Semiconductor packaging structure

Abstract

The utility model discloses a semiconductor packaging structure. The semiconductor packaging structure comprises a first substrate; the second substrate is positioned above the first substrate; the active element is arranged on the first substrate; the passive element groups are arranged on the first substrate and surround the active elements, and the passive elements in the passive element groups are stacked in a staggered mode and used for shielding electromagnetic wave interference. According to the technical scheme, at least the area of the semiconductor packaging structure can be reduced, and meanwhile a good shielding effect is provided for the active element.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and more specifically, to a semiconductor packaging structure. Background Art

[0002] like Figure 1 As shown, when the panel 10 and the module 20 are both large in area, the warpage is difficult to control. Furthermore, when the warpage directions / degrees on both sides do not match, it will cause poor bonding such as non-joint / neck 30.

[0003] At present, the warpage control capability of RDL (redistribution layer) panel is within 3mm to 7mm. It is still difficult to control the warpage to less than 3mm by physical pressing with a jig, which will cause bonding problems for SMT (surface mount technology). The number of components 22 and the area of ​​substrate 24 in the current module design are close to the upper limit of substrate utilization. In order to avoid bridging problems between components, it is not appropriate to reduce the substrate area in the original structure. Utility Model Content

[0004] In view of the above problems, the present application proposes a semiconductor packaging structure, which can at least reduce the area of ​​the semiconductor packaging structure and provide a good shielding effect for active components.

[0005] The technical solution of this application is implemented as follows:

[0006] According to one aspect of the present application, a semiconductor packaging structure is provided, which includes: a first substrate; a second substrate located above the first substrate; an active component disposed on the first substrate; and a plurality of passive component groups disposed on the first substrate and surrounding the active component, wherein the passive components in the passive component groups are staggered and stacked to shield electromagnetic wave interference.

[0007] In some embodiments, a passive component group includes a first passive component, a second passive component and a third passive component. The first passive component and the second passive component are laterally spaced apart on the first substrate, and the third passive component partially overlaps the first passive component and the second passive component in the vertical direction.

[0008] In some embodiments, multiple passive component groups are disposed on the upper surface of the first substrate, and the first passive component, the second passive component, and the third passive component respectively have length directions parallel to the upper surface of the first substrate, wherein the length directions of the first passive component, the second passive component, and the third passive component are parallel to each other.

[0009] In some embodiments, multiple groups of passive components are disposed on the upper surface of the first substrate. The first passive component, the second passive component, and the third passive component each have a length direction parallel to the upper surface of the first substrate. Among them, the length direction of the first passive component is parallel to the length direction of the second passive component, and the length direction of the third passive component intersects obliquely with the length directions of the first passive component and the second passive component.

[0010] In some embodiments, multiple groups of passive components are disposed on the upper surface of the first substrate. The first passive component, the second passive component, and the third passive component each have a length direction parallel to the upper surface of the first substrate. Among them, the length direction of the first passive component is parallel to the length direction of the second passive component, and the length direction of the third passive component is perpendicular to the length directions of the first passive component and the second passive component.

[0011] In some embodiments, multiple groups of passive components are disposed on the upper surface of the first substrate. The first passive component, the second passive component, and the third passive component each have a length direction parallel to the upper surface of the first substrate. The length direction of the first passive component is parallel to the length direction of the third passive component, and the length direction of the second passive component is perpendicular to the length directions of the first passive component and the third passive component.

[0012] In some embodiments, multiple groups of passive components are disposed on the upper surface of the first substrate. The first passive component, the second passive component, and the third passive component each have a length direction parallel to the upper surface of the first substrate. The length direction of the first passive component is perpendicular to the length direction of the second passive component, and the length direction of the third passive component intersects obliquely with the length directions of the first passive component and the second passive component.

[0013] In some embodiments, a group of passive components further includes a fourth passive component. The fourth passive component is laterally spaced from the first passive component and the second passive component on the first substrate, and the third passive component also partially overlaps with the fourth passive component in the vertical direction.

[0014] In some embodiments, in a top-down view, multiple passive components stacked in an interleaved manner in a group of passive components surround a corner of the active component.

[0015] In some embodiments, three sides of the active component are adjacent to the edge of the first substrate, and multiple groups of passive components are disposed beside the three sides.

[0016] In the semiconductor packaging structure of the present application, by stacking the passive components in the passive component group between the first substrate and the second substrate, the advantage of reducing the area of the passive component group with the same number of components is achieved. Furthermore, the areas of the first substrate and the second substrate and the area of the semiconductor packaging structure can be reduced. The area of the panel docked with the semiconductor packaging structure can be reduced, and finally the unconnected influence caused by the warping of the docked panel can be reduced. In addition, by integrating the active components into the interlayer between the first substrate and the second substrate and using the passive component group as a barrier, a shielding effect can be achieved simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0018] Figure 1 is a cross-sectional schematic view of a docking structure between an existing module and a panel.

[0019] Figure 2A and Figure 2B are respectively a cross-sectional schematic view and a top view schematic view of a semiconductor packaging structure according to an embodiment of the present application.

[0020] Figure 3A and Figure 3B are respectively a cross-sectional schematic view and a top view schematic view of a semiconductor packaging structure according to another embodiment of the present application.

[0021] Figure 4A-1 and Figure 4A-2 、 Figure 4B-1 and Figure 4B-2 、 Figure 4C-1 and Figure 4C-2 、 Figure 4D-1 and Figure 4D-2 are respectively a three-dimensional schematic view and a top view schematic view of a passive component group according to the first stacking method to the fourth stacking method.

[0022] Figure 5A-1 and Figure 5A-2 、 Figure 5B-1 and Figure 5B-2 、 Figure 5C-1 and Figure 5C-2 、 Figure 5D-1 and Figure 5D-2 are respectively a three-dimensional schematic view and a top view schematic view of a passive component group according to the fifth stacking method to the eighth stacking method.

