Resource board card and board-to-board wireless communication system

Abstract

The utility model provides a resource board card and a board-to-board wireless communication system. The resource board card comprises a board card body, a processor and a millimeter wave communication module. The millimeter wave communication module is connected with the processor; the millimeter wave communication module is arranged on the board card body. The two millimeter wave communication modules are respectively a millimeter wave communication module A and a millimeter wave communication module B; the millimeter wave communication module A is arranged on one board surface of the board card body, and the millimeter wave communication module B is arranged on the other board surface of the board card body. According to the utility model, the communication boards can be connected in a millimeter wave wireless mode, so that the omnibearing practicability of the resource board card is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of resource boards, specifically to resource boards and board-to-board wireless communication systems. Background Art

[0002] Resource boards are used to provide functions such as data signal acquisition, excitation signal drive, and high-precision power supply.

[0003] Currently, in the applications of signal acquisition systems or semiconductor test systems, the resource board and the communication card board are generally connected by physically plugging the PCIE interface. However, this connection method has some problems: on the one hand, it is easy to cause signal loss; on the other hand, with the increase of the number of pluggings and unplugging, the physical interface will be worn, and non-standard plugging and unplugging may cause interface damage, such as broken pins or bent pins.

[0004] Currently, non-contact communication between boards can also be achieved between resource boards based on near-field communication (NFC). However, due to the limitation of the transmission distance, the transmission frequency of signals is usually low, which cannot meet the transmission requirements of high frequency and high bandwidth. In some improved technologies, guided NFC communication is used. For example, Texas Instruments has proposed a conical coaxial emission structure, which can meet the design requirements of different frequencies by correspondingly adjusting the physical size of the field limiter. However, this undoubtedly increases the design difficulty and makes the structure of the resource board more complex.

[0005] Therefore, there is an urgent need for a new communication connection method between resource boards to solve the above problems. Summary of the Utility Model

[0006] The technical problem to be solved by the utility model is: to provide a resource board and a board-to-board wireless communication system, in which the boards can be connected by millimeter-wave wireless means to improve the all-round practicability of the resource board.

[0007] To solve the above technical problem, the first technical solution adopted by the utility model is:

[0008] A resource board, comprising a board body, a processor, and a millimeter-wave communication module; the millimeter-wave communication module is connected to the processor; the millimeter-wave communication module is arranged on the board body.

[0009] Optionally, the number of the millimeter-wave communication modules is two, namely millimeter-wave communication module A and millimeter-wave communication module B; the millimeter-wave communication module A is arranged on one board surface of the board body, and the millimeter-wave communication module B is arranged on the other board surface of the board body.

[0010] Optionally, the millimeter-wave communication module A and the millimeter-wave communication module B are arranged staggeredly on the board surface of the board body.

[0011] Optionally, the millimeter-wave communication module A and the millimeter-wave communication module B are arranged overlappingly on the board surface of the board body.

[0012] Optionally, the millimeter-wave communication module is provided with a millimeter-wave transmitting unit and a millimeter-wave receiving unit; the millimeter-wave transmitting unit and the millimeter-wave receiving unit are respectively connected to the processor.

[0013] Optionally, it further includes a codec; the millimeter-wave communication module is connected to the processor via the codec.

[0014] Optionally, the millimeter-wave communication module is a millimeter-wave communication chip.

[0015] The second technical solution adopted by the present utility model is:

[0016] A board-to-board wireless communication system includes at least two of the above-mentioned resource boards; wireless communication connection is performed between the at least two resource boards based on the millimeter-wave communication module.

[0017] Optionally, it further includes a power supply board; the power supply board is connected to the at least two resource boards.

[0018] Optionally, it further includes a data board; a millimeter-wave communication module is provided on the data board; wireless communication connection is performed between the data board and the at least two resource boards based on the millimeter-wave communication module.

[0019] The beneficial effects of the present utility model are as follows: The resource board provided by the present utility model can realize wireless communication transmission between boards based on the millimeter-wave communication module; in particular, millimeter-wave communication modules can be respectively arranged on the front and back sides of the resource board to realize two-way full-duplex wireless communication of the resource board. The present utility model can fundamentally solve the problems caused by the existing resource boards using wired communication connection or near-field communication (NFC) wireless communication method, not only can improve the stability and fidelity of data transmission, but also improve the service life of the communication board; moreover, it can simplify the structure of the communication board and reduce the design difficulty. In addition, it can easily achieve impedance matching of signals and shorten the signal transmission path, so as to have a higher transmission frequency; furthermore, the resource boards based on millimeter-wave connection can also be compatible with a larger board installation position tolerance, thus showing strong mechanical vibration tolerance. In summary, the resource board provided by the present utility model can improve the practicality in all aspects. Description of the Drawings

