Bio-electricity signal acquisition equipment

Abstract

The utility model relates to bio-electricity signal acquisition equipment, which comprises a PCBA (Printed Circuit Board Assembly) board, a signal acquisition module and a signal processing module, the flexible printed circuit board comprises a second conductive connection position, a printed circuit and a thin film layer which is arranged over against the PCBA board; the conductive silver adhesive is used for communicating the first conductive connection position with the second conductive connection position; the adhesive layer has a preset thickness and is positioned between the PCBA board and the flexible printed circuit board, so that an adhesive filling space with a preset size is formed between the PCBA board and the flexible printed circuit board; the filling glue layer is formed by filling glue liquid in the glue filling space and curing; the device has the advantages of stable sampling and strong impact resistance.

Description

Technical Field

[0001] The utility model relates to the field of medical devices, in particular to a bioelectric signal acquisition device. Background Art

[0002] In the field of medical devices, bioelectric signal acquisition devices are commonly used to acquire bioelectric signals. Since the application of the combined material of Ag and AgCl can improve the effect of bioelectric signal acquisition, in the existing bioelectric signal acquisition devices, in order to improve the sampling stability and sampling effect, the PCBA board and the flexible printed circuit board printed with Ag and AgCl are usually assembled and used.

[0003] In an existing assembly method, a jig is usually used for auxiliary assembly. Specifically: first, conductive silver glue is dotted on the flexible printed circuit board; then, the PCBA board is fixed at a preset position on the flexible printed circuit board by using the jig, and the jig is sent into an oven together with the PCBA board and the flexible printed circuit board for baking to cure the conductive silver glue, so as to realize the connection between the PCBA board and the flexible printed circuit board; then, glue is dotted around the PCBA board to make the glue penetrate between the PCBA board and the flexible printed circuit board, and finally the PCBA board and the flexible printed circuit board are sent into the oven for baking to cure the glue. In this process, during the curing process of the conductive silver glue, its thickness is uncontrollable, which will further cause the distance between the PCBA board and the flexible printed circuit board to be inconsistent. During the injection of glue, it is difficult for the glue to penetrate and fill the gap between the PCBA board and the thin film layer, further affecting the impact resistance and durability of the bioelectric signal acquisition device.

[0004] Therefore, it is urgent for those skilled in the art to provide a bioelectric signal acquisition device that takes into account both sampling stability and strong impact resistance. Summary of the Utility Model

[0005] The technical problem to be solved by the utility model is to overcome the defects in the prior art, so as to provide a bioelectric signal acquisition device.

[0006] To achieve the above purpose, the utility model adopts the following technical scheme:

[0007] A bioelectric signal acquisition device, comprising:

[0008] A PCBA board, including a first conductive connection position;

[0009] A flexible printed circuit board, including a second conductive connection position, a printed circuit, and a thin film layer disposed opposite to the PCBA board;

[0010] Conductive silver glue, used to connect the first conductive connection position and the second conductive connection position;

[0011] The adhesive layer, having a preset thickness, is located between the PCBA board and the flexible printed circuit board, so as to form a glue-filling spacing with a preset size between the PCBA board and the flexible printed circuit board;

[0012] The filling glue layer is formed by curing glue liquid filled in the glue-filling spacing.

[0013] Preferably, the adhesive layer is set as a high-temperature resistant double-sided adhesive;

[0014] One end face of the high-temperature resistant double-sided adhesive is adhered to the PCBA board, and the other end face is adhered to the flexible printed circuit board.

[0015] Preferably, the adhesive layer includes a covering part;

[0016] The covering part at least covers the overlapping area of the printed circuit and the thin film layer;

[0017] One end of the covering part extends out of the thin film layer along the direction of the printed circuit.

[0018] Preferably, the adhesive layer further includes a blocking part;

[0019] The blocking part is located at one end of the covering part away from the thin film layer;

[0020] The blocking part and the covering part enclose a diversion channel, and the diversion channel communicates the glue-filling spacing and the outside of the PCBA board.

