Wafer clamping mechanism suitable for semiconductor

Abstract

The utility model relates to the technical field of wafer clamping in the semiconductor industry, in particular to a wafer clamping mechanism suitable for semiconductors, which comprises a clamping base and a clamping head, the clamping head is connected onto the clamping base through a rotating mechanism, the clamping head is composed of a metal plate and a flexible unit, the flexible unit is arranged at the bottom of one end of the metal plate, and the metal plate is connected with the flexible unit. A clamping head threaded hole is formed in the other end of the metal plate, a base threaded hole consistent with the threaded hole in the metal plate is formed in the clamping base, the rotating mechanism comprises a rotating shaft, and the rotating shaft is provided with external threads matched with the clamping head threaded hole and the base threaded hole; after a wafer is placed on the clamping base, the flexible unit of the clamping head is rotated to the position above the wafer along the rotating shaft, and the rotating shaft is tightened so that the flexible unit can make elastic contact with the wafer. According to the clamping mechanism, the rotary clamping mechanism is designed, the clamping contact head is subjected to material optimization, and a manual operation mode is adopted, so that the clamping mechanism is ensured to be stable and reliable, and the problem of wafer damage is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer clamping in the semiconductor industry, and particularly relates to a wafer clamping mechanism suitable for semiconductors. Background Art

[0002] In the semiconductor industry, parts in contact with wafers are crucial, and their reliability, stability, corrosion resistance, scratch-free property, and ease of operation have a great impact on the efficiency and yield of the entire manufacturing process. In current equipment, the wafer clamping mechanism is fixed by set screws or limited by positioning pins. Such clamping mechanisms are prone to damaging the wafer surface, require high precision from operators, and have an impact on the process quality and work efficiency.

[0003] Therefore, in view of the above problems, designing a wafer clamping mechanism suitable for semiconductors, which can achieve stable and reliable clamping of wafers, avoid damage to the wafer surface, and improve the process quality and efficiency, has become an urgent problem to be solved in the semiconductor industry. Summary of the Utility Model

[0004] In order to solve the above problems, the utility model provides a wafer clamping mechanism suitable for semiconductors. By designing the clamping mechanism, a rotary clamping mechanism is designed, and the material of the clamping contact head is optimized. By adopting a manual operation method, the clamping mechanism is ensured to be stable and reliable, and the problem of wafer damage is avoided.

[0005] The technical solution of the utility model is as follows:

[0006] A wafer clamping mechanism suitable for semiconductors includes a clamping base and a clamping head. The clamping head is connected to the clamping base through a rotating mechanism. The clamping head is composed of a metal plate and a flexible unit. The flexible unit is arranged at the bottom of one end of the metal plate. A clamping head threaded hole is arranged at the other end of the metal plate. A base threaded hole consistent with the threaded hole on the metal plate is arranged on the clamping base. The rotating mechanism includes a rotating shaft, and the rotating shaft is provided with external threads that cooperate with the clamping head threaded hole and the base threaded hole.

[0007] After the wafer is placed on the clamping base, the flexible unit of the clamping head is rotated along the rotating shaft 4 above the wafer, and the rotating shaft is tightened so that the flexible unit is in elastic contact with the wafer.

[0008] A hole with a clearance fit with the rotating shaft is arranged above the clamping head threaded hole.

[0009] The flexible unit is made of rubber material.

[0010] The flexible unit is firmly bonded to the metal plate by vulcanization.

[0011] The surface of the clamping base is subjected to hard anodizing treatment.

[0012] The film thickness of the hard anodic oxidation treatment on the surface of the clamping base is 50 μm.

[0013] The beneficial effects of the present utility model are as follows:

[0014] 1. A wafer clamping mechanism applicable to semiconductors disclosed by the present utility model. By selecting flexible unit materials, the clamping process of this wafer clamping mechanism applicable to semiconductors is ensured to be stable and reliable.

[0015] 2. A wafer clamping mechanism applicable to semiconductors disclosed by the present utility model. This wafer clamping mechanism applicable to semiconductors uses a rotary clamping mechanism that rotates first and then locks, and the operation is simple and convenient.

[0016] 3. A wafer clamping mechanism applicable to semiconductors disclosed by the present utility model. This wafer clamping mechanism applicable to semiconductors reduces the requirements for the skills of operators, avoids damage to the wafer surface, and directly improves the yield rate and overall efficiency of the manufacturing process. Description of the Drawings

[0017] By reading the detailed description of the preferred embodiments below, the solutions and advantages of the present application will become clear and understandable to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present utility model.

[0018] In the drawings:

[0019] Figure 1 is a schematic three-dimensional structure diagram of a wafer clamping mechanism applicable to semiconductors according to an embodiment of the present utility model;

[0020] Figure 2 is a schematic structure diagram of the rotating mechanism of a wafer clamping mechanism applicable to semiconductors according to an embodiment of the present utility model before rotation;

[0021] Figure 3 is a schematic structure diagram of the rotating mechanism of a wafer clamping mechanism applicable to semiconductors according to an embodiment of the present utility model after rotation;

[0022] Figure 4 is a schematic structure diagram of the clamping head of a wafer clamping mechanism applicable to semiconductors according to an embodiment of the present utility model;

[0023] The components represented by the reference numerals in the drawings are:

[0024] The present utility model: 1. Clamping base, 2. Rotating mechanism, 3. Clamping head, 31. Metal plate, 32. Flexible unit, 4. Rotating shaft. Detailed Embodiments

[0025] As Figure 1As shown in the figure, the wafer clamping mechanism applicable to semiconductors includes a clamping base 1 and a clamping head 3, and the clamping head 3 is connected to the clamping base 1 through a rotating mechanism 2.

