Plate punching die for circuit board

By designing a circuit board punching mold that uses components such as cylinders, L-shaped plywood and anti-slip pads, the problems of circuit board deviation and surface wear during punching of existing stamping molds are solved, and the effects of precise punching and waste chip collection are achieved.

CN223013326UActive Publication Date: 2025-06-24CHANGZHOU SHUANGJIN ELECTRIC CO LTD
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Patent Information

Application Number
CN202421710764.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-19
Publication Date
2025-06-24
Estimated Expiration
2034-07-19

AI Technical Summary

Technical Problem

When existing stamping dies punch the circuit board, it is easy to cause wear on the surface of the circuit board, and the circuit board is prone to deviation and cannot be accurately punched.

Method used

A punching mold for circuit boards is designed, using components such as cylinders, L-shaped clamps, anti-slip pads, fixed seats, screws and collection boxes. The circuit board is pressed on the lower mold by driving the L-shaped clamps through the cylinder, and the stamping head is driven by the hydraulic cylinder to ensure the accurate positioning and stable compression of the circuit board.

Benefits of technology

It effectively avoids the problems of circuit board deviation and surface wear during punching, and at the same time realizes centralized collection of waste chips dropped from the hedge holes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a board punching die for a circuit board, and belongs to the technical field of board punching dies. The device mainly comprises a workbench, wherein the workbench is provided with two groups of sliding chutes; the stamping assembly is provided with a lower die for placing the circuit board and a top plate mounted on the lower die; the clamping assembly is installed in the sliding groove, and the clamping assembly comprises an air cylinder installed in the sliding groove; the L-shaped clamping plate is mounted at the output end of the air cylinder; the pressing mechanism is installed on the L-shaped clamping plate, the pressing mechanism comprises a fixed seat, the fixed seat is installed on the L-shaped clamping plate, and a screw rod is in threaded connection with the fixed seat; and the pressing block is arranged at one end of the screw rod. According to the plate punching die for the circuit board, through the arrangement of the air cylinder, the L-shaped clamping plate, the first anti-skid pad, the fixing base, the screw rod, the collecting box, the sliding rail and the sliding block, the circuit board can be prevented from deviating when the circuit board is punched, and meanwhile waste scraps falling during punching can be collected in a centralized mode.
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Description

Technical Field

[0001] This application relates to the technical field of punching dies, specifically to a punching die for circuit boards. Background Art

[0002] A circuit board, also known as a printed circuit board or printed wiring board, is an important electronic component. Its main function is to connect various electronic components according to a predetermined circuit to form a complete circuit system and realize various functions of electronic devices. A circuit board usually consists of a substrate made of insulating material, and conductive lines and pads formed through processes such as etching.

[0003] During the production process of circuit boards, stamping operations are required to quickly cut the circuit boards into the required shapes and sizes, improve production efficiency, and at the same time ensure the accurate external dimensions of the circuit boards to meet the design and assembly requirements.

[0004] For example, the patent with the publication number CN217617193U specifically discloses a sheet metal stamping die, including a stamping die, a lower die, a stamping table, a stamping cylinder, a limiting strip, a clamping groove, bolts, and a feeding block. Thus, the sheet metal part can be positioned during the stamping process to ensure stamping accuracy, and by pushing the feeding block, the sheet metal part is sent below the stamping die for stamping.

[0005] When the above-mentioned patent stamping die is in use, one end of the circuit board is passed through the lower part of the pressure plate and placed in the clamping groove of the feeding block, and then the bolts are tightened so that the bolts are in contact with the circuit board. Then the circuit board is pushed to the position for feeding and stamping. Then, the circuit board is pressed tightly on the stamping die by the action of the spring on the pressure plate, and finally punching is carried out. However, in the way of clamping the circuit board by tightening the bolts, the direct contact between the bolts and the circuit board easily causes wear on the surface of the circuit board. At the same time, only by the action of the spring on the pressure plate to press the circuit board tightly, when stamping the circuit board again, the circuit board is prone to deviation. Therefore, it is necessary to design a punching die for circuit boards to solve the above problems.

[0006] It should be noted that the above information disclosed in this background art part is only used to understand the background art of the concept of this application, and therefore, it may include information that does not constitute the prior art. Summary of the Invention

[0007] Based on the above problems existing in the prior art, the problem to be solved by this application is: to provide a punching die for circuit boards to solve the problems that when the above-mentioned patent stamping die is in use, one end of the sheet metal part is passed through the lower part of the pressure plate and placed in the clamping groove of the feeding block, and then the bolts are tightened so that the bolts are in contact with the circuit board. Then the circuit board is pushed to the position for feeding and stamping, and the stamping die then punches the circuit board. However, in the way of clamping the circuit board by tightening the bolts, the direct contact between the bolts and the circuit board easily causes wear on the surface of the circuit board.

