Device for controlling uniformity of copper layer of flexible printed circuit (FPC)

Abstract

The utility model discloses a flexible FPC circuit board copper layer uniformity control device, and relates to the field of flexible FPC circuit board copper layer processing auxiliary devices, the flexible FPC circuit board copper layer uniformity control device comprises an electrolytic tank body and an electrolyte mixing box, the front side and the rear side of the electrolytic tank body are symmetrically provided with bearing plates, and the top of each bearing plate is provided with an electric telescopic rod. According to the flexible FPC circuit board copper layer uniformity control device, through the arranged electric telescopic rod, the electric telescopic rod can drive the copper layer bearing assembly to stably ascend and descend along the inner surface of the electrolytic tank body during operation, and when a worker needs to replace a copper layer, the worker only needs to open the electric telescopic rod, and the electric telescopic rod can drive the copper layer bearing assembly to stably ascend and descend. The copper layer bearing assembly can drive the copper layer to be completely separated from the electrolyte in the electrolytic tank body, and therefore the situation that when a worker replaces the copper layer, the hand of the worker makes direct contact with the electrolyte, and potential safety hazards exist when the worker replaces the copper layer is avoided.

Description

Technical Field

[0001] The utility model relates to the field of auxiliary devices for copper layer processing of flexible FPC circuit boards, and specifically relates to a device for controlling the uniformity of copper layers on flexible FPC circuit boards. Background Technique

[0002] Flexible FPC circuit boards, also generally known as flexible circuit boards, are a type of highly reliable and extremely flexible printed circuit board made with polyimide or polyester film as the base material. They have the characteristics of high wiring density, light weight, thin thickness, and good bendability. The copper layer is one of the important components of flexible FPC circuit boards. When staff make the copper layer, they need to use a uniformity control device to adjust the uniformity of the copper layer, so as to improve the quality and reliability of the circuit board.

[0003] However, the current uniformity control devices still have some deficiencies. For example, most existing uniformity control devices use electrochemically deposition technology to control the uniformity of the copper layer by adjusting parameters such as current density, electrolyte composition, and deposition time. However, when staff replace the copper layer, their hands are prone to direct contact with the electrolyte, which brings certain interference to the safety of copper layer replacement for staff, and thus there are certain usage defects.

[0004] Therefore, it is urgent to improve this shortcoming. The utility model studies and improves the existing structural deficiencies, and provides a device for controlling the uniformity of copper layers on flexible FPC circuit boards. Summary of the Invention

[0005] The purpose of the utility model is to provide a device for controlling the uniformity of copper layers on flexible FPC circuit boards to solve the problems raised in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A device for controlling the uniformity of copper layers on flexible FPC circuit boards, including an electrolytic cell body and an electrolyte mixing tank. The front and back sides of the electrolytic cell body are symmetrically installed with bearing plates, and an electric telescopic rod is installed on the top of the bearing plates. The inner surface of the electrolytic cell body is connected with a copper layer bearing component in a lifting and sliding manner. The electrolyte mixing tank is fixedly installed on the right side of the electrolytic cell body, and a driving motor is installed on the top of the electrolyte mixing tank. The output shaft of the driving motor is installed with a stirring component through a coupling, and a feeding hopper is embedded and installed on the top of the electrolyte mixing tank.

[0007] Further, the copper layer bearing component includes a bearing frame, T-shaped sliding bars, connecting plates, and partition filter plates. T-shaped sliding bars are symmetrically installed on the front and back sides of the bearing frame, connecting plates are fixedly connected to the front and back sides of the bearing frame, and partition filter plates are fixedly installed at equal distances on the inner surface of the bearing frame.

[0008] Furthermore, the outer side of the bearing frame is fixedly connected to the inner side of the T-shaped sliding bar, and the bearing frame and the electrolytic cell body form a sliding structure through the T-shaped sliding bar.

[0009] Furthermore, the bottom of the connecting plate is fixedly connected to the top of the extending end of the electric telescopic rod, and the bottom of the fixed end of the electric telescopic rod is fixedly connected to the top of the bearing plate.

