Heat dissipation structure and terminal

Abstract

The utility model relates to a heat radiation structure and a terminal. The heat radiation structure comprises a first plate body, a second plate body and a third plate body. The first plate body comprises a first surface and a second surface which are oppositely arranged in the thickness direction; the first surface is attached to the heating area; the second plate body is located on the side, deviating from the heating area, of the first plate body in the thickness direction, the third surface of the second plate body is opposite to the second surface, a closed cavity is defined by the third surface and the second surface, and the closed cavity is filled with a cooling medium; the third plate body is located on the side, deviating from the first plate body, of the second plate body in the thickness direction, the fourth surface of the second plate body is opposite to the third surface, and an airflow cavity communicated with the outside is defined by the fourth surface and the third plate body; according to the utility model, the local high-temperature heating area is rapidly diffused and equalized in temperature, the phase change process and the fan blast heat dissipation are combined, the heat dissipation efficiency is obviously improved, the terminal can be effectively protected, and the service life is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation structure and a terminal. Background Art

[0002] The heating problem of consumer electronic terminals has become increasingly prominent as products become smarter and usage scenarios become more complicated, becoming one of the key factors affecting device performance and user experience. The existing heat dissipation structure is concentrated in the heat-generating area to achieve heat dissipation after uniform temperature over a large area. Especially in heat dissipation scenarios with narrow spaces such as consumer electronic terminals, the existing structure has limited heat dissipation capacity due to limitations in the heat dissipation area and the thermal conductivity of the medium, and is unable to quickly dissipate heat, which is not conducive to the service life of batteries and other terminal components. Utility Model Content

[0003] To this end, the technical problem to be solved by the utility model is to overcome the technical difficulties of limited heat dissipation capacity and poor heat dissipation effect of the heat dissipation structure in the prior art, and to provide a heat dissipation structure and terminal that combine refrigerant phase change and blast heat dissipation to greatly improve the heat dissipation efficiency.

[0004] In the first aspect, in order to solve the above technical problems, the utility model provides a heat dissipation structure, which includes:

[0005] A first plate body, the first plate body comprising a first surface and a second surface arranged opposite to each other in a thickness direction; the first surface is configured to fit the heat generating area;

[0006] a second plate body, the second plate body being located at a side of the first plate body away from the heat generating area in the thickness direction, the third surface of the second plate body being arranged opposite to the second surface, the third surface and the second surface forming a closed chamber, and the closed chamber being filled with a cooling medium;

[0007] The third plate body is located on a side of the second plate body away from the first plate body in the thickness direction, the fourth surface of the second plate body is arranged opposite to the third surface, the fourth surface and the third plate body form an airflow chamber, and the airflow chamber is connected to the outside.

[0008] In one embodiment of the utility model, it also includes a through hole extending along the thickness direction, and the through hole is sequentially arranged through the first plate body, the second plate body and the third plate body; a fan is fixed in the through hole, and the air outlet of the fan is connected to the airflow chamber.

[0009] In one embodiment of the utility model, the airflow chamber includes several groups of air ducts, and the air ducts are formed by the inward depression of the fifth surface of the third plate body facing the second plate body; the fifth surface is tightly fitted with the second surface in the area outside the air ducts, and the several groups of air ducts are all connected to the through hole.

[0010] In an embodiment of the present invention, the air duct includes a heat dissipation air duct and a connecting air duct. The heat dissipation air ducts are arranged parallel to each other and are equally spaced apart. The connecting air duct is perpendicular to the heat dissipation air duct.

[0011] In an embodiment of the present invention, the third plate body is further provided with an air hole, one end of the air hole is connected to a side of the third plate body away from the second plate body in the thickness direction, and the other end of the air hole is connected to the airway.

[0012] In an embodiment of the present invention, the air holes extend along the thickness direction of the third plate body, each group of the air passages is connected to at least two groups of the air holes, and the two groups of air holes are respectively located at two ends of the extension direction of the air passages.

[0013] In one embodiment of the utility model, a flow channel is provided in the closed chamber, and the flow channel is located on the second surface of the first plate body, or the flow channel is located on the third surface of the second plate body; the cooling medium flows in the flow channel.

[0014] In one embodiment of the present invention, at least a portion of the cooling medium in the flow channel is configured to vaporize when the first surface is in close contact with the heat generating area.

[0015] In an embodiment of the present invention, the materials of the first plate body, the second plate body and the third plate body are all set to contain aluminum alloy.

[0016] In a second aspect, the utility model further provides a terminal, which includes the heat dissipation structure described in any one of the above embodiments.