[0021] Preferably, the PCBA board has a communication hole;

[0022] The communication hole communicates the glue-filling spacing and the outside of the PCBA board.

[0023] Preferably, there are two adhesive layers, which are respectively located on two opposite sides of the PCBA board;

[0024] The two ends of the two adhesive layers, the outer edge of the PCBA board and the outer edge of the thin film layer enclose a glue injection port;

[0025] The glue injection port communicates with the glue-filling spacing.

[0026] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0027] In the above technical solution, a bioelectric signal acquisition device is provided. By setting an adhesive layer with a preset thickness between the PCBA board and the flexible printed circuit board, a glue-filling gap with a preset width can be formed between the PCBA board and the flexible printed circuit board, which can avoid different widths at different positions of the glue-filling gap, and further avoid the glue liquid not filling the entire glue-filling gap, and can increase the connection stability between the PCBA board and the flexible printed circuit board. Description of the Drawings

[0028] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required to be used in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0029] Figure 1 It is a schematic structural diagram of one of the embodiments of the present invention.

[0030] Figure 2 It is Figure 1 an enlarged schematic view of position A in

[0031] Figure 3 It is Figure 1 a sectional view of

[0032] Figure 4 It is Figure 3 an enlarged schematic view of position B in

[0033] Figure 5 It is a schematic diagram of the positions of the conductive silver glue and the adhesive layer on the flexible printed circuit board.

[0034] Figure 6 It is a connection schematic diagram of the PCBA board and the adhesive layer.

[0035] Description of the Reference Numerals:

[0036] 1. PCBA board; 10. Communication hole; 11. First conductive connection position; 2. Flexible printed circuit board; 21. Second conductive connection position; 22. Printed circuit; 23. Film layer; 3. Conductive silver glue; 4. Adhesive layer; 41. Covering part; 42. Blocking part; 43. Flow guiding channel; 5. Glue-filling gap; 50. Glue injection port; 6. Filled glue layer. Detailed Embodiments

[0037] The technical solution of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0038] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0039] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0040] See Figures 1 to 6 , an embodiment of the present utility model provides a bioelectric signal acquisition device, including a PCBA board 1, a flexible printed circuit board 2, a conductive silver paste 3, an adhesive layer 4, and a filling glue layer 6. Specifically, the PCBA board 1 includes a first conductive connection position 11; the flexible printed circuit board 2 includes a second conductive connection position 21, a printed circuit 22, and a thin film layer 23 disposed opposite to the PCBA board 1; the conductive silver paste 3 is used to connect the first conductive connection position 11 and the second conductive connection position 21; the adhesive layer 4 has a preset thickness, and the adhesive layer 4 is located between the PCBA board 1 and the flexible printed circuit board 2 to form a glue filling space 5 with a preset size between the PCBA board 1 and the flexible printed circuit board 2; the filling glue layer 6 is formed by curing the glue liquid filled in the glue filling space 5.

[0041] In this embodiment, by providing an adhesive layer 4 with a preset thickness between the PCBA board 1 and the flexible printed circuit board 2, a glue-filling gap 5 with a preset width can be formed between the PCBA board 1 and the flexible printed circuit board 2, which can avoid excessive local resistance within the glue-filling gap 5 caused by different widths at different positions of the glue-filling gap 5, and further avoid the glue liquid being unable to fill the entire glue-filling gap 5, and can increase the connection stability between the PCBA board 1 and the flexible printed circuit board 2.

[0042] It can be known that after the bioelectrical signal acquisition device is assembled, the first conductive connection positions 11 are arranged in one-to-one correspondence with the second conductive connection positions 21. The conductive silver glue 3 realizes the electrical connection between the first conductive connection positions 11 and the second conductive connection positions 21. At the same time, it can also increase the connection stability between the PCBA board 1 and the flexible printed circuit board 2 to a certain extent.

