Vehicle-mounted screen all-in-one machine and automobile

Abstract

The utility model relates to the technical field of vehicle-mounted screens, in particular to a vehicle-mounted screen all-in-one machine and an automobile, the vehicle-mounted screen all-in-one machine comprises a main body structure and a rear shell structure, the main body structure is installed in an inner cavity of the rear shell structure, and the main body structure comprises a combined screen, a front panel, a PCB and a cooling fin structure; the back side of the combined screen is correspondingly bonded with the front side of the front panel through structural adhesive, the back side of the front panel is correspondingly connected with the PCB, meanwhile, a screen flat cable of the combined screen is correspondingly connected with a socket of the PCB in an inserted mode, the PCB is provided with a chip module, the cooling fin structure is connected with the PCB, and the chip module is connected with the cooling fin structure. The chip module is correspondingly contacted with the radiating fin structure; the screen and the host can be designed into a whole, so that the problem of high cost of split assembly is solved, and the requirements of customers on light and thin appearance of products and complete machine integration are met.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle-mounted screens, and more specifically, to a vehicle-mounted screen all-in-one machine and an automobile. Background Art

[0002] The in-vehicle entertainment system is becoming increasingly important in the current automotive industry. As the functions of the entertainment system (such as radio, navigation, Ethernet, USB, video, etc.) are increasing, usually customers design and install the screen and the central control host as two separate units on the vehicle, and then connect the two through the vehicle-side wiring harness to achieve the communication function. This not only increases the assembly process, but also the product costs of these two units are relatively high. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a vehicle-mounted screen all-in-one machine, which can integrate the screen and the host into one, solve the problem of relatively high disassembly and assembly costs, and meet the requirements of customers for the thin and light appearance of the product and the integration of the whole machine.

[0004] Another purpose of the utility model is to provide an automobile, which can integrate the screen and the host into one, solve the problem of relatively high disassembly and assembly costs, and meet the requirements of customers for the thin and light appearance of the product and the integration of the whole machine.

[0005] The technical solution of the utility model is realized as follows:

[0006] A vehicle-mounted screen all-in-one machine includes a main body structure and a rear housing structure. The main body structure is installed in the inner cavity of the rear housing structure. The main body structure includes a combined screen, a front panel, a PCB board, and a heat sink structure;

[0007] The back side of the combined screen is adhesively bonded to the front side of the front panel through structural adhesive. The back side of the front panel is correspondingly connected to the PCB board. At the same time, the screen cable of the combined screen is correspondingly inserted into the socket of the PCB board. The PCB board has a chip module. The heat sink structure is connected to the PCB board, and the chip module is in corresponding contact with the heat sink structure.

[0008] Further, the chip module includes a core chip and a power amplifier chip. The heat sink structure includes a first heat dissipation module and a second heat dissipation module. The first heat dissipation module is in corresponding contact with the core chip, and the second heat dissipation module is in corresponding contact with the power amplifier chip.

[0009] Further, the first heat dissipation module includes a first fin substrate, first main fins, and first auxiliary fins. The first fin substrate is correspondingly attached to the core chip. The number of the first main fins is at least one and is disposed on the fin substrate. When the number of the first main fins is at least two, a heat dissipation gap is left between the first main fins, and a plurality of the first auxiliary fins are respectively disposed on both sides of each first main fin.

[0010] Further, the second heat dissipation module includes a second fin substrate, second main fins, and second auxiliary fins. The second fin substrate is correspondingly attached to the core chip. The number of the second main fins is at least one and is disposed on the fin substrate. When the number of the second main fins is at least two, a heat dissipation gap is left between the second main fins, and a plurality of the second auxiliary fins are respectively disposed on both sides of each second main fin.

[0011] Further, a heat conductive material is further included. Heat conductive materials are respectively disposed between the first heat dissipation module and the core chip, and between the second heat dissipation module and the power amplifier chip.

[0012] Further, the heat conductive material is a heat conductive gel, and the thickness of the heat conductive gel is not greater than 0.5 mm.