[0010] Furthermore, the stirring assembly includes a connecting shaft, a connecting sleeve, a mounting seat, stirring blades, and through holes. The connecting sleeves are equidistantly installed on the outer surface of the connecting shaft. The mounting seats are fixedly installed on the outer surface of the connecting sleeve at equal intervals in a ring shape. The other end of the mounting seat is fixedly connected to the stirring blade. At the same time, through holes are equidistantly arranged in an array inside the stirring blade.

[0011] Furthermore, the inside of the connecting sleeve is fixedly connected to the outer surface of the connecting shaft, the outer surface of the connecting sleeve is fixedly connected to the end of the mounting seat, and the mounting seat and the connecting shaft form a fixed structure through the connecting sleeve.

[0012] Furthermore, the end of the mounting seat is fixedly connected to the end of the stirring blade, the other end of the mounting seat is fixedly connected to the outer surface of the connecting sleeve, and the stirring blade and the connecting sleeve form a fixed structure through the mounting seat.

[0013] The present utility model provides a device for controlling the uniformity of the copper layer of a flexible FPC circuit board, having the following beneficial effects:

[0014] 1. By setting the electric telescopic rod in the present utility model, when the electric telescopic rod operates, it can drive the copper layer bearing assembly to stably move up and down along the inner surface of the electrolytic cell body. When the staff needs to replace the copper layer, they only need to turn on the electric telescopic rod, and the copper layer bearing assembly can drive the copper layer to be completely separated from the electrolyte in the electrolytic cell body, thus avoiding the situation that the staff's hands directly contact the electrolyte during the replacement of the copper layer, which may pose a safety hazard during the copper layer replacement work. And because the copper layer bearing assembly can automatically move up and down, it also makes it more convenient for the staff to replace the copper layer.

[0015] 2. By providing a connecting shaft, the driving motor can drive the connecting shaft to rotate inside the electrolyte mixing tank during operation. Then, through the mutual cooperation of the connecting sleeve and the mounting seat, the through hole can rotate synchronously when the connecting shaft rotates, so as to quickly mix and stir the electrolyte raw materials in the electrolyte mixing tank, thus avoiding the situation that the overall processing efficiency of the staff is interfered because it takes a long time for the staff to perform the mixing operation when preparing the electrolyte. And by providing the through hole, the stirring effect of the stirring blade is better when mixing and stirring the electrolyte, so as to accelerate the mixing speed of the electrolyte. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a front three-dimensional structural schematic diagram of a device for controlling the copper layer uniformity of a flexible FPC circuit board according to the present invention;

[0017] Figure 2 is a three-dimensional structural schematic diagram of a carrier frame - partition filter plate of a device for controlling the copper layer uniformity of a flexible FPC circuit board according to the present invention;

[0018] Figure 3 is a three-dimensional structural schematic diagram of a connecting shaft - connecting sleeve of a device for controlling the copper layer uniformity of a flexible FPC circuit board according to the present invention.

[0019] In the figure: 1, electrolytic cell body; 2, bearing plate; 3, electric telescopic rod; 4, copper layer bearing assembly; 41, carrier frame; 42, T-shaped slide bar; 43, connecting plate; 44, partition filter plate; 5, electrolyte mixing tank; 6, driving motor; 7, stirring assembly; 71, connecting shaft; 72, connecting sleeve; 73, mounting seat; 74, stirring blade; 75, through hole; 8, feeding hopper. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The following further describes in detail the embodiments of the present invention in conjunction with the drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0021] Such as Figure 1 and Figure 2As shown in the figure, a device for controlling the uniformity of the copper layer of a flexible FPC circuit board includes an electrolytic cell body 1 and an electrolyte mixing tank 5. Bearing plates 2 are symmetrically installed on the front and rear sides of the electrolytic cell body 1, and an electric telescopic rod 3 is installed on the top of the bearing plate 2. Moreover, a copper layer bearing assembly 4 is connected to the inner surface of the electrolytic cell body 1 in a lifting and sliding manner. The copper layer bearing assembly 4 includes a bearing frame 41, T-shaped sliding bars 42, connecting plates 43, and partition filter plates 44. T-shaped sliding bars 42 are symmetrically installed on the front and rear sides of the bearing frame 41. The outer side of the bearing frame 41 is fixedly connected to the inner side of the T-shaped sliding bars 42. And the bearing frame 41 forms a sliding structure with the electrolytic cell body 1 through the T-shaped sliding bars 42. By setting the bearing frame 41 and the electrolytic cell body 1 into a sliding structure, when the bearing frame 41 moves up and down along the inner surface of the electrolytic cell body 1, it is more smooth and stable. Moreover, connecting plates 43 are fixedly connected to the front and rear sides of the bearing frame 41. The bottom of the connecting plate 43 is fixedly connected to the top of the extending end of the electric telescopic rod 3. And the bottom of the fixed end of the electric telescopic rod 3 is fixedly connected to the top of the bearing plate 2. Furthermore, partition filter plates 44 are fixedly installed at equal distances on the inner surface of the bearing frame 41.

