Polishing pad dressing disc replacing device and polishing pad dressing disc replacing system

Abstract

The utility model provides a grinding pad finishing disc replacing device and a grinding pad finishing disc replacing system.The grinding pad finishing disc replacing device comprises a first bearing table, a first driving part and a first cavity; through cooperation of the first bearing table and the first cavity, automatic replacement of the to-be-replaced grinding pad finishing disc and the to-be-replaced grinding pad finishing disc can be achieved, so that the processing time wasted by manual replacement of the grinding pad finishing disc in the related technology is shortened, and then the machine table utilization rate of the chemical mechanical polishing equipment is increased.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and particularly to a dressing disk replacement device and a dressing disk replacement system for a polishing pad. Background Art

[0002] In chemical mechanical polishing, each polishing table has a dedicated dressing disk for the polishing pad. After multiple polishings, the surface of the polishing pad on the polishing table becomes smooth. Due to the change in the pattern of the polished wafer, the polishing head applies different pressures on the polishing table through sweeping and rotating motions, resulting in uneven wear of the polishing pad. The dressing disk applies a fixed pressure on the dresser through sweeping and rotating motions, and the diamond on the surface of the dresser makes the polishing pad rough and uniform again, so that the wafer can obtain good topography and uniformity.

[0003] However, after being used for a period of time, the dresser needs to be replaced manually, resulting in a large amount of process time wasted during the process of shutting down the chemical mechanical polishing equipment to replace the consumables and then restarting the machine, and thus the utilization rate of the chemical mechanical polishing equipment is relatively low. Summary of the Utility Model

[0004] The purpose of this application is to provide a dressing disk replacement device and a dressing disk replacement system for a polishing pad, aiming to solve the problem in the related art that the dresser in the chemical mechanical polishing equipment needs to be replaced manually, resulting in a relatively low utilization rate of the chemical mechanical polishing equipment.

[0005] In a first aspect, this application provides a dressing disk replacement device for a polishing pad, including:

[0006] A first carrier for carrying the dressing disk for the polishing pad;

[0007] A first driving member connected to the first carrier and used to drive the first carrier to move along a first direction; and

[0008] A first cavity, including a first upper cavity and a first lower cavity. The first upper cavity is used to accommodate the dressing disk for the polishing pad to be replaced, and the first lower cavity is used to accommodate the dressing disk for the polishing pad to be removed;

[0009] At the connection of the first upper cavity and the first lower cavity, there are a first opening and a second opening that are opposite in the first direction and parallel to the surface of the first carrier. The height of the first opening is greater than the thickness of the first carrier and less than the sum of the thicknesses of the first carrier and the dressing disk for the polishing pad, and the height of the second opening is greater than the sum of the thicknesses of the first carrier and the dressing disk for the polishing pad.

[0010] In some embodiments, it further includes a support assembly. The support assembly includes at least one support portion, and the support portion is arranged in the cavity of the first upper cavity and is movably installed in the first upper cavity;

[0011] The support part includes a first state and a second state. When the support part is in the first state, the support part limits the lapping pad dressing disc in the first upper cavity in the second direction; when the support part is in the second state, the support part cancels the limitation on the lapping pad dressing disc, and the second direction intersects the first direction.

[0012] In some embodiments, the first upper cavity includes a third opening, and the third opening is a channel for storing the lapping pad dressing disc to be replaced into the first upper cavity; and / or

[0013] The first lower cavity includes a fourth opening, and the fourth opening is a channel for taking out the lapping pad dressing disc to be replaced from the first lower cavity.

[0014] In some embodiments, it further includes:

[0015] A second carrier for receiving the lapping pad dressing disc to be replaced transmitted from the first carrier; and

[0016] A second driving member, connected to the second carrier and used for driving the second carrier to move along the second direction, and the second direction intersects the first direction.