[0023] Figure 6A-1 and Figure 6A-2 、Figure 6B-1 and Figure 6B-2 、 Figure 6C-1 and Figure 6C-2 、 Figure 6D-1 and Figure 6D-2 are respectively the three-dimensional schematic diagram and the top view schematic diagram of the passive component group according to the ninth stacking method to the twelfth stacking method.

[0024] Figure 7A-1 and Figure 7A-2 、 Figure 7B-1 and Figure 7B-2 、 Figure 7C-1 and Figure 7C-2 are respectively the three-dimensional schematic diagram and the top view schematic diagram of the passive component group according to the thirteenth stacking method to the fifteenth stacking method.

[0025] Figure 8A and Figure 8B are respectively the three-dimensional schematic diagram and the top view schematic diagram of the passive component group according to the sixteenth stacking method.

[0026] Figure 9A-1 and Figure 9A-2 、 Figure 9B-1 and Figure 9B-2 are respectively the three-dimensional schematic diagram and the top view schematic diagram of the passive component group according to the seventeenth stacking method to the eighteenth stacking method.

[0027] Figure 10A-1 and Figure 10A-2 、 Figure 10B-1 and Figure 10B-2 are respectively the three-dimensional schematic diagram and the top view schematic diagram of the passive component group according to the nineteenth stacking method to the twentieth stacking method.

[0028] Figure 11A-1 and Figure 11A-2 、 Figure 11B-1 and Figure 11B-2 、 Figure 11C-1 and Figure 11C-2 are respectively the three-dimensional schematic diagram and the top view schematic diagram of the passive component group according to the twenty-first stacking method to the twenty-third stacking method. Detailed implementation manners

[0029] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0030] The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and arrangements will be described below to simplify the present utility model. Of course, these are merely examples and are not intended to limit the present utility model. For example, in the following description, forming the first component above or on the second component may include embodiments where the first component and the second component are in direct contact, and may also include embodiments where additional components are formed between the first component and the second component such that the first component and the second component may not be in direct contact. Moreover, the present utility model may repeat reference numerals and / or letters in various examples. Such repetition is only for the sake of brevity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0031] In addition, without conflict, the embodiments in this application and the features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0032] An embodiment of the present application provides a semiconductor package structure 100. Figure 2A is a cross-sectional schematic diagram of a semiconductor package structure 100 according to an embodiment of the present application. Figure 2B is Figure 2A a top view schematic diagram of the semiconductor package structure 100 in

[0033] Combined with Figure 2A and Figure 2B as shown, the semiconductor package structure 100 may include a first substrate 101 and a second substrate 102 located above the first substrate 101. The semiconductor package structure 100 may further include a plurality of passive component groups 500 disposed on the first substrate 101. The passive components in each passive component group 500 are stacked in an interleaved manner. In this embodiment, the passive component group 500 includes three passive components stacked in an interleaved manner, namely a first passive component 501, a second passive component 502, and a third passive component 503.

[0034] In the above semiconductor package structure 100, by stacking the passive components in the passive component group 500 on top of each other, the occupied area of the passive component group 500 is reduced. Since the occupied area of the passive component group 500 is reduced, the warpage of the semiconductor package structure 100 can be reduced.

[0035] Figure 3A is a cross-sectional schematic diagram of a semiconductor package structure 200 according to another embodiment of the present application. Figure 3B is Figure 3A a top view schematic diagram of the semiconductor package structure 200 in

[0036] Combined with Figure 3A and Figure 3BAs shown, the semiconductor package structure 200 may include: a first substrate 101 and a second substrate 102 located above the first substrate 101. At least one active component 130 (two active components 130 are shown in this embodiment) and a plurality of passive component groups 500 are disposed on the first substrate 101. Two active components 130 are shown as an example in this embodiment. The plurality of passive components in the passive component group 500 are stacked in an interleaved manner. In this embodiment, the passive component group 500 includes three passive components stacked in an interleaved manner, namely a first passive component 501, a second passive component 502, and a third passive component 503. The plurality of passive component groups 500 surround the active component 130. Moreover, the plurality of passive component groups 500 disposed around the active component 130 can be used as a barrier to shield the electromagnetic wave from interfering with the active component 130.

[0037] The first passive component 501, the second passive component 502, and the third passive component 502 respectively have a length direction parallel to the upper surface of the first substrate 101, that is, the length direction extends in the X-Y plane. In this embodiment, the first passive component 501 and the second passive component 502 are laterally spaced apart on the first substrate 101, and the third passive component 503 partially overlaps both the first passive component 501 and the second passive component 502 in the vertical direction Z. In the passive component group 500, the first passive component 501 and the second passive component 502 are close to the first substrate 101, and the electrical connection terminals 501a, 501b of the first passive component 501 and the second passive component 502 can be directly bonded to the first substrate 101, and the electrical connection terminals 503a, 503b of the third passive component 503 close to the second substrate 102 in a passive component group 500 can be directly bonded to the second substrate 102.

[0038] In the semiconductor package structure 200, within the interlayer between the first substrate 101 and the second substrate 102, there is a layer of passive component group 500 that is docked with the first substrate 101 and the second substrate 102. The passive components (such as the first passive component 501, the second passive component 502, and the third passive component 503) in the passive component group 500 are stacked on top of each other, achieving the advantage of reducing the area in the X-Y plane of the passive component group 500 with the same number of components. The area of the passive component group 500 can be reduced by more than one-third. Furthermore, the areas of the first substrate 101 and the second substrate 102 and the area of the semiconductor package structure 200 can be reduced. In addition, the active component 130 that could originally be disposed on the upper first substrate 101 is integrated into the interlayer, and by using the passive component group 500 as a barrier, a shielding effect can be achieved simultaneously. The semiconductor package structure 200 can be bonded to a panel. Due to the reduction in the area of the passive component group 500, the area of the panel docked with the semiconductor package structure 200 can be reduced, ultimately reducing the unconnected impact caused by the warping of the docked panel.

