Liquid-cooled radiator

Abstract

The utility model relates to a liquid-cooled radiator, which is provided with a top cover, an upper cover and a bottom cover. The top cover is a plate body, is provided with an inlet and an outlet, penetrates through the top cover and is used for allowing cooling liquid to flow in and out of the heat exchanger. The upper cover is attached to the top cover and provided with an upper cover groove body, at least one baffle and a plurality of heat dissipation structures. An opening of the upper cover groove body faces the top cover, and the inner space of the upper cover groove body can be communicated with the inlet and the outlet of the top cover. The baffle and the heat dissipation structure extend from the bottom face of the upper cover groove body to the top cover, and one end of the baffle is connected to the side wall of the upper cover. The bottom cover is attached to the upper cover and is provided with a bottom cover groove body and working fluid. An opening of the bottom cover groove body faces the upper cover, and the working fluid is arranged in the bottom cover groove body. Therefore, the upper cover can directly carry out liquid-cooled heat dissipation, the bottom cover does not need to be bonded by using heat-conducting paste, and the thermal resistance is reduced.

Description

Technical Field

[0001] The utility model relates to a radiator, in particular to a liquid-cooled radiator. Background Art

[0002] In modern society, semiconductor components are used in various devices in life. To meet people's needs, high-power electronic components have gradually become the mainstream, such as those used in electric vehicles, high-speed railways, or frequency conversion devices. However, while pursuing speed, high-power electronic components generate a large amount of heat. Therefore, when installing high-power electronic components, a corresponding heat dissipation device is often required to prevent heat from accumulating in the high-power electronic components and affecting their operation.

[0003] Common liquid-cooled heat dissipation devices mostly use a substrate with high thermal conductivity efficiency and are set on high-power electronic components. Several copper columns or fins are arranged on the substrate to increase the contact area with the surrounding environment. Then, heat is taken away from the copper columns or fins by flowing a liquid through the several copper columns or fins to complete heat dissipation.

[0004] In order to quickly dissipate the large amount of heat generated by high-power electronic components in a concentrated manner, the substrate is now mostly changed to a heat pipe. The internal space of the heat pipe can accommodate a working fluid. When the working fluid in the heat pipe undergoes a phase change due to the heat of the high-power electronic components, a large amount of heat is taken away. Then, heat is taken away from the heat pipe by flowing a liquid through several copper columns or fins to complete heat dissipation.

[0005] If one wants to combine the heat pipe and the substrate, thermal grease is mostly set on the heat dissipation surface of the heat pipe, and the substrate is set on the thermal grease. However, the thermal grease still generates a thermal resistance between the heat pipe and the substrate, thereby affecting the heat dissipation of the heat pipe and the substrate.

[0006] In view of this, proposing a better improvement scheme is an urgent problem to be solved in this industry. Summary of the Utility Model

[0007] The utility model provides a liquid-cooled radiator, which is used to solve the problem that when the heat pipe and the substrate are combined, thermal grease is used for bonding, but the thermal grease still generates a thermal resistance between the heat pipe and the substrate, thereby affecting the heat dissipation of the heat pipe and the substrate.

[0008] To achieve the above object, the liquid-cooled radiator proposed by the utility model has:

[0009] A top cover, which is a plate body and has:

[0010] An inlet and an outlet, which penetrate through the top cover;

[0011] An upper cover, which is hermetically attached to the top cover and has:

[0012] An upper cover groove body, with its opening facing the top cover, and the internal space of the upper cover groove body can communicate with the inlet and the outlet;

[0013] At least one baffle, extending from the bottom surface of the upper cover groove body towards the top cover until it can fit against the top cover, and one end is connected to the side wall of the upper cover groove body;

[0014] Several heat dissipation structures, extending from the bottom surface of the upper cover groove body towards the top cover;

[0015] A bottom cover, sealingly fitting against the upper cover, and having:

[0016] A bottom cover groove body, with its opening facing the upper cover;

[0017] A working fluid, arranged in the bottom cover groove body.

[0018] The liquid-cooled radiator as described above, wherein each of the several heat dissipation structures is a cylinder and is evenly dispersed in the upper cover groove body.

[0019] The liquid-cooled radiator as described above, wherein each of the several heat dissipation structures is a fin and is parallel to one of the baffles.

[0020] The liquid-cooled radiator as described above, wherein the bottom cover further has several support columns, extending from the bottom surface of the bottom cover groove body towards the upper cover and fitting against the upper cover.

[0021] The liquid-cooled radiator as described above, wherein the bottom cover further has a channel, passing through one side wall of the bottom cover and used for evacuating the internal space of the bottom cover groove body.

