Heat-conducting and electric-conducting double-faced adhesive tape

Abstract

The utility model discloses a heat-conducting and electric-conducting double-faced adhesive tape, which comprises an electric-conducting base material layer, a first surface and a second surface which are opposite to each other along the thickness direction of the adhesive; the adhesive layers are respectively arranged on the first surface and the second surface; the adhesive layer is provided with a plurality of accommodating holes penetrating in the layer thickness direction, and the accommodating holes are filled with heat-conducting and electric-conducting adhesive or heat-conducting and electric-conducting filler; the adhesive layer comprises a high-viscosity adhesive layer and a heat-conducting adhesive layer which are alternately stacked, and the high-viscosity adhesive layer is the surface layer of the adhesive layer. The toughness, the bending resistance and the bonding firmness of the heat-conducting and electric-conducting double-sided adhesive tape are improved through the adhesive layer with the structure that the high-viscosity adhesive layers and the heat-conducting adhesive layers are alternately stacked; the heat-conducting glue layer of the glue layer is communicated with the heat-conducting and electric-conducting material in the accommodating hole to form a heat-conducting net-shaped channel, so that the heat-conducting effect is optimized, and the electric-conducting effect in the glue thickness direction is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of double-sided adhesives, in particular to a thermally conductive and electrically conductive double-sided adhesive. Background Art

[0002] With the increasing integration of electronic devices, double-sided adhesives are required to connect components, and the double-sided adhesives need to have both heat dissipation and electrical conductivity functions. Traditional heat dissipation and electrical conductivity materials often cannot meet the requirements of good heat dissipation effect and excellent electrical conductivity at the same time. The thermally conductive and electrically conductive tapes on the market improve the overall thermal conductivity of the tape by adding some thermally conductive fillers and electrically conductive fillers to the glue. However, since the thermal conductivity of the glue itself is very low (the thermal conductivity of ordinary acrylic glue is generally 0.2w / m k), a large amount of high thermal conductivity fillers need to be added to improve the overall thermal conductivity of the tape. At the same time, electrically conductive materials are also added, which greatly increases the hardness of the tape and decreases the viscosity, having a negative impact on the quality and application scenarios of the tape.

[0003] Therefore, it is necessary to improve the thermally conductive and electrically conductive double-sided adhesive in the prior art. Summary of the Utility Model

[0004] The purpose of the utility model is to overcome the defects existing in the prior art and provide a thermally conductive and electrically conductive double-sided adhesive. The toughness, bending resistance and bonding firmness of the thermally conductive and electrically conductive double-sided adhesive are improved through the adhesive layer with an alternating laminated structure of a high-viscosity adhesive layer and a thermally conductive adhesive layer. The thermally conductive adhesive layer of the adhesive layer communicates with the thermally conductive and electrically conductive material in the accommodation hole to form a thermally conductive network channel to optimize the thermal conductivity and improve the electrical conductivity along the adhesive thickness direction.

[0005] To achieve the above technical effects, the technical solution of the utility model is: a thermally conductive and electrically conductive double-sided adhesive, comprising:

[0006] An electrically conductive base material layer having a first surface and a second surface opposite to each other along the adhesive thickness direction;

[0007] An adhesive layer provided on the first surface and the second surface respectively;

[0008] The adhesive layer is provided with a plurality of accommodation holes penetrating along the layer thickness direction, and the accommodation holes are filled with thermally conductive and electrically conductive glue or thermally conductive and electrically conductive fillers;

[0009] The adhesive layer includes an alternating laminated high-viscosity adhesive layer and thermally conductive adhesive layer, and the high-viscosity adhesive layer is the surface layer of the adhesive layer.

[0010] Preferably, the thermally conductive adhesive layer contains ceramic particles and / or metal particles.

[0011] Preferably, the main material of the thermally conductive adhesive layer is polyurethane-modified acrylic pressure-sensitive adhesive.

[0012] Preferably, the thermally conductive and electrically conductive adhesive or the thermally conductive and electrically conductive filler comprises a metal and / or a carbon material.