[0039] Reference Figure 3B As shown, multiple passive components stacked in an interleaved manner in a passive component group 500 can surround a corner of the active component 130. For example, in this embodiment, at the corner 130R1 of the active component 130, the first passive component 501, the second passive component 502, and the third passive component 503 in a corresponding passive component group 500 can surround the corner 130R1 of the active component 130. Specifically, the corner 130R1 is formed by the side surfaces 130a and 130b of the active component 130. The first passive component 501 is disposed beside the side surface 130a, and the length direction (X direction) of the first passive component 501 is parallel to the side surface 130a. The second passive component 502 is disposed beside the side surface 130b, and the length direction (Y direction) of the second passive component 502 is parallel to the side surface 130b. The third passive component 503 is stacked on the first passive component 501 and the second passive component 502.

[0040] The electrical connection terminal 501b of the first passive component 501 is directly bonded to the electrical connection terminal 503a of the third passive component 503, and the other electrical connection terminal 501a of the first passive component 501 does not overlap with the other electrical connection terminal 503b of the third passive component 503 in the vertical direction. Instead, the electrical connection terminal 503b of the third passive component 503 and the electrical connection terminal 502a of the second passive component 502 are stacked on top of each other and directly bonded. As Figure 3B shown, similar to that at the corner 130R1, other passive component groups 500 can surround the corresponding corners of the corresponding active component 130.

[0041] In addition, three sides 130a, 130b, and 130c of the active component 130 are adjacent to corresponding edges of the first substrate 101, and multiple groups of passive components 500 can be disposed beside the three sides 130a, 130b, and 130c. Specifically, one group of passive components 500 is disposed beside side 130a and side 130b and surrounds the corner 130R1 formed by side 130a and side 130a. Another group of passive components 500 is disposed beside side 130b and side 130c and surrounds the corner formed by side 130b and side 130c.

[0042] According to an embodiment of the present application, multiple passive components in the group of passive components 500 can be stacked in a variety of different stacking manners. Figures 4A-1 to 4D-2 Different stacking manners of multiple passive components in a single group of passive components 500 are shown.

[0043] Figure 4A-1 is a perspective schematic view of a group of passive components 500A according to the first stacking manner. Figure 4A-2 is Figure 4A-1 a top view schematic. Refer to Figure 4A-1 and Figure 4A-2 As shown, in the group of passive components 500A, the first passive component 501, the second passive component 502, and the third passive component 503 may have the same size. It should be understood that having the same size in the top view means that the components have the same size in both the length direction and the width direction. The third passive component 503 is stacked above the first passive component 501 and the second passive component 502. The length directions of both the first passive component 501 and the second passive component 502 are along the X direction, and the first passive component 501 and the second passive component 502 may be aligned along the X direction.

[0044] The length direction of the third passive component 503 is also along the X direction and may be parallel to the length directions of the first passive component 501 and the second passive component 502. Specifically, the electrical connection terminal 501b of the first passive component 501 and the electrical connection terminal 502a of the second passive component 502 are adjacent, and the electrical connection terminals 503a and 503b of the third passive component 503 are directly bonded to the electrical connection terminal 501b of the first passive component 501 and the electrical connection terminal 502a of the second passive component 502 respectively, and the third passive component 503 straddles the gap between the first passive component 501 and the second passive component 502.

[0045] In one embodiment, the length of each of the first passive element 501 to the third passive element 503 may be 600 μm, and the width may be 300 μm. In such an embodiment, the length S1 of the gap between the first passive element 501 and the second passive element 502 may be 300 μm. The total dimension D1 of the passive element group in the X direction is 1500 μm, and the total dimension D2 in the Y direction is 300 μm.

[0046] In another embodiment, the length of each of the first passive element 501 to the third passive element 503 may be 400 μm, and the width may be 200 μm. In such an embodiment, the length S1 of the gap between the first passive element 501 and the second passive element 502 may be 200 μm. The total dimension D1 of the passive element group 500A in the X direction is 1000 μm, and the total dimension D2 in the Y direction is 200 μm.

[0047] Figure 4B-1 is a three-dimensional schematic diagram of the passive element group 500B according to the second stacking method. Figure 4B-2 is Figure 4B-1 a top view schematic diagram. Figure 4B-1 and Figure 4B-2 Multiple aspects of the passive element group 500B shown in Figure 4A-1 and Figure 4A-2 may be similar to the passive element group 500A shown above. Only the differences of the passive element group 500B shown in Figure 4B-1 and Figure 4B-2 will be described below.

[0048] In the passive element group 500B, the third passive element 503 is stacked above the first passive element 501, but not above the second passive element 502. The two electrical connection terminals 503a, 503b of the third passive element 503 are directly bonded to the two electrical connection terminals 501a, 501b of the first passive element 501 respectively.

[0049] In this embodiment, since the third passive element 503 does not span the gap between the first passive element 501 and the second passive element 502, the gap between the first passive element 501 and the second passive element 502 can be smaller. In an embodiment where the size of each of the first passive element 501 to the third passive element 503 is 600*300 μm, the length S1 of the gap can be 40 μm. In this way, the total size D1 of the passive element group 500B in the X direction is 1240 μm, and the total size D2 in the Y direction is 200 μm. In an embodiment where the size of each of the first passive element 501 to the third passive element 503 is 400*200 μm, the length S1 of the gap can be 40 μm. In this way, the total size D1 of the passive element group 500B in the X direction is 840 μm, and the total size D2 in the Y direction is 200 μm. It can be seen that, compared with Figure 4B-1 and Figure 4B-2 the passive element group 500A shown, the passive element group 500B can occupy a smaller size in the X direction.

[0050] Figure 4C-1 FIG. is a three-dimensional schematic diagram of a passive element group 500C according to the third stacking method. Figure 4C-2 is Figure 4C-1 a top view schematic diagram of. In this embodiment, the length directions of the first passive element 501 and the second passive element 502 are parallel, but the first passive element 501 and the second passive element 502 are not aligned in the X direction. That is to say, the corresponding long sides of the first passive element 501 and the second passive element 502 are offset by a distance S2 along the Y direction. The electrical connection terminals 503a, 503b of the third passive element 503 are directly joined to the adjacent electrical connection terminals 501b, 502a of the first passive element 501 and the second passive element 502 respectively. The length direction of the third passive element 503 intersects obliquely with the length directions of the first passive element 501 and the second passive element 502.