[0017] The above technical solution of the utility model has the following beneficial effects compared with the prior art:

[0018] The heat dissipation structure and terminal described in the utility model are suitable for heating entities with uneven temperature and limited heat dissipation space. They occupy a small space and have excellent uniform temperature heat dissipation effect. They can quickly diffuse local high-temperature heating areas to obtain a larger heat exchange area for heat dissipation. The utility model combines the phase change process and the fan blowing heat dissipation method in the heat dissipation process. Compared with traditional heat dissipation fins, the efficiency is significantly improved, and it can effectively protect the terminal, extend the service life, and optimize the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] To make the content of the present utility model easier to understand clearly, the following further details the present utility model according to specific embodiments of the present utility model and in conjunction with the accompanying drawings, where:

[0020] Figure 1 It is a schematic structural diagram of a heat dissipation structure in Embodiment 1 of the present utility model;

[0021] Figure 2 is Figure 1 an exploded view of the shown heat dissipation structure;

[0022] Figure 3 It is a schematic structural diagram of the first plate body in Embodiment 1 of the present utility model;

[0023] Figure 4 It is a schematic structural diagram of the second plate body in Embodiment 1 of the present utility model;

[0024] Figure 5 It is a schematic structural diagram of the third plate body in Embodiment 1 of the present utility model;

[0025] Figure 6 It is a schematic structural diagram of the heat dissipation structure and the fixing frame in Embodiment 2 of the present utility model.

[0026] Explanation of the reference numerals in the drawings of the specification: 1. First plate body; 11. First surface; 12. Second surface; 2. Second plate body; 21. Third surface; 22. Fourth surface; 3. Third plate body; 31. Fifth surface; 32. Sixth surface; 4. Flow channel; 41. Injection port; 5. Through hole; 6. Fan; 7. Air duct; 71. Heat dissipation air duct; 72. Connecting air duct; 8. Air hole; 9. Fixing frame. Detailed implementation manners

[0027] The following further illustrates the present utility model in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present utility model and be able to implement it, but the illustrated embodiments shall not be construed as limiting the present utility model.

[0028] Embodiment 1

[0029] Referring to Figures 1 to 5 shown, Embodiment 1 of the present utility model provides a heat dissipation structure, and the heat dissipation structure includes a first plate body 1, a second plate body 2, and a third plate body 3 that are stacked; the three sets of plate bodies form two spaces in the stacking direction, enabling the heat dissipation structure to combine the phase change of the refrigerant and the air blowing of the fan for heat dissipation, greatly improving the heat dissipation efficiency compared with traditional heat dissipation fins, and being applicable to various heat dissipation scenarios.

[0030] Specifically, referring to Figures 2 to 5As shown, the first plate body 1 includes a first surface 11 and a second surface 12 that are oppositely arranged in the thickness direction; wherein the first surface 11 is set as a smooth plane, and the first surface 11 is configured to fit the heat generation area. The second plate body 2 is located on the side of the first plate body 1 that is away from the heat generation area in the thickness direction, and the second plate body 2 includes a third surface 21 and a fourth surface 22 that are oppositely arranged in the thickness direction, wherein the third surface 21 is oppositely arranged to the second surface 12, and the third surface 21 and the second surface 12 enclose a closed chamber for filling a cooling medium. The third plate body 3 is located on the side of the second plate body 2 that is away from the first plate body 1 in the thickness direction, and the third plate body 3 includes a fifth surface 31 and a sixth surface 32 that are oppositely arranged in the thickness direction, wherein the fifth surface 31 and the fourth surface 22 enclose an airflow chamber, the airflow chamber is connected to the outside, and the third plate body 3 is in contact with the outside air.

[0031] Further, refer to Figure 4 As shown, a flow channel 4 for the cooling medium to flow is provided in the closed chamber. In some embodiments, the flow channel 4 is located on the second surface 12 of the first plate body 1. Alternatively, in some embodiments, the flow channel 4 may also be provided on the third surface 21 of the second plate body 2. Figure 4 As shown, the flow channel 4 includes cavities arranged in an array and welded to each other. The cavity can be set to a spherical, hemispherical, grooved or rectangular cavity with R corners, and can also be set according to actual needs of cooling medium flow, but is not limited thereto.

[0032] Next, after the first surface 11 contacts and clings to the heating area, heat is conducted from the first surface 11 to the second surface 12 of the first plate body 1, and at least part of the cooling medium in the flow channel 4 is configured to absorb heat and vaporize when the first surface 11 clings to the heating area, and then liquefy and reflux when flowing to other positions in the flow channel 4. In a preferred implementation of Example 1, the vaporization temperature of the cooling medium is related to the heating temperature of the heating area; preferably, the cooling medium includes at least two different components, and the vaporization temperature of the refrigerant included in each component is different, and the cooling medium can be vaporized within the temperature range of the heating area by adjusting the proportion of the components; at the same time, when the closed chamber has an internal pressure, the vaporization temperature of the cooling medium will also increase accordingly.