[0043] It is worth noting that in this embodiment, the preset width H of the glue-filling gap 5 is equal to the preset thickness of the adhesive layer 4. The "preset width H" is also the distance between one end face of the PCBA board 1 and one end face of the flexible printed circuit board 2.

[0044] For the convenience of assembling the bioelectrical signal acquisition device, in this embodiment, the adhesive layer 4 is set as a high-temperature resistant double-sided adhesive; one end face of the high-temperature resistant double-sided adhesive is adhered to the PCBA board 1, and the other end face is adhered to the flexible printed circuit board 2.

[0045] Since the filling glue layer 6 is cured and filled between the thin film layer 23 and the PCBA board 1, and the cured filling glue layer 6 has a certain hardness. Correspondingly, if the printed circuit 22 is covered by the filling glue layer 6, its hardness will also be further increased. After the bioelectrical signal acquisition device is assembled, when the bioelectrical signal acquisition device is impacted, it is easy to cause the printed circuit 22 to break. To protect the printed circuit 22, in this embodiment, the adhesive layer 4 includes a covering portion 41; the covering portion 41 at least covers the overlapping area of the printed circuit 22 and the thin film layer 23, so that there is a covering portion 41 between the printed circuit 22 on the thin film layer 23 and the filling glue layer 6. The hardness of the covering portion 41 is less than that of the filling glue layer 6, and it has a certain buffering effect to avoid the printed circuit 22 from breaking.

[0046] Furthermore, the PCBA board 1 has a large hardness. The edge of the PCBA board 1 is the area where the soft and hard parts of the bioelectrical signal acquisition device transition, and it is also the area that is more impacted. After the bioelectrical signal acquisition device is assembled, when it is impacted, it is easy to cause the printed circuit 22 to break. Therefore, in this embodiment, one end of the covering portion 41 extends out of the thin film layer 23 along the direction of the printed circuit 22, so that the covering portion 41 can protect the soft and hard transition area of the bioelectrical signal acquisition device (that is, the edge positions of the PCBA board 1 and the flexible printed circuit board 2).

[0047] Since the adhesive liquid has a certain fluidity, and the printed circuit 22 is also provided on the outer side of the thin film layer 23 of the flexible printed circuit board 2, in order to prevent the adhesive liquid from flowing from the glue filling gap 5 to the printed circuit 22 on the outer side of the thin film layer 23 during the process of filling the glue filling gap 5 with the adhesive liquid, in this embodiment, the adhesive layer 4 further includes a blocking portion 42; the blocking portion 42 is located at one end of the covering portion 41 away from the thin film layer 23; the blocking portion 42 and the covering portion 41 enclose a diversion channel 43, and the diversion channel 43 communicates with the glue filling gap 5 and the outside of the PCBA board 1.

[0048] It can be known that the diversion channel 43 enclosed between the blocking portion 42 and the covering portion 41 can also discharge the gas in the glue filling gap 5 during the flow of the adhesive liquid, so as to prevent the gas resistance from affecting the adhesive liquid from filling the entire glue filling gap 5. At the same time, the adhesive liquid can flow into the diversion channel 43 to connect the edge of the PCBA board 1 and the edge of the thin film layer 23, increasing the connection stability and sealing effect between the PCBA board 1 and the thin film layer 23.

[0049] It should be noted that the position distribution and size requirements of the covering portion 41, the blocking portion 42 and the diversion channel 43 of the adhesive layer 4 can be set according to the structure of the flexible printed circuit board 2. The covering portion 41 can protect the printed circuit 22, the blocking portion 42 can block the adhesive liquid from flowing to the printed circuit 22 outside the thin film layer 23, and the diversion channel 43 can communicate the glue filling gap 5 with the outside of the edge of the PCBA board 1.