[0022] As Figure 1 and Figure 3 shown in the figure, the electrolyte mixing tank 5 is fixedly installed on the right side of the electrolytic cell body 1. A driving motor 6 is installed on the top of the electrolyte mixing tank 5. And a stirring assembly 7 is installed on the output shaft of the driving motor 6 through a coupling. The stirring assembly 7 includes a connecting shaft 71, connecting sleeves 72, mounting seats 73, stirring blades 74, and through holes 75. Connecting sleeves 72 are installed at equal distances on the outer surface of the connecting shaft 71. And mounting seats 73 are fixedly installed at equal distances in a ring shape on the outer surface of the connecting sleeves 72. The inside of the connecting sleeve 72 is fixedly connected to the outer surface of the connecting shaft 71. And the outer surface of the connecting sleeve 72 is fixedly connected to the end of the mounting seat 73. And the mounting seat 73 forms a fixed structure with the connecting shaft 71 through the connecting sleeve 72. By setting the mounting seat 73 and the connecting shaft 71 into a fixed structure, when the connecting shaft 71 drives the mounting seat 73 to rotate, the mounting seat 73 will not become loose. Moreover, a stirring blade 74 is fixedly connected to the other end of the mounting seat 73. The end of the mounting seat 73 is fixedly connected to the end of the stirring blade 74. And the other end of the mounting seat 73 is fixedly connected to the outer surface of the connecting sleeve 72. And the stirring blade 74 forms a fixed structure with the connecting sleeve 72 through the mounting seat 73. By setting the stirring blade 74 and the connecting sleeve 72 into a fixed structure, when the stirring blade 74 mixes and stirs the electrolyte, it will not become loose. At the same time, through holes 75 are arranged in an array at equal distances inside the stirring blade 74. Moreover, a feeding hopper 8 is embedded and installed on the top of the electrolyte mixing tank 5.

[0023] In summary, for this device for controlling the uniformity of the copper layer of a flexible FPC circuit board, first, according to Figures 1 to 3In the structure shown, the staff pour the electrolyte preparation raw materials and clean water into the interior of the electrolyte mixing tank 5 in sequence through the feeding hopper 8. Then, the staff turn on the driving motor 6 through the controller. When the driving motor 6 starts to operate, it drives the connecting shaft 71 to rotate inside the electrolyte mixing tank 5. At this time, through the connection of the connecting sleeve 72 and the mounting seat 73, the stirring blades 74 mix and stir the electrolyte inside the electrolyte mixing tank 5, and through the cooperation of the through holes 75, the stirring effect of the stirring blades 74 is better. When the electrolyte in the electrolyte mixing tank 5 is prepared, the staff open the control valve in the material guiding pipe, so that the electrolyte in the electrolyte mixing tank 5 is automatically transported into the interior of the electrolytic cell body 1. Then, the staff place the copper layer to be controlled for uniformity into the interior of the bearing frame 41. At this time, the copper layer is separated through the cooperation of the partition filter plate 44. Then, the staff turn on the electric telescopic rod 3 at the top of the bearing plate 2 through the controller. When the electric telescopic rod 3 starts to operate, through the sliding of the T-shaped slide bar 42 and the connection of the connecting plate 43, the bearing frame 41 drives the copper layer into the interior of the electrolytic cell body 1. Then, the staff turn on the electrode plate in the electrolytic cell body 1 through the controller, so that the electrolyte in the electrolytic cell body 1 controls the deposition of the uniformity of the copper layer.

