Silicon wafer label stripping and transferring device

By designing a label peeling and transport device including a rack, material table, downward assembly, transverse assembly and hoist assembly, the problems of low efficiency of traditional manual operation and difficult to guarantee the quality of the label are solved, and automatic stripping and efficient transport of the label are achieved.

CN223015149UActive Publication Date: 2025-06-24JINWAN GAOJING SOLAR ENERGY TECH CO LTD +1
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Patent Information

Application Number
CN202422048842.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-22
Publication Date
2025-06-24
Estimated Expiration
2034-08-22

AI Technical Summary

Technical Problem

After the label is printed, traditional label printers manually pick up and transfer the label, which is inefficient in production and can easily lead to label folds, deformation or damage, making it difficult to ensure the quality of the label.

Method used

Design a stripping and transport device for silicon wafer labels, including frames, material tables, downward pressure components, transverse shift components and hoisting components. Through mechanized downward pressure, transverse shift and hoisting operations, automatic stripping and transport of labels are achieved.

Benefits of technology

Improve the production efficiency of labels, reduce manual intervention, avoid label damage and quality problems, and realize automatic label mounting.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a silicon wafer label stripping and transferring device which comprises a rack, a material platform, a pressing assembly, a transverse moving assembly and a jacking assembly, the material platform, the pressing assembly, the transverse moving assembly and the jacking assembly are arranged on the rack, the silicon wafer label stripping and transferring device is arranged on the side portion of a label printer, and the material platform is close to a label outlet of the label printer. The label enters the position above the material table from the label outlet, the downward pressing assembly presses the label on the material table, the transverse moving assembly drives the material table to retreat, and therefore the label is stripped from the label base band, and finally the jacking assembly jacks the label upwards so that the label can be taken away by the follow-up material taking assembly. Therefore, the device can complete automatic stripping and transferring of the labels from the printer, the production efficiency is high, mechanical stripping and transferring operation is easier to control, wrinkles, deformation and damage of the labels are not prone to being caused, the quality of the labels can be guaranteed, and the device can be matched with a follow-up material taking assembly to achieve automatic pasting of the labels.
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Description

Technical Field

[0001] The utility model relates to the technical field of label mounting in silicon wafer packaging, and particularly relates to a device for peeling and transporting silicon wafer labels. Background Art

[0002] During the silicon wafer packaging process, as the initial source device for labels, a label printer can print labels of various sizes and contents for use at other different workstations. However, after the traditional label printer finishes printing labels, the labels can only be manually taken and transferred by workers, resulting in low production efficiency. Moreover, during the manual taking and transferring of labels, it is difficult for manual operations to be controlled, easily leading to label wrinkles, deformation, or even damage, and it is difficult to guarantee the quality. Content of the Utility Model

[0003] In order to overcome the deficiencies of the prior art, the purpose of the utility model is to provide a device for peeling and transporting silicon wafer labels, which can improve production efficiency and ensure label quality.

[0004] To solve the above problems, the technical solution adopted by the utility model is as follows: A device for peeling and transporting silicon wafer labels includes a frame and a material table, a pressing-down component, a transverse movement component, and a lifting component provided on the frame; the pressing-down component can press down towards the material table to press the label on the material table; the transverse movement component can drive the material table to move backward to peel the label from the label base tape; the lifting component can lift towards the label on the material table to lift the label on the material table.

[0005] Compared with the prior art, the beneficial effect of the utility model lies in that: This device is arranged on the side of the label printer, and the material table is close to the label outlet of the label printer. After the label is printed in the printer, it enters above the material table from the label outlet. The pressing-down component presses the label on the material table, and the transverse movement component drives the material table to move backward, thereby peeling the label from the label base tape. Finally, the lifting component lifts the label upward for the subsequent material taking component to take away. Therefore, this device can complete the automatic peeling and transportation of labels from the printer, with high production efficiency, and the mechanical peeling and transportation operations are easier to control, not easily causing label wrinkles, deformation, and damage, capable of guaranteeing label quality, and can cooperate with the subsequent material taking component to realize the automatic mounting of labels.

[0006] The above-mentioned device for peeling and transporting silicon wafer labels further includes a lifting component, and the lifting component can drive the material table, the pressing-down component, the transverse movement component, and the lifting component to move up and down together.

[0007] The above-mentioned silicon wafer label peeling and transfer device, wherein the lifting assembly includes a lifting driving member, a vertical slide rail, a lifting plate and a mounting plate; the lifting driving member and the vertical slide rail are installed on the frame; the lifting plate is installed at the output end of the lifting driving member and is slidably connected to the vertical slide rail; the mounting plate is installed on the upper part of the lifting plate; the material table, the pressing-down assembly, the transverse movement assembly and the jacking assembly are all arranged on the mounting plate.

[0008] The above-mentioned silicon wafer label peeling and transfer device, wherein a scale for identifying the lifting height of the lifting plate is provided on the frame.

[0009] The above-mentioned silicon wafer label peeling and transfer device, wherein the pressing-down assembly includes a pressing-down driving member and a pressing block, and the pressing block is installed at the output end of the pressing-down driving member.

