Ultrathin side-emitting high-brightness common-polarity RGB LED packaging structure
By adopting the double-layer BT board circuit layout and flip-fit eutectic welding process in RGB LED products, the existing products have been solved, and the thickness compression and brightness improvement have been achieved, meeting the high brightness and lightness needs of consumer electronic products.
Patent Information
- Application Number
- CN202420423731.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-05
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-03-05
AI Technical Summary
The existing common polarity RGB LED products are thicker in size and have low brightness, making it difficult to meet the demand for high brightness and lightness of consumer electronic products.
The double-layer BT board circuit layout and flip-fit eutectic welding process are adopted to design a compact packaging structure to improve product brightness by reducing the thickness of the line layout and maximizing the luminous area.
The thickness of the common polarity RGB product is compressed to 0.3mm, which improves the brightness of the product and meets the needs of consumer electronic products for high brightness and lightness.
Smart Images
Figure CN222996978U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED packaging structures, and particularly relates to an ultra-thin side-emitting high-brightness common-polarity RGB LED packaging structure. Background Art
[0002] RGB LEDs have a wide range of applications in the packaging industry, such as instrument indicator lights and keyboard ambient lights. The carrier brackets generally use traditional PLCC products and CHIP products, such as traditional side-emitting CHIP3004RGB, CHIP4004RGB, 4509RGB, and 3005RGB products. However, due to the limitations of the processing technology of the brackets and the wire bonding technology, the current thickness of side-emitting RGB products is generally too thick and the brightness is low. The basic thickness of PLCC-based RGB products is above 0.5 mm, and the thickness of CHIP-based RGB products is also basically above 0.4 mm. Summary of the Utility Model
[0003] In view of the technical problems in the above background art, the purpose of the present utility model is to provide an ultra-thin side-emitting high-brightness common-polarity RGB LED packaging structure, so as to solve the packaging problem that the current common-polarity RGB LED products are relatively thick in size and low in brightness. The side-emitting common-polarity RGB product designed by the present utility model adopts a double-layer BT board circuit layout, and the thickness can be controlled to 0.3 mm. In addition, the flip-chip process is adopted to maximize the light-emitting area of the product, which meets the market demand for high brightness and thinness of current consumer electronics products.
[0004] To achieve the above purpose, the present utility model provides the following technical solutions:
[0005] An ultra-thin side-emitting high-brightness common-polarity RGB LED packaging structure, comprising a first-layer BT board and a second-layer BT board stacked on top of each other in sequence from top to bottom. A first-layer copper foil area is provided on the first-layer BT board. A press-fit copper foil groove is formed on the upper side of the second-layer BT board, and a second-layer copper foil area is filled in the press-fit copper foil groove. A third-layer copper foil area is provided on the lower side of the second-layer BT board. A plurality of vertically penetrating through holes are formed on the first-layer BT board, and conduction columns connecting the first-layer copper foil area and the second-layer copper foil area are arranged in the through holes. A plurality of vertically penetrating and horizontally open connection holes are formed on the second-layer BT board, and a metal coating connecting the second-layer copper foil area and the third-layer copper foil area is arranged in the connection holes.
[0006] Further, the first-layer copper foil area is composed of six spaced-apart pads.
[0007] Further, there are four connection holes, which are arranged horizontally and spaced apart from each other on the second-layer BT board.
[0008] Further, the third-layer copper foil area is composed of six copper foil pieces, which are respectively connected to the right side of the leftmost connection hole horizontally, both sides of the middle two connection holes horizontally, and the left side of the rightmost connection hole horizontally. The copper foil piece is connected and conducted with the metal coating in its corresponding connection hole. The first pad from left to right is electrically connected to the metal coating in the first connection hole through the first conduction column, the second pad is electrically connected to the metal coating in the second connection hole through the second conduction column, the third pad is electrically connected to the metal coating in the third connection hole through the third conduction column, the fourth pad is electrically connected to the metal coating in the second connection hole through the fourth conduction column, the fifth pad is electrically connected to the fourth pad, and the sixth pad is electrically connected to the metal coating in the fourth connection hole through the fifth conduction column.
