Cushion package of server

By designing server buffer packaging that adjusts the connection components and complementary buffer components, the problem of poor versatility of server packaging structure in the prior art is solved, and high versatility and low-cost production are achieved for different models of servers.

CN223002047UActive Publication Date: 2025-06-20LENOVO (BEIJING) LTD
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Patent Information

Application Number
CN202420862662.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-24
Publication Date
2025-06-20
Estimated Expiration
2034-04-24

AI Technical Summary

Technical Problem

The existing server packaging structure is poorly versatile, and each server needs to redesign the packaging structure, resulting in high manpower and material resources consumption and high cost.

Method used

A server buffer package is designed including a support component, a connecting component and a buffer component, the support component consisting of a first and a second support component, the connecting component is adjustable to accommodate different server models, and the buffer component complements the server shape to provide protection.

Benefits of technology

Through this design, the same support components can be adapted to different models of servers, reducing manpower and material consumption, reducing production costs, and improving packaging versatility.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a buffering package of a server, the buffering package is provided with a supporting assembly, the supporting assembly is provided with a first supporting piece and a second supporting piece, the first supporting piece and the second supporting piece are connected through a connecting assembly, and the buffering package further comprises a buffering assembly embedded in the supporting assembly, the shape of the buffer assembly is complementary with that of the server to be contained, the server can be borne through the buffer assembly, and the server can be directly placed on the buffer assembly which is complementary with the server in shape. Therefore, in the buffer package provided by the technical scheme of the invention, the buffer assembly and the connecting assembly matched with the server can be designed to be matched with the servers of different models, the same supporting assembly can be used for the buffer package of the servers of different models, and the buffer package has good universality.
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Description

Technical Field

[0001] This application relates to the technical field of electronic device packaging, and more specifically, to a buffer packaging for a server. Background Art

[0002] The server packaging structure is an important part in the transportation process of the server. It not only needs to play a protective role during transportation, but also is directly related to the quality issues during the subsequent use of the server. Therefore, for products like servers with large volume, heavy weight, and high precision, during transportation, not only should the physical appearance be prevented from being damaged by external impacts, but also the internal structure should be ensured not to be damaged due to transportation impacts.

[0003] However, currently, the packaging structure of a server only corresponds to one type of server, with poor versatility. For each type of server, a corresponding packaging structure needs to be redesigned, which requires a lot of manpower and material resources and is costly. Summary of the Utility Model

[0004] In view of this, this application provides a buffer packaging for a server, and the solution is as follows:

[0005] A buffer packaging for a server, comprising:

[0006] A support component, which includes a first support member and a second support member;

[0007] A connection component, located between the first support member and the second support member, connecting the first support member and the second support member, and the size of the connection component can adjust the distance between the first support member and the second support member;

[0008] A buffer component, which is embedded in the support component, is complementary in shape to the server to be accommodated in the buffer packaging, and is used to carry the server.

[0009] Optionally, the buffer component includes a first buffer member and a second buffer member. The first buffer member is embedded in the first embedding area of the first support member, and the second buffer member is embedded in the second embedding area of the second support member. The first buffer member is complementary in shape to the first end of the server, and the second buffer member is complementary in shape to the second end of the server;

[0010] The first embedding area and the second embedding area are respectively located in the edge area of the support component along a first direction, the first direction is parallel to the arrangement direction of the first support member and the second support member, the first end of the server is the side where the switch control end of the server is located, and the second end of the server is the side where the wiring port of the server is located.

[0011] Optionally, the depth of the first embedding area is greater than or equal to the height of the first buffer member;

[0012] The depth of the second embedding area is greater than or equal to the height of the second buffer member.

[0013] Optionally, the first support member and the second support member are the same.

[0014] Optionally, the elastic modulus of the support assembly is greater than that of the buffer assembly and greater than that of the connection assembly.

[0015] Optionally, the support assembly is a marine plastic structural member;

[0016] Both the buffer assembly and the connection assembly are EPE structural members.

[0017] Optionally, the first support member includes a first connection structure, and the second support member includes a second connection structure. The first connection structure is located on the side of the first support member facing the second support member, and the second connection structure is located on the side of the second support member facing the first support member;

[0018] The connection assembly is detachably connected to the first connection structure and detachably connected to the second connection structure, so that the distance between the first support member and the second support member can be adjusted based on connection assemblies of different sizes.