[0017] In some embodiments, it further includes a second cavity;

[0018] The second driving member drives the second carrier to move along the second direction in the second cavity;

[0019] The second cavity includes a fifth opening, and the fifth opening has a third state and a fourth state;

[0020] When the fifth opening is in the third state, the height of the fifth opening is greater than the thickness of the first carrier and less than the sum of the thicknesses of the first carrier and the lapping pad dressing disc;

[0021] When the fifth opening is in the fourth state, the height of the fifth opening is greater than the sum of the thicknesses of the first carrier and the lapping pad dressing disc.

[0022] In some embodiments, the first cavity and the second cavity are connected;

[0023] Wherein, the second opening and the fifth opening are the same opening.

[0024] In some embodiments, the cavity wall of the second cavity surrounds the periphery of the second carrier to prevent the lapping pad dressing disc from falling off the second carrier.

[0025] In a second aspect, the present application provides a lapping pad dressing disc replacement system, including:

[0026] A grinding device, including a lapping pad dressing disc; and

[0027] A polishing pad dressing disk replacement device is used to replace the polishing pad dressing disk.

[0028] In some embodiments, the grinding device further includes a connecting member connecting the polishing pad dressing disk, and the connecting member vacuum adsorbs the polishing pad dressing disk.

[0029] In some embodiments, the connecting member is provided with a vacuum groove on a side close to the polishing pad dressing disk.

[0030] This application provides a polishing pad dressing disk replacement device. The first driving member drives the first carrier to move along the first direction. The first carrier can move inside and outside the cavity of the first cavity. When the first carrier leaves the first cavity from the second opening, the first carrier carries the polishing pad dressing disk to be replaced stored in the first upper cavity. The first carrier conveys the polishing pad dressing disk to be replaced so that the polishing pad dressing disk to be replaced can be installed at its position to be installed in the chemical mechanical polishing equipment; the first carrier can also receive the polishing pad dressing disk to be replaced in the chemical mechanical polishing equipment and drive the polishing pad dressing disk to be replaced to enter the first cavity from the second opening. When the first carrier leaves the first cavity from the first opening, limited by the size of the first opening, the polishing pad dressing disk to be replaced falls off the first carrier and falls into the first lower cavity; In summary, in the embodiments of this application, the cooperation of the first carrier and the first cavity can realize the automatic replacement of the polishing pad dressing disk to be replaced and the polishing pad dressing disk to be removed, thereby reducing the process time wasted by manually replacing the polishing pad dressing disk in the related art, and further improving the machine utilization rate of the chemical mechanical polishing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The following will clearly show the technical solutions and other beneficial effects of this application by describing the specific embodiments of this application in detail in conjunction with the drawings.

[0032] Figure 1 is a schematic structural diagram of the polishing pad dressing disk replacement device provided by the embodiment of this application;

[0033] Figure 2 is a schematic structural diagram of the polishing pad dressing disk replacement system provided by the embodiment of this application;

[0034] Figure 3 is a schematic structural diagram of the grinding device provided by the embodiment of this application;

[0035] Figure 4 is a schematic structural diagram of one perspective of the connecting member of the grinding device provided by the embodiment of this application;

[0036] Figure 5 is a schematic structural diagram of another perspective of the connecting member of the grinding device provided by the embodiment of this application.

[0037] Description of reference numerals:

[0038] 100. Grinding pad conditioning disc replacement device; 200. Grinding pad conditioning disc replacement system; 1. First supporting platform; 2. Grinding pad conditioning disc; 3. First driving member; 4. First cavity; 41. First upper cavity; 42. First lower cavity; 5. First opening; 6. Second opening; 7. Support assembly; 71. Support part; 8. Third opening; 9. Fourth opening; 10. Second supporting platform; 11. Second driving member; 12. Second cavity; 13. Fifth opening; 14. Grinding device; 141. Connecting member; 142. Pipeline; 143. Valve; 144. Pressure sensor; 145. Gas supply device; 146. Connecting arm; 147. Connecting shaft; 15. First groove; 16. Vacuum groove. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0040] It should be understood that although the terms first, second, etc. may be used herein to describe various components, these components should not be limited to these terms. These terms are used to distinguish one component from another component. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the present application.

