is provided on the back side wall of the liquid cooling tank 1211. The lines led out from the PDU 132 and the switch enter the liquid cooling tank 1211 from the back of the liquid cooling tank 1211 and are connected to the server.

[0077] As yet another embodiment, in the direction from the front 10a to the back 10b of the containerized data center 10, the size of the cover plate is smaller than that of the opening 1211a. When the cover plate covers the top of the liquid cooling tank 1211, only a part of the opening 1211a is blocked, and the opening 1211a near the back 10b of the containerized data center 10 is in an open state. The open part of the opening 1211a can be used as the inlet 1217. In some embodiments, a cross bar can also be provided to divide the opening 1211a into two parts. One part is close to the front 10a of the containerized data center 10, and the other part is close to the back 10b of the containerized data center 10. When the cover plate is closed, the part of the opening 1211a near the front 10a of the containerized data center 10 is completely covered, and the opening 1211a near the back 10b of the containerized data center 10 is open to form the inlet 1217.

[0078] It can be understood that the inlet 1217 can be located on the top surface 10e of the liquid cooling tank 1211 or on the back 10b of the liquid cooling cabinet 121.

[0079] It can be understood that the wire passing hole 1241a cooperates with the hollow part 1216 to provide a wire routing channel. The lines of the switch and the PDU 132 are connected to the server through the wire routing channel, including but not limited to the following wire routing methods:

[0080] In the embodiment where the inlet 1217 is located on the top surface 10e of the liquid cooling tank 1211, the lines on the switch located at the bottom of the top plate 1213 pass through the wire passing hole 1241a, bypass the backplane 1214, then pass through the hollow portion 1216, and enter the liquid cooling tank 1211 from the inlet 1217 to be connected to the server. That is, a wiring channel for the switch is formed among the space below the top plate 1213, the wire passing hole 1241a, the back space of the backplane 1214, the hollow portion 1216, and the inlet 1217. The lines on the PDU 132 directly enter the inlet 1217 from the side of the backplane 1214 close to the front surface 10a of the containerized data center 10. That is, a wiring channel for power supply is formed between the space on the front surface 10a of the containerized data center 10 and the inlet 1217.

[0081] In the embodiment where the inlet 1217 is located on the side of the liquid cooling tank 1211, the lines on the switch located at the bottom of the top plate 1213 pass through the wire passing hole 1241a, bypass the backplane 1214, and then enter the server in the liquid cooling tank 1211 from the inlet 1217. That is, a wiring channel for the switch is formed among the space below the top plate 1213, the wire passing hole 1241a, the back space of the backplane 1214, and the inlet 1217. The lines on the PDU 132 extend from the side of the backplane 1214 close to the front surface 10a of the containerized data center 10, then pass through the hollow portion 1216, and enter the inlet 1217. That is, a wiring channel for power supply is formed among the space on the front surface 10a of the containerized data center 10, the hollow portion 1216, and the inlet 1217.

[0082] With the liquid cooling cabinet 121 in the present application, the PDU 132 is arranged on the backplane 1214, the switch is arranged on the side of the top plate 1213 close to the liquid cooling tank 1211, the backplane 1214 is provided with a wire passing hole 1241a, and a hollow portion 1216 is arranged below the backplane 1214. The overall layout is reasonable, which is convenient for wiring and convenient for the staff to disassemble, assemble, and maintain the server and its lines.

[0083] As an embodiment, a wire groove (not shown in the figure) is arranged at the bottom of the backplane 1214. It can be understood that arranging a wire groove at the bottom of the backplane 1214 means that the wire groove can be arranged at the bottom of the backplane 1214 on the side close to or far from the front surface 10a of the containerized data center 10, or directly arranged on the lower surface of the backplane 1214. The lines of the switch pass through the wire passing hole 1241a, bypass the backplane 1214, can be fixed on the wire groove first, and then enter the liquid cooling tank 1211 from the inlet 1217.

[0084] As an embodiment, the wire groove is a keel wire groove.

[0085] It can be understood that the liquid cooling tanks 1211 included in the liquid cooling cabinet 121 are multiple interconnected liquid cooling tanks 1211. Of course, it can also be understood that multiple interconnected liquid cooling tanks 1211 are a single larger liquid cooling tank 1211.

[0086] As an embodiment, the number of liquid cooling cabinets 121 can be one or at least two. In the embodiment where there are multiple liquid cooling cabinets 121, the liquid cooling cabinets 121 are arranged along the first direction.

