Heating mattress

Abstract

The utility model provides a heating mattress which comprises a facing layer, a heating chip, an upper packaging layer and a lower packaging layer, and the heating chip is arranged below the facing layer; the heating chip comprises a first packaging layer, a second packaging layer, a heating film, and at least three diversion strips and diversion lines which are arranged on the heating film at intervals, and the heating film is a thin film formed by sputtering a semiconductor metal oxide on the first packaging layer in a vacuum manner; the second packaging layer covers the heating film and the flow guide strips, the first packaging layer and the second packaging layer are used for packaging the heating film and the flow guide strips, one end of a flow guide wire penetrates through the second packaging layer to be correspondingly and electrically connected with one flow guide strip, the other end of the flow guide wire is connected with a power source, and the positive electrode and the negative electrode of the power source are connected with the flow guide strips at intervals; the upper packaging layer and the lower packaging layer are used for clamping the heating chip between the upper packaging layer and the lower packaging layer and performing waterproof packaging on the heating chip. The heating mattress disclosed by the utility model can emit heat to increase the temperature and resist cold, and the heating mattress adopts multi-electrode connection, so that a low-voltage and high-power heating mode can be realized.

Description

Technical Field

[0001] The utility model relates to the technical field of bed heating articles, in particular to a heating mattress. Background Art

[0002] A mattress is a necessity for people's lives. The comfort level of the mattress affects people's quality of life and further affects people's physical health. With the continuous improvement of people's living standards, the pursuit of a comfortable life is becoming stronger and stronger. There are many types of mattresses, and the mattresses used by people are becoming more and more diversified. Different types of mattresses bring different feelings to users.

[0003] However, when the weather gets cold in early spring and autumn, the indoor temperature is relatively low. Ordinary mattresses do not have a heating function, which will make users feel cold. Moreover, ordinary electric blankets are all high-voltage and high-power heating appliances, which are prone to danger. Content of the Utility Model

[0004] The embodiment of the utility model provides a heating mattress to solve one or more of the above technical problems.

[0005] In a first aspect, the embodiment of the utility model provides a heating mattress, including:

[0006] A decorative layer,

[0007] A heating chip, the heating chip is arranged under the decorative layer, and the heating chip is used for connecting with a power supply to generate heat; the heating chip includes a first encapsulation layer and a second encapsulation layer, a heating film, at least three flow guide strips arranged at intervals on the heating film and a flow guide wire. The heating film is a thin film formed by vacuum sputtering of semiconductor metal oxide on the first encapsulation layer; the second encapsulation layer covers the heating film and the flow guide strips. The first encapsulation layer and the second encapsulation layer are used for encapsulating the heating film and the flow guide strips. One end of a flow guide wire passes through the second encapsulation layer and is correspondingly electrically connected to a flow guide strip, the other end of the flow guide wire is connected to the power supply, and the positive and negative poles of the power supply are connected to the flow guide strips at intervals;

[0008] An upper encapsulation layer and a lower encapsulation layer, the upper and lower encapsulation layers are used for clamping the heating chip in the middle and performing waterproof encapsulation on it.

[0009] In an implementable manner, the heating film includes one of nickel-chromium alloy, silicon carbide, ZnOxS(1-x), InOxS(1-x), SnxIn(1-x)O, ZnxMg(1-x)O and ZnxAl(1-x)O.

[0010] In an implementable manner, the thickness range of the heating film includes 15nm to 1000nm.

[0011] In an implementable manner, the power density of the heating film is 50-200 W / ㎡. When the distance between adjacent current-carrying bars is D, the sheet resistance of the heating film is 2 / D² to 36 / D 2 .

[0012] In an implementable manner, the decorative layer is adhesively bonded to the surface of the upper encapsulation layer. The decorative layer is disposed on the surface of the upper encapsulation layer and is made of one of cotton, silk, linen, silk, ramie-cotton blend, pure silk, acetate fiber, and chiffon; or the decorative layer is made of a blend of multiple of cotton, silk, linen, silk, ramie-cotton, pure silk, acetate fiber, and chiffon.

[0013] One of the above technical solutions has the following advantages or beneficial effects: The heating mattress can generate heat to raise the temperature and resist cold, and the heating mattress adopts multi-electrode connection, which can achieve a low-voltage and high-power heating method.

[0014] The above summary is only for the purpose of the specification and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will be readily apparent by reference to the drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In the drawings, unless otherwise specified, the same reference numerals throughout the several views denote the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in accordance with the present invention and should not be regarded as limiting the scope of the present invention.

[0016] Figure 1 A cross-sectional view of a heating mattress according to an embodiment of the present invention is shown.

[0017] Figure 2 A top view of a heating mattress according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0018] In the following, only some exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present invention. Therefore, the drawings and the description are considered to be exemplary in nature rather than restrictive.