[0041] It should be understood that when a component is said to be "on" or "connected" another component, it can be directly on or connected to another component, or there may be an intervening component. Other words used to describe the relationship between components should be interpreted in a similar manner.

[0042] As used herein, the term "layer" refers to a portion of a material including an area having a thickness. A layer may extend over the entire underlying or superstructure, or may have an extent that is less than the extent of the underlying or superstructure. In addition, a layer may be an area of ​​a uniform or non-uniform continuous structure having a thickness that is less than the thickness of a continuous structure. For example, a layer may be located between the top and bottom surfaces of a continuous structure or between any set of horizontal planes at the top and bottom surfaces. A layer may extend horizontally, vertically and / or along a tapered surface. A substrate may be a layer, which may include one or more layers, and / or may have one or more layers on, above and / or below it. A layer may include multiple layers. For example, an interconnect layer may include one or more conductive layers and a contact layer and one or more dielectric layers.

[0043] It should be noted that the diagrams provided in the embodiments of the present application only illustrate the basic concept of the present application in a schematic manner. Although only the components related to the present application are shown in the diagrams and are not drawn according to the number, shape, and size of the components in actual implementation, the types, quantities, and proportions of the components in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0044] The present application provides a device for replacing a polishing pad dressing disk. Figures 1 to 5 These are some embodiments of the present application.

[0045] Among them, the X direction in the attached drawings is the first direction, and the Y direction is the second direction. The first direction and the second direction intersect, and the included angle between the first direction and the second direction is not limited and can be 80°, 85°, 90°, 95°, 100°. In the following embodiments, the included angle between the first direction and the second direction is 90° for illustration. It should be emphasized that the included angle between the first direction and the second direction being 90° does not constitute a limitation to the solution of the embodiments of the present application below.

[0046] Please refer to Figures 1 to 2 , in some embodiments of the present application, the device 100 for replacing a polishing pad dressing disk includes a first carrier 1 and a first driving member 3. The first carrier 1 is used to carry the polishing pad dressing disk 2; the first driving member 3 is connected to the first carrier 1 and is used to drive the first carrier 1 to move along the first direction X. Among them, the first carrier 1 can receive the polishing pad dressing disk 2 to be replaced in the chemical mechanical polishing equipment and convey the polishing pad dressing disk 2 to be replaced in the chemical mechanical polishing equipment.

[0047] The device 100 for replacing a polishing pad dressing disk further includes a first cavity 4. The first cavity 4 includes a first upper cavity 41 and a first lower cavity 42. The first upper cavity 41 is used to accommodate the polishing pad dressing disk 2 to be replaced, and the first lower cavity 42 is used to accommodate the polishing pad dressing disk 2 to be replaced. That is, the first carrier 1 can receive the polishing pad dressing disk 2 to be replaced from the first upper cavity 41 and transfer the polishing pad dressing disk 2 to be replaced to the first lower cavity 42.

[0048] It can be understood that the polishing pad dressing disk 2 accommodated in the first lower cavity 42 is the polishing pad dressing disk 2 that has been used and needs to be replaced in the chemical mechanical polishing equipment.

[0049] Among them, at the connection of the first upper cavity 41 and the first lower cavity 42, there are a first opening 5 and a second opening 6 that are opposite in the first direction X and parallel to the tabletop of the first carrier 1. The height of the first opening 5 is greater than the thickness of the first carrier 1 and less than the sum of the thicknesses of the first carrier 1 and the polishing pad dressing disk 2, and the height of the second opening 6 is greater than the sum of the thicknesses of the first carrier 1 and the polishing pad dressing disk 2.