[0013] Further, an on-board antenna is further disposed on the PCB board, and the on-board antenna is disposed on the PCB board by means of a ceramic antenna patch, and a clearance area is reserved at the top of the on-board antenna.

[0014] Further, the on-board antenna is grounded, and a grounding material is disposed at the grounding position of the on-board antenna.

[0015] Further, a plurality of positioning posts and buckles are further disposed on the back of the front panel. A plurality of positioning holes and card slots are disposed on the PCB board. The positioning posts and the positioning holes are arranged in one-to-one correspondence, and the buckles and the card slots are arranged in one-to-one correspondence. The positioning posts are correspondingly inserted into the positioning holes, and at the same time, the buckles pass through the card slots and are buckled with the back of the PCB board.

[0016] Further, the rear housing structure includes a rear housing and a decorative cover plate. The rear housing and the decorative cover plate are fixed by screws.

[0017] Further, the combined screen includes a display screen and a touch screen adhered to the display screen.

[0018] Further, the heat sink structure is made of aluminum, aluminum alloy or copper.

[0019] A vehicle includes the in-vehicle screen integrated machine described above.

[0020] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0021] In this application, when manufacturing or producing an in-vehicle screen all-in-one machine, the combined screen, front panel, PCB board and heat sink structure are stacked and connected in sequence to form a main structure, and then the main structure is assembled into the inner cavity of the rear housing structure and fixed to realize the production of the in-vehicle screen all-in-one machine. Such a manufacturing method can integrate the screen and the host into one, solve the problem of relatively high cost of split assembly, and meet the requirements of customers for the thin and light appearance of the product and the integration of the whole machine. At the same time, a heat sink structure is designed to improve the heat dissipation efficiency, ensure the normal operation of the whole machine, reduce costs, and meet the customer experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 is the overall exploded view of the in-vehicle screen all-in-one machine of the present utility model;

[0024] Figure 2 is the front axonometric view of the in-vehicle screen all-in-one machine of the present utility model;

[0025] Figure 3 is the rear axonometric view of the in-vehicle screen all-in-one machine of the present utility model;

[0026] Figure 4 is the side view of the in-vehicle screen all-in-one machine of the present utility model;

[0027] Figure 5 is the axonometric view of another perspective of the back view of the in-vehicle screen all-in-one machine of the present utility model;

[0028] Figure 6 is the schematic diagram of the back side structure of the front panel of the present utility model;

[0029] Figure 7 is the schematic diagram of the structure after the front panel and the PCB board are positioned and installed and snap-connected of the present utility model;

[0030] Figure 8 is the rear axonometric view of the heat sink structure of the present utility model;

[0031] Figure 9 is the back view of the heat sink structure of the present utility model;

[0032] Figure 10 of the present utility model Figure 9Enlarged view of the local structure at frame A;

[0033] Figure 11 This is the present utility model Figure 9 Enlarged view of the local structure at frame B;

[0034] Figure 12 Schematic diagram of the grounding shield structure at the on-board antenna of this utility model;

[0035] Figure 13 Schematic diagram of the heat sink and the heat-generating components of the PCB board of this utility model.

[0036] In the figure:

[0037] 10 - combined screen; 20 - structural adhesive; 30 - front panel; 301 - positioning post; 302 - first buckle;

[0038] 40 - PCB board; 41 - power amplifier chip; 42 - grounding sponge; 43 - grounding pad; 44 - first card slot;

[0039] 50 - heat sink structure; 501 - first heat dissipation module; 5011 - first main fin; 5012 - first auxiliary fin;

[0040] 502 - second heat dissipation module; 5021 - second main fin; 5022 - second auxiliary fin;

[0041] 503 - heat sink housing; 504 - clamping plate; 5041 - second card slot; 505 - third buckle;

[0042] 60 - rear housing; 61 - decorative cover plate; 610 - second buckle; 62 - buckle structure. Detailed implementation manners

[0043] To make the objectives, technical solutions and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of this utility model. Obviously, the described embodiments are some but not all of the embodiments of this utility model. Usually, the components of the embodiments of this utility model described and illustrated herein can be arranged and designed in various different configurations.