[0051] In an embodiment where each of the first passive element 501 to the third passive element 503 has a size of 600*300 μm, the length S1 of the interval can be 40 μm, and the distance S2 by which the first passive element 501 and the second passive element 502 are offset along the Y direction can be 40 μm. Thus, the total size D1 of the passive element group 500C in the X direction is 1240 μm. The total size D2 of the passive element group 500C in the Y direction is 640 μm. In an embodiment where each of the first passive element 501 to the third passive element 503 has a size of 400*200 μm, the length S1 of the interval can be 40 μm, and the distance S2 by which the first passive element 501 and the second passive element 502 are offset along the Y direction can be 40 μm. Thus, the total size D1 of the passive element group 500C in the X direction is 840 μm, and the total size D2 in the Y direction is 440 μm. It can be seen that, compared with Figure 4A-1 and Figure 4A-2 the passive element group 500A shown, the passive element group 500C can also occupy a smaller size in the X direction; Figure 4B-1 and Figure 4B-2 the passive element group 500B shown occupies a smaller size in the Y direction compared with the passive element group 500C.

[0052] Figure 4D-1 is a three-dimensional schematic diagram of a passive element group 500D according to the fourth stacking method. Figure 4D-2 is Figure 4D-1 a top view schematic diagram. In this embodiment, the length directions of the first passive element 501 and the second passive element 502 are parallel, and the corresponding long sides of the first passive element 501 and the second passive element 502 are offset by a distance S2 along the Y direction. The electrical connection terminals 503a, 503b of the third passive element 503 are directly joined to the adjacent electrical connection terminals 501b, 502a of the first passive element 501 and the second passive element 502 respectively. In this embodiment, the length direction of the third passive element 503 is perpendicular to the length directions of the first passive element 501 and the second passive element 502.

[0053] In an embodiment where the dimensions of each of the first passive element 501 to the third passive element 503 are 600*300 μm, the distance S2 by which the first passive element 501 and the second passive element 502 are offset along the Y direction can be 40 μm. In this way, the total dimension D1 of the passive element group 500D in the X direction is 1050 μm, and the total dimension D2 in the Y direction is 640 μm. In an embodiment where the dimensions of each of the first passive element 501 to the third passive element 503 are 400*200 μm, the distance S2 by which the first passive element 501 and the second passive element 502 are offset along the Y direction can be 40 μm. In this way, the total dimension D1 of the passive element group 500D in the X direction is 600 μm, and the total dimension D2 in the Y direction is 440 μm. It can be seen that, compared with the above passive element groups 500A, 500B, and 500C, the passive element group 500D can occupy a smaller dimension in the X direction.

[0054] Figure 5A-1 is a three-dimensional schematic diagram of a passive element group 500E according to the fifth stacking method. Figure 5A-2 is Figure 5A-1 a top view schematic diagram of. Refer to Figure 5A-1 and Figure 5A-2 As shown in, in the passive element group 500E, the dimensions of the first passive element 501 to the third passive element 503 can be the same. The first passive element 501 and the second passive element 502 can be aligned along the Y direction and spaced apart by a distance S2. The third passive element 503 is stacked on the first passive element 501 but not on the second passive element 502. The length directions of the first passive element 501, the second passive element 502, and the third passive element 503 can be parallel to each other. The two electrical connection terminals 503a, 503b of the third passive element 503 are directly bonded to the two electrical connection terminals 502a, 502b of the second passive element 502 respectively.

[0055] In an embodiment where the dimensions of each of the first passive element 501 to the third passive element 503 are 600*300 μm, the distance S2 between the first passive element 501 and the second passive element 502 can be 40 μm. In such an embodiment, the total dimension D1 of the passive element group 500E in the X direction is 600 μm, and the total dimension D2 in the Y direction is 640 μm. In an embodiment where the dimensions of each of the first passive element 501 to the third passive element 503 are 400*200 μm, the distance S2 between the first passive element 501 and the second passive element 502 can be 40 μm. In such an embodiment, the total dimension D1 of the passive element group 500E in the X direction is 400 μm, and the total dimension D2 in the Y direction is 440 μm.

[0056] Figure 5B-1It is a three-dimensional schematic diagram of the passive component group 500F according to the sixth stacking method. Figure 5B-2 is Figure 5B-1 a top view schematic diagram of. Figure 5B-1 and Figure 5B-2 Multiple aspects of the passive component group 500F shown can be similar to those of the passive component group 500E shown above Figure 5A-1 and Figure 5A-2 Only the differences between the passive component group 500F shown and Figure 5B-1 and Figure 5B-2 the passive component group 500F shown will be described below.

[0057] In the passive component group 500F, the third passive component 503 is stacked on the first passive component 501 and the second passive component 502. The electrical connection terminals 503a of the third passive component 503 straddle the electrical connection terminals 501a, 502a of the first passive component 501 and the second passive component 502, and the other electrical connection terminal 503b of the third passive component 503 straddles the electrical connection terminals 501b, 502b of the first passive component 501 and the second passive component 502.

[0058] In an embodiment where the dimensions of each of the first passive component 501 to the third passive component 503 are 600 * 300 μm, the distance S2 between the first passive component 501 and the second passive component 502 can be 40 μm. In such an embodiment, the total dimension D1 of the passive component group 500F in the X direction is 600 μm, and the total dimension D2 in the Y direction is 640 μm. In an embodiment where the dimensions of each of the first passive component 501 to the third passive component 503 are 400 * 200 μm, the interval S2 between the first passive component 501 and the second passive component 502 can be 40 μm. In such an embodiment, the total dimension D1 of the passive component group 500F in the X direction is 400 μm, and the total dimension D2 in the Y direction is 440 μm.