[0009] Further, multiple conduction columns are respectively electrically connected to the corresponding metal coatings through copper foil connection layers, and multiple copper foil connection layers constitute the second-layer copper foil area.
[0010] Further, the chip is fixed on the pad by soldering.
[0011] Further, the LED chip is soldered on the pad through the flip-chip eutectic soldering process.
[0012] The beneficial effects of the present utility model are as follows: First, the structure design is compact, enabling the thickness of the finished co-polarity RGB product to be compressed to 0.3 mm. Through the double-layer circuit design of the first layer and the second layer of copper foil, the circuit layout can be compressed, greatly reducing the product thickness. Limited by the current processing technology, currently, the thickness of the mass-produced co-polarity RGB product can be compressed to 0.3 mm, saving design space for subsequent finished product design; if the processing accuracy is improved, it is expected to compress the thickness to a thinner size in the future.
[0013] Second, the flip-chip eutectic soldering process is adopted to improve the brightness. The circuit connection is realized by soldering, with relatively high reliability; at the same time, there is no bonding process, reducing the high material cost of the gold wire, effectively reducing the production cost, and avoiding defects such as wire collapse in the traditional wire bonding process. In addition, the flip-chip process can remove the wire bonding functional area of the traditional wire bonding process, increasing the chip size and thus improving the product brightness. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 is the exploded view of the present utility model Figure 1 ;
[0015] Figure 2 is the exploded view of the present utility model Figure 2 ;
[0016] Figure 3 is the combined view of the present utility model and the structure diagram of the re-molded protective colloid.
[0017] Description of reference numerals: the first layer of BT board 1, through hole 1-2; structural member two 2, pad 2-1, conduction copper column 2-2, metal coating 2-3, third layer of copper foil area 2-4, second layer of copper foil area 2-5; second layer of BT board 3, connection hole 3-1, pressed copper foil groove 3-2; chip 4-1, protective colloid 4-2. Specific embodiments
[0018] The following further describes the specific embodiments of the present invention with reference to the accompanying drawings.
[0019] An ultra-thin side-emitting flip-chip high-brightness co-polarity RGB LED packaging structure designs 6 PADs (i.e., pads) in the bracket functional area (the first layer of copper foil circuit, i.e., the first layer of copper foil area) for welding with the chip electrodes, eliminating the need to set up a wire bonding area, maximizing the product's light-emitting area and enhancing brightness; the first layer of resin board (i.e., the first layer of BT board) is laser-drilled (i.e., through hole), filled with copper in the middle (i.e., conduction column) to connect the two layers of copper foil (i.e., the second layer of copper foil area), and the second layer of copper foil is designed with circuits according to the electrical requirements of the product; after the second layer of resin (i.e., the second layer of BT board) is laser-drilled (i.e., connection hole), the hole wall is coated with copper (i.e., metal coating) to conduct with the third layer of copper foil (i.e., the third layer of copper foil area). The first layer of copper foil is used for welding with the chip and serves as a bracket carrier, the second layer of copper foil is used to realize the circuit design of the co-polarity RGB product, and the third layer of copper foil is used for product heat dissipation and enhancing the welding thrust of the finished product. In terms of the production process, through a high-precision die bonder, after applying solder paste, the chip is fixed on the surface of the bracket, and then the chip is welded to the bracket using a vacuum eutectic welding process, and then a molding press is used to mold the protective colloid, and after cutting and forming, it is sorted and packaged for shipment.