[0050] In the technical solution of the present application, the first driving member 3 drives the first carrier 1 to move along the first direction X. The first carrier 1 can move inside and outside the cavity of the first cavity 4. When the first carrier 1 leaves the first cavity 4 from the second opening 6, the first carrier 1 carries the abrasive pad dressing disc 2 to be replaced stored in the first upper cavity 41. The first carrier 1 conveys the abrasive pad dressing disc 2 to be replaced so that the abrasive pad dressing disc 2 to be replaced can be installed at its position to be installed in the chemical mechanical polishing equipment; the first carrier 1 can also receive the abrasive pad dressing disc 2 to be replaced in the chemical mechanical polishing equipment, and drive the abrasive pad dressing disc 2 to be replaced to enter the first cavity 4 from the second opening 6. When the first carrier 1 leaves the first cavity 4 from the first opening 5, due to the size limitation of the first opening 5, the abrasive pad dressing disc 2 to be replaced falls off the first carrier 1 and falls into the first lower cavity 42; in summary, in the embodiment of the present application, the cooperation of the first carrier 1 and the first cavity 4 can realize the automatic replacement of the abrasive pad dressing disc 2 to be replaced and the abrasive pad dressing disc 2 to be removed, thereby reducing the process time wasted by manually replacing the abrasive pad dressing disc 2 in the related art, and further improving the machine utilization rate of the chemical mechanical polishing equipment.

[0051] It should be added that since the height of the second opening 6 is greater than the sum of the thicknesses of the first carrier 1 and the abrasive pad dressing disc 2, that is, the dimension of the second opening 6 in the second direction Y is greater than the sum of the thicknesses of the first carrier 1 and the abrasive pad dressing disc 2, when the first carrier 1 passes through the second opening 6, the abrasive pad dressing disc 2 located on the first carrier 1 will not fall off the first carrier 1.

[0052] In addition, in the process of manually replacing the abrasive pad dressing disc 2 in the related art, it is necessary to open the machine door of the chemical mechanical polishing equipment for replacement. After the replacement of the abrasive pad dressing disc 2 is completed, it is necessary to use a silicon wafer to test the machine to detect the silicon wafer particle content, thereby wasting a large amount of process time of the chemical mechanical polishing equipment. However, the first carrier 1, the first driving member 3 and the first cavity 4 of the present application are all located inside the chemical mechanical polishing equipment, and there is no need to open the machine door to replace the abrasive pad dressing disc 2, and the automatic replacement of the abrasive pad dressing disc 2 to be replaced and the abrasive pad dressing disc 2 to be removed can be realized by using the first carrier 1, thereby reducing the production cost and improving the machine utilization rate of the chemical mechanical polishing equipment.

[0053] When the first carrier 1 conveys the abrasive pad dressing disc 2 to be replaced, it can be that the first carrier 1 directly moves the abrasive pad dressing disc 2 to be replaced to the position where the abrasive pad dressing disc 2 is to be installed in the chemical mechanical polishing equipment; or it can be that other components transfer the abrasive pad dressing disc 2 to be replaced on the first carrier 1 and move the abrasive pad dressing disc 2 to be replaced to the position where the abrasive pad dressing disc 2 is to be installed in the chemical mechanical polishing equipment.

[0054] In some embodiments of the present application, the polishing pad conditioning disc replacement device 100 further includes a support assembly 7 , which includes at least one support portion 71 , which is disposed in the cavity of the first upper cavity 41 and movably installed in the first upper cavity 41 .

[0055] The support portion 71 includes a first state and a second state. When the support portion 71 is in the first state, the support portion 71 limits the grinding pad conditioning disk 2 in the first upper cavity 41 in the second direction Y; when the support portion 71 is in the second state, the support portion 71 cancels the limitation on the grinding pad conditioning disk 2.

[0056] Among them, there is no restriction on the movement mode of the support part 71, and it can be horizontal movement in the first direction X, or it can be rotation around the cavity wall of the first upper cavity 41; in one embodiment of the present application, the support part 71 can be connected to the output shaft of the cylinder and driven by the cylinder to move in the first direction X; in another embodiment of the present application, the support part 71 can be connected to the output shaft of the motor and driven by the motor so that the support part 71 rotates around the cavity wall of the first upper cavity 41.