[0059] Figure 5C-1 It is a three-dimensional schematic diagram of the passive component group 500G according to the seventh stacking method. Figure 5C-2 is Figure 5C-1Top view schematic diagram. In the passive component group 500G, the third passive component 503 is stacked on the first passive component 501 and the second passive component 502. The length directions of the first passive component 501 and the second passive component 502 are parallel to each other, and the length direction of the third passive component 503 is perpendicular to the length directions of the first passive component 501 and the second passive component 502. The first passive component 501 and the second passive component 502 can be aligned in the Y direction. The electrical connection terminal 503a of the third passive component 503 is directly bonded to the electrical connection terminal 501a of the first passive component 501, and the other electrical connection terminal 503b of the third passive component 503 is directly bonded to the electrical connection terminal 502a of the second passive component 502.

[0060] In an embodiment where the dimensions of each of the first passive component 501 to the third passive component 503 are 600*300 μm, the distance S2 between the first passive component 501 and the second passive component 502 can be 40 μm. In such an embodiment, the total dimension D1 of the passive component group 500G in the X direction is 600 μm, and the total dimension D2 in the Y direction is 640 μm. In an embodiment where the dimensions of each of the first passive component 501 to the third passive component 503 are 400*200 μm, the interval S2 between the first passive component 501 and the second passive component 502 can be 40 μm. In such an embodiment, the total dimension D1 of the passive component group 500G in the X direction is 400 μm, and the total dimension D2 in the Y direction is 440 μm.

[0061] Figure 5D-1 Is a three-dimensional schematic diagram of the passive component group 500H according to the eighth stacking method. Figure 5D-2 Is Figure 5D-1 Top view schematic diagram. In the passive component group 500H, the length direction of the third passive component 503 intersects obliquely with the length directions of the first passive component 501 and the second passive component 502. The two electrical connection terminals 503a, 503b of the third passive component 503 are directly bonded to the electrical connection terminals 501b, 502a at the opposite ends of the first passive component 501 and the second passive component 502.

[0062] In an embodiment where each of the first passive element 501 to the third passive element 503 has a size of 600*300 μm, the distance S2 between the first passive element 501 and the second passive element 502 can be 40 μm. In such an embodiment, the total size D1 of the passive element group 500H in the X direction is 600 μm, and the total size D2 in the Y direction is 640 μm. In an embodiment where each of the first passive element 501 to the third passive element 503 has a size of 400*200 μm, the interval S2 between the first passive element 501 and the second passive element 502 can be 40 μm. In such an embodiment, the total size D1 of the passive element group 500H in the X direction is 400 μm, and the total size D2 in the Y direction is 440 μm.

[0063] As described above, Figures 5A-1 to 5D-2 The total size D1 occupied by the shown passive element groups 500E, 500F, 500G, 500H in the X direction can be the same, and the total size D2 occupied in the Y direction can be the same.

[0064] Figure 6A-1 is a three-dimensional schematic diagram of a passive element group 500I according to the ninth stacking method. Figure 6A-2 is Figure 6A-1 a top view schematic diagram. Refer to Figure 6A-1 and Figure 6A-2 As shown, the sizes of the first passive element 501 to the third passive element 503 can be the same. The length direction of the first passive element 501 is along the X direction, and the length direction of the second passive element 502 is along the Y direction. The first passive element 501 overlaps with an electrical connection terminal 502a of the second passive element 502 along the X direction.

[0065] The third passive element 503 is stacked above the first passive element 501 and the second passive element 502, and the length direction of the third passive element 503 can be parallel to the length direction of the first passive element 501. The electrical connection terminal 501b of the first passive element 501 and the electrical connection terminal 502a of the second passive element 502 are adjacent. The electrical connection terminals 503a, 503b of the third passive element 503 are directly bonded to the electrical connection terminal 501b of the first passive element 501 and the electrical connection terminal 502a of the second passive element 502 respectively, and the third passive element 503 straddles the interval between the first passive element 501 and the second passive element 502.

[0066] In an embodiment where each of the first passive element 501 to the third passive element 503 has a size of 600*300 μm, the length S1 of the interval between the first passive element 501 and the second passive element 502 can be 300 μm. In such an embodiment, the total size D1 of the passive element group 500I in the X direction is 1200 μm, and the total size D2 in the Y direction is 600 μm. In an embodiment where each of the first passive element 501 to the third passive element 503 has a size of 400*200 μm, the length S1 of the interval between the first passive element 501 and the second passive element 502 can be 200 μm. In such an embodiment, the total size D1 of the passive element group 500I in the X direction is 800 μm, and the total size D2 in the Y direction is 400 μm.

[0067] Figure 6B-1 is a perspective view of the passive element group 500J according to the tenth stacking method. Figure 6B-2 is Figure 6B-1 a top view schematic. In the passive element group 500J, the first passive element 501 and the second passive element 502 are located below, and the length direction of the first passive element 501 is perpendicular to the length direction of the second passive element 502. The first passive element 501 can overlap with the middle part of the second passive element 502 in the X direction. The third passive element 503 is stacked on the first passive element 501 but not on the second passive element 502. The two electrical connection terminals 503a, 503b of the third passive element 503 are directly bonded to the two electrical connection terminals 501a, 501b of the first passive element 501 respectively.

[0068] Figure 6C-1 is a perspective view of the passive element group 500K according to the eleventh stacking method. Figure 6C-2 is Figure 6C-1 the top view schematic. Different from the passive element group 500J in Figure 6B-1 and Figure 6B-2 , the first passive element 501 overlaps with the electrical connection terminal 502a at one end of the second passive element 502 in the X direction.

[0069] Figure 6D-1 is a perspective view of the passive element group 500L according to the twelfth stacking method. Figure 6D-2 is Figure 6D-1 the top view schematic. The passive element group 500L is different from Figure 6C-1 and Figure 6C-2Different from the passive element group 500K, the length direction of the third passive element 503 intersects obliquely with the length directions of the first passive element 501 and the second passive element 502 respectively. The two electrical connection terminals 503a and 503b of the third passive element 503 are directly joined to the electrical connection terminal 501b of the first passive element 501 and the electrical connection terminal 502b of the second passive element 502 respectively.