[0013] Preferably, the total layer thickness of the high-viscosity adhesive layer is greater than or equal to the layer thickness of the thermally conductive adhesive layer.

[0014] Preferably, the conductive base material layer is a polyester fiber with a coating, or is a woven or blended fabric of conductive fibers and polyester fibers.

[0015] Preferably, the layer thickness of the conductive base material layer is 15 - 50 microns, and the layer thickness of the adhesive layer is 15 - 30 microns.

[0016] Preferably, an antistatic release layer is provided on the surface of the adhesive layer away from the conductive base material layer.

[0017] The advantages and beneficial effects of the present utility model are as follows:

[0018] The structure of the thermally conductive and electrically conductive double-sided adhesive is reasonable. The toughness and bending resistance of the thermally conductive and electrically conductive double-sided adhesive are improved through the adhesive layer with an alternating laminated structure of the high-viscosity adhesive layer and the thermally conductive adhesive layer. At the same time, the high-viscosity adhesive layer improves the bonding firmness of the double-sided adhesive on the surface of the adhesive layer; the thermally conductive adhesive layer of the adhesive layer communicates with the thermally conductive and electrically conductive material in the accommodation hole to form a thermally conductive network channel, optimizing the thermal conductivity effect and improving the electrical conductivity effect along the adhesive thickness direction, preventing the deposition of the conductive material from being unfavorable for exerting the electrical conductivity effect of the double-sided adhesive. Description of the Drawings

[0019] Figure 1 is a schematic structural diagram of Embodiment 1 of the thermally conductive and electrically conductive double-sided adhesive of the present utility model;

[0020] Figure 2 is a schematic structural diagram of Embodiment 2 of the thermally conductive and electrically conductive double-sided adhesive of the present utility model.

[0021] In the figure: 1, conductive base material layer; 2, adhesive layer; 3, antistatic release layer; 20, accommodation hole; 21, high-viscosity adhesive layer; 22, thermally conductive adhesive layer. Detailed Embodiments

[0022] The following combines the drawings and embodiments to further describe the specific embodiments of the present utility model. The following embodiments are only used to more clearly illustrate the technical solutions of the present utility model and cannot be used to limit the protection scope of the present utility model.

[0023] "Surface" is referenced to the normal use state of the thermally conductive and electrically conductive double-sided adhesive. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present utility model.

[0024] In addition, terms such as "first", "second", etc. are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the creation of the present utility model, unless otherwise stated, the meaning of "a plurality" is two or more.

[0025] As Figures 1 - 2 shown, the thermally conductive and electrically conductive double-sided adhesive disclosed by the present utility model comprises an electrically conductive base material layer 1 and an adhesive layer 2. The electrically conductive base material layer 1 has a first surface (not marked) and a second surface (not marked) that are opposite to each other along the adhesive thickness direction. The adhesive layer 2 is disposed on the first surface and the second surface respectively. Among them, the adhesive layer 2 is provided with a plurality of accommodation holes 20 that penetrate along the layer thickness direction, and the accommodation holes 20 are filled with thermally conductive and electrically conductive adhesive or thermally conductive and electrically conductive filler. Further, the adhesive layer 2 comprises a high-viscosity adhesive layer 21 and a thermally conductive adhesive layer 22 that are alternately laminated, and the high-viscosity adhesive layer 21 is the surface layer of the adhesive layer.

[0026] The high-viscosity adhesive layer 21 is formed by coating and curing a polyurethane-modified acrylic pressure-sensitive adhesive solution on a release film; the thermally conductive adhesive layer 22 is formed by adding a thermally conductive filler to the polyurethane-modified acrylic pressure-sensitive adhesive solution and then coating and curing on the release film. Then the high-viscosity adhesive layer 21 and the thermally conductive adhesive layer 22 are laminated in sequence, and the high-viscosity adhesive layer 21 is the surface layer of the adhesive layer, thereby achieving the improvement of the connection firmness between the adhesive layer and the connected object. Then holes are drilled in the adhesive layer, thereby forming the accommodation holes 20 that penetrate along the layer thickness direction. By coating a thermally conductive and electrically conductive adhesive solution on a base film with uneven surfaces and demolding after curing, a thermally conductive and electrically conductive adhesive that is in concave-convex fit with the accommodation holes 20 is formed. Or the laminated adhesive layer is compounded with the two surfaces of the electrically conductive base material layer, and the release film on the surface of the adhesive layer is retained (the release film also has holes drilled at the same time), and the double-sided adhesive containing the accommodation holes 20 is placed in an electroplating solution for double-sided electroplating, thereby filling the thermally conductive filler in the accommodation holes 20.