[0008] The technical solution adopted by this application to solve its technical problems is: a punching die for a circuit board. It mainly includes: a workbench, which has two groups of chutes; a punching assembly, which is installed on the workbench. The punching assembly has a lower die for placing the circuit board and a top plate installed on the lower die; a clamping assembly, which is installed in the chute. The clamping assembly includes: a cylinder, which is installed in the chute; an L-shaped clamping plate, which is installed at the output end of the cylinder; a pressing mechanism, which is installed on the L-shaped clamping plate. The pressing mechanism includes: a fixed seat, which is installed on the L-shaped clamping plate, and a screw is threadedly connected to the fixed seat; a pressing block, which is installed at one end of the screw.

[0009] Further, a rotating wheel is installed at one end of the screw away from the pressing block.

[0010] Further, an opening groove is formed on one side of the workbench away from the punching assembly. A groove adapted to the size of the lower die is formed on the workbench, and the opening groove is communicated with the groove. A collection assembly is installed on the workbench. The collection assembly includes two groups of slide rails installed on the workbench, and a slider is slidably installed on the slide rails. A collection box is connected between the two sliders.

[0011] Further, two groups of limit plates are installed on the lower die.

[0012] Further, a first anti-slip pad is provided at the contact position between the L-shaped clamping plate and the circuit board.

[0013] The beneficial effects of this application are: The punching die for a circuit board provided by this application, through the settings of the cylinder, L-shaped clamping plate, first anti-slip pad, fixed seat, screw, collection box, slide rail and slider, can avoid the circuit board from running off during punching of the circuit board, and at the same time can centrally collect the waste chips dropped during punching.

[0014] In addition to the purposes, features and advantages described above, this application has other purposes, features and advantages. The following will refer to the drawings for a further detailed description of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The specification drawings forming a part of this application are used to provide a further understanding of this application. The schematic embodiments of this application and their descriptions are used to explain this application and do not constitute an improper limitation to this application.

[0016] In the drawings:

[0017] Figure 1 is the overall schematic diagram of the punching die for a circuit board in this application;

[0018] Figure 2 is Figure 1 an explosion schematic diagram of

[0019] Figure 3 is Figure 2 a schematic diagram of the bottom structure of

[0020] Figure 4 is Figure 3 a partial structure schematic diagram at position A in

[0021] Among them, each reference numeral in the figure:

[0022] 1. Workbench; 101. Slide groove; 102. Open groove; 2. Stamping assembly; 201. Upper die; 202. Lower die; 203. Hydraulic cylinder; 204. Top plate; 205. Limiting plate; 3. Clamping assembly; 301. Cylinder; 302. L-shaped clamping plate; 303. First anti-slip pad; 304. Fixed seat; 305. Screw; 306. Rotating wheel; 307. Pressing block; 4. Collection assembly; 401. Collection box; 402. Slide rail; 403. Slide block. Specific embodiments

[0023] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0024] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0025] As Figures 1-3 shown, the present application provides a stamping die for circuit boards, including a workbench 1, which has two groups of slide grooves 101. A stamping assembly 2 is installed on the workbench 1, and the stamping assembly 2 is used for stamping the circuit board;

[0026] The stamping assembly 2 includes a lower die 202 fixedly installed on the workbench 1, and the lower die 202 is suitable for placing the circuit board. At the same time, a groove (not marked in the figure) adapted to the size of the lower die 202 is opened on the workbench 1. The lower die 202 has four groups of columns, and an upper die 201 is connected to the four groups of columns. A hydraulic cylinder 203 is fixedly installed on the upper die 201, and a stamping head (not marked in the figure) is fixedly installed at the output end of the hydraulic cylinder 203;

[0027] Two sets of limit plates 205 are fixedly installed on the lower mold 202, and the limit plates 205 are adapted to limit both sides of the circuit board;

[0028] The punching head is adapted to approach or move away from the circuit board along with the output end of the hydraulic cylinder 203 to punch the circuit board;

[0029] A clamping assembly 3 is installed in the chute 101. The clamping assembly 3 includes a cylinder 301 fixedly installed at one end of the inner wall of the chute 101. An L-shaped clamping plate 302 is connected and installed at the output ends of the two cylinders 301. At the same time, a top plate 204 is fixedly installed on the lower mold 202;