[0044] Therefore, the following detailed description of the embodiments of this utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but merely represents the selected embodiments of this utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of this utility model without creative efforts shall fall within the protection scope of this utility model.

[0045] It should be noted that like reference numerals and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it does not need to be further defined or explained in subsequent figures.

[0046] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the figures, or the orientation or positional relationship in which the product of the present utility model is habitually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be construed as indicating or implying relative importance.

[0047] In addition, the terms "horizontal", "vertical", "hanging", etc. do not mean that the components are required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0048] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0049] The following will describe in detail some embodiments of the present utility model with reference to the figures. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0050] Embodiment 1

[0051] Referring to Figures 1-13 , this embodiment provides an in-vehicle screen integrated machine, including a main body structure and a rear housing structure. The main body structure is the combination of the screen and the central control host. The main body structure is inlaid and installed in the inner cavity of the rear housing structure. The main body structure includes a combined screen 10, a front panel 30, a PCB board 40 (circuit board), and a heat sink structure 50. The combined screen 10, the front panel 30, the PCB board 40, and the heat sink structure 50 are stacked and connected together in sequence. Among them, the combined screen 10 includes a display screen and a touch screen pasted on the display screen. The touch screen is located on the front side, and the display screen is located on the back side.

[0052] Specifically, the back side of the combined screen 10 and the front side of the front panel 30 are adhesively bonded correspondingly through the structural adhesive 20. First, the combined screen 10 and the front panel 30 are combined into one body, and the front panel 30 can be a plastic front panel 30. The front side of the front panel 30 has a receiving cavity for receiving the combined screen 10. After the combined screen 10 is correspondingly inserted into the receiving cavity, it is adhesively fixed through the structural adhesive 20. Since the on-board antenna is integrated on the PCB board 40 and the on-board antenna can be directly printed on the PCB board 40, high integration can be achieved. This integration can not only reduce the volume of the product but also improve the overall performance of the product. Grounding treatments need to be performed on both the back side of the on-board antenna and the combined screen 10. Then, grounding materials are respectively installed at the grounding positions on the back side of the on-board antenna and the combined screen 10. The grounding material can be the grounding sponge 42, and the grounding sponge 42 is a conductive foam. A conductive foam is a foam material with conductive properties, usually composed of sponge foam and conductive materials. The main function of the grounding sponge 42 is to provide electromagnetic shielding, grounding protection, and conductive connection during the assembly and repair of electronic products. After the grounding treatment, the back side of the front panel 30 is correspondingly connected to the PCB board 40. Specifically, a plurality of positioning posts 301 and first buckles 302 are provided on the back of the front panel 30, and a plurality of positioning holes and first card slots 44 are provided on the PCB board 40. The positioning posts 301 and the positioning holes are arranged in one-to-one correspondence, and the first buckles 302 and the first card slots 44 are arranged in one-to-one correspondence. The positioning posts 301 are correspondingly inserted into the positioning holes, and at the same time, the first buckles 302 are inserted into the first card slots 44 and buckled with the back of the PCB board 40. After the plastic front panel 30 and the PCB board 40 are positioned and installed and buckled through the buckles, this can prevent the PCB board 40 from being bounced up due to the interference fit of the grounding sponge 42. At the same time, the screen cable of the combined screen 10 is correspondingly inserted into the socket of the PCB board 40 to achieve electrical connection. The PCB board 40 has a chip module, and the heat sink structure 50 is connected to the PCB board 40, and the chip module is correspondingly in contact with the heat sink structure 50 for quickly dissipating heat from the chip module. After the heat sink structure 50 is assembled, the front panel 30, the PCB board 40, and the heat sink structure 50 can be connected and fixed through a plurality of connecting screws. It should be noted that a plurality of positioning holes are also opened on the heat sink structure 50, and the positioning holes on the heat sink structure 50 and the positioning holes on the PCB board 40 are arranged in one-to-one correspondence. When assembling the heat sink structure 50, it also needs to be positioned and installed, that is, the positioning posts 301 on the front panel 30 are sequentially inserted into the positioning holes on the PCB board 40 and the positioning holes on the heat sink structure 50 to achieve the positioning assembly among the front panel 30, the PCB board 40, and the heat sink structure 50.After the main body structure is assembled, it is then assembled to the rear housing structure. The rear housing structure includes a rear housing 60 and a decorative cover plate 61. The rear housing 60 has an installation space for accommodating the main body structure. After the main body structure is assembled, it is inserted into the installation space from the front side of the rear housing 60. Then, the rear housing 60 and the heat sink structure 50 are fixedly connected by screws, and the heat sink structure 50 can dissipate heat from the rear side of the rear housing 60. Finally, the decorative cover plate 61 is installed. The decorative cover plate 61 is snap-connected to the rear housing 60 through a snap structure 62. At least two second snaps 610 are provided on the decorative cover plate 61, and two clamping plates 504 are correspondingly provided on the heat sink structure 50. A second card slot 5041 is opened on the clamping plate 504. While the decorative cover plate 61 is snap-connected to the rear housing 60, the second snaps 610 are inserted into the second card slots 5041 of the clamping plates 504, and at the same time, the decorative cover plate 61 is snap-connected to the heat sink structure 50. Finally, the decorative cover plate 61 and the rear housing 60 are fixed by screws.