[0019] Optionally, both the first connection structure and the second connection structure have two first protrusions facing the connection assembly; the two first protrusions in the same connection structure are opposite to each other in a second direction, the second direction is perpendicular to the arrangement direction of the first support member and the second support member, and is parallel to the plane where the connection assembly is located;

[0020] One side of the connection assembly facing the first connection structure has a first protruding portion for detachably buckling between the two first protrusions of the first connection structure; one side of the connection assembly facing the second connection structure has a second protruding portion for detachably buckling between the two first protrusions of the second connection structure.

[0021] Optionally, the connection assembly is a hollow structure;

[0022] Or, both the first protruding portion and the second protruding portion have two second protrusions opposite to each other in the second direction; the two second protrusions in the first protruding portion are buckled between the two first protrusions of the first connection structure; the two second protrusions in the second protruding portion are buckled between the two first protrusions of the second connection structure.

[0023] Optionally, it further includes:

[0024] A top cover plate, which is located above the support assembly and forms a sealed space with the support assembly. When packaging the server, the server is located in the sealed space.

[0025] As can be seen from the above description, in the technical solution provided by this application, the buffer packaging of the server has a support component, and the support component has a first support member and a second support member. The first support member and the second support member are connected by a connection component. The buffer packaging further includes a buffer component embedded in the support component. The buffer component is complementary in shape to the server to be accommodated. The server can be carried by the buffer component, and the server can be directly placed on the buffer component with a complementary shape. Therefore, in the buffer packaging provided by the technical solution of this application, by designing a buffer component and a connection component adapted to the server, different models of servers can be adapted. The buffer packaging of different models of servers can use the same support component, which has good versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the provided drawings.

[0027] The structures, proportions, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limited conditions under which this application can be implemented. Therefore, they do not have technical essence. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that this application can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in this application.

[0028] Figure 1 FIG. 12 is a schematic structural diagram of a buffer packaging of a server provided by an embodiment of this application when the buffer component is not placed;

[0029] Figure 2 FIG. 16 is a schematic structural diagram of a buffer packaging of a server provided by an embodiment of this application after the buffer component is placed;

[0030] Figure 3 FIG. 20 is an exploded view of a buffer packaging of a server provided by an embodiment of this application;

[0031] Figure 4 FIG. 24 is an actual exploded view of a buffer packaging of a server provided by an embodiment of this application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] The following will clearly and completely describe the embodiments in the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0033] The buffer packaging of a conventional server generally prepares a buffer packaging structural member with a complementary shape based on the server to be packaged. This results in the need to separately set buffer packaging structural members with complementary shapes for different models of servers to place the servers to be packaged, and there is no universality in the buffer packaging of different models of servers. Therefore, a corresponding packaging structure needs to be redesigned for each type of server, which requires a lot of manpower and material resources and has a high cost.

[0034] In view of this, the technical solution of the embodiment of the present application provides a buffer packaging for a server, including:

[0035] A support component, the support component includes a first support member and a second support member;

[0036] A connection component, located between the first support member and the second support member, connecting the first support member and the second support member, and the size of the connection component can adjust the distance between the first support member and the second support member;

[0037] A buffer component, the buffer component is embedded in the support component, and is complementary in shape to the server to be contained in the buffer packaging, and is used to carry the server.

[0038] In the buffer packaging of the server provided by the embodiment of the present application, the server is carried by the buffer component, and the server to be packaged can be directly placed on the buffer component with a complementary shape, and then the support column component and the connection component are combined to package the server together. It can be seen that the buffer packaging of the server can be adapted to different models of servers by designing a buffer component and a connection component adapted to the server. The buffer packaging of different models of servers can use the same support component, which has good universality. When used for packaging different models of servers, it can reduce manpower and material resources and reduce costs.

[0039] To make the above objects, features, and advantages of the present application more obvious and understandable, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0040] Refer to Figures 1-4 , Figure 1 is a schematic structural diagram of a buffer packaging for a server provided by an embodiment of the present application when the buffer component is not placed, Figure 2 is a schematic structural diagram of a buffer packaging for a server provided by an embodiment of the present application after the buffer component is placed, Figure 3An exploded view of the buffer packaging of a server provided by an embodiment of the present application. Figure 4 A physical exploded view of the buffer packaging of a server provided by an embodiment of the present application.