[0010] The above-mentioned silicon wafer label peeling and transfer device, wherein the transverse movement assembly includes a transverse movement driving member and a horizontal slide rail, and the transverse movement driving member can drive the material table to move horizontally along the horizontal slide rail.

[0011] The above-mentioned silicon wafer label peeling and transfer device, wherein the jacking assembly includes a jacking driving member and a jacking pin, the jacking pin is installed at the output end of the jacking driving member, and the jacking driving member can drive the jacking pin to move upward to jack up the label on the material table.

[0012] The above-mentioned silicon wafer label peeling and transfer device, wherein there are multiple rows of the jacking pins.

[0013] The above-mentioned silicon wafer label peeling and transfer device further includes a sensor for identifying the entry or exit of the label from the material table.

[0014] The above-mentioned silicon wafer label peeling and transfer device further includes a material taking assembly for taking away the label on the material table.

[0015] The following further describes the present invention in detail with reference to the accompanying drawings and specific embodiments. Description of the Drawings

[0016] Figure 1 is a schematic diagram of the overall structure of the device according to an embodiment of the present invention;

[0017] Figure 2 is a schematic diagram of the structure of the pressing-down assembly according to an embodiment of the present invention.

[0018] Description of the attached reference numerals: 100 frame, 200 material table, 300 downward pressing assembly, 310 downward pressing driving member, 320 pressing block, 400 transverse movement assembly, 410 transverse movement driving member, 420 horizontal slide rail, 500 lifting assembly, 510 lifting driving member, 520 ejector pin, 600 lifting and lowering assembly, 610 vertical slide rail, 620 lifting and lowering plate, 630 mounting plate, 700 printer, 710 label outlet. Detailed implementation manners

[0019] The following details the embodiments of the present utility model. Referring to Figure 1 and Figure 2 An embodiment of the present utility model provides a device for peeling and transporting silicon wafer labels, including a frame 100 and a material table 200, a downward pressing assembly 300, a transverse movement assembly 400, and a lifting assembly 500 provided on the frame 100; the downward pressing assembly 300 can press downward towards the material table 200 to press the label on the material table 200; the transverse movement assembly 400 can drive the material table 200 to retreat to peel the label from the label base tape; the lifting assembly 500 can lift towards the label on the material table 200 to lift the label on the material table 200.

[0020] This device is arranged on the side of a label printer 700, and the material table 200 is close to the label outlet 710 of the label printer 700. After the label is printed in the printer 700, it enters above the material table 200 from the label outlet 710. The downward pressing assembly 300 presses the label on the material table 200, and the transverse movement assembly 400 drives the material table 200 to retreat, thereby peeling the label from the label base tape. Finally, the lifting assembly 500 lifts the label upward for subsequent picking-up components to pick up. Therefore, this device can realize the transportation of the label in multiple directions, complete the automatic peeling, blanking and transportation of the label from the printer 700, has high production efficiency, and the operations of mechanical peeling and transportation are easier to control, can reduce manual intervention, are not likely to cause wrinkles, deformation and damage to the label, can ensure the quality of the label, and can cooperate with subsequent picking-up components to realize the automatic labeling of the label.

[0021] Furthermore, the device further includes a lifting assembly 600. The lifting assembly 600 can drive the material table 200, the pressing-down assembly 300, the transverse movement assembly 400 and the jacking assembly 500 to move up and down together, so as to supply labels of different height specifications correspondingly. During use, it can be adjusted according to the height of the label outlet 710 on the label printer 700, so that the material table 200 corresponds to the label outlet 710. When the label printing is completed, the label output from the label outlet 710 can just enter the material table 200. An inductor is provided on the frame 100 or the material table 200. When the label enters the material table 200, it will be recognized by the inductor, thereby driving the pressing-down assembly 300 to start working. After the subsequent label is taken away, the inductor can also recognize it, thereby driving the material table 200 to reset, waiting to peel off the next label.

[0022] Furthermore, the lifting assembly 600 includes a lifting driving member, a vertical slide rail 610, a lifting plate 620 and a mounting plate 630; the lifting driving member and the vertical slide rail 610 are installed on the frame 100; the lifting plate 620 is installed at the output end of the lifting driving member and is slidably connected to the vertical slide rail 610; the mounting plate 630 is installed on the upper part of the lifting plate 620; the material table 200, the pressing-down assembly 300, the transverse movement assembly 400 and the jacking assembly 500 are all arranged on the mounting plate 630. The lifting driving member can be a lifting cylinder or other structures. During operation, it can drive the lifting plate 620 and the mounting plate 630 to move up and down together, so as to achieve height adjustment. Furthermore, a scale for identifying the lifting height of the lifting plate 620 is provided on the frame 100, so as to facilitate identifying whether the lifting plate 620 is adjusted to the target height.