[0087] As an embodiment, the power distribution cabinet 131 included in the power supply system 13 is arranged between two adjacent liquid cooling cabinets 121; the power distribution cabinet 131 is electrically connected to the PDU 132. Arranging the power distribution cabinet 131 between adjacent liquid cooling cabinets 121 facilitates the laying of power supply lines and can effectively shorten the line length. In the prior art, the power distribution cabinet 131 is usually arranged at the end of the containerized data center 10, resulting in a significant increase in the laying length of the power supply lines. In this application, however, the power distribution cabinet 131 is arranged between adjacent liquid cooling cabinets 121, which can greatly shorten the laying lines.

[0088] As an embodiment, the inlet pipe 122 is connected to the bottom position on the side of the liquid cooling tank 1211, and the outlet pipe 123 is connected to the top position on the side of the liquid cooling tank 1211. The cooled coolant enters from the bottom of the liquid cooling tank 1211, can fully exchange heat with the server, and then flows out from the top, effectively taking away the heat generated during the operation of the server. The connection positions of the inlet pipe 122 and / or the outlet pipe 123 to the liquid cooling tank 1211 are not limited to the sides of the liquid cooling tank 1211 and can also be connected to other positions of the liquid cooling tank 1211.

[0089] Please refer to Figure 5 , the liquid cooling system 126 includes a first pipe 1261, a second pipe 1262, several U-shaped coiled pipes 1264, and a cooling tower 1265. The outlet pipe 123 is connected to the first pipe 1261, the inlet pipe 122 is connected to the second pipe 1262, the coiled pipes 1264 extend into the cooling tower 1265, and one end (inlet end 1264a) of the coiled pipe 1264 is connected to the first pipe 1261, and the other end (outlet end 1264b) is connected to the second pipe 1262.

[0090] It can be understood that the opposite ends of the first pipe 1261 and the second pipe 1262 are closed.

[0091] As an embodiment, the connection position of the outlet pipe 123 to the first pipe 1261 is at the bottom of the first pipe 1261, and the connection position of the inlet pipe 122 to the second pipe 1262 is at the top of the second pipe 1262.

[0092] As an embodiment, the pipe diameters of the first pipe 1261 and the second pipe 1262 are much larger than the pipe diameter of the coiled pipe 1264. As an embodiment, the pipe diameters of the first pipe 1261 and the second pipe 1262 are 5-25 times the pipe diameter of the coiled pipe 1264, and can further be 8-15 times or 10-18 times. Under the said dimensional parameters, the coolant can be effectively cooled and the flow rate of the coolant can be ensured.

[0093] As an embodiment, the length from the liquid inlet end 1264a to the liquid outlet end 1264b of the coiled pipe 1264 is greater than 8 m, and can further be greater than 10 m. Under this dimensional parameter, the coolant can obtain a very good cooling effect.

[0094] As an embodiment, the cooling tower 1265 is arranged at the back of the liquid cooling cabinet 121; the extending direction of the coiled pipe 1264 is the same as the arranging direction of the liquid cooling cabinet 121 and the extending direction of the cooling tower 1265. It can be understood that the direction with the largest dimension of the liquid cooling cabinet 121 is its arranging direction. For example, the extending direction of the cuboid-shaped liquid cooling cabinet 121 is the long side direction. The direction with the largest dimension of the cooling tower 1265 is its extending direction.

[0095] As an embodiment, the first pipe 1261 and the second pipe 1262 are arranged in the vertical direction, and the U-shaped coiled pipe 1264 extends along the horizontal direction.

[0096] As a variant embodiment, the shape of the coiled pipe 1264 may not be U-shaped, but may be S-shaped, curved-shaped, etc., as long as its extending length in the cooling tower 1265 can be ensured to ensure the cooling effect.

[0097] As a variant embodiment, the liquid path heat dissipation system 126 further includes a cover body 1263. The cover body 1263 and the side surface of the cooling tower 1265 cooperate to enclose a first space (not labeled), and the first pipe 1261 and the second pipe 1262 are located in the first space. The setting of the cover body 1263 can prevent maintenance personnel from accidentally touching the first pipe 1261 and getting scalded.

[0098] As a variant embodiment, the length of the cooling tower 1265 in the arranging direction of the liquid cooling cabinet 121 is L, and the extending length of the coiled pipe 1264 in the arranging direction of the liquid cooling cabinet 121 (the length from the liquid inlet end 1264a to the liquid outlet end 1264b) is greater than 85%*L, which can effectively ensure the heat dissipation effect.

[0099] As an embodiment, the side surface of the cold tower 1265 (which is also a part of the back surface 10b of the containerized data center 10) is the air inlet surface 1266, and the top surface 10e of the cold tower 1265 (which is also a part of the top surface 10e of the containerized data center 10) is the air outlet surface 1267. A fan 1268 is arranged on the air outlet surface 1267. Air enters from the air inlet surface 1266, passes through the space inside the cold tower 1265, takes away the heat dissipated by the coil pipe 1264 in the space, and discharges the hot air through the fan 1268.