[0041] As Figures 1-4 shown, the buffer packaging of the server provided by the embodiment of the present application includes:

[0042] A support component 11, and the support component 11 includes a first support member 111 and a second support member 112;

[0043] A connection component 12, the connection component 12 is located between the first support member 111 and the second support member 112, connecting the first support member 111 and the second support member 112, and the size of the connection component 12 can adjust the distance between the first support member 111 and the second support member 112;

[0044] A buffer component 13, the buffer component 13 is embedded in the support component 11, and the buffer component 13 is complementary in shape to the server 14 to be contained in the buffer packaging, and is used to carry the server 14.

[0045] It should be noted that, for the convenience of showing the relative position of the server 14 in the buffer packaging, the server 14 is shown in Figure 4 . The server 14 is the object to be packaged by the buffer packaging and is not a structural part of the buffer packaging.

[0046] Since the size of the connection component 12 can adjust the distance between the first support member 111 and the second support member 112, by adjusting the size of the connection component 12, the buffer packaging can be made to adapt to the packaging requirements corresponding to the lengths of different models of servers 14.

[0047] Since the buffer component 13 is complementary in shape to the server 14 to be contained in the buffer packaging, by adjusting the graphic structure on the upper surface of the buffer component 13, the buffer packaging can be made to adapt to the packaging requirements for the required graphics for embedded fixation of different models of servers 14. Based on the above description, it can be seen that the buffer component 13 is complementary in shape to the server 14 to be contained, the server 14 can be carried by the buffer component 13, and the server 14 can be directly placed on the buffer component 13 that is complementary in shape to it.

[0048] Therefore, in the embodiment of the present application, by designing the buffer component 13 and the connection component 12 adapted to the server 14, different models of servers 14 can be adapted. The buffer packaging of different models of servers 14 can use the same support component 11, which has good versatility.

[0049] The fact that the buffer component 13 is complementary in shape to the server 14 to be loaded means that the upper surface of the buffer component 13 that needs to carry the server 14 is complementary in shape to the area of the lower surface of the server 14 that needs to be carried by the buffer component 13.

[0050] As Figure 2 and Figure 3 shown, the buffer component 13 includes a first buffer member 131 and a second buffer member 132. The first buffer member 131 is embedded in the first embedding area 151 of the first support member 111, and the second buffer member 132 is embedded in the second embedding area 152 of the second support member 112. The first buffer member 131 is complementary in shape to the first end 141 of the server 14, and the second buffer member 132 is complementary in shape to the second end 142 of the server 14. The first embedding area 151 and the second embedding area 152 are respectively located in the edge area of the support component 11 along a first direction. The first direction is parallel to the arrangement direction of the first support member 111 and the second support member 112. The first end 141 of the server 14 is the side where the switch control end of the server is located, and the second end 142 of the server 14 is the side where the wiring port of the server 14 is located.

[0051] The fact that the first buffer member 131 is complementary in shape to the first end 141 of the server 14 means that the upper surface of the first buffer member 131 is complementary in shape to the lower surface of the first end 141. The fact that the second buffer member 132 is complementary in shape to the second end 142 of the server 14 means that the upper surface of the second buffer member 132 is complementary in shape to the lower surface of the second end 142.

[0052] Wherein, the arrangement direction of the first support member 111 and the second support member 112 is the direction from the first support member 111 to the second support member 112. As Figure 1 and Figure 2 shown, after the support component 11 and the buffer component 13 are assembled together, in this direction, the first support member 111, the connection component 12, and the second support member 112 are arranged in sequence.

[0053] In the buffer packaging, the buffer component 13 is provided to include: a first buffer member 131 that is complementary in shape to the first end 141 of the server 14 and a second buffer member 132 that is complementary in shape to the second end 142 of the server 14, so that the first end 141 and the second end 142 of the server 14 can be respectively carried in a shape-adapted manner by the first buffer member 131 and the second buffer member 132, so as to better buffer and protect both ends of the server 14.

[0054] The first end 141 of the server 14 is the front end of the server 14, including the user interface part of the server 14, such as the control panel and the control system. The second end 142 of the server 14 is the back end of the server 14, including the data processing part of the server 14, which is responsible for executing the business logic on the server side, database management, and the implementation of the API interface. In terms of the hardware of the server 14, the front end includes structures such as a panel and indicator lights for user interaction, and the back end includes structures such as a power supply, a network connection port, and a data interface.