[0020] Figure 1Schematic diagram of the structure of a resource board provided for the specific implementation mode of the present utility model;

[0021] Figure 2 For Figure 1 Schematic side view structure diagram of the resource board;

[0022] Figure 3 Schematic diagram of the structure of a resource board provided for another specific implementation mode of the present utility model;

[0023] Figure 4 For Figure 3 Schematic side view structure diagram of the resource board;

[0024] Figure 5 Schematic diagram of communication interaction between resource boards in the embodiment of the present utility model;

[0025] Figure 6 Schematic diagram of the installation between resource boards in the embodiment of the present utility model;

[0026] Figure 7 Schematic diagram of the system framework of the board-to-board wireless communication system provided in the embodiment of the present utility model.

[0027] Label description:

[0028] 1. Board card body; 2. Resource board; 3. Millimeter-wave communication module; 4. Daisy-chain substrate;

[0029] 31. Millimeter-wave communication module A; 32. Millimeter-wave communication module B. Specific implementation mode

[0030] To describe in detail the technical content, achieved purpose and effect of the present utility model, the following is described in conjunction with the implementation mode and accompanied by the drawings.

[0031] The present utility model provides a resource board, including a board card body, a processor and a millimeter-wave communication module; the millimeter-wave communication module is connected to the processor; the millimeter-wave communication module is arranged on the board card body.

[0032] Furthermore, the number of the millimeter-wave communication modules is two, namely a millimeter-wave communication module A and a millimeter-wave communication module B; the millimeter-wave communication module A is arranged on one of the board surfaces of the board card body, and the millimeter-wave communication module B is arranged on the other board surface of the board card body.

[0033] It can be seen from the above description that the two millimeter-wave communication modules are respectively arranged on the two surfaces of the resource board to realize the millimeter-wave communication function in the orientation of each board surface. This design is reasonable, conforms to the daily installation and use habits of the resource board, and can realize two-way wireless communication transmission.

[0034] Further, the millimeter-wave communication module A and the millimeter-wave communication module B are arranged staggeredly on the board surface of the board body.

[0035] Further, the millimeter-wave communication module A and the millimeter-wave communication module B are arranged overlappingly on the board surface of the board body.

[0036] As can be seen from the above description, the specific layout design of the two millimeter-wave communication modules on the board surface can be a staggered arrangement or an overlapping arrangement, which is specifically configured according to requirements.

[0037] Further, the millimeter-wave communication module is provided with a millimeter-wave transmitting unit and a millimeter-wave receiving unit; the millimeter-wave transmitting unit and the millimeter-wave receiving unit are respectively connected to the processor.

[0038] As can be seen from the above description, each millimeter-wave communication module is provided with a millimeter-wave transmitting unit and a millimeter-wave receiving unit at the same time, so as to realize the two-way transmission of receiving and sending data simultaneously on one board surface.

[0039] Further, it further includes a codec; the millimeter-wave communication module is connected to the processor via the codec.

[0040] As can be seen from the above description, for the wireless communication transmission based on millimeter waves, it can be realized only by configuring a millimeter-wave communication module and a codec, with a simple structure and low design difficulty.

[0041] Further, the millimeter-wave communication module is a millimeter-wave communication chip.

[0042] As can be seen from the above description, the millimeter-wave communication module is designed in the form of an integrated chip, which can greatly reduce the size of the module and facilitate the layout design of other electrical components / modules on the board body.

[0043] The present utility model further provides a board-to-board wireless communication system, including at least two of the above resource boards; wireless communication connection is performed between the at least two resource boards based on the millimeter-wave communication module.

[0044] As can be seen from the above description, for the board-to-board wireless communication system provided in this embodiment, communication transmission can be performed between every two resource boards based on millimeter waves, that is to say, one resource board can communicate with two adjacent resource boards at the same time.

[0045] Further, it further includes a power supply board; the power supply board is connected to the at least two resource boards.

[0046] As can be seen from the above description, the power supply board provides power for each resource board.

[0047] Further, it further includes a data board; a millimeter-wave communication module is provided on the data board; the data board is wirelessly communicatively connected to the at least two resource boards based on the millimeter-wave communication module.

[0048] As can be seen from the above description, a millimeter-wave communication module is correspondingly configured on the data board, and it also performs wireless communication interaction with the resource board based on millimeter waves, realizing unified system configuration and simultaneously improving data transmission efficiency.

[0049] Please refer to Figures 1 to 4 , the first embodiment of the present utility model is:

[0050] The present utility model provides a resource board, including a board body, a processor, and a millimeter-wave communication module; the millimeter-wave communication module is connected to the processor; the millimeter-wave communication module is provided on the board body.