[0100] As an embodiment, the air inlet surface 1266 extends from the bottom to the top of the containerized data center 10. In this way, the air inlet area is very large and the heat dissipation effect is good. It can be understood that in this embodiment, it is also allowed that there is a distance between the air inlet surface 1266 and the top surface 10e and the bottom surface of the containerized data center 10, such as a distance less than 10% of the height (the height refers to the distance from the top surface 10e to the bottom surface).

[0101] As an embodiment, the air inlet surface 1266 occupies more than 70% of the area of the back surface 10b of the containerized data center 10, and further can be more than 80% or 85%.

[0102] As an embodiment, a water curtain is arranged on the air inlet surface 1266, and the arrangement of the water curtain can greatly reduce the air inlet temperature at the air inlet surface 1266.

[0103] Please refer to the figure **. The containerized data center 10 further includes a housing 11. The space enclosed by the housing 11 includes a second space 112 and a third space 113. The second space 112 is located at the end of the containerized data center 10. The liquid circuit control system 125 is located in the second space 112, and the liquid-cooled computer cabinet 121 is located in the third space 113. An access door 114 is opened on the end surface of the containerized data center 10, which is convenient for maintenance personnel to repair the liquid circuit control system 125. As an embodiment, the first pipeline 1261, the second pipeline 1262 and the cover 1263 are also located in the second space 112.

[0104] It can be understood that an access door 114 is opened on the end surface of the containerized data center 10, that is, the end surface is basically a plate-like structure, rather than a completely hollow structure 115. It can effectively prevent sundries and the like from entering the second space 112.

[0105] As an embodiment, the second space 112 communicates with the outside world on the front surface 10a or the back surface 10b of the containerized data center 10, and can perform heat exchange with the outside world through air flow, and to a certain extent, optimize the heat dissipation effect of the containerized data center 10. Its size in the horizontal direction is larger than the size of the end surface (10c, 10d) in the horizontal direction.

[0106] In some embodiments, the end face of the containerized data center 10 is designed with a hollow-out structure.

[0107] As an embodiment, the number of the second spaces 112, the liquid-cooled cabinets 121, and the liquid circuit control systems 125 is two, and the second spaces 112, the liquid-cooled cabinets 121, and the liquid circuit control systems 125 are symmetrically arranged with respect to the central line of the containerized data center 10. In this way, the weights at both ends of the containerized data center 10 are balanced, which is more conducive to transportation.

[0108] As an embodiment, an access door 116 is provided on the front face 10a of the containerized data center 10, and maintenance personnel can enter the interior of the containerized data center 10 through the access door 116.

[0109] The present utility model further provides a containerized liquid cooling device, which is the part of the above-mentioned containerized data center 10 that does not include the data processing system. Therefore, the descriptions of the containerized data center 10 are all applicable to the containerized liquid cooling device, and will not be repeated here.

[0110] Those skilled in the art can understand that, on the premise of no conflict, the above-mentioned preferred solutions can be freely combined and superimposed.

[0111] It should be understood that the above embodiments are merely exemplary and not restrictive. Without departing from the basic principle of the present utility model, various obvious or equivalent modifications or substitutions made by those skilled in the art to the above details will all be included within the scope of the claims of the present utility model.

Claims

1. A containerized liquid cooling device, which is used to dissipate heat for a data processing system, characterized in that: The containerized liquid cooling device comprises a liquid cooling system and a power supply system, wherein the liquid cooling system dissipates heat for the data processing system, and the power supply system at least supplies power to the data processing system; The data processing system includes several servers and switches; The power supply system includes a PDU; The liquid cooling system comprises at least one liquid cooling cabinet, the liquid cooling cabinet comprises a liquid cooling tank, a support, a top plate and a back plate, one end of the support is connected to the liquid cooling tank, and the other end is connected to the top plate, and the top plate is located directly above the liquid cooling tank; The back plate is connected to the pillar and / or the top plate and is located at the back of the liquid cooling cabinet, and a hollow portion is provided between the bottom of the back plate and the top of the liquid cooling tank; The server is immersed in the liquid cooling tank containing cooling liquid; the PDU is fixed on the inner side of the back plate; the switch is fixed on one side of the top plate close to the liquid cooling tank; A wire hole passing through the back plate is provided at a position of the back plate close to the top plate; the wire hole cooperates with the hollow portion to provide a wiring channel, and the lines of the switch and the PDU are connected to the server through the wiring channel.