[0027] The thermally conductive and electrically conductive adhesive or thermally conductive and electrically conductive filler comprises a metal and / or a carbon material. Metal fillers such as copper powder or copper foil, copper has extremely high electrical conductivity and good thermal conductivity, and is an ideal material for making the thermally conductive and electrically conductive double-sided adhesive. Copper powder can be mixed in the adhesive to enhance conductivity, while copper foil can be directly used as the conductive layer and at the same time promote heat transfer. Metal fillers such as aluminum powder or aluminum foil, although the electrical conductivity and thermal conductivity are slightly lower than those of copper, aluminum is lighter, lower in cost, and has good corrosion resistance, and is also a common choice.

[0028] Carbon materials such as graphene, as one of the thinnest, strongest, and best electrically and thermally conductive materials currently discovered, graphene can exhibit excellent electrical and thermal conductivity in a thin layer state and is very suitable for high-performance thermally conductive and electrically conductive double-sided adhesive applications. Carbon materials such as carbon nanotubes: have extremely high axial electrical conductivity and thermal conductivity, and the addition of carbon nanotubes can significantly improve the comprehensive performance of the double-sided adhesive.

[0029] The thermally conductive adhesive layer 22 contains ceramic particles and / or metal particles. Ceramic particles such as aluminum oxide and boron nitride have high thermal conductivity, can effectively improve the heat dissipation capacity of the adhesive tape and have good stability. Metal particles (such as copper and aluminum powder): Metal particles not only have excellent thermal conductivity, but also provide a certain degree of electrical conductivity. The advantage is that both thermal and electrical conductivity are excellent.

[0030] The main material of the thermal conductive adhesive layer 22 is polyurethane modified acrylic pressure-sensitive adhesive. The acrylic pressure-sensitive adhesive can be modified with polyurethane to improve the adhesion of the pressure-sensitive adhesive to various substrates (including low surface energy materials), especially under complex or challenging surface conditions, such as porous or irregular surfaces. Since polyurethane has excellent hydrolysis resistance, weather resistance and chemical resistance, the modified acrylic pressure-sensitive adhesive can better resist the erosion of the outdoor environment and extend its service life. Polyurethane modification gives the acrylic pressure-sensitive adhesive better elasticity and toughness, allowing it to return to its original shape after being subjected to external forces. Polyurethane-modified acrylic pressure-sensitive adhesives usually have a wider operating temperature range, which can maintain flexibility at low temperatures and stable bonding properties at high temperatures.

[0031] To optimize the toughness of the adhesive layer and enhance bonding, the total thickness of the high-viscosity adhesive layer 21 is greater than or equal to the thickness of the thermal conductive adhesive layer 22 .

[0032] The conductive substrate layer 1 is a polyester fiber with a coating, or a conductive fiber interwoven or blended with a polyester fiber. Among them, the most commonly used substrate is polyester fiber, which is polyester, because it has high strength, wear resistance, is not easy to shrink and has a relatively low cost. Polyester fiber provides the basic physical structure support for the conductive cloth. Such as metal plating, including nickel plating, copper plating, gold plating, etc. Among them, nickel plating can provide good basic conductivity and anti-corrosion ability; copper plating provides higher conductivity; gold plating is used for high-end applications that require excellent conductivity and oxidation resistance. Including carbon-plated conductive cloth, the conductivity of carbon is used to achieve the conductive function. Conductive fibers such as metal fibers (copper, nickel, stainless steel, etc.) or fibers that have been specially treated (such as carbonization) are interwoven or blended with polyester fibers to enhance the overall conductive properties.