[0053] At least two third snaps 505 are further provided on the heat sink structure 50 for installing the in-vehicle screen integrated machine on the vehicle and snap-connecting it to the vehicle body.

[0054] It should be noted that the on-board antenna on the PCB board 40 is arranged on the PCB board 40 by means of a ceramic antenna patch, and a grounding pad 43 for the antenna patch is correspondingly provided. The top of the on-board antenna needs to be hollowed out to reserve a clearance area to avoid blocking the on-board antenna. The periphery around the top and the bottom of the on-board antenna are respectively grounded to avoid interfering with the antenna signal. The technical effect is that this integrated machine uses an on-board antenna, and the functions of wireless network and Bluetooth (WIFI&BT) can be realized by means of a ceramic antenna patch, reducing the antenna cost. To solve the problems of antenna interfering with the screen and efficiency, enough clearance positions for the antenna are left at the top of the antenna. To avoid antenna interference, grounding is done around the antenna circumference, a U-shaped grounding is added at the bottom of the antenna, and a plastic shell material is used at the top of the antenna to avoid signal shielding.

[0055] In this embodiment, the chip module includes a core chip (SOC) and a power amplifier chip 41 (power amplifier IC). The heat sink structure 50 includes a first heat dissipation module 501 and a second heat dissipation module 502. The first heat dissipation module 501 is in contact with the core chip correspondingly, and the second heat dissipation module 502 is in contact with the power amplifier chip 41 correspondingly.

[0056] Specifically, the first heat dissipation module 501 includes a first fin substrate, first main fins 5011 and first auxiliary fins. The first fin substrate is correspondingly attached to the core chip. The number of the first main fins 5011 is at least one and they are arranged on the first fin substrate. When the number of the first main fins 5011 is at least two, a heat dissipation gap is left between the first main fins 5011, and several first auxiliary fins are respectively arranged on both sides of each first main fin 5011. The second heat dissipation module 502 includes a second fin substrate, second main fins 5021 and second auxiliary fins 5022. The second fin substrate is correspondingly attached to the core chip. The number of the second main fins 5021 is at least one and they are arranged on the second fin substrate. When the number of the second main fins 5021 is at least two, a heat dissipation gap is left between the second main fins 5021, and several second auxiliary fins 5022 are respectively arranged on both sides of each second main fin 5021. Moreover, the first auxiliary fins on both sides of each first main fin 5011 are arranged staggeredly, and the second auxiliary fins 5022 on both sides of each second main fin 5021 are also arranged staggeredly. This way of arranging the auxiliary fins (the first auxiliary fins and the second auxiliary fins 5022) staggeredly can increase the heat dissipation area and improve the heat dissipation effect, as Figures 8-11 shown.