[0055] Optionally, the depth of the first embedding area 151 is greater than or equal to the height of the first buffer member 131; the depth of the second embedding area 152 is greater than or equal to the height of the second buffer member 132. In this way, the first buffer member 131 can be more stably embedded in the first embedding area 151, and the second buffer member 132 can be more stably embedded in the second embedding area 152, so that the buffer packaging can better provide reliable and stable buffer packaging protection for the server 14.

[0056] In other embodiments, it is also possible to set the depth of the first embedding area 151 to be less than the height of the first buffer member 131, so that a part of the first buffer member 131 is embedded in the first embedding area 151, and the other part can protrude from the first embedding area 151. To ensure the embedding stability and reliability of the first buffer member 131, it can be set that the height of the part of the first buffer member 131 embedded in the first embedding area 151 is not less than one-third of the height of the first buffer member 131.

[0057] In other embodiments, it is also possible to set the depth of the second embedding area 152 to be less than the height of the second buffer member 132, so that a part of the second buffer member 132 is embedded in the second embedding area 152, and the other part can protrude from the second embedding area 152. To ensure the embedding stability and reliability of the second buffer member 132, it can be set that the height of the part of the second buffer member 132 embedded in the second embedding area 152 is not less than one-third of the height of the second buffer member 132.

[0058] In the embodiments of the present application, the first support member 111 and the second support member 112 are the same. In this way, in the buffer packaging of the server, the first support member 111 and the second support member 112 are the same structural members, and the first support member 111 and the second support member 112 can be prepared using molds of the same shape and the same size, making the preparation process of the buffer packaging simple and the manufacturing cost low.

[0059] If the first support member 111 and the second support member 112 are set to be the same, if it is necessary to adapt to different models of the server 14, only the shape and size of the upper surface of the buffer assembly 13 need to be changed to adapt to different models of the server 14.

[0060] Among them, the lower surface shapes of the buffer components 13 adapted to different models of servers 14 are the same. In this way, for the buffer packaging used to package different models of servers 14, it is not necessary to change the graphic structure of the lower surface of the buffer component 13, but it is necessary to change the graphic structure of the upper surface of the buffer component 13 to be complementary to the graphic of the lower surface of the server 14.

[0061] In the buffer packaging of the server 14, the elastic modulus of the support component 11 is greater than that of the buffer component 13 and greater than that of the connection component 12. Thus, under the same acting force, compared with the support component 11, the buffer component 13 and the connection component 12 are more likely to deform, so as to connect the first support 111 and the second support 112 through the connection component 12, and to embed at least part of the buffer component 13 into the support component 11.

[0062] By setting the elastic modulus of the support component 11 to be greater than that of the buffer component 13, on the one hand, a relatively large supporting force can be provided by the support component 11, so that the buffer packaging has a certain mechanical strength and can better support the server 14. On the other hand, when the buffer packaging is subjected to an impact force, the impact force can be released through the buffer component 13 with better deformation ability, and the impact force received by the server 14 can be better released, so as to better protect the server 14 in the buffer packaging.

[0063] By setting the elastic modulus of the support component 11 to be greater than that of the connection component 12, the first support 111 and the second support 112 can be connected through the connection component 12 with better deformation ability. The connection component 12 can be buckled between the two supports by a buckling method, which is convenient for the assembly of the support component 11 and the connection component 12.

[0064] Optionally, the support component 11 is a marine plastic (OBP) structural member; both the buffer component 13 and the connection component 12 are expanded polyethylene (EPE) structural members. Therefore, the buffer packaging is a combined structure including two different material structural members. Compared with marine plastic, expanded polyethylene has a smaller elastic modulus. Therefore, for two materials with the same shape and size, expanded polyethylene is more likely to deform under the same acting force.

[0065] In the implementation of this application, the buffer packaging is formed by combining marine plastic structural members and expanded polyethylene structural members with different elastic moduli, which can not only ensure the mechanical strength of the buffer packaging, but also enable the buffer packaging to better release the impact force. Moreover, compared with expanded polyethylene, marine plastic has a higher recycling rate, and the environmental pollution caused by the buffer packaging can be reduced through the recycling of materials.

[0066] It should be noted that in the implementation of this application, the material of the support component 11 is not limited to OBP, and the materials of the connection component 12 and the buffer component 13 are not limited to EPE. Other types of plastics can also be selected to prepare the support component 11, the connection component 12 and the buffer component 13. The embodiments of this application do not limit the materials of the respective components.