[0050] In order to increase the injection efficiency (that is, the adhesive liquid fills the glue filling gap 5), keep the size in the glue filling gap 5 uniform, and increase the stability and support of the PCBA board 1 under force, in this embodiment, two adhesive layers 4 are provided and are respectively located on two opposite sides of the PCBA board 1; the two ends of the two adhesive layers 4, the outer edge of the PCBA board 1 and the outer edge of the thin film layer 23 enclose a glue injection port 50; the glue injection port 50 communicates with the glue filling gap 5.

[0051] In order to facilitate the flow of the adhesive liquid, in this embodiment, the PCBA board 1 has a communication hole 10; the communication hole 10 communicates with the glue filling gap 5 and the outside of the PCBA board 1. After injecting the adhesive liquid from the glue injection port 50, the adhesive liquid flows, and under the action of the fluid flow force, the gas is discharged through the communication hole 10, facilitating the adhesive liquid to fill the entire glue filling gap 5.

[0052] In this embodiment, the PCBA board 1 is set to be rectangular, and printed circuits 22 are provided on two opposite sides. The two adhesive layers 4 are located on two opposite sides of the PCBA board 1, and the glue injection port 50 is provided at both ends of the PCBA board 1 where the adhesive layers 4 are not provided. The process of injecting glue and curing to form the filling glue layer 6 is as follows: injecting the adhesive liquid from the two glue injection ports 50, and the adhesive liquid flows into the glue filling gap 5 and the diversion channel 43 in sequence and cures to form the filling glue layer 6.

[0053] The above embodiments are only the preferred embodiments of the present utility model, and the scope of protection of the present utility model cannot be limited thereby. Any non-substantive changes and substitutions made by those skilled in the art based on the present utility model fall within the scope of protection required by the present utility model.

Claims

1. A bioelectric signal acquisition device, characterized in that: include: A PCBA board (1) comprising a first conductive connection point (11); A flexible printed circuit board (2), comprising a second conductive connection position (21), a printed circuit (22), and a thin film layer (23) disposed opposite to the PCBA board (1); Conductive silver glue (3), used for connecting the first conductive connection position (11) and the second conductive connection position (21); An adhesive layer (4) having a preset thickness and located between the PCBA board (1) and the flexible printed circuit board (2) so as to form an adhesive filling distance (5) of a preset size between the PCBA board (1) and the flexible printed circuit board (2); The filling glue layer (6) is formed by filling glue liquid in the filling glue interval (5) and solidifying it.

2. A bioelectric signal acquisition device according to claim 1, characterized in that: The adhesive layer (4) is configured as a high temperature resistant double-sided adhesive; One end surface of the high temperature resistant double-sided adhesive tape is adhered to the PCBA board (1), and the other end surface is adhered to the flexible printed circuit board (2).

3. A bioelectric signal acquisition device according to claim 1 or 2, characterized in that: The adhesive layer (4) comprises a covering portion (41); The covering portion (41) at least covers the overlapping area of ​​the printed circuit (22) and the thin film layer (23); One end of the covering portion (41) extends out of the film layer (23) along the direction of the printed circuit (22).

4. The bioelectric signal acquisition device according to claim 3, characterized in that: The adhesive layer (4) further comprises a blocking portion (42); The blocking portion (42) is located at an end of the covering portion (41) away from the film layer (23); The blocking portion (42) and the covering portion (41) enclose a guide channel (43), and the guide channel (43) communicates with the glue filling interval (5) and the outside of the PCBA board (1).

5. A bioelectric signal acquisition device according to claim 1 or 4, characterized in that: The PCBA board (1) has a communication hole (10); The connecting hole (10) connects the glue filling interval (5) and the outside of the PCBA board (1).

6. The bioelectric signal acquisition device according to claim 1, characterized in that: The adhesive layers (4) are provided with two and are respectively located on two opposite sides of the PCBA board (1); The two ends of the two adhesive layers (4), the outer edge of the PCBA board (1) and the outer edge of the film layer (23) enclose a glue injection port (50); The glue injection port (50) is in communication with the glue filling interval (5).

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