[0020] The present invention discloses an ultra-thin side-emitting high-brightness co-polarity RGB LED packaging structure, including a fixed packaging bracket ( Figure 1 ), on which there is a first layer of BT board 1 ( Figure 1 structural member one), and laser through holes are drilled on the BT board ( Figure 2 inside 1-2); the circuit layout on the bracket ( Figure 1 structural member two 2), including etched pads 2-1 on the functional area, conduction copper columns 2-2, metal coating 2-3 after laser drilling, third layer of etched circuit (i.e., third layer of copper foil area 2-4), second layer of etched circuit (i.e., second layer of copper foil area 2-5); second layer of BT board 3 ( Figure 1 structural member three), including laser drilling, i.e., connection hole 3-1, pressed copper foil groove 3-2; the chip ( Figure 3 inside 4-1) is fixed on the bracket by applying solder paste, and then through eutectic welding, and then the protective colloid 4-2 is molded, completing the LED packaging.
Claims
1. An ultra-thin, photometric, high-brightness, common-polarity RGB LED packaging structure, characterized in that: The invention comprises a first layer BT board (1) and a second layer BT board (3) which are stacked in sequence from top to bottom, wherein a first layer copper foil area is arranged on the first layer BT board (1), a pressed copper foil groove (3-2) is opened on the upper side surface of the second layer BT board (3), the pressed copper foil groove (3-2) is filled with the second layer copper foil area, and a third layer copper foil area is arranged on the lower side surface of the second layer BT board (3), a plurality of vertically transparent through holes (1-2) are opened on the first layer BT board (1), and conductive columns (2-2) connecting the first layer copper foil area and the second layer copper foil area are arranged in the through holes (1-2), and a plurality of vertically transparent connection holes (3-1) which are open toward the horizontal side surface are opened on the second layer BT board (3), and a metal coating (2-3) connecting the second layer copper foil area and the third layer copper foil area is arranged in the connection holes (3-1).
2. The ultra-thin photometric high-brightness common-polarity RGB LED packaging structure according to claim 1, characterized in that: The first copper foil area is composed of six pads (2-1) arranged at intervals.
3. The ultra-thin photometric high-brightness common-polarity RGB LED packaging structure according to claim 2, characterized in that: There are four connection holes (3-1), which are arranged in sequence and at intervals in a transverse direction on the second layer of BT board (3).
4. The ultra-thin photometric high-brightness common-polarity RGB LED packaging structure according to claim 3, characterized in that: The third layer copper foil area is composed of six copper foil sheets (2-4), and the six copper foil sheets (2-4) are respectively connected to the right side of the leftmost connection hole (3-1), the two sides of the middle two connection holes (3-1), and the left side of the rightmost connection hole (3-1). The copper foil sheets (2-4) are connected and conducted with the metal coating (2-3) in the corresponding connection hole (3-1). From left to right, the first pad (2-1) is electrically connected to the metal coating (2-3) in the first connection hole (3-1) via the first conducting column (2-2), and the second pad (2-1) is electrically connected to the metal coating (2-3) in the first connection hole (3-1) via the second conducting column (2-2). The pillar (2-2) is electrically connected to the metal coating (2-3) in the second connection hole (3-1); the third pad (2-1) is electrically connected to the metal coating (2-3) in the third connection hole (3-1) via the third conductive pillar (2-2); the fourth pad (2-1) is electrically connected to the metal coating (2-3) in the second connection hole (3-1) via the fourth conductive pillar (2-2); the fifth pad (2-1) is electrically connected to the fourth pad (2-1); and the sixth pad (2-1) is electrically connected to the metal coating (2-3) in the fourth connection hole (3-1) via the fifth conductive pillar (2-2).
5. The ultra-thin photometric high-brightness common-polarity RGB LED packaging structure according to claim 4, characterized in that: The plurality of conducting columns (2-2) are electrically connected to the corresponding metal coating (2-3) through the copper foil connection layer (2-5), and the plurality of copper foil connection layers (2-5) constitute a second copper foil area.
6. The ultra-thin photometric high-brightness common-polarity RGB LED packaging structure according to claim 2, characterized in that: The chip is fixed on the pad (2-1) by soldering.
7. The ultra-thin photometric high-brightness common-polarity RGB LED packaging structure according to claim 2, characterized in that: The LED chip is welded on the welding pad (2-1) through a flip-chip eutectic welding process.