Transparent heatable electromagnetic shielding window

Abstract

The utility model discloses a transparent heatable electromagnetic shielding window, which comprises a transparent base material layer, a metal grid layer, an inorganic material layer and a fluorosilicone material layer which are sequentially laminated and connected from bottom to top, and the inorganic material layer comprises a plurality of silicon dioxide coatings and a plurality of trititanium pentoxide coatings which are staggered and stacked. The transparent heatable electromagnetic shielding window is novel in structure, the metal grid layer not only can be used for electromagnetic shielding, but also can be used for introducing a relatively large current to heat the electromagnetic shielding window so as to ensure the permeability of the electromagnetic shielding window in a severe cold environment, and then the visibility of the electromagnetic shielding window is ensured; the arrangement of the inorganic material layer can improve the light transmission of the electromagnetic shielding window to a greater extent; the fluorosilicone material layer can improve the antifouling capability of the electromagnetic shielding window and improve the phenomenon that fingerprints are easy to remain in the electromagnetic shielding window, so that the visibility of the electromagnetic shielding window is further ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of electromagnetic shielding devices, in particular to a transparent heatable electromagnetic shielding window. Background Art

[0002] With the widespread application of information equipment, the electromagnetic environment is becoming more and more complex and harsh. At the same time, the integration of information equipment is getting higher and higher, and the electromagnetic sensitivity and electromagnetic vulnerability of the circuit system are becoming more and more serious. Electromagnetic shielding windows are widely used in civil and national defense fields such as communications, IT, electricity, medical care, banking, securities, government, and the military. Electromagnetic shielding windows mainly solve the electromagnetic interference between electronic systems and electronic equipment, prevent electromagnetic information leakage, protect electromagnetic radiation pollution, effectively ensure the normal operation of instruments and equipment, ensure the security of confidential information, and ensure the health of staff.

[0003] The light transmittance and electromagnetic protection capabilities of existing electromagnetic shielding windows are usually low, and it is difficult to take both high light transmittance and high screen efficiency into account at the same time. The main bottleneck problem faced by existing technologies (such as grid shielding glass, ITO glass, etc.) is that they cannot handle the problem of high light transmittance and electromagnetic high screen efficiency well. In addition, electromagnetic shielding windows may accumulate snow and ice in extreme climates. Therefore, electromagnetic shielding window materials need to have heating properties to ensure normal use. Traditional electromagnetic shielding windows mostly use ITO-plated conductive materials or silver nanowires coated on transparent substrates to achieve transparency and shielding performance. Although they also have certain heating properties, due to the need to take into account light transmittance, both ITO-plated and silver nanowire-coated are very thin. When a large current passes through, the conductive path will be destroyed and fail.

[0004] In addition, the existing electromagnetic shielding windows also have the problem of poor anti-fouling effect. Fingerprints are easily left after being touched by human hands, so that the light transmittance of the electromagnetic shielding windows is affected. Utility Model Content

[0005] The technical problem solved by the utility model is to provide a highly transparent heated electromagnetic shielding window with strong anti-fouling ability.

[0006] In order to solve the above technical problems, the technical solution adopted by the utility model is: a transparent heatable electromagnetic shielding window, including a transparent substrate layer, a metal grid layer, an inorganic material layer and a fluorosilicone material layer stacked and connected in sequence from bottom to top, and the inorganic material layer includes a plurality of silicon dioxide coating layers and a plurality of titanium pentoxide coating layers stacked in an alternating manner.

[0007] In one embodiment, the transparent substrate layer is made of glass or a transparent polymer film.

[0008] In one embodiment, the metal grid layer has a power-on terminal for conducting an external power source.

[0009] In one embodiment, the line width of the traces of the metal mesh layer is 2.5 μm - 5 μm, and the line pitch is 100 μm - 300 μm.

[0010] In one embodiment, the thickness of a single layer of the silicon dioxide coating is greater than or equal to the thickness of a single layer of the titanium pentoxide coating.

[0011] In one embodiment, the thicknesses of all the silicon dioxide coatings are equal, and the thicknesses of all the titanium pentoxide coatings are equal.

[0012] In one embodiment, the total thickness of multiple silicon dioxide coatings is 180 nm, and the total thickness of multiple titanium pentoxide coatings is 120 nm.

[0013] In one embodiment, the sum of the number of silicon dioxide coatings and the number of titanium pentoxide coatings is 6 - 14 layers.

[0014] In one embodiment, the sum of the number of silicon dioxide coatings and the number of titanium pentoxide coatings is 10 layers.

[0015] In one embodiment, the thickness of the fluorosilicon material layer is 10 nm.

[0016] The beneficial effects of the present utility model are as follows: The structure of the transparent heat - able electromagnetic shielding window of the present utility model is novel. The metal mesh layer can not only be used for electromagnetic shielding, but also can be used to pass a slightly larger current to heat the electromagnetic shielding window to ensure the transparency of the electromagnetic shielding window in a cold environment, thereby ensuring the visibility of the electromagnetic shielding window; the setting of the inorganic material layer can greatly improve the light transmittance of the electromagnetic shielding window; the fluorosilicon material layer can improve the anti - fouling ability of the electromagnetic shielding window, improve the phenomenon that fingerprints are easily left on the electromagnetic shielding window, and thus further ensure the visibility of the electromagnetic shielding window. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0018] Figure 1 It is a schematic structural diagram of the transparent heat - able electromagnetic shielding window according to Embodiment 1 of the present utility model;

[0019] Figure 2 It is a schematic structural diagram of the inorganic material layer in the transparent heat - able electromagnetic shielding window according to Embodiment 1 of the present utility model.