[0051] In this embodiment, by providing a millimeter-wave communication module on the resource board, wireless communication between resource boards based on millimeter waves is realized. In the signal transmission between boards, using millimeter-wave wireless communication to replace the existing NFC wireless transmission can not only eliminate the waveguide transmission structure of NFC, but also easily achieve impedance matching of signals, while shortening the signal transmission path and supporting higher transmission frequencies; in addition, millimeter-wave connection can also be compatible with larger board installation position tolerances and show strong mechanical vibration tolerance.

[0052] As a preferred specific implementation manner of this embodiment, as Figure 1 shown, the number of the millimeter-wave communication modules 3 is two, namely a millimeter-wave communication module A31 and a millimeter-wave communication module B32; the millimeter-wave communication module A31 is provided on one of the board surfaces of the board body 1, and the millimeter-wave communication module B32 is provided on the other board surface of the board body 1. That is to say, a millimeter-wave communication module is provided on each of the front and back surfaces of the board body, and the specific setting position is not limited and can be flexibly adjusted according to the internal circuit routing of the board body and other design or scenario requirements.

[0053] Designed in this way, the resource board can be realized to have a two-way (corresponding to the front and back surfaces respectively) wireless communication function. It is particularly suitable for application scenarios where three or more resource boards are arranged side by side, and wireless communication interaction based on millimeter waves can be realized between adjacent two resource boards, such as for transmitting control instructions and returning test data.

[0054] In some feasible specific examples, such as Figure 1 and Figure 2As shown, the millimeter wave communication module A31 and the millimeter wave communication module B32 are staggered on the board surface of the board body 1, that is, staggered back to back. Here, the staggered means that although the millimeter wave communication module A31 and the millimeter wave communication module B32 are respectively arranged on two different board surfaces of the board body 1, there is no overlapping part between the two relative to the plane where the board body 1 is located.

[0055] In some feasible specific examples, the millimeter wave communication module A and the millimeter wave communication module B are arranged overlappingly on the board surface of the board body. Here, the overlapping arrangement can be as follows: Figure 3 and Figure 4 As shown, the millimeter wave communication module A31 and the millimeter wave communication module B32 are completely overlapped relative to the plane where the board body 1 is located, that is, they are arranged back to back; they can also be partially overlapped. The specifics still depend on the specific usage scenario or circuit layout design.

[0056] As a preferred example of the above preferred specific implementation, the millimeter wave communication module A and the millimeter wave communication module B are "staggered" or "overlapped" on the center line of the length direction of the board body. Such a design is more conducive to the resource board to perform wireless communication based on the common and universal side-by-side setting, so that the millimeter wave communication modules of the boards can be aligned as much as possible to ensure tolerance to mechanical vibration deviation and improve communication quality.

[0057] In this embodiment, each millimeter wave communication module provided on the resource board includes a millimeter wave transmitting unit TX and a millimeter wave receiving unit RX; the millimeter wave transmitting unit TX and the millimeter wave receiving unit RX are connected to the processor respectively. It can be seen that the resource board of this embodiment can realize the full-duplex communication function of simultaneous reception and transmission based on one millimeter wave communication module.

[0058] Corresponding to the above preferred specific implementation, since a millimeter wave communication module is provided on both sides of each resource board, it is possible to realize that both sides of the resource board have full-duplex communication function, that is, bidirectional full-duplex communication function.

[0059] As a preferred specific implementation of this embodiment, the millimeter wave communication modules on the resource board are all millimeter wave communication chips. That is, each millimeter wave communication module is integrated with a set of RX / TX antennas in the form of chip integration. By integrating the antenna inside the chip, the size of the millimeter wave communication module can be made smaller, and then the size of the module used to realize the wireless communication function on the resource board can be made smaller, which is more conducive to integration; further, it can also free up more space for the board body on the resource board, making it more convenient for the resource board to design and integrate other electrical components / modules required according to different functional requirements, so as to achieve functional improvement.

[0060] As a preferred example of the above preferred specific embodiments, the millimeter-wave communication chip has front and back sides. A set of RX / TX antennas are integrated on the front side of the chip, which are responsible for transmitting / receiving millimeter-wave signals; on the back side, there are chip pins PAD, which are responsible for being fixed on the board body and realizing electrical connection with other components on the board body.

[0061] In the resource board of this embodiment, there is also a codec, and the millimeter-wave communication module is connected to the processor via the codec. The codec is used to encode the signals to be sent by the millimeter-wave communication module and decode the signals received by the millimeter-wave communication module. One resource board is correspondingly provided with one codec. Corresponding to the above preferred specific embodiments, millimeter-wave communication module A and millimeter-wave communication module B are respectively connected to the processor via the codec.