[0030] A first anti-slip pad 303 is arranged at the contact position between the L-shaped clamping plate 302 and the circuit board. The first anti-slip pad 303 is used to prevent the L-shaped clamping plate 302 from directly contacting the circuit board and causing external clamping damage. And the L-shaped clamping plate 302 is adapted to move linearly along with the output end of the cylinder 301 to abut the circuit board against one end of the top plate 204;

[0031] In this application, a second anti-slip pad is arranged at the contact position between the circuit board and the top plate 204. The second anti-slip pad is made of an elastic material and is used to prevent the top plate 204 from directly contacting the circuit board and causing external clamping damage;

[0032] A pressing mechanism is installed on the L-shaped clamping plate 302. The pressing mechanism is adapted to press the circuit board against the lower mold 202. The pressing mechanism includes a fixed seat 304 fixedly installed on the L-shaped clamping plate 302. A screw rod 305 is threadedly connected to the fixed seat 304. One end of the screw rod 305 movably penetrates through the L-shaped clamping plate 302, and a pressing block 307 is installed at one end of the L-shaped clamping plate 302 by means of a bearing;

[0033] The pressing block 307 is adapted to rotate in the fixed seat 304 along with the screw rod 305 to approach or move away from the circuit board, so as to press the circuit board against the lower mold 202;

[0034] A runner 306 is fixedly installed at one end of the screw rod 305 away from the pressing block 307, and the runner 306 facilitates the rotation of the screw rod 305;

[0035] An opening groove 102 is formed on one side of the workbench 1 away from the punching assembly 2. The width of the opening groove 102 is smaller than the width of the groove, and the opening groove 102 is communicated with the groove, so that the waste chips dropped by punching can pass through the opening groove 102 and fall;

[0036] A collection assembly 4 is installed on one side of the workbench 1 away from the stamping assembly 2. The collection assembly 4 is used to collect the waste materials dropped during stamping. The collection assembly 4 includes two sets of slide rails 402 fixedly installed on one side of the workbench 1 away from the stamping assembly 2. A slider 403 is slidably installed on the slide rail 402. A collection box 401 is connected between the two sliders 403. The collection box 401 is adapted to move along the linear direction of the slide rail 402 through the slider 403.

[0037] Working principle:

[0038] When stamping a circuit board, place the circuit board on the lower die 202, then start the cylinder 301 and push the L-shaped clamping plate 302 to move, so that the L-shaped clamping plate 302 pushes the circuit board and abuts against the top plate 204. By holding the rotating wheel 306 and rotating the screw rod 305, the pressing block 307 is driven to move downward until the circuit board is pressed tightly on the lower die 202. Then, start the hydraulic cylinder 203 to drive the stamping head to stamp the circuit board. The waste chips dropped during stamping are centrally collected in the collection box 401 through the opening groove 102, so as to avoid the circuit board from running off during punching of the circuit board and at the same time centrally collect the waste chips dropped during punching.

[0039] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A punching die for a circuit board, characterized in that: include: A workbench (1), the workbench (1) having two sets of slide grooves (101); A stamping assembly (2), the stamping assembly (2) being mounted on the workbench (1), the stamping assembly (2) comprising a lower mold (202) for placing a circuit board and a top plate (204) mounted on the lower mold (202); A clamping assembly (3), the clamping assembly (3) being installed in the slide groove (101), the clamping assembly (3) comprising: A cylinder (301), the cylinder (301) being installed in the slide groove (101); An L-shaped clamping plate (302), the L-shaped clamping plate (302) being mounted on the output end of the cylinder (301); A clamping mechanism, which is mounted on the L-shaped clamping plate (302), and comprises: A fixing seat (304), the fixing seat (304) being mounted on the L-shaped clamping plate (302), and a screw (305) being threadedly connected to the fixing seat (304); A pressing block (307) is installed at one end of the screw rod (305).

2. The circuit board punching die according to claim 1, characterized in that: A rotating wheel (306) is mounted on one end of the screw rod (305) away from the pressing block (307).

3. The circuit board punching die according to claim 2, characterized in that: An open groove (102) is provided on a side of the workbench (1) away from the punching assembly (2), and a groove matching the size of the lower mold (202) is provided on the workbench (1); A collecting assembly (4) is installed on the workbench (1), and the collecting assembly (4) comprises two sets of slide rails (402) installed on the workbench (1), a slider (403) is slidably installed on the slide rails (402), and a collecting box (401) is connected between the two sets of sliders (403).

4. The circuit board punching die according to claim 3, characterized in that: Two sets of limiting plates (205) are installed on the lower mold (202).

5. The circuit board punching die according to claim 4, characterized in that: A first anti-slip pad (303) is provided at the contact position between the L-shaped clamping plate (302) and the circuit board.

Citation Information

Patent Citations

  • Sheet metal part stamping die

    CN217617193U