[0023] Furthermore, the pressing-down assembly 300 includes a pressing-down driving member 310 and a pressing block 320. The pressing block 320 is installed at the output end of the pressing-down driving member 310. The pressing-down driving member 310 can be a rotary cylinder or other structures. When the inductor recognizes that the label enters above the material table 200, it can send a signal to the pressing-down driving member 310, and the pressing-down driving member 310 drives the pressing block 320 to press down, so as to press the label on the material table 200. When the transverse movement assembly 400 drives the material table 200 backward, the label will be peeled off from the label base tape.

[0024] Furthermore, the transverse movement assembly 400 includes a transverse movement driving member 410 and a horizontal slide rail 420. The transverse movement driving member 410 can drive the material table 200 to move horizontally along the horizontal slide rail 420. The transverse movement driving member 410 is installed on the frame 100 or the mounting plate 630 and can be a cylinder or other structures. When the transverse movement driving member 410 works, it can drive the material table 200 to move backward along the horizontal slide rail 420, so as to peel off the label from the label base tape.

[0025] Furthermore, referring to Figure 2, the lifting assembly 500 includes a lifting driving member 510 and a thimble 520. The thimble 520 is installed at the output end of the lifting driving member 510. The lifting driving member 510 can drive the thimble 520 to move upward to lift the label on the material table 200. Further, the thimble 520 is provided with multiple rows to effectively lift the label, avoid damaging the label, and facilitate the subsequent picking of the label. Further, the device further includes a picking component. The picking component can be a structure such as a manipulator, and picks up the label on the material table 200 by means of adsorption or the like for use in the full-automatic mounting of the label.

[0026] It should be noted that in the description of the present utility model, if there is a description of the orientation, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc., it is all based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and should not be construed as a limitation to the present utility model.

[0027] In the description of the present utility model, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, exceeding, etc. are understood as not including the present number, and above, below, within, etc. are understood as including the present number. If there is a description of the first or the second, etc., it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0028] In the description of the present utility model, unless otherwise clearly defined, words such as setting, installing, connecting, etc. should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meanings of the above words in the present utility model in combination with the specific content of the technical solution.

[0029] The above embodiments are only the preferred embodiments of the present utility model and cannot be used to limit the scope of protection of the present utility model. Any non-substantial changes and substitutions made by those skilled in the art based on the present utility model belong to the scope of protection required by the present utility model.

Claims

1. A device for peeling and transferring silicon wafer labels, characterized in that: It comprises a frame (100), and a material platform (200), a pressing assembly (300), a transverse movement assembly (400), and a lifting assembly (500) arranged on the frame (100); The pressing component (300) is capable of pressing downward toward the material platform (200) to press the label onto the material platform (200); The transverse movement assembly (400) can drive the material platform (200) to move backward to peel the label from the label base tape; The lifting component (500) is capable of lifting toward the label on the material platform (200) to lift up the label on the material platform (200).

2. The device for peeling and transferring silicon wafer labels according to claim 1, characterized in that: It also includes a lifting component (600), and the lifting component (600) can drive the material platform (200), the pressing component (300), the transverse movement component (400) and the lifting component (500) to move up and down together.

3. The device for peeling and transferring silicon wafer labels according to claim 2, characterized in that: The lifting assembly (600) comprises a lifting drive member, a vertical slide rail (610), a lifting plate (620) and a mounting plate (630); The lifting drive member and the vertical slide rail (610) are installed on the frame (100); The lifting plate (620) is installed at the output end of the lifting drive member and is slidably connected to the vertical slide rail (610); The mounting plate (630) is mounted on the upper portion of the lifting plate (620); The material platform (200), the pressing assembly (300), the transverse movement assembly (400) and the lifting assembly (500) are all arranged on the mounting plate (630).

4. The device for peeling and transferring silicon wafer labels according to claim 3, characterized in that: The frame (100) is provided with a scale for identifying the lifting height of the lifting plate (620).

5. The device for peeling and transferring silicon wafer labels according to claim 1, characterized in that: The pressing assembly (300) comprises a pressing driving member (310) and a pressing block (320), wherein the pressing block (320) is installed at the output end of the pressing driving member (310).

6. The device for peeling and transferring silicon wafer labels according to claim 1, characterized in that: The transverse movement assembly (400) comprises a transverse movement driving member (410) and a horizontal slide rail (420), and the transverse movement driving member (410) is capable of driving the material platform (200) to move horizontally along the horizontal slide rail (420).

7. The device for peeling and transferring silicon wafer labels according to claim 1, characterized in that: The lifting assembly (500) comprises a lifting drive (510) and a lift pin (520), wherein the lift pin (520) is installed at the output end of the lifting drive (510), and the lifting drive (510) can drive the lift pin (520) to move upward to lift the label on the material platform (200).

8. The device for peeling and transferring silicon wafer labels according to claim 7, characterized in that: The ejector pins (520) are arranged in multiple rows.

9. The device for peeling and transferring silicon wafer labels according to claim 1, characterized in that: It also includes a sensor for identifying whether a tag enters or leaves the material platform (200).

10. The device for peeling and transferring silicon wafer labels according to claim 1, characterized in that: It also comprises a material taking component, and the material taking component is used to take away the label on the material platform (200).