[0070] In Figures 6B-1 to 6D-2 In the passive element groups 500J, 500K, and 500L shown, in an embodiment where the dimensions of each of the first passive element 501 to the third passive element 503 are 600 * 300 μm, the length S1 of the interval between the first passive element 501 and the second passive element 502 can be 40 μm. In such an embodiment, the total dimension D1 of the passive element groups 500J, 500K, and 500L in the X direction is 940 μm, and the total dimension D2 in the Y direction is 600 μm.

[0071] In Figures 6B-1 to 6D-2 In the passive element groups 500J, 500K, and 500L shown, in an embodiment where the dimensions of each of the first passive element 501 to the third passive element 503 are 400 * 200 μm, the length S1 of the interval between the first passive element 501 and the second passive element 502 can be 40 μm. In such an embodiment, the total dimension D1 of the passive element groups 500J, 500K, and 500L in the X direction is 640 μm, and the total dimension D2 in the Y direction is 400 μm.

[0072] Figure 7A-1 is a three-dimensional schematic diagram of a passive element group 500M according to the thirteenth stacking method. Figure 7A-2 is Figure 7A-1 a top view schematic diagram of Figure 7A-1 and Figure 7A-2 The passive element group 500M shown can be similar to Figure 4A-1 and Figure 4A-2 the passive element group 500A shown in many aspects. Refer to Figure 7A-1 and Figure 7A-2As shown, the first passive element 501 and the second passive element 502 in the passive element group 500M are located below, and the length directions of both the first passive element 501 and the second passive element 502 are along the X direction, and the first passive element 501 and the second passive element 502 can be aligned along the X direction. The third passive element 503 is stacked above the first passive element 501 and the second passive element 502, and the length direction of the third passive element 503 can be parallel to the length directions of the first passive element 501 and the second passive element 502. The sizes of the first passive element 501 and the second passive element 502 can be the same. The size of the third passive element 503 is smaller than the size of either the first passive element 501 or the second passive element 502, that is, in a top view, the dimensions of the third passive element 503 in both the length direction and the width direction are smaller than the corresponding dimensions of the first passive element 501 and the second passive element 502.

[0073] The electrical connection terminals 501b of the first passive element 501 and the electrical connection terminal 502a of the second passive element 502 are adjacent, and the electrical connection terminals 503a, 503b of the third passive element 503 are directly bonded to the electrical connection terminal 501b of the first passive element 501 and the electrical connection terminal 502a of the second passive element 502 respectively, and the third passive element 503 straddles the gap between the first passive element 501 and the second passive element 502.

[0074] Figure 7B-1 is a three-dimensional schematic diagram of the passive element group 500N according to the fourteenth stacking method. Figure 7B-2 is Figure 7B-1 a top view schematic diagram. Figure 7B-1 and Figure 7B-2 The passive element group 500N shown in Figure 4C-1 and Figure 4C-2 can be similar to the passive element group 500C shown in

[0075] in many aspects. The length directions of the first passive element 501 and the second passive element 502 are parallel, and the corresponding long sides of the first passive element 501 and the second passive element 502 are offset along the Y direction. The sizes of the first passive element 501 and the second passive element 502 can be the same. The size of the third passive element 503 is smaller than the size of either the first passive element 501 or the second passive element 502.

[0075] The length direction of the third passive element 503 intersects obliquely with the length directions of the first passive element 501 and the second passive element 502. The electrical connection terminals 503a, 503b of the third passive element 503 are directly bonded to the adjacent electrical connection terminals 501b, 502a of the first passive element 501 and the second passive element 502 respectively.

[0076] Figure 7C-1It is a three-dimensional schematic diagram of the passive component group 500O according to the fifteenth stacking method. Figure 7C-2 is Figure 7C-1 a top view schematic diagram of. Figure 7C-1 and Figure 7C-2 The passive component group 500O shown in can be similar to Figure 4D-1 and Figure 4D-2 in many aspects. In the passive component group 500O, the length directions of the first passive component 501 and the second passive component 502 are parallel, and the corresponding long sides of the first passive component 501 and the second passive component 502 are offset along the Y direction. The first passive component 501 and the second passive component 502 are not aligned in the Y direction. The sizes of the first passive component 501 and the second passive component 502 can be the same. The size of the third passive component 503 is smaller than that of either the first passive component 501 or the second passive component 502.

[0077] The length direction of the third passive component 503 is perpendicular to the length directions of the first passive component 501 and the second passive component 502. The electrical connection terminals 503a, 503b of the third passive component 503 are directly joined to the adjacent electrical connection terminals 501b, 502a of the first passive component 501 and the second passive component 502 respectively. The electrical connection terminals 501a, 502b of the first passive component 501 and the second passive component 502 that are far from each other are located on opposite sides of the third passive component 503.

[0078] Figure 8A It is a three-dimensional schematic diagram of the passive component group 500P according to the sixteenth stacking method. Figure 8B is Figure 8A a top view schematic diagram of. Figure 8A and Figure 8B The passive component group 500P shown in can be similar to Figure 5C-1 and Figure 5C-2 in many aspects.

[0079] The sizes of the first passive component 501 and the second passive component 502 are the same. The first passive component 501 and the second passive component 502 are aligned in the Y direction. The third passive component 503 is stacked on the first passive component 501 and the second passive component 502. The size of the third passive component 503 is smaller than that of either the first passive component 501 or the second passive component 502. The length directions of the first passive component 501 and the second passive component 502 are parallel to each other, and the length direction of the third passive component 503 is perpendicular to the length directions of the first passive component 501 and the second passive component 502. The electrical connection terminals 503a, 503b of the third passive component 503 are directly joined to the electrical connection terminals 501a, 502a of the first passive component 501 and the second passive component 502.