[0057] In some embodiments of the present application, the first upper cavity 41 includes a third opening 8, which is a passage for storing the grinding pad dressing disc 2 to be replaced into the cavity of the first upper cavity 41; that is, the operator can place an unused grinding pad dressing disc 2 to be replaced into the first upper cavity 41 through the third opening 8.

[0058] In some embodiments of the present application, the first lower cavity 42 includes a fourth opening 9, which is a channel for taking out the grinding pad conditioning disc 2 to be replaced from the cavity of the first lower cavity 42; that is, the operator can take out the used grinding pad conditioning disc 2 to be replaced from the first lower cavity 42 through the fourth opening 9.

[0059] In some embodiments of the present application, the grinding pad dressing disc replacement device 100 also includes a second carrier platform 10 and a second driving member 11, the second carrier platform 10 is used to receive the grinding pad dressing disc 2 to be replaced transmitted from the first carrier platform 1; the second driving member 11 is connected to the second carrier platform 10 and is used to drive the second carrier platform 10 to move along the second direction Y; that is, in this embodiment, after the first carrier platform 1 transports the grinding pad dressing disc 2 to be replaced out of the first cavity 4, the grinding pad dressing disc 2 to be replaced can be transferred to the second carrier platform 10, and through the movement of the second carrier platform 10 in the second direction Y, the grinding pad dressing disc 2 to be replaced is driven close to the position of the grinding pad dressing disc 2 to be installed in the chemical mechanical polishing equipment, so that the grinding pad dressing disc 2 to be replaced can be assembled into the chemical mechanical polishing equipment.

[0060] Since the position of the polishing pad dressing disk 2 to be installed in the chemical mechanical polishing equipment faces the second direction Y, that is, the polishing pad dressing disk 2 needs to be installed on the connecting member 141 in the chemical mechanical polishing equipment. Compared with the first carrier 1 driving the polishing pad dressing disk 2 to be replaced to move in the first direction X, since the second carrier 10 can move in the second direction Y, the second carrier 10 can drive the polishing pad dressing disk 2 to be replaced to be closer to the connecting member 141 in the second direction Y, so as to ensure that the polishing pad dressing disk 2 to be replaced can be assembled onto the connecting member 141.

[0061] Among them, there is no limitation on the driving forms of the first driving member 3 driving the first carrier 1 and the second driving member 11 driving the second carrier 10; the first driving member 3 can be a combination of a driving motor and a lead screw extending in the first direction X. The first carrier 1 is connected to the lead screw and is in anti-rotation cooperation with the lead screw to drive the first carrier 1 to move in the first direction X. The first driving member 3 can also be a cylinder, that is, the first carrier 1 is connected to the output end of the cylinder to move in the first direction X; the second driving member 11 can be a combination of a driving motor and a lead screw extending in the second direction Y. The second carrier 10 is connected to the lead screw and is in anti-rotation cooperation with the lead screw to drive the second carrier 10 to move in the second direction Y. The second driving member 11 can also be a cylinder, that is, the second carrier 10 is connected to the output end of the cylinder to move in the second direction Y.

[0062] In some embodiments of the present application, the polishing pad dressing disk replacement device 100 further includes a second cavity 12; the second driving member 11 drives the second carrier 10 to move in the second direction Y within the second cavity 12, and the first driving member 3 drives the first carrier 1 to move in the first direction X within and outside the second cavity 12; that is, in this embodiment, by providing the second cavity 12, the second carrier 10 can drive the polishing pad dressing disk 2 to be replaced to move within the second cavity 12, so as to avoid possible interference of external components on the movement of the second carrier 10, and can also protect the polishing pad dressing disk 2 to be replaced conveyed on the second carrier 10.