[0067] In the buffer packaging, the first support member 111 includes a first connection structure, and the second support member 112 includes a second connection structure. The first connection structure is located on the side of the first support member 111 facing the second support member 112, and the second connection structure is located on the side of the second support member 112 facing the first support member 111; the connection component 12 is detachably connected to the first connection structure and detachably connected to the second connection structure, so that the distance between the first support member 111 and the second support member 112 can be adjusted based on connection components 12 of different sizes.

[0068] In the buffer packaging, along the first direction, the first support member 111, the connection component 12, and the second support member 112 are arranged in sequence. Based on the first connection structure and the second connection structure, the connection component 12 can be detachably connected to the first support member 111 and the second support member 112 respectively. Thus, by replacing the connection components 12 of different sizes, the distance between the first support member 111 and the second support member 112 can be adjusted. When packaging servers 14 of different lengths, only the connection components 12 of the appropriate size need to be replaced, and the same support component 11 can be used. The design of the support component 11 does not need to be changed for the packaging of servers 14 of different lengths.

[0069] As Figures 1-3 shown, both the first connection structure and the second connection structure have two first protrusions 16 facing the connection component 12; the two first protrusions 16 in the same connection structure are opposite in the second direction. The second direction is perpendicular to the arrangement direction of the first support member 111 and the second support member 112 and parallel to the plane where the connection component 12 is located; one side of the connection component 12 facing the first connection structure has a first protruding portion, and the first protruding portion is used for detachably buckling between the two first protrusions 16 of the first connection structure; one side of the connection component 12 facing the second connection structure has a second protruding portion, and the second protruding portion is used for detachably buckling between the two first protrusions 16 of the second connection structure. In this way, the two first protrusions 16 in the first support member 111 can be buckled and connected with the first protruding portion, and the two first protrusions 16 in the second support member 112 can be buckled and connected with the second protruding portion, so as to realize the detachable connection between the connection component 12 and the first support member 111 and the second support member 112.

[0070] Both the first protruding portion and the second protruding portion can be buckled and connected with the two first protrusions 16 in the corresponding connection structure in an insertion and nesting manner.

[0071] There is a first set distance between two first bumps 16 of the same connection structure, which is used to snap the protruding part of the connection component 12. Specifically, the first set distance between two first bumps 16 in the first connection structure is used to snap the first protruding part, and the first set distance between two first bumps 16 in the second connection structure is used to snap the second protruding part.

[0072] The first protruding part and the second protruding part have the same length in the second direction, and this length is the same as or greater than the above first set distance, so that both the first connection structure and the second connection structure can stably snap the corresponding protruding parts of the connection component 12 based on the two first bumps 16.

[0073] The connection component 12 can be set as a hollow structure. Specifically, the connection component 12 includes a body, and a hollow area 121 is provided in the central area of the body. Based on the hollow area 121, the quality and material cost of the connection component 12 can be reduced.

[0074] It can be set that both the first protruding part and the second protruding part have two second bumps 17 opposite to each other in the second direction; the two second bumps 17 in the first protruding part are snapped between the two first bumps 16 of the first connection structure; the two second bumps 17 in the second protruding part are snapped between the two first bumps 16 of the second connection structure.

[0075] There is a second set distance between the two second bumps 17 in the first protruding part and between the two second bumps 17 in the second protruding part, so that the quality and material cost of the connection component 12 can be reduced.

[0076] To ensure the stability of the assembled support component 11 and connection component 12 and prevent relative movement between the two, it is set that both the first protruding part and the second protruding part have two third bumps 18. In the first direction, the third bumps 18 are arranged opposite to the first bumps 16 one by one, and the third bumps 18 can limit the distance between the first support member 111 and the second support member 112.

[0077] Optionally, the buffer packaging may further include: a top cover plate, which is located above the support component 11 and can form a sealed space with the support component 11. When the server 14 is packaged, the server 14 is located in the sealed space.

[0078] In the embodiments of the present application, multiple buffer packagings with the server 14 can be vertically stacked on the same pallet for easy transportation and storage. Adjacent two buffer packagings can be spaced by an accessory box 19. The accessory box can facilitate the management and protection of multiple stacked buffer packagings and can also improve the handling efficiency.

[0079] The technical effects of the buffer packaging provided in the embodiments of the present application will be described below by comparing the first buffer packaging and the second buffer packaging.