[0033] It should be noted that the volume changes with the phase change of the cooling medium. In the preferred embodiment of the utility model, the closed chamber is evacuated before the cooling medium is injected, and the specific amount of the injected cooling medium is calculated by using the scene and the heating temperature. The injection port 41 of the cooling medium is located on one of the sides of the second plate body 2 and the first plate body 1. The injection port 41 is set to a semicircular or arched shape in the area of ​​the first plate body 1 and the second plate body 2 and spliced ​​with each other. After the injection is completed, the spliced ​​injection ports 41 are sealed and closed by gluing or welding, so that the chambers in the first plate body 1 and the second plate body 2 are closed.

[0034] Specifically, refer to Figure 2 As shown, the heat dissipation structure also includes a through hole 5 extending along the thickness direction, and the through hole 5 is sequentially arranged through the first plate body 1, the second plate body 2 and the third plate body 3; the closed chamber between the first plate body 1 and the second plate body 2 is closed at the through hole 5, and the airflow chamber between the second plate body 2 and the third plate body 3 is connected to the through hole 5, and a fan 6 is fixed in the through hole 5, and the outer edge of the fan 6 is fixedly connected with the hole wall of the through hole 5 by snap-fitting; the air outlet of the fan 6 is connected with the airflow chamber for air blowing and heat dissipation.

[0035] Further, refer to Figure 5 As shown, the airflow chamber includes several groups of air channels 7, and the air channels 7 are formed by the fifth surface 31 being recessed into the interior of the third plate body 3. The fifth surface 31 is tightly attached to and welded to the second surface 12 in the area outside the air channels 7, and the several groups of air channels 7 are all connected to the through hole 5.

[0036] Next, the third plate body 3 is further provided with air holes 8, one end of the air holes 8 is connected to the sixth surface 32 of the third plate body 3 on the side away from the second plate body 2 in the thickness direction, and the other end of the air holes 8 is connected to the air channel 7. Preferably, the air holes 8 extend along the thickness direction of the third plate body 3, and each group of the air channels 7 is connected to at least two groups of the air holes 8, and the two groups of air holes 8 are respectively located at both ends of the extension direction of the air channels 7; in order to improve the heat dissipation efficiency, each group of the air channels 7 is connected to multiple groups of air holes 8, and the air holes 8 are arranged in an array.

[0037] It should be noted that the air duct 7 includes a heat dissipation air duct 71 and a connecting air duct 72; the heat dissipation air ducts 71 are arranged in parallel and at equal intervals, and at least part of the heat dissipation air ducts 71 communicate with the air outlet of the fan 6 when passing through the through hole 5, so that the heat in the air flow chamber can be evenly distributed and dissipated; in addition, the heat dissipation air ducts 71 extend along the radial direction of the through hole 5 of the heat dissipation structure, so that the fan 6 can evenly blow air to the air hole 8 to discharge air, improving the air flow efficiency. Limited by the aperture of the through hole 5, the heat dissipation air ducts 71 located on both sides in the arrangement direction do not pass through the through hole 5. Refer to Figure 5 As shown, one end of the connecting air duct 72 communicates with the heat dissipation air ducts 71 on both sides, and the other end of the connecting air duct 72 communicates with the through hole 5; preferably, the connecting air duct 72 is perpendicular to the heat dissipation air ducts 71 on both sides, reducing the air duct extension length, improving the heat exchange efficiency, and avoiding excessive dead volume in the air duct 7.

[0038] Specifically, in the preferred embodiment of the present invention, the materials of the first plate body 1, the second plate body 2, and the third plate body 3 are all set to contain aluminum alloy or red copper; preferably, the aluminum alloy is set to be one or more of the first series, third series, and sixth series aluminum materials; the first plate body 1, the second plate body 2, and the third plate body 3 can be welded to form the heat dissipation structure. Aluminum alloy has anti-corrosion characteristics and high thermal conductivity, facilitating heat dissipation. In addition, the aluminum alloy material is convenient for processing such as welding or stamping, which is beneficial to controlling the production cost of the heat dissipation structure.

[0039] The working principle of a heat dissipation structure according to Embodiment 1 of the present invention is as follows:

[0040] The heat in the heating area is conducted from the first surface 11 of the first plate body 1 to the second surface 12 and enters the closed chamber formed by welding the first plate body 1 and the second plate body 2; part of the cooling medium in the flow channel 4 of the closed chamber absorbs heat and vaporizes, and the vaporized gaseous cooling medium transports the heat to other areas in the closed chamber through the flow channel 4. Since the temperature of other areas in the closed chamber is lower, the gaseous cooling medium is cooled and liquefied again, releasing the heat carried.