[0063] In some embodiments of the present application, the cavity wall of the second cavity 12 surrounds the second carrier 10 on its circumference to limit the polishing pad dressing disk 2 from falling off the second carrier 10; that is, with such a setting, the problem that the polishing pad dressing disk 2 to be replaced falls off the second carrier 10 during movement in the second direction Y can be avoided.

[0064] In addition, since the first carrier 1 can extend into the second cavity 12, when the first carrier 1 receives the dressing disk 2 of the grinding pad to be replaced in the second cavity 12, the dressing disk 2 of the grinding pad that falls on the first carrier 1 will not fall off the first carrier 1 due to the limitation of the wall size of the second cavity 12, thereby ensuring the normal operation of the dressing disk replacement device 100 of the grinding pad.

[0065] In some embodiments of the present application, the second cavity 12 includes a fifth opening 13, and the fifth opening 13 is a passage for the first carrier 1 to move in and out of the second cavity 12 along the first direction X.

[0066] Among them, the fifth opening 13 has a third state and a fourth state. When the fifth opening 13 is in the third state, the height of the fifth opening 13 is greater than the thickness of the first carrier 1 and less than the sum of the thicknesses of the first carrier 1 and the dressing disk 2 of the grinding pad; when the fifth opening 13 is in the fourth state, the height of the fifth opening 13 is greater than the sum of the thicknesses of the first carrier 1 and the dressing disk 2 of the grinding pad.

[0067] That is to say, in this embodiment, when the fifth opening 13 is in the third state, the fifth opening 13 allows the first carrier 1 to pass through, but when the dressing disk 2 of the grinding pad is placed on the first carrier 1, the dressing disk 2 of the grinding pad located on the first carrier 1 cannot pass through the fifth opening 13, and when the fifth opening 13 is in the fourth state, the first carrier 1 and the dressing disk 2 of the grinding pad located on the first carrier 1 can freely pass through the fifth opening 13.

[0068] Therefore, when the first carrier 1 conveys the dressing disk 2 of the grinding pad to be replaced into the second cavity 12, first adjust the fifth opening 13 to the fourth state, the first carrier 1 can drive the dressing disk 2 of the grinding pad to be replaced into the second cavity 12, and then adjust the fifth opening 13 to the third state. When the first carrier 1 moves away from the second cavity 12 along the first direction X, the dressing disk 2 of the grinding pad to be replaced located on the first carrier 1 cannot pass through the fifth opening 13, so it falls on the second carrier 10, and then the second carrier 10 conveys the dressing disk 2 of the grinding pad to be replaced to the lower part of the connecting member 141.

[0069] It can be understood that when the first carrier 1 receives the dressing disk 2 of the grinding pad to be replaced that falls from the connecting member 141 in the second cavity 12, the fifth opening 13 is in the fourth state, so that the first carrier 1 and the dressing disk 2 of the grinding pad located on the first carrier 1 can be normally removed from the second cavity 12.

[0070] In addition, the form of adjusting the size of the fifth opening 13 is not limited. A stop portion can be provided on the periphery of the fifth opening 13, and the size of the fifth opening 13 can be adjusted by adjusting the size of the stop portion covering the fifth opening 13.

[0071] In some embodiments of the present application, the first cavity 4 is connected to the second cavity 12; wherein, the second opening 6 and the fifth opening 13 are the same opening; with such a setting, the abrasive pad dressing disk 2 to be replaced and the abrasive pad dressing disk 2 to be removed are always located in the first cavity 4 or the second cavity 12 during the conveying process, thereby ensuring the stability of the abrasive pad dressing disk 2 during the conveying process.

[0072] The present application also provides an abrasive pad dressing disk replacement system 200. The abrasive pad dressing disk replacement system 200 includes an abrasive device 14 and an abrasive pad dressing disk replacement device 100. The abrasive device 14 includes an abrasive pad dressing disk 2. The abrasive pad dressing disk replacement device 100 is used to replace the abrasive pad dressing disk 2. The abrasive pad dressing disk replacement device 100 is as described in the above embodiments. Since the abrasive pad dressing disk replacement system 200 adopts all the technical solutions of the above embodiments, it has at least the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated here one by one.