2. The containerized liquid cooling device according to claim 1, characterized in that: The liquid cooling tank includes an opening, and the liquid cooling system further includes a cover plate, and the cover plate covers the opening to relatively close the liquid cooling tank; A line inlet is provided at the back of the liquid cooling tank and near the cover plate, and the lines of the switch and the PDU are connected to the server located in the liquid cooling tank through the line inlet; Or the size of the cover plate is smaller than the opening, and when the cover plate is closed, the opening close to the back plate is not blocked to form a wire entry port.

3. The containerized liquid cooling device according to claim 1, characterized in that: A wire slot is provided at the bottom of the back plate, and the line of the switch passes through the wire hole, bypasses the back plate, and then passes through the hollow part and is fixed on the wire slot.

4. The containerized liquid cooling device according to claim 1, characterized in that: A side of the top plate away from the liquid cooling tank forms an article placement position.

5. The containerized liquid cooling device according to claim 1, characterized in that: The liquid cooling system includes at least two liquid cooling cabinets, and the at least two liquid cooling cabinets are arranged along a first direction; The power supply system includes a power distribution cabinet, which is arranged between two adjacent liquid cooling cabinets; the power distribution cabinet is electrically connected to the PDU.

6. The containerized liquid cooling device according to claim 1, characterized in that: The liquid cooling system further comprises a liquid inlet pipe, a liquid outlet pipe and a liquid circuit control system, wherein the liquid circuit control system is connected to the liquid inlet pipe and the liquid outlet pipe, and the liquid circuit control system controls the coolant in the liquid inlet pipe and the liquid outlet pipe to enter and be discharged from the liquid cooling tank; The liquid inlet pipe is connected to the bottom of the liquid cooling tank, and the liquid outlet pipe is connected to the top of the liquid cooling tank.

7. The containerized liquid cooling device according to claim 6, characterized in that: The liquid cooling system comprises a liquid heat dissipation system, which is connected to the liquid inlet pipe and the liquid outlet pipe, and cools the coolant flowing out of the liquid outlet pipe and then sends it to the liquid inlet pipe; The liquid circuit heat dissipation system includes a first pipeline, a second pipeline, a plurality of coils and a cooling tower; the liquid outlet pipe is connected to the first pipeline, the liquid inlet pipe is connected to the second pipeline, the coil extends to the inside of the cooling tower, and the liquid inlet end of the coil is connected to the first pipeline, and the liquid outlet end of the coil is connected to the second pipeline; The cooling tower is arranged at the back of the liquid cooling cabinet; the extension direction of the coil is consistent with the arrangement direction of the liquid cooling cabinet and the extension direction of the cooling tower; The connection position between the liquid outlet pipe and the first pipeline is located at the bottom of the first pipeline, and the connection position between the liquid inlet pipe and the second pipeline is located at the top of the second pipeline.

8. The containerized liquid cooling device according to claim 7, characterized in that: The liquid circuit heat dissipation system further comprises a cover body, wherein the cover body cooperates with the side surface of the cooling tower to enclose a first space, and the first pipeline and the second pipeline are located in the first space; The length of the cooling tower along the arrangement direction of the liquid cooling cabinets is L, and the extension length of the coil in the cooling tower is greater than 85%*L; The back side of the containerized liquid cooling device is the air inlet side of the cooling tower, and the top side of the containerized data center of the liquid cooling system is the air outlet side of the cooling tower, and a fan is arranged at the air outlet side; a water curtain is arranged on the air inlet side, and the air inlet side extends from the bottom of the containerized liquid cooling device to the top thereof.

9. The containerized liquid cooling device according to claim 6, characterized in that: The containerized liquid cooling device comprises a shell, the space enclosed by the shell comprises a second space and a third space, and the second space is located at the end of the containerized liquid cooling device; The liquid circuit control system is located in the second space, the liquid cooling cabinet is located in the third space, an inspection door is provided on the end face of the containerized liquid cooling device, the second space is connected to the outside world at the front or back side of the containerized liquid cooling device, and the horizontal dimension of the front or back side is larger than the horizontal dimension of the end face.

10. The containerized liquid cooling device according to claim 9, characterized in that: The number of the second space, the liquid cooling cabinet, and the liquid circuit control system is two, and the second space, the liquid cooling cabinet, and the liquid circuit control system are symmetrically arranged about the center line of the containerized liquid cooling device.

11. A containerized data center with a liquid cooling system, characterized in that: It comprises a containerized liquid cooling device as claimed in any one of claims 1 to 9 and a data processing system, wherein the data processing system comprises a plurality of servers and switches; The server is immersed in the liquid cooling tank containing cooling liquid, and the switch is fixed on one side of the top plate close to the liquid cooling tank.

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