[0041] During the heat dissipation process, the cooling medium in the flow channel 4 vaporizes upon heating in each area, is transported by flowing, liquefies upon cooling and then flows back, and thereafter vaporizes and liquefies again for a reciprocating cycle; during the phase change of the cooling medium during the cycle, the first plate body 1 and the second plate body 2 reduce the temperature in the high-temperature area and increase the temperature in other areas, thereby achieving the effect of uniform temperature. Since the rate of heat transfer during the vaporization phase change of the cooling medium is much higher than the thermal conductivity of currently known materials, the rapid uniform heating of the local high-temperature area can be achieved through the phase change process in the present utility model. Compared with the heat dissipation of the local area, the heat dissipation structure of the present utility model actually improves the heat dissipation efficiency by expanding the heat exchange area.

[0042] After the heat in the closed chamber is evenly diffused and evenly heated, it is conducted from the third surface 21 through the second plate body 2 to the air flow chamber, and a part of the heat is diffused to the air outward through the contact of the plate; another part of the heat is stored in the air flow chamber between the second plate body 2 and the third plate body 3, and by starting the fan 6, the air circulation speed in the air duct 7 and the air holes 8 is accelerated, and the heat in the air flow chamber is diffused to the air through the circulating gas.

[0043] Embodiment 2

[0044] Embodiment 2 of the present utility model further provides a terminal, which includes a heat-generating body (not shown in the figure), and the heat dissipation structure described in Embodiment 1; the heat-generating body can be set as a mobile phone, a PC or other base stations or workpieces with heat dissipation requirements; the terminal further includes a fixing frame 9 for fixing the heat dissipation structure and the heat-generating body.

[0045] Refer to Figure 6 As shown, when the heat-generating body is set as a mobile phone, during use, the temperature of the heat-generating area is about 30°C to 50°C, and the cooling medium at least includes component one with a vaporization temperature of 18°C and component two with a vaporization temperature of 25°C; the cooling medium adjusts the vaporization temperature according to the component ratio to adapt to the heat-generating body. The heat dissipation structure improves the heat dissipation efficiency without excessively increasing the volume of the terminal, has rich use scenarios and good heat dissipation effects; it can stabilize the performance of the terminal, improve the user experience, protect the battery and extend the service life.

[0046] Obviously, the above embodiments are merely examples given for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. And the obvious changes or modifications derived therefrom are still within the protection scope of the present utility model.

Claims

1. A heat dissipation structure, characterized in that: include, A first plate body, the first plate body comprising a first surface and a second surface arranged opposite to each other in a thickness direction; the first surface is configured to fit the heat generating area; a second plate body, the second plate body being located at a side of the first plate body away from the heat generating area in the thickness direction, the third surface of the second plate body being arranged opposite to the second surface, the third surface and the second surface forming a closed chamber, and the closed chamber being filled with a cooling medium; The third plate body is located on a side of the second plate body away from the first plate body in the thickness direction, the fourth surface of the second plate body is arranged opposite to the third surface, the fourth surface and the third plate body form an airflow chamber, and the airflow chamber is connected to the outside.

2. The heat dissipation structure according to claim 1, characterized in that: It also includes a through hole extending along the thickness direction, and the through hole passes through the first plate body, the second plate body and the third plate body in sequence; a fan is fixed in the through hole, and the air outlet of the fan is connected to the airflow chamber.

3. The heat dissipation structure according to claim 2, characterized in that: The airflow chamber includes a plurality of groups of air channels, and the air channels are formed by the fifth surface of the third plate body being recessed inwardly facing the second plate body; the fifth surface is tightly fitted with the second surface in the area outside the air channels, and the plurality of groups of air channels are all connected to the through holes.

4. The heat dissipation structure according to claim 3, characterized in that: The air channels include heat dissipation air channels and connecting air channels. The heat dissipation air channels are arranged in parallel with each other and at equal intervals. The connecting air channels are perpendicular to the heat dissipation air channels.

5. The heat dissipation structure according to claim 3, characterized in that: The third plate body is further provided with an air hole, one end of which is connected to a side of the third plate body away from the second plate body in the thickness direction, and the other end of which is connected to the air passage.

6. The heat dissipation structure according to claim 5, characterized in that: The air holes extend along the thickness direction of the third plate body, and each group of the air passages is connected to at least two groups of the air holes, and the two groups of air holes are respectively located at two ends of the extending direction of the air passages.

7. The heat dissipation structure according to claim 1, characterized in that: A flow channel is provided in the closed chamber, and the flow channel is located on the second surface of the first plate body, or the flow channel is located on the third surface of the second plate body; the cooling medium flows in the flow channel.

8. The heat dissipation structure according to claim 7, characterized in that: At least a portion of the cooling medium in the flow channel is configured to vaporize when the first surface is in close contact with the heat generating area.

9. The heat dissipation structure according to claim 1, characterized in that: The materials of the first plate body, the second plate body and the third plate body are all set to contain aluminum alloy.

10. A terminal, characterized in that: The invention comprises the heat dissipation structure as claimed in any one of claims 1 to 9.

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