[0057] In this embodiment, a heat-conducting material is further included. Specifically, a heat-conducting material is provided between the first heat dissipation module 501 and the core chip, and between the second heat dissipation module 502 and the power amplifier chip 41 respectively. The heat-conducting material can be a paste-like heat-conducting gel. The heat-conducting gap between the chip module and the heat sink structure 50 is designed to be less than 0.5 mm, that is, the thickness of the heat-conducting gel is not greater than 0.5 mm. The heat sink structure 50 further includes a heat sink housing 503. The first fin substrate of the first heat dissipation module 501 and the second fin substrate of the second heat dissipation module 502 are both arranged on the heat sink housing 503, or the first fin substrate and the second fin substrate belong to the heat sink housing 503 together; and a core chip fitting portion and a power amplifier chip 41 fitting portion are also arranged on the heat sink housing 503. The first heat dissipation module 501 is correspondingly arranged with the core chip fitting portion, and the second heat dissipation module 502 is correspondingly arranged with the power amplifier chip 41 fitting portion. And a heat-conducting gel is coated between the core chip fitting portion and the core chip on the PCB board 40, and a heat-conducting gel is also coated between the power amplifier chip 41 fitting portion and the power amplifier chip 41 on the PCB board 40. The heat of the main heat-generating core chip (SOC) and the power amplifier chip 41 (power amplifier IC) on the PCB board 40 is conducted to the heat sink housing 503 through the heat-conducting gel as a heat-conducting medium. The heat sink structure 50 as a whole is made of a material with a relatively high thermal conductivity, such as materials in the aluminum and aluminum alloy series, and copper or copper heat pipe materials can also be used. That is, the heat sink structure 50 is made of a material with a relatively high heat-conducting efficiency to ensure that the heat is conducted and dissipated with the maximum efficiency and reduce the thermal resistance; it should be noted that the whole of the heat sink structure 50 may not be entirely made of the same material, and can also be composed of a combination of multiple materials with good heat dissipation performance. The heat-conducting gap between the chip module and the heat sink structure 50 is designed to be less than 0.5 mm, and then a heat-conducting gel is used for assembly between them. On the one hand, it can reduce the increase in thermal resistance due to too large a distance. On the other hand, the paste-like heat-conducting gel used can reduce the assembly stress between the heat sink structure 50 and the chip and prevent stress damage; on the heat sink structure 50, the main heat dissipation fins (such as the first main fin 5011 and the second main fin 5021) are used with auxiliary heat dissipation fins (such as the first auxiliary fin and the second auxiliary fin 5022) for heat dissipation, avoiding interference between heat conduction, and increasing the heat dissipation area of the heat sink to improve the heat dissipation efficiency.

[0058] It should be noted that the front panel 30 and the rear housing structure are made of plastic material. To avoid the problem that the screen is stressed and discolored due to excessive deformation of general plastic during the thermal shock, the commonly used plastic material (made of a mixture of PC + ABS) is changed to PC material or changed to a material made of a mixture of PC material + glass fiber and other materials with a smaller coefficient of thermal expansion.

[0059] Embodiment 2

[0060] This embodiment provides an automobile, including the in-vehicle screen all-in-one machine. The in-vehicle screen all-in-one machine is installed on the automobile body and is snap-connected to the automobile body through the third snap 505.

[0061] The beneficial effects of the technical solution of the present utility model are as follows:

[0062] 1. The integrated design of each component in this application can integrate the screen and the central control host, solving the problem of high cost due to split assembly in the prior art, and meeting the requirements of customers for the thin and light appearance of the product and the integration of the whole machine.

[0063] 2. In the prior art, even if the screen and the central control host are designed into a thin and light integrated all-in-one machine structure, there is still a problem of difficult heat dissipation due to space compression caused by the thin and light integrated design; while this application uses the method of adding auxiliary heat dissipation fins to the main heat dissipation fins on the heat sink structure 50 for heat dissipation, avoiding interference between heat conduction, increasing the heat dissipation area of the heat sink, and improving the heat dissipation efficiency, which well solves this problem, ensures the normal operation of the whole machine, reduces costs, and meets the customer experience;

[0064] 3. Leave enough clearance area at the position of the board-mounted antenna to avoid plastic shielding. Grounding is adopted around the top and bottom of the antenna to avoid interference with the antenna signal and ensure signal stability.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than to limit it; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present utility model.