[0080] Figure 9A-1 It is a three-dimensional schematic diagram of the passive component group 500Q according to the seventeenth stacking method. Figure 9A-2 is Figure 9A-1 the top view schematic diagram. Figure 9A-1 and Figure 9A-2 The passive component group 500Q shown in Figure 6A-1 and Figure 6A-2 can be similar to the passive component group 500I shown in

[0081] Figure 9B-1 in many aspects. The difference is that the size of the third passive component 503 is smaller than the size of either the first passive component 501 or the second passive component 502. Figure 9B-2 is Figure 9B-1 the top view schematic diagram. Figure 9B-1 and Figure 9B-2 The passive component group 500R shown in Figure 6D-1 and Figure 6D-2 can be similar to the passive component group 500L shown in

[0082] Figure 10A-1 in many aspects. The difference is that the size of the third passive component 503 is smaller than the size of either the first passive component 501 or the second passive component 502. Figure 10A-2 is Figure 10A-1 the top view schematic diagram. Figure 10A-1 and Figure 10A-2 The passive component group 500S shown in Figure 7A-1 and Figure 7A-2 can be similar to the passive component group 500M shown in Figure 4A-1 and Figure 4A-2 and the passive component group 500A shown in

[0083] Figure 10B-1 The following mainly describes the differences of the passive component group 500S. In the passive component group 500S, the size of the third passive component 503 is larger than the size of either the first passive component 501 or the second passive component 502 below it. The electrical connection terminal 501b of the first passive component 501 and the electrical connection terminal 502a of the second passive component 502 are adjacent, and the electrical connection terminal 501a of the first passive component 501 is far from the second passive component 502. One electrical connection terminal 503a of the third passive component 503 is directly joined to the electrical connection terminal 501a of the first passive component 501, and the other electrical connection terminal 503b of the third passive component 503 is directly joined to the electrical connection terminal 502a of the second passive component 502.

[0083] Figure 10B-1It is a three-dimensional schematic diagram of a passive component group 500T according to the twentieth stacking method. Figure 10B-2 It is Figure 10B-1 a top view schematic diagram. Figure 10B-1 And Figure 10B-2 the passive component group 500T shown in Figure 6A-1 and Figure 6A-2 can be similar to the passive component group 600I shown in Figure 9A-1 and Figure 9A-2 the passive component group 500Q shown in many aspects. The difference of the passive component group 500T is that the size of the third passive component 503 can be larger than the size of either the first passive component 501 or the second passive component 502. The electrical connection terminal 501b of the first passive component 501 is adjacent to the electrical connection terminal 5002a of the second passive component 502. One electrical connection terminal 503a of the third passive component 503 is directly bonded to the electrical connection terminal 501a of the first passive component 501 away from the second passive component 502, and the other electrical connection terminal 503b of the third passive component 503 is directly bonded to the electrical connection terminal 502a of the second passive component 502.

[0084] Figure 11A-1 It is a three-dimensional schematic diagram of a passive component group 500U according to the twenty-first stacking method. Figure 11A-2 It is Figure 11A-1 a top view schematic diagram. Refer to Figure 11A-1 and Figure 11A-2 , in some embodiments, a passive component group 500U may further include a fourth passive component 504. The first passive component 501, the second passive component 502, and the fourth passive component 504 are located below the third passive component 503. The sizes of the first passive component 501, the second passive component 502, and the fourth passive component 504 may be the same, and the size of the third passive component 503 may be larger than any one of the sizes of the first passive component 501, the second passive component 502, and the fourth passive component 504.

[0085] The length directions of the first passive element 501, the second passive element 502, and the fourth passive element 504 are parallel to each other. The length direction of the third passive element 503 is perpendicular to the length directions of the first passive element 501, the second passive element 502, and the fourth passive element 504. The first passive element 501, the second passive element 502, and the fourth passive element 504 are arranged at intervals in the Y direction, and the fourth passive element 504 is located between the first passive element 501 and the second passive element 502. The second passive element 502 and the fourth passive element 504 can be aligned with each other along the Y direction, and the first passive element 501 may not be aligned with the second passive element 502 and the fourth passive element 504 along the Y direction. The third passive element 503 partially overlaps each of the first passive element 501, the second passive element 502, and the fourth passive element 504.

[0086] Specifically, an electrical connection terminal 501a of the first passive element 501, an electrical connection terminal 502a of the second passive element 502, and an electrical connection terminal 504a of the fourth passive element 504 vertically overlap with the third passive element 503. Another electrical connection terminal 501a of the first passive element 501, another electrical connection terminal 504b of the fourth passive element 504, and another electrical connection terminal 502b of the second passive element 502 are located on the opposite side of the third passive element 503. An electrical connection terminal 503a of the third passive element 503 is directly bonded to the electrical connection terminal 501b of the first passive element 501, and another electrical connection terminal 503b is directly bonded to the electrical connection terminal 502a of the second passive element 502.

[0087] Figure 11B-1 is a three-dimensional schematic diagram of the passive element group 500V according to the twenty-second stacking method. Figure 11B-2 is Figure 11B-1 a top view schematic diagram. Refer to Figure 11B-1 and Figure 11B-2 , in the passive element group 500V, the first passive element 501, the second passive element 502, and the fourth passive element 504 are located below the third passive element 503. The first passive element 501, the second passive element 502, and the fourth passive element 504 may have the same size, and the size of the third passive element 503 may be larger than the size of any one of the first passive element 501, the second passive element 502, and the fourth passive element 504.

[0088] The length directions of the first passive element 501, the second passive element 502, and the third passive element 503 are parallel to each other. The length direction of the fourth passive element 504 is perpendicular to the length directions of the first passive element 501, the second passive element 502, and the third passive element 503. The first passive element 501 and the second passive element 502 are arranged at intervals in the Y direction and are aligned with each other. The fourth passive element 504 is located on one side of the first passive element 501 and the second passive element 502 along the X direction. The third passive element 503 partially overlaps with each of the first passive element 501, the second passive element 502, and the fourth passive element 504. Specifically, one electrical connection terminal 503a of the third passive element 503 is directly bonded to the electrical connection terminal 501a of the first passive element 501, and the other electrical connection terminal 503b is directly bonded to the electrical connection terminal 504a of the fourth passive element 504.