[0033] The surface of the adhesive layer 2 away from the conductive substrate layer 1 is provided with an antistatic release layer 3. The release film with holes is peeled off and re-pasted to form a complete antistatic release layer 3, thereby preventing the thermally conductive adhesive or thermally conductive filler from being oxidized.

[0034] The thickness of the conductive substrate layer 1 is 15-50 microns, and the thickness of the adhesive layer 2 is 15-30 microns.

[0035] Example 1

[0036] like Figure 1As shown in the figure, the thermally conductive and electrically conductive double-sided adhesive of Embodiment 1 includes an electrically conductive substrate layer 1 and an adhesive layer 2. The electrically conductive substrate layer 1 has a first surface and a second surface that are opposite to each other in the adhesive thickness direction. The adhesive layer 2 is disposed on the first surface and the second surface respectively. Among them, the adhesive layer 2 is provided with a plurality of accommodating holes 20 that penetrate in the layer thickness direction, and the accommodating holes 20 are filled with thermally conductive and electrically conductive adhesive. The adhesive layer 2 includes alternately stacked high-viscosity adhesive layers 21 and thermally conductive adhesive layers 22. The high-viscosity adhesive layer 21 is the surface layer of the adhesive layer 2, and the adhesive layer 2 is an alternately stacked structure of the high-viscosity adhesive layer 21, the thermally conductive adhesive layer 22, and the high-viscosity adhesive layer 21 (Structure 1). An antistatic release layer 3 is provided on the surface of the adhesive layer 2 away from the electrically conductive substrate layer 1.

[0037] Embodiment 2

[0038] As Figure 2 shown in the figure, Embodiment 2 is based on Embodiment 1, and the difference is that the alternately stacked structure of the adhesive layer 3 is the high-viscosity adhesive layer 21, the thermally conductive adhesive layer 22, the high-viscosity adhesive layer 21, the thermally conductive adhesive layer 22, and the high-viscosity adhesive layer 21 (Structure 2). Embodiment 2 has better toughness than Embodiment 1.

[0039] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A thermally and electrically conductive double-sided adhesive comprising: The conductive substrate layer has a first surface and a second surface opposite to each other along the thickness direction of the adhesive; An adhesive layer is disposed on the first surface and the second surface; The invention is characterized in that the adhesive layer is provided with a plurality of receiving holes penetrating along the layer thickness direction, and the receiving holes are filled with thermally conductive and electrically conductive adhesive or thermally conductive and electrically conductive filler; The adhesive layer comprises alternately stacked high-viscosity adhesive layers and thermally conductive adhesive layers, and the high-viscosity adhesive layer is the surface layer of the adhesive layer.

2. The thermally and electrically conductive double-sided adhesive according to claim 1, characterized in that: The thermal conductive adhesive layer contains ceramic particles and / or metal particles.

3. The thermally and electrically conductive double-sided adhesive according to claim 1 or 2, characterized in that: The main material of the thermal conductive adhesive layer is polyurethane modified acrylic pressure sensitive adhesive.

4. The thermally and electrically conductive double-sided adhesive according to claim 1, characterized in that: The total thickness of the high-viscosity adhesive layer is greater than or equal to the thickness of the thermal conductive adhesive layer.

5. The thermally and electrically conductive double-sided adhesive according to claim 1, characterized in that: The conductive substrate layer is a plated polyester fiber, or a conductive fiber interwoven or blended with a polyester fiber.

6. The thermally and electrically conductive double-sided adhesive according to claim 1, characterized in that: The thickness of the conductive substrate layer is 15 to 50 micrometers, and the thickness of the adhesive layer is 15 to 30 micrometers.

7. The thermally and electrically conductive double-sided adhesive according to claim 1, characterized in that: An antistatic release layer is disposed on the surface of the adhesive layer away from the conductive substrate layer.

Images