[0020] Description of the reference numerals in the drawings:

[0021] 1. Transparent substrate layer;

[0022] 2. Metal mesh layer;

[0023] 3. Inorganic material layer; 31. Silicon dioxide coating; 32. Titanium pentoxide coating;

[0024] 4. Fluorosilicon material layer. Detailed implementation manners

[0025] The realization of the object, functional features and advantages of the present utility model will be further described with reference to the embodiments and the accompanying drawings.

[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0027] It should be noted that if there are directional indications such as up, down, left, right, front, back... in the embodiments of the present utility model, the directional indications are only used to explain the relative position relationship and movement conditions between components in a specific posture as shown in the drawings. If the specific posture changes, the directional indications will also change accordingly.

[0028] In addition, if there are descriptions such as "first", "second", etc. in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature.

[0029] In addition, the meaning of "and / or" appearing throughout the text is that it includes three parallel solutions. Taking "and / or" as an example, it includes the solution, or the solution, or the solution that satisfies both simultaneously. In addition, the technical solutions between the embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0030] In this application, unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] Embodiment 1

[0032] Please refer to Figure 1 and Figure 2 , Embodiment 1 of the present utility model is: a transparent heatable electromagnetic shielding window, which includes a transparent substrate layer 1, a metal grid layer 2, an inorganic material layer 3, and a fluorosilicon material layer 4 that are stacked and connected in sequence from bottom to top. The inorganic material layer 3 includes a plurality of silicon dioxide coatings 31 and a plurality of titanium pentoxide coatings 32 that are stacked alternately.

[0033] It is easy to understand that when manufacturing the metal grid layer 2, a copper coating can be first formed on the transparent substrate layer 1, and then the metal grid layer 2 can be obtained by means of exposure - development - etching. The silicon dioxide coating 31, the silicon dioxide coating 31, and the fluorosilicon material layer 4 can be formed by means of vacuum coating.

[0034] The material of the transparent substrate layer 1 is glass or a polymer transparent film.

[0035] To facilitate the conduction and temperature rise of the metal grid layer 2, optionally, the metal grid layer 2 has a power - on end for conducting an external power supply. The external power supply can be connected to the power - on end to supply power to the metal grid layer 2, so that the metal grid layer 2 can be heated to achieve the purpose of defogging and de - icing.

[0036] The line width of the wiring of the metal grid layer 2 is 2.5 μm - 5 μm, and the line pitch is 100 μm - 300 μm.

[0037] The thickness of a single silicon dioxide coating 31 is greater than or equal to the thickness of a single titanium pentoxide coating 32. Optionally, the thicknesses of all the silicon dioxide coatings 31 are equal, and the thicknesses of all the titanium pentoxide coatings 32 are equal. In this embodiment, the total thickness of the plurality of silicon dioxide coatings 31 is 180 nm, and the total thickness of the plurality of titanium pentoxide coatings 32 is 120 nm.

[0038] The sum of the number of silicon dioxide coatings 31 and the number of titanium pentoxide coatings 32 is 6 - 14 layers. In this embodiment, the sum of the number of silicon dioxide coatings 31 and the number of titanium pentoxide coatings 32 is 10 layers.

[0039] The thickness of the fluorosilicon material layer 4 is 10 nm.

[0040] Example 1

[0041] Using glass as the transparent substrate layer, a copper plating layer is formed on the transparent substrate layer, and then the designed copper circuit is obtained by the traditional exposure - development - etching method, obtaining a metal mesh layer with a line width of 2.5 μm and a line pitch of 300 μm.

[0042] Electron beam evaporation coating on the circuit surface: Using silicon dioxide and titanium pentoxide as raw materials, the coating parameters are set as follows: the background vacuum is below 6×10 -4 Pa, the glass is heated to 120 °C, the deposition rate of the titanium pentoxide coating is 0.2 nm / s, the deposition rate of the silicon dioxide coating is 0.1 nm / s. The inorganic material layer is formed by cross - coating on the side of the glass with the metal mesh layer, with a total of 10 layers coated. The total thickness of the silicon dioxide coating is 180 nm, the total thickness of the titanium pentoxide coating is 120 nm. After the inorganic material layer coating is completed, a fluorosilicon material layer is further coated. The thickness of the fluorosilicon material layer is 10 nm, and the deposition rate of the fluorosilicon material layer is 1.0 nm / s.

[0043] The transmittance and electromagnetic shielding performance of the prepared electromagnetic shielding window are tested, as shown in 1# of Table 1.