[0026] The clamping base 1 is of a disc structure, and the clamping head 3 is arranged at the circumferential position of the clamping base 1.

[0027] The clamping head 3 is composed of a metal plate 31 and a flexible unit 32. The flexible unit 32 is arranged at the bottom of one end of the metal plate 31. A clamping head threaded hole is arranged at the other end of the metal plate 31, and a base threaded hole consistent with the threaded hole on the metal plate 31 is arranged on the clamping base 1. The rotating mechanism 2 includes a rotating shaft 4, and the rotating shaft 4 is provided with an external thread that matches the clamping head threaded hole and the base threaded hole.

[0028] After the wafer is placed on the clamping base 1, the flexible unit 32 of the clamping head 3 is rotated along the rotating shaft 4 to above the wafer, and the rotating shaft is tightened so that the flexible unit 32 is in elastic contact with the wafer.

[0029] A hole with a clearance fit with the rotating shaft 4 is arranged above the clamping head threaded hole.

[0030] The flexible unit 32 is made of rubber material.

[0031] The flexible unit 32 is firmly bonded to the metal plate 31 by vulcanization.

[0032] The surface of the clamping base 1 is subjected to hard anodic oxidation treatment.

[0033] The film thickness of the hard anodic oxidation treatment on the surface of the clamping base 1 is 50μm.

[0034] In a specific embodiment:

[0035] The clamping base 1 provides a support mechanism for the wafer; before the wafer is placed, the rotating mechanism is as Figure 2 shown. After the wafer is placed, the rotating mechanism rotates 180° along the rotating shaft 4, as Figure 3 shown. At the same time, the rotating shaft is threadedly connected to the clamping base. During the process of thread tightening, the flexible unit of the clamping head is in elastic contact with the wafer to ensure the fixation of the wafer.

[0036] The rotating mechanism is placed at the Figure 2 shown position, and the wafer is placed on the clamping base. The good contact between the wafer and the clamping base is ensured by the high flatness requirement of the base. The surface of the clamping base is subjected to hard anodic oxidation treatment with a film thickness of 50μm. Hard anodic oxidation can not only enhance the surface hardness of the clamping base and its wear resistance, but also reduce the influence of gas in the process on the clamping base to a certain extent.

[0037] After the wafer is placed, it rotates along the rotation axis 4 by an angle of 180°. The axial surface of the chuck in contact with the rotation axis is designed in a two-stage manner. The upper end is designed with a clearance fit, and the lower end is designed in a threaded form to prevent the rotation axis from falling out of the chuck. The clamping base is designed with the same thread size as the chuck to ensure proper fit of the rotation axis.

[0038] When the rotation axis is locked downward along the thread, the flexible unit of the chuck gradually contacts the wafer. By calculating the force required for the flexible unit to fix the wafer, a suitable flexible material is selected to ensure reliable wafer fixation.

[0039] The flexible material of the chuck and the metal material of the chuck are integrally formed. The metal and rubber materials are firmly bonded by vulcanization. The flexible material is a rubber material suitable for the semiconductor process environment. This material has the characteristic of low particles in the process environment, which can not only ensure good wafer fixation but also ensure no pollution source is generated during the process.

[0040] The wafer clamping mechanism suitable for semiconductors designs the clamping mechanism, designs a rotating clamping mechanism, optimizes the material of the clamping contact head, and uses a manual operation method to ensure the stability and reliability of the clamping mechanism, avoiding the problem of wafer damage.

Claims

1. A wafer clamping mechanism suitable for semiconductors, characterized in that: The clamping device comprises a clamping base (1) and a clamping head (3), wherein the clamping head (3) is connected to the clamping base (1) via a rotating mechanism (2), the clamping head (3) is composed of a metal plate (31) and a flexible unit (32), the flexible unit (32) is arranged at the bottom of one end of the metal plate (31), a clamping head threaded hole is arranged at the other end of the metal plate (31), a base threaded hole that is consistent with the threaded hole on the metal plate (31) is arranged on the clamping base (1), and the rotating mechanism (2) comprises a rotating shaft (4), and the rotating shaft (4) is provided with an external thread that matches the clamping head threaded hole and the base threaded hole; After the wafer is placed on the clamping base (1), the flexible unit (32) of the clamping head (3) is rotated along the rotating shaft 4 to above the wafer, and the rotating shaft is tightened so that the flexible unit (32) and the wafer are in elastic contact.

2. A wafer clamping mechanism suitable for semiconductors according to claim 1, characterized in that: A hole that is clearance-matched with the rotating shaft (4) is provided above the threaded hole of the clamping head.

3. A wafer clamping mechanism suitable for semiconductors according to claim 1, characterized in that: The flexible unit (32) is made of rubber material.

4. A wafer clamping mechanism suitable for semiconductors according to claim 3, characterized in that: The flexible unit (32) is firmly bonded to the metal plate (31) by vulcanization.

5. The wafer clamping mechanism suitable for semiconductors according to claim 1, characterized in that: The surface of the clamping base (1) is hard anodized.

6. A wafer clamping mechanism suitable for semiconductors according to claim 5, characterized in that: The surface of the clamping base (1) is hard anodized and has a film thickness of 50 μm.

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