[0073] In some embodiments of the present application, the abrasive device 14 includes a connecting member 141, and the connecting member 141 vacuum adsorbs the abrasive pad dressing disk 2.

[0074] Wherein, the steps of replacing the abrasive pad dressing disk 2 on the connecting member 141 are as follows: The first carrier 1 moves into the second cavity 12 and faces the connecting member 141 in the second direction Y. The connecting member 141 cancels the vacuum adsorption of the abrasive pad dressing disk 2 to be removed, and the abrasive pad dressing disk 2 to be removed falls onto the first carrier 1. The first carrier 1 enters the first cavity 4 through the fifth opening 13 in the fourth state, and the first carrier 1 continues to pass through the first opening 5, so that the abrasive pad dressing disk 2 to be removed falls into the first lower cavity 42. At this time, the first carrier 1 returns to the first cavity 4 and faces the first upper cavity 41 in the second direction Y. The supporting portion 71 moves from the first state to the second state, so that the abrasive pad dressing disk 2 to be replaced falls onto the first carrier 1. The first carrier 1 and the abrasive pad dressing disk 2 to be replaced enter the first cavity 4 through the fifth opening 13 in the fourth state. The fifth opening 13 is adjusted to the third state, and the first carrier 1 moves out of the second cavity 12. The abrasive pad dressing disk 2 to be replaced falls onto the second carrier 10. The second carrier 10 drives the abrasive pad dressing disk 2 to be replaced to approach the connecting member 141 in the second direction Y, and the connecting member 141 vacuum adsorbs the abrasive pad dressing disk 2 to be replaced.

[0075] It should be noted that in the related art, the polishing pad dressing disk 2 is connected to the connecting member 141 by screws or by magnetic attraction. When using screws to connect the polishing pad dressing disk 2 and the connecting member 141, it is necessary to disassemble and install the screws. The screws are prone to slipping or falling off, resulting in the detachment of the polishing pad dressing disk 2, and thus abnormal scrapping of the product. When using magnetic attraction, the connection between the connecting member 141 and the polishing pad dressing disk 2 will be relatively tight. Frequent disassembly is likely to cause the connecting member 141 to crack. In addition, the connecting member 141 with a magnet will generate eddy currents in the rotating state, which will affect the end point detection signal and the state of the sensor for detecting the upward or downward movement of the polishing pad dressing disk 2. By using the vacuum adsorption method to fix the polishing pad dressing disk 2, the damage to the connecting member 141 can be reduced, and at the same time, eddy currents will not be generated, thereby reducing the maintenance cost of the chemical mechanical polishing equipment, reducing the downtime of the chemical mechanical polishing equipment, and improving the machine utilization rate.

[0076] Please refer to Figure 3 , in some embodiments of the present application, the grinding device 14 further includes at least one pipeline 142. One end of the pipeline 142 penetrates through the connecting member 141 in the second direction Y. That is, in this embodiment, the pipeline 142 can evacuate the environment between the polishing pad dressing disk 2 and the connecting member 141 to make the polishing pad dressing disk 2 and the connecting member 141 firmly fixed. Similarly, gas can also be injected into the pipeline 142 to break the vacuum environment between the polishing pad dressing disk 2 and the connecting member 141, so that the polishing pad dressing disk 2 and the connecting member 141 are separated.

[0077] The grinding device 14 further includes a pressure sensor 144 and a gas supply device 145. The pressure sensor 144 is arranged on the pipeline 142 and is used to detect the air pressure in the pipeline 142. The gas supply device 145 is connected to the other end of the pipeline 142 and is used to inject gas into the pipeline 142 or extract gas from the pipeline 142. Among them, when the value of the pressure sensor 144 is greater than the set value, the control system of the chemical mechanical polishing equipment determines that the polishing pad dressing disk 2 and the connecting member 141 are completely separated. When the value of the pressure sensor 144 is less than the set value, the control system of the chemical mechanical polishing equipment determines that the polishing pad dressing disk 2 and the connecting member 141 are firmly fixed.