[0080] The first buffer packaging is a conventional buffer packaging made of pure EPE material. The second buffer packaging is the buffer packaging provided by the technical solution of the embodiments of the present application. In the second buffer packaging, the support component 11 is an OBP structural member; both the buffer component 13 and the connection component 12 are EEPE structural members.

[0081] Since EPE material and OBP material have different elastic moduli, the structural members prepared from these two materials have different compression amounts in the drop test. The compression amount of the EPE structural member in the drop test is about 55%, and the compression amount of the OBP structural member with the same shape and size in the drop test at the same height is about 27%. If one more layer of buffer packaging is to be stacked on the pallet, it is necessary to reduce the buffer space of each layer of buffer packaging, that is, it is necessary to reduce the thickness of the buffer packaging. Since the loading height of a single pallet is fixed, if the stacking quantity of buffer packaging is increased by reducing the height of the buffer packaging, it will result in a reduction of buffer material and insufficient supporting force, which is likely to cause damage to the buffer packaging located below due to excessive pressure.

[0082] Based on this, taking the buffer packaging for a 1U server as an example, if the first buffer packaging is adopted, at most 5 layers of the first buffer packaging can be stacked on the same pallet. If the second buffer packaging is adopted, since the OBP material has a larger elastic modulus than the EPE material, a smaller thickness can provide sufficient supporting force. Therefore, the thickness can be reduced relative to the first buffer packaging, and at the same time, the buffer performance can be ensured by the buffer component 13 made of EPE material. Therefore, the second buffer packaging can stack more layers on the pallet under the same stacking height, and 6 layers or even more layers of buffer packaging can be stacked. If 6 layers are stacked, the container loading capacity can be increased by 20%.

[0083] In the second buffer packaging, since the volume ratio of the support component 11 is relatively large, the mass ratio of the support component 11 in the entire buffer packaging can reach 88%. Therefore, the mass ratio of the OBP material can reach 88%, while the mass ratio of the EPE material is only 12%. In addition, compared with the OBP material, the material recovery rate of EPE is lower. Generally, the recovery rate of EPE material is 70%, while the recovery rate of OBP material can reach 90%. Therefore, compared with the first buffer packaging made of pure EPT material, the second buffer packaging with a higher mass ratio of OBP material can greatly improve the material recovery rate.

[0084] The first type of buffer packaging requires separate setting of the adapted shape and size for different models of servers. When used to package different models of servers, the first type of buffer packaging has poor versatility, and the mass ratio of the structural parts to be replaced is at least 50%. The second type of buffer packaging is a combined structure formed by EPE structural parts and OBP structures. With the support component 11 as the main structure of the buffer packaging, the support component 11 can be used for different models of servers. The support component 11 with a relatively large volume can be universal. By changing the design parameters of the buffer component 13 and the connection component 12, it can be adapted to different models of servers. When it is needed to be used for packaging different models of servers, only a small amount of EPE material structural parts need to be replaced, and the volume change rate is only 9%.

[0085] As described above, the second type of buffer packaging is a combined structure formed by EPE structural parts and OBP structures. The first support member 111 and the second support member 112 located at the opposite ends of the buffer packaging in the first direction are the main structure of the buffer packaging. Therefore, the support component 11 is made of a fixed OBP material. That is to say, in the second type of buffer packaging for different models of servers 14, the structure of the support component 11 is the same. A connection component 12 is detachably connected between the first support member 111 and the second support member 112. The connection component 12 is made of EPE material. By adjusting the length dimension of the connection component 12 in the first direction, the total length of the buffer packaging in the first direction can be adapted to the packaging length requirement of the server 14 to be packaged. In the second type of buffer packaging, the size of the EPE structural parts is determined according to the material processing characteristics and the product characteristics of the server 14 to be packaged.

[0086] Therefore, when using the second type of buffer packaging, the support component 11 as the main structure can be applicable to the packaging of various different models of servers 14. For the first end and the second end of the server 14, buffer protection can be carried out through the buffer components 13 detachably embedded at both ends of the support component 11. The buffer component 13 includes a first buffer member 131 and a second buffer member 132. Both the first buffer member 131 and the second buffer member 132 are EPE structural parts. By preparing the buffer members with EPE material having good deformation ability, the fragile structure at the end of the service area can be better protected.