[0089] Figure 11C-1 is a three-dimensional schematic diagram of the passive element group 500W according to the twenty-third stacking method. Figure 11C-2 is Figure 11C-1 a top view schematic diagram of. Refer to Figure 11C-1 and Figure 11C-2 , in the passive element group 500W, the sizes of the first passive element 501, the second passive element 502, and the fourth passive element 504 can be the same, and the size of the third passive element 503 can be larger than any one of the sizes of the first passive element 501, the second passive element 502, and the fourth passive element 504.

[0090] The length directions of the first passive element 501, the second passive element 502, and the fourth passive element 504 are parallel to each other. The length direction of the third passive element 503 is perpendicular to the length directions of the first passive element 501, the second passive element 502, and the fourth passive element 504. The first passive element 501, the second passive element 502, and the fourth passive element 504 are arranged at intervals in the Y direction, and the fourth passive element 504 is located between the first passive element 501 and the second passive element 502. The first passive element 501 and the second passive element 502 can be aligned with each other along the Y direction, and the fourth passive element 504 may not be aligned with the first passive element 501 and the second passive element 502 along the Y direction. The third passive element 503 partially overlaps with each of the first passive element 501, the second passive element 502, and the fourth passive element 504.

[0091] Specifically, an electrical connection terminal 501b of the first passive component 501, an electrical connection terminal 502b of the second passive component 502, and an electrical connection terminal 504a of the fourth passive component 504 are vertically overlapped with the third passive component 503. Another electrical connection terminal 501a of the first passive component 501, another electrical connection terminal 502a of the second passive component 502, and another electrical connection terminal 504b of the fourth passive component 504 are located on the opposite side of the third passive component 503. An electrical connection terminal 503a of the third passive component 503 is directly bonded to the electrical connection terminal 501b of the first passive component 501, and another electrical connection terminal 503b is directly bonded to the electrical connection terminal 502b of the second passive component 502.

[0092] Return reference Figure 3A and Figure 3B , each passive component group 500 in the semiconductor package structure 200 can adopt any one of the passive component groups 500A - 500W described above. The stacking manner of the passive components in any two passive component groups 500 among the multiple passive component groups 500 can be the same or different.

[0093] In summary, in the semiconductor package structure of the present application, by stacking the passive components in the passive component group between the first substrate and the second substrate, the advantage of reducing the area of the passive component group with the same number of components is achieved. Furthermore, the areas of the first substrate and the second substrate and the area of the semiconductor package structure can be reduced. The area of the panel docked with the semiconductor package structure can be reduced, and finally the unconnected influence caused by the warping of the docked panel can be reduced. In addition, by integrating the active components into the interlayer between the first substrate and the second substrate and using the passive component group as a barrier, the shielding effect can be achieved simultaneously.

[0094] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A semiconductor packaging structure, characterized in that: include: a first substrate; a second substrate, located above the first substrate; An active component is disposed on the first substrate; A plurality of passive component groups are disposed on the first substrate and surround the active component, wherein the passive components in the passive component groups are stacked in an interlaced manner and are used to shield electromagnetic wave interference.

2. The semiconductor package structure according to claim 1, wherein: One of the passive component groups includes a first passive component, a second passive component and a third passive component. The first passive component and the second passive component are laterally spaced apart on the first substrate, and the third passive component partially overlaps the first passive component and the second passive component in a vertical direction.

3. The semiconductor package structure according to claim 2, characterized in that: The plurality of passive component groups are disposed on the upper surface of the first substrate, and the first passive component, the second passive component, and the third passive component each have a length direction parallel to the upper surface of the first substrate. The length direction of the first passive component, the length direction of the second passive component and the length direction of the third passive component are parallel to each other.

4. The semiconductor package structure according to claim 2, wherein: The plurality of passive component groups are disposed on the upper surface of the first substrate, and the first passive component, the second passive component, and the third passive component each have a length direction parallel to the upper surface of the first substrate. The length direction of the first passive component is parallel to the length direction of the second passive component, and the length direction of the third passive component is obliquely intersected with the length directions of the first passive component and the second passive component.

5. The semiconductor package structure according to claim 2, wherein: The plurality of passive component groups are disposed on the upper surface of the first substrate, and the first passive component, the second passive component, and the third passive component each have a length direction parallel to the upper surface of the first substrate. The length direction of the first passive component is parallel to the length direction of the second passive component, and the length direction of the third passive component is perpendicular to the length direction of the first passive component and the length direction of the second passive component.

6. The semiconductor package structure according to claim 2, wherein: The plurality of passive component groups are disposed on the upper surface of the first substrate, and the first passive component, the second passive component, and the third passive component each have a length direction parallel to the upper surface of the first substrate. The length direction of the first passive component is parallel to the length direction of the third passive component, and the length direction of the second passive component is perpendicular to the length directions of the first passive component and the third passive component.

7. The semiconductor package structure according to claim 2, wherein: The plurality of passive component groups are disposed on the upper surface of the first substrate, and the first passive component, the second passive component, and the third passive component each have a length direction parallel to the upper surface of the first substrate. The length direction of the first passive component is perpendicular to the length direction of the second passive component, and the length direction of the third passive component obliquely intersects with the length directions of the first passive component and the second passive component.

8. The semiconductor package structure according to claim 2, wherein: One of the passive component groups further includes a fourth passive component, which is laterally spaced apart from the first passive component and the second passive component on the first substrate, and the third passive component also partially overlaps with the fourth passive component in the vertical direction.

9. The semiconductor package structure according to claim 1, wherein: In a top view, a plurality of staggered and stacked passive components in one passive component group surround a corner of the active component.

10. The semiconductor package structure according to claim 1, wherein: Three side surfaces of the active component are adjacent to the edge of the first substrate, and the plurality of passive component groups are disposed beside the three side surfaces.

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