[0066] The above is only the preferred embodiment of the present utility model and is not used to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A vehicle-mounted integrated screen machine, characterized in that: It comprises a main body structure and a rear shell structure, wherein the main body structure is installed in the inner cavity of the rear shell structure, and the main body structure comprises a combined screen (10), a front panel (30), a PCB board (40), and a heat sink structure (50); The back side of the combined screen (10) is bonded to the front side of the front panel (30) via structural adhesive (20), and the back side of the front panel (30) is connected to the PCB board (40). At the same time, the screen cable of the combined screen (10) is plugged into the socket of the PCB board (40). The PCB board (40) has a chip module. The heat sink structure (50) is connected to the PCB board (40), and the chip module is in contact with the heat sink structure (50).

2. The vehicle-mounted integrated screen machine according to claim 1, characterized in that: The chip module comprises a core chip and a power amplifier chip (41); the heat sink structure (50) comprises a first heat dissipation module (501) and a second heat dissipation module (502); the first heat dissipation module (501) is in corresponding contact with the core chip, and the second heat dissipation module (502) is in corresponding contact with the power amplifier chip (41).

3. The vehicle-mounted integrated screen machine according to claim 2, characterized in that: The first heat dissipation module (501) comprises a first fin substrate, a first main fin (5011) and a first auxiliary fin. The first fin substrate is bonded to the core chip in correspondence. There is at least one first main fin (5011) and it is arranged on the fin substrate. When there are at least two first main fins (5011), a heat dissipation gap is left between the first main fins (5011). A plurality of the first auxiliary fins are respectively arranged on both sides of each first main fin (5011).

4. The vehicle-mounted integrated screen machine according to claim 3, characterized in that: The second heat dissipation module (502) comprises a second fin substrate, a second main fin (5021) and a second auxiliary fin (5022); the second fin substrate is bonded to the core chip in correspondence; there is at least one second main fin (5021) and the second main fin (5021) is arranged on the fin substrate; when there are at least two second main fins (5021), a heat dissipation gap is left between the second main fins (5021); and a plurality of second auxiliary fins (5022) are arranged on both sides of each second main fin (5021).

5. The vehicle-mounted integrated screen machine according to claim 4, characterized in that: It also includes heat-conducting materials, with heat-conducting materials being respectively arranged between the first heat-dissipating module (501) and the core chip, and between the second heat-dissipating module (502) and the power amplifier chip (41).

6. The vehicle-mounted integrated screen machine according to claim 5, characterized in that: The thermal conductive material is thermal conductive gel, and the thickness of the thermal conductive gel is no more than 0.5 mm.

7. The vehicle-mounted integrated screen machine according to claim 1, characterized in that: The PCB board (40) is also provided with an onboard antenna, and the onboard antenna is provided on the PCB board (40) by means of a ceramic antenna patch, and a clearance area is reserved on the top of the onboard antenna.

8. The vehicle-mounted integrated screen machine according to claim 7, characterized in that: The onboard antenna is grounded, and a grounding material is arranged at the grounding position of the onboard antenna.

9. The vehicle-mounted integrated screen machine according to claim 1, characterized in that: The back of the front panel (30) is also provided with a plurality of positioning posts (301) and buckles, and the PCB board (40) is provided with a plurality of positioning holes and slots, the positioning posts (301) are provided in a one-to-one correspondence with the positioning holes, the buckles are provided in a one-to-one correspondence with the slots, the positioning posts (301) are correspondingly inserted into the positioning holes, and the buckles are inserted into the slots and buckled with the back of the PCB board (40).

10. An automobile, characterized in that: Including the vehicle-mounted integrated screen machine described in any one of claims 1-9.

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