[0024] The embodiments of the present invention are given for purposes of illustration and description, and are not exhaustive or limit the present invention to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are chosen and described in order to better explain the principles of the present invention and its practical applications, and to enable those of ordinary skill in the art to understand the present invention so as to design various embodiments with various modifications suitable for specific purposes.

Claims

1. A flexible FPC circuit board copper layer uniformity control device, comprising an electrolytic cell body (1) and an electrolyte mixing box (5), characterized in that: The electrolytic cell body (1) is symmetrically provided with support plates (2) on both sides thereof, and an electric telescopic rod (3) is provided on the top of the support plates (2). The inner surface of the electrolytic cell body (1) is connected to a copper layer support component (4) in a lifting and sliding manner. The electrolyte mixing box (5) is fixedly provided on the right side of the electrolytic cell body (1), and a driving motor (6) is provided on the top of the electrolyte mixing box (5). A stirring component (7) is provided on the output shaft of the driving motor (6) via a coupling. An upper hopper (8) is embedded and provided on the top of the electrolyte mixing box (5).

2. A flexible FPC circuit board copper layer uniformity control device according to claim 1, characterized in that: The copper layer bearing assembly (4) comprises a bearing frame (41), a T-shaped slide bar (42), a connecting plate (43) and a partition filter plate (44), wherein the T-shaped slide bars (42) are symmetrically mounted on the front and rear sides of the bearing frame (41), the connecting plate (43) is fixedly connected to the front and rear sides of the bearing frame (41), and the partition filter plate (44) is fixedly mounted at an equal distance on the inner surface of the bearing frame (41).

3. A flexible FPC circuit board copper layer uniformity control device according to claim 2, characterized in that: The outer side of the supporting frame (41) is fixedly connected to the inner side of the T-shaped sliding bar (42), and the supporting frame (41) forms a sliding structure with the electrolytic cell body (1) via the T-shaped sliding bar (42).

4. A flexible FPC circuit board copper layer uniformity control device according to claim 2, characterized in that: The bottom of the connecting plate (43) is fixedly connected to the top of the extended end of the electric telescopic rod (3), and the bottom of the fixed end of the electric telescopic rod (3) is fixedly connected to the top of the bearing plate (2).

5. A flexible FPC circuit board copper layer uniformity control device according to claim 1, characterized in that: The stirring assembly (7) comprises a connecting shaft (71), a connecting sleeve (72), a mounting seat (73), a stirring blade (74) and a through hole (75), wherein the connecting sleeve (72) is mounted at equal distances on the outer surface of the connecting shaft (71), and the mounting seat (73) is fixedly mounted at equal distances on the outer surface of the connecting sleeve (72) in an annular shape, and the other end of the mounting seat (73) is fixedly connected to the stirring blade (74), and the interior of the stirring blade (74) is provided with through holes (75) in an array-like manner and at equal distances.

6. A flexible FPC circuit board copper layer uniformity control device according to claim 5, characterized in that: The interior of the connecting sleeve (72) is fixedly connected to the outer surface of the connecting shaft (71), and the outer surface of the connecting sleeve (72) is fixedly connected to the end of the mounting seat (73), and the mounting seat (73) forms a fixed structure with the connecting shaft (71) through the connecting sleeve (72).

7. A flexible FPC circuit board copper layer uniformity control device according to claim 5, characterized in that: The end of the mounting seat (73) is fixedly connected to the end of the stirring blade (74), and the other end of the mounting seat (73) is fixedly connected to the outer surface of the connecting sleeve (72), and the stirring blade (74) forms a fixed structure through the mounting seat (73) and the connecting sleeve (72).

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