[0019] In a first aspect, an embodiment of the present invention provides a heating mattress.

[0020] See Figure 1As shown, the heating mattress includes a decorative layer 170, an upper encapsulation layer 150, a heating chip, and a lower encapsulation layer 160 that are arranged in sequence.

[0021] See Figure 1 and Figure 2 As shown, the heating chip is arranged under the decorative layer 170 and is used to connect to a power source for heating; the heating chip includes a first encapsulation layer 110, a second encapsulation layer 120, a heating film 130, at least three current-carrying strips 140 spaced apart on the heating film 130, and current-carrying wires 141. The spaced-apart current-carrying strips 140 can shorten the distance between the electrodes and still have a rated power for heating under a reduced voltage. The heating film 130 is a thin film formed by vacuum sputtering of semiconductor metal oxide on the first encapsulation layer 110; the second encapsulation layer 120 covers the heating film 130 and the current-carrying strips 140. The first encapsulation layer 110 and the second encapsulation layer 120 are used to encapsulate the heating film 130 and the current-carrying strips 140. One end of a current-carrying wire 141 passes through the second encapsulation layer 120 and is correspondingly electrically connected to a current-carrying strip 140 through a conductive node 141a. The other end of the current-carrying wire 141 is connected to the power source, and the positive and negative poles of the power source are connected to the current-carrying strips 140 at intervals.

[0022] See Figure 1 As shown, the upper encapsulation layer 150 and the lower encapsulation layer 160 are used to sandwich the heating chip in the middle and perform waterproof encapsulation on it.

[0023] The heating mattress in this embodiment can generate heat to raise the temperature and resist cold, and the heating mattress uses multi-electrode connection, which can achieve a low-voltage and high-power heating method.

[0024] Furthermore, the heating film 130 includes one of nickel-chromium alloy, silicon carbide, ZnOxS(1-x), InOxS(1-x), SnxIn(1-x)O, ZnxMg(1-x)O, and ZnxAl(1-x)O.

[0025] Furthermore, the thickness range of the heating film 130 includes 15 nm to 1000 nm.

[0026] Furthermore, the power density of the heating film 130 is 50 - 200 W / ㎡. When the distance between adjacent current-carrying strips 140 is D, the sheet resistance of the heating film 130 is 2 / D2 to 36 / D 2 .

[0027] Furthermore, the decorative layer 170 is adhesively bonded to the surface of the upper encapsulation layer 150. The decorative layer 170 is made of one of cotton, silk, linen, silk, ramie-cotton blend, pure silk, acetate fiber, and chiffon; or the decorative layer 170 is made of a blend of multiple of cotton, silk, linen, silk, ramie-cotton, pure silk, acetate fiber, and chiffon.

[0028] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. Moreover, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0029] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, "a plurality of" means two or more unless otherwise specifically defined.

[0030] The above is only the specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model can easily think of various changes or substitutions, and these should all be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims

1. A heating mattress, characterized in that: include: Finishing layer, A heating chip, the heating chip is arranged under the finishing layer, and the heating chip is used to connect to a power source to generate heat; the heating chip comprises a first packaging layer and a second packaging layer, a heating film, at least three guide bars and guide wires arranged at intervals on the heating film, and the heating film is a thin film formed by vacuum sputtering of semiconductor metal oxide on the first packaging layer; The second encapsulation layer covers the heating film and the guide bar, the first encapsulation layer and the second encapsulation layer are used to encapsulate the heating film and the guide bar, one end of a guide wire passes through the second encapsulation layer and is electrically connected to a corresponding guide bar, the other end of the guide wire is connected to a power source, and the positive and negative electrodes of the power source are connected to the guide bar at intervals; The upper packaging layer and the lower packaging layer are used to sandwich the heat generating chip and perform waterproof packaging on it.

2. The heating mattress according to claim 1, characterized in that: The heating film includes one of nickel-chromium alloy, silicon carbide, ZnOxS(1-x), InOxS(1-x), SnxIn(1-x)O, ZnxMg(1-x)O and ZnxAl(1-x)O.

3. The heating mattress according to claim 2, characterized in that: The thickness of the heating film ranges from 15 nm to 1000 nm.

4. The heating mattress according to any one of claims 1 to 3, characterized in that: The power density of the heating film is 50-200W / ㎡. When the distance between adjacent guide strips is D, the square resistance of the heating film is 2 / D2~36 / D 2 .

5. The heating mattress according to claim 4, characterized in that: The finishing layer is bonded to the surface of the upper packaging layer, and the finishing layer is arranged on the surface of the upper packaging layer. The finishing layer is woven from one of pure cotton, silk, flax, silk, linen and cotton blended, silk, acetate fiber, and chiffon; or, the finishing layer is a blend of multiple of pure cotton, silk, flax, silk, linen and cotton, silk, acetate fiber, and chiffon.

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