[0022] The liquid-cooled radiator as described above, wherein the upper cover further has a stepped surface, arranged on the side of the upper cover close to the top cover, and the top cover can sealingly fit against the stepped surface, so that the upper cover and the top cover can be connected to form a continuous surface.

[0023] The liquid-cooled radiator as described above, wherein the upper cover further has a protrusion, protruding from the side of the upper cover close to the bottom cover towards the bottom cover, and the protrusion can be engaged in the bottom cover groove body.

[0024] The advantages of the present utility model are that a heat spreader structure is formed by the bottom cover and the bottom surface of the upper cover, and the upper cover can directly perform liquid-cooled heat dissipation without using thermal paste for bonding, reducing the thermal resistance between the heat spreader and the substrate. In addition, the protrusion of the upper cover can be engaged in the bottom cover groove body, and the top cover can fit into the upper cover groove body without using welding or clamping forms for joining, thereby reducing the installation cost of the present utility model. Description of the Drawings

[0025] Figure 1 Isometric view of the first embodiment of the present utility model;

[0026] Figure 2 Exploded view of the first embodiment of the present utility model;

[0027] Figure 3 Another perspective exploded view of the first embodiment of the present utility model;

[0028] Figure 4 Cross-sectional view of the first embodiment of the present utility model;

[0029] Figure 5 For the first embodiment of the present utility model along Figure 4 Cross-sectional view taken along the A-A section line;

[0030] Figure 6 Top view of an upper cover of the first embodiment of the present utility model;

[0031] Figure 7 Top view of an upper cover of the second embodiment of the present utility model. Detailed implementation manners

[0032] The following, in conjunction with the drawings and the preferred embodiments of the present utility model, further elaborates on the technical means adopted by the present utility model to achieve the intended utility model purpose.

[0033] Please refer to Figure 1 . The present utility model proposes a liquid-cooled radiator, which has a top cover 10, an upper cover 20, and a bottom cover 30.

[0034] Please refer to Figure 2 and Figure 3 . The top cover 10 is a plate body and has an inlet 11 and an outlet 12. The inlet 11 and the outlet 12 penetrate through the top cover 10 and are used to allow a coolant to enter and exit the liquid-cooled radiator. The upper cover 20 is hermetically and conformally attached to the top cover 10, and the upper cover 20 has a stepped surface 21, a protrusion 22, an upper cover groove 23, at least one baffle 24, and several heat dissipation structures 25.

[0035] Please refer to Figure 4 and Figure 5。The stepped surface 21 is disposed on the side of the upper cover 20 close to the top cover 10, and the top cover 10 can be hermetically fitted to the stepped surface 21, so that the upper cover 20 and the top cover 10 can be connected to form a continuous surface. In other words, the top cover 10 can be snapped into the upper cover 20. The protrusion 22 protrudes outward from the side of the upper cover 20 away from the top cover 10. The opening of the upper cover groove 23 faces the top cover 10, and the internal space of the upper cover groove 23 can communicate with the inlet 11 and the outlet 12 of the top cover 10, whereby the coolant can enter the internal space of the upper cover groove 23 from the inlet 11 of the top cover 10 and flow out from the outlet 12 of the top cover 10.

[0036] The baffle 24 extends from the bottom surface of the upper cover groove 23 towards the top cover 10 to be able to fit the top cover 10, and one end is connected to the side wall of the upper cover groove 23. Specifically, the baffles 24 are spaced apart from each other and parallel to each other, so that the internal space of the upper cover groove 23 presents an S-shaped winding flow channel, whereby the coolant can uniformly pass through the internal space of the upper cover groove 23. The heat dissipation structure 25 extends from the bottom surface of the upper cover groove 23 towards the top cover 10. Please refer to Figure 6 。In the first embodiment, each heat dissipation structure 25 is a cylinder and is uniformly distributed in the upper cover groove 23. Please refer to Figure 7 。In the second embodiment, each heat dissipation structure 25A is a fin and is parallel to one of the baffles 24. In other embodiments, the shape of the heat dissipation structure 25 is not limited thereto, as long as the heat dissipation structure 25 can increase the area of contact between the coolant and the upper cover 20. In the first and second embodiments, the materials of the heat dissipation structures 25, 25A include copper and aluminum alloy. In other embodiments, the material of the heat dissipation structure 25 is not limited thereto.