[0078] In some embodiments of the present application, a valve 143 is further arranged on the pipeline 142. The valve 143 is used to control the on-off of the lumen in the pipeline 142. For example, after the polishing pad dressing disk 2 and the connecting member 141 are firmly fixed, the valve 143 can be in a closed state, so as to avoid continuous operation of the gas supply device 145.

[0079] In some embodiments of the present application, two pipes 142 are provided. One of the pipes 142 is a nitrogen pipe, and the other pipe 142 is a vacuum pipe. Valves 143, pressure sensors 144, and gas supply devices 145 are connected to both pipes 142.

[0080] When the polishing pad dressing disk 2 needs to be fixed to the connecting member 141, the valve 143 and the gas supply device 145 of the nitrogen pipe are closed, and the valve 143 and the gas supply device 145 of the vacuum pipe are opened. When the value of the pressure sensor 144 located on the vacuum pipe is less than the set value, the control system of the chemical mechanical polishing equipment determines that the polishing pad dressing disk 2 is firmly fixed to the connecting member 141.

[0081] When the polishing pad dressing disk 2 needs to be separated from the connecting member 141, the valve 143 and the gas supply device 145 of the vacuum pipe are closed, and the valve 143 and the gas supply device 145 of the nitrogen pipe are opened. When the value of the pressure sensor 144 located on the nitrogen pipe is greater than the set value, the control system of the chemical mechanical polishing equipment determines that the polishing pad dressing disk 2 is completely separated from the connecting member 141.

[0082] Please refer to Figures 3 to 4 , in some embodiments of the present application, the connecting member 141 is mounted on the connecting arm 146 through a connecting shaft 147, and the connecting member 141 can rotate around the connecting shaft 147. To avoid interference of the pipe 142 with the rotation of the connecting member 141, the pipe 142 is provided at the middle position of the connecting member 141 and passes through the connecting shaft 147.

[0083] Please refer to Figure 5 , in some embodiments of the present application, a first groove 15 is provided on one side of the connecting member 141 close to the polishing pad dressing disk 2 in the second direction Y. The first groove 15 communicates with the pipe 142; wherein, the polishing pad dressing disk 2 is located within the enclosed space of the first groove 15; thus arranged, the side wall of the first groove 15 can limit the polishing pad dressing disk 2, thereby preventing the polishing pad dressing disk 2 from falling off the connecting member 141 when the connecting arm 146 drives the connecting member 141 to perform a sweeping motion.

[0084] In some embodiments of the present application, at least one vacuum groove 16 is provided at the bottom of the first groove 15 of the connecting member 141. The vacuum groove 16 communicates with the pipe 142; arranged in this way in this embodiment, the contact area between the polishing pad dressing disk 2 and the vacuum groove 16 can be increased, and the vacuum groove 16 communicates with the pipe 142 and can be evacuated by the gas supply device 145, so that the fixing between the polishing pad dressing disk 2 and the connecting member 141 is more reliable.

[0085] It should be noted that since the connecting arm 146 can drive the connecting member 141 to perform a sweeping motion, in order to avoid interference of the lapping pad dresser replacement device 100 with the operation of the lapping pad, the lapping pad dresser replacement device 100 is arranged on one side of the lapping pad, and the connecting arm 146 can move between the lapping pad and the lapping pad dresser replacement device 100 to realize automatic replacement of the lapping pad dresser 2.

[0086] The description of the above embodiments is only used to help understand the technical solution and its core idea of the present application; those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A grinding pad dressing disc replacement device, characterized in that: include: A first bearing platform, used for bearing the grinding pad dressing disc; A first driving member, connected to the first carrying platform and used to drive the first carrying platform to move