[0044] Example 2

[0045] Using glass as the transparent substrate layer, a copper plating layer is formed on the transparent substrate layer, and then the designed copper circuit is obtained by the traditional exposure - development - etching method, obtaining a metal mesh layer with a line width of 3.0 μm and a line pitch of 200 μm.

[0046] Electron beam evaporation coating on the circuit surface: Using silicon dioxide and titanium pentoxide as raw materials, the coating parameters are set as follows: the background vacuum is below 6×10 -4 Pa, the glass is heated to 120 °C, the deposition rate of the titanium pentoxide coating is 0.2 nm / s, the deposition rate of the silicon dioxide coating is 0.1 nm / s. The inorganic material layer is formed by cross - coating on the side of the glass with the metal mesh layer, with a total of 10 layers coated. The total thickness of the silicon dioxide coating is 180 nm, the total thickness of the titanium pentoxide coating is 120 nm. After the inorganic material layer coating is completed, a fluorosilicon material layer is further coated. The thickness of the fluorosilicon material layer is 10 nm, and the deposition rate of the fluorosilicon material layer is 1.0 nm / s.

[0047] The transmittance and electromagnetic shielding performance of the prepared electromagnetic shielding window are tested, as shown in 2# of Table 1.

[0048] Example 3

[0049] Using a 100-μm-thick COP film as the transparent substrate layer, a copper plating layer is formed on the transparent substrate layer, and then the designed copper circuit is obtained by the traditional exposure - development - etching method, resulting in a metal grid layer with a line width of 5.0 μm and a line pitch of 100 μm.

[0050] Electron beam evaporation coating on the circuit surface: Using silicon dioxide and titanium pentoxide as raw materials, the coating parameters are set as follows: the background vacuum is below 6×10 -4 Pa, the COP film is not heated, the deposition rate of the titanium pentoxide coating is 0.2 nm / s, the deposition rate of the silicon dioxide coating is 0.1 nm / s. The inorganic material layer is formed by cross-coating on the side of the glass with the metal grid layer, with a total of 10 layers coated. The total thickness of the silicon dioxide coating is 180 nm, and the total thickness of the titanium pentoxide coating is 120 nm. After the coating of the inorganic material layer, a fluorosilicon material layer is further coated, with a thickness of 10 nm and a deposition rate of 1.0 nm / s.

[0051] The transmittance and electromagnetic shielding performance of the prepared electromagnetic shielding window are tested, as shown in No. 3 of Table 1.

[0052] Table 1 Comparison table of transmittance and electromagnetic shielding performance test for Examples 1 to 3

[0053] Example Transmittance (%) Shielding effectiveness (dB) 1# 88 20 2# 85 25 3# 90 30

[0054] As can be seen from Table 1, this transparent heatable electromagnetic shielding window can not only balance the shielding performance and optical performance.

[0055] This transparent heatable electromagnetic shielding window can withstand a larger current passing through compared with the conductive ITO and silver nanowire electromagnetic shielding windows, and has higher stability. In addition, this transparent heatable electromagnetic shielding window has excellent waterproof, anti-fouling, and anti-fingerprint and other characteristics.

[0056] The above are only optional embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. All equivalent structural transformations made under the inventive concept of the present utility model by using the content of the specification and drawings of the present utility model, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present utility model.

Claims

1. A transparent heatable electromagnetic shielding window, characterized in that: It comprises a transparent substrate layer, a metal grid layer, an inorganic material layer and a fluorine silicon material layer which are sequentially stacked and connected from bottom to top, wherein the inorganic material layer comprises a plurality of silicon dioxide coating layers and a plurality of titanium pentoxide coating layers which are staggered and stacked.

2. The transparent heatable electromagnetic shielding window according to claim 1, characterized in that: The material of the transparent substrate layer is glass or a polymer transparent film.

3. The transparent heatable electromagnetic shielding window according to claim 1, characterized in that: The metal grid layer has a power-on terminal for conducting an external power source.

4. The transparent heatable electromagnetic shielding window according to claim 3, characterized in that: The metal grid layer has a wiring line width of 2.5 μm-5 μm and a line spacing of 100 μm-300 μm.

5. The transparent heatable electromagnetic shielding window according to claim 1, characterized in that: The thickness of the single-layer silicon dioxide coating is greater than or equal to the thickness of the single-layer titanium pentoxide coating.

6. The transparent heatable electromagnetic shielding window according to claim 5, characterized in that: The thickness of each silicon dioxide coating layer is equal, and the thickness of each titanium pentoxide coating layer is equal.

7. The transparent heatable electromagnetic shielding window according to claim 5, characterized in that: The total thickness of the multiple silicon dioxide coatings is 180 nm, and the total thickness of the multiple titanium pentoxide coatings is 120 nm.

8. The transparent heatable electromagnetic shielding window according to claim 1, characterized in that: The sum of the number of the silicon dioxide coating layers and the number of the titanium pentoxide coating layers is 6-14 layers.

9. The transparent heatable electromagnetic shielding window according to claim 8, characterized in that: The sum of the number of the silicon dioxide coating layers and the number of the titanium pentoxide coating layers is 10 layers.

10. The transparent heatable electromagnetic shielding window according to claim 1, characterized in that: The thickness of the fluorine silicon material layer is 10 nm.

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