[0037] Please refer to Figure 4 and Figure 5 。The bottom cover 30 is hermetically fitted to the upper cover 20 and has a bottom cover groove 31, several support columns 32, a working fluid, and a channel 33. The opening of the bottom cover groove 31 faces the upper cover 20, and in the first and second embodiments, the protrusion 22 of the upper cover 20 can be snapped into the bottom cover groove 31. The support columns 32 extend from the bottom surface of the bottom cover groove 31 towards the upper cover 20 and are fitted to the bottom surface of the upper cover 20. In the first and second embodiments, the support columns 32 are fitted to the protrusion 22 of the upper cover 20. The working fluid is disposed in the bottom cover groove 31. The channel 33 penetrates through one side wall of the bottom cover 30 and is used for evacuating the internal space of the bottom cover groove 31, so that the bottom cover groove 31 can be in a vacuum state. In other embodiments, a capillary structure such as a sintered copper mesh or copper columns can also be laid on the bottom surface of the bottom cover groove 31 to facilitate the condensation of the working fluid, thereby increasing the heat dissipation efficiency of the bottom cover 30.

[0038] The bottom cover 30 of the present utility model can be disposed on the surface of a high-power electronic component. The heat generated after the operation of the high-power electronic component will be transferred from the bottom surface of the bottom cover 30 to the working fluid in the bottom cover groove 31, causing the working fluid to vaporize from liquid to gas. During this process, heat energy will be absorbed and the bottom cover groove 31 will be filled. When the vaporized working fluid contacts the bottom of the relatively cold upper cover 20, it will release heat and condense back to the liquid state for recycling. The heat released during condensation will be transferred through the bottom surface of the upper cover 20 to the heat dissipation structure 25, and finally, it will be cooled by the coolant passing through the heat dissipation structure 25, completing the heat dissipation process of the high-power electronic component.

[0039] The advantages of the present utility model are that a heat pipe structure is formed by the bottom cover 30 and the bottom surface of the upper cover 20, and the upper cover 20 can directly perform liquid cooling without using thermal paste for bonding, reducing the thermal resistance between the heat pipe and the substrate. In addition, the protruding portion 22 of the upper cover 20 can be engaged in the bottom cover groove 31, and the top cover 10 can be fitted in the upper cover groove 23 without using welding or fitting forms for joining, thereby reducing the installation cost of the present utility model.

[0040] The above description is only a preferred embodiment of the present utility model and does not impose any formal limitations on the present utility model. Although the present utility model has been disclosed above with a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art, without departing from the technical solution of the present utility model, can make some changes or modifications to equivalent embodiments by using the disclosed technical content. However, as long as it does not depart from the technical solution of the present utility model, any simple modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present utility model still fall within the scope of the technical solution of the present utility model.

Claims

1. A liquid-cooled radiator, characterized in that: It has: A top cover, which is a plate body and has: an inlet and an outlet extending through the top cover; An upper cover is sealed to the top cover and has: An upper cover tank body, whose opening faces the top cover, and the inner space of the upper cover tank body can be connected with the inlet and the outlet; At least one baffle, which extends from the bottom surface of the upper cover tank body to the top cover to fit the top cover, and one end of which is connected to the side wall of the upper cover tank body; A plurality of heat dissipation structures extending from the bottom surface of the upper cover tank body toward the top cover; A bottom cover is sealed to the upper cover and has: A bottom cover groove, the opening of which faces the upper cover; A working fluid is disposed in the bottom cover tank.

2. The liquid-cooled radiator according to claim 1, characterized in that: Each of the heat dissipation structures is a column and is evenly dispersed in the upper cover tank.

3. The liquid-cooled radiator according to claim 1, characterized in that: Each of the heat dissipation structures is a fin and is parallel to one of the baffles.

4. The liquid-cooled radiator according to any one of claims 1 to 3, characterized in that: The bottom cover also has a plurality of support columns, which extend from the bottom surface of the bottom cover groove body toward the upper cover and are attached to the upper cover.

5. The liquid-cooled radiator according to any one of claims 1 to 3, characterized in that: The bottom cover also has a channel which runs through one of the side walls of the bottom cover and is used to evacuate air from the inner space of the bottom cover tank.

6. The liquid-cooled radiator according to any one of claims 1 to 3, characterized in that: The upper cover also has a step surface, which is arranged on a side of the upper cover close to the top cover, and the top cover can be sealed and attached to the step surface, so that the upper cover and the top cover can be connected to form a continuous surface.

7. The liquid-cooled radiator according to any one of claims 1 to 3, characterized in that: The upper cover also has a protrusion, which protrudes from a surface of the upper cover close to the bottom cover toward the bottom cover, and the protrusion can be engaged in the bottom cover groove.

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