[0062] Embodiment 2

[0063] Please refer to Figures 5 to 6 , this embodiment provides a board-to-board wireless communication system based on Embodiment 1. As Figure 5 shown, the board-to-board wireless communication system described in this embodiment includes at least two resource boards 2 of Embodiment 1; wireless communication connection is performed between the at least two resource boards 2 based on the millimeter-wave communication module 3.

[0064] The board-to-board wireless communication system provided in this embodiment can be applied to the following application scenarios: signal acquisition systems, semiconductor test systems, etc.

[0065] In addition, the number of communication boards configured in the board-to-board wireless communication system provided in this embodiment is determined according to the specific requirements of application resources.

[0066] If only two resource boards need to be equipped, then a resource board with only one millimeter-wave communication module on each resource board can be selected to meet the board-to-board wireless communication requirements, and the simplest configuration can achieve the required requirements.

[0067] If more than three resource boards need to be equipped, then a resource board with one millimeter-wave communication module configured on each of the front and back sides of each resource board is selected. That is, the resource board configuration described in the preferred specific embodiment of Embodiment 1 can be selected.

[0068] One feasible installation and use method corresponding to the above-mentioned configuration of more than three resource boards is as Figure 6 shown. It uses a daisy-chain substrate 4 as the insertion base plate of the resource board. More than three resource boards 2 are inserted in the daisy-chain substrate 4 side by side and aligned, and the design and reuse are very convenient. Corresponding to Figure 6 the communication interaction schematic diagram between the resource boards 2 of the installation and use method is as Figure 5As shown in Figure 5 and Figure 6 shown, preferably for two opposite resource boards, the millimeter-wave communication modules thereof also correspond to each other (are aligned) as much as possible, which can ensure the maximum tolerance for mechanical vibration deviation.

[0069] In some specific embodiments of this embodiment, as Figure 7 shown, the board-to-board wireless communication system further includes a power supply board, and the power supply board is respectively connected to each resource board ( Figure 7 as shown in the figure including multiple resource boards from card 1 to card N) to provide energy for each resource board separately. Preferably, an isolated power supply is further provided on the board body of each resource board; the power supply board is connected to the electrical components through the isolated power supply of each resource board.

[0070] In some specific embodiments of this embodiment, as Figure 7 shown, the board-to-board wireless communication system further includes a data board; a millimeter-wave communication module is provided on the data board; the data board and one of the resource boards are wirelessly communication-connected based on the millimeter-wave communication module. The data board mainly acts as a central processing unit, responsible for sending relevant control instructions to the resource boards and processing the data returned by the resource boards.

[0071] In some specific embodiments of this embodiment, as Figure 7 shown, an external interface is further provided on the board body of each resource board, and the external interface is connected to a processor for providing an external communication function.

[0072] The above are only the embodiments of the present invention, and thus do not limit the patent scope of the present invention. Any equivalent transformation made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in the related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A resource board, characterized in that: It includes a board body, a processor and a millimeter wave communication module; the millimeter wave communication module is connected to the processor; the millimeter wave communication module is arranged on the board body; There are two millimeter wave communication modules, namely millimeter wave communication module A and millimeter wave communication module B; the millimeter wave communication module A is arranged on one of the board surfaces of the board body, and the millimeter wave communication module B is arranged on the other board surface of the board body.

2. A resource board as claimed in claim 1, characterized in that: The millimeter wave communication module A and the millimeter wave communication module B are staggered on the board surface of the board body.

3. A resource board as claimed in claim 1, characterized in that: The millimeter wave communication module A and the millimeter wave communication module B are arranged overlappingly on the board surface of the board body.

4. A resource board as claimed in claim 1, characterized in that: The millimeter wave communication module is provided with a millimeter wave transmitting unit and a millimeter wave receiving unit; the millimeter wave transmitting unit and the millimeter wave receiving unit are respectively connected to the processor.

5. A resource board as claimed in claim 1, characterized in that: It also includes a codec; the millimeter wave communication module is connected to the processor via the codec.

6. A resource board as claimed in claim 1, characterized in that: The millimeter wave communication module is a millimeter wave communication chip.

7. A board-to-board wireless communication system, characterized in that: It comprises at least two resource boards as described in any one of claims 1 to 6; the at least two resource boards are wirelessly connected based on a millimeter wave communication module.

8. The board-to-board wireless communication system according to claim 7, characterized in that: It also includes a power board card; the power board card is connected to the at least two resource boards.

9. The board-to-board wireless communication system according to claim 7, characterized in that: It also includes a data board; a millimeter wave communication module is provided on the data board; the data board and the at least two resource boards are wirelessly connected based on their respective millimeter wave communication modules.

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