[0087] In the description of the embodiments of this application, each embodiment is described in a progressive, or parallel, or a combination of progressive and parallel manners. Each embodiment focuses on the differences from other embodiments. For the same and similar parts between the embodiments, reference can be made to each other. The embodiments provided in the embodiments of this application can be combined with each other under the condition of no contradiction.

[0088] It should be noted that in the description of the present application, it should be understood that the descriptions of the drawings and embodiments are illustrative rather than restrictive. The same reference numerals throughout the embodiments of the specification identify the same structures. Additionally, for the sake of understanding and ease of description, some thicknesses of layers, films, panels, regions, etc. may be exaggerated in the drawings. At the same time, it can be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element can be directly on the other element or there may be intermediate elements. Additionally, "on" means positioning the element on or under another element, but does not inherently mean positioning on the upper side of another element according to the direction of gravity.

[0089] The orientation or positional relationship indicated by terms such as "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be intermediate components present at the same time.

[0090] It should also be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including", or any other variation thereof is intended to cover non-exclusive inclusion, such that an article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the presence of additional identical elements in the article or device including the above elements.

[0091] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but rather will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A buffer packaging for a server, characterized in that: include: A support assembly, the support assembly comprising a first support member and a second support member; A connecting assembly, located between the first supporting member and the second supporting member, connecting the first supporting member and the second supporting member, wherein a size of the connecting assembly can adjust a distance between the first supporting member and the second supporting member; A buffer component is embedded in the support component, complementary in shape to the server to be contained in the buffer package, and used for carrying the server.

2. The cushioning packaging according to claim 1, characterized in that: The buffer assembly comprises a first buffer member and a second buffer member, the first buffer member is embedded in a first embedding area of ​​the first support member, the second buffer member is embedded in a second embedding area of ​​the second support member, the first buffer member is complementary in shape to the first end of the server, and the second buffer member is complementary in shape to the second end of the server; The first embedded area and the second embedded area are respectively located at the edge area of ​​the supporting assembly along a first direction, the first direction is parallel to the arrangement direction of the first supporting member and the second supporting member, the first end of the server is the side where the switch control end of the server is located, and the second end of the server is the side where the wiring port of the server is located.

3. The cushioning packaging according to claim 2, characterized in that: The depth of the first embedded area is greater than or equal to the height of the first buffer member; The depth of the second embedded area is greater than or equal to the height of the second buffer member.

4. The cushioning packaging according to claim 1, characterized in that: The first support member and the second support member are identical.

5. The cushioning packaging according to claim 1, characterized in that: The elastic modulus of the supporting component is greater than the elastic modulus of the buffer component, and greater than the elastic modulus of the connecting component.

6. The cushioning packaging according to claim 1, characterized in that: The support assembly is a marine plastic structural member; The buffer component and the connecting component are both pearl cotton structural parts.

7. The cushioning packaging according to claim 1, characterized in that: The first support member includes a first connection structure, and the second support member includes a second connection structure, the first connection structure is located on a side of the first support member facing the second support member, and the second connection structure is located on a side of the second support member facing the first support member; The connecting assembly is detachably connected to the first connecting structure and detachably connected to the second connecting structure, so that the distance between the first supporting member and the second supporting member can be adjusted based on the connecting assembly of different sizes.

8. The cushioning packaging according to claim 7, characterized in that: The first connection structure and the second connection structure each have two first protrusions facing the connection component; the two first protrusions in the same connection structure are opposite to each other in a second direction, and the second direction is perpendicular to the arrangement direction of the first support member and the second support member, and parallel to the plane where the connection component is located; The connecting component has a first protruding portion on the side facing the first connecting structure, which is used for detachably snapping between the two first protrusions of the first connecting structure; the connecting component has a second protruding portion on the side facing the second connecting structure, which is used for detachably snapping between the two first protrusions of the second connecting structure.

9. The cushioning packaging according to claim 8, characterized in that: The connecting component is a hollow structure; Or, the first protruding portion and the second protruding portion each have two second protrusions opposite to each other in the second direction; the two second protrusions in the first protruding portion are snapped between the two first protrusions of the first connecting structure; and the two second protrusions in the second protruding portion are snapped between the two first protrusions of the second connecting structure.

10. The cushioning packaging according to claim 1, characterized in that: Also includes: A top cover plate, wherein the top cover plate is located above the support assembly and forms a sealed space with the support assembly. When the server is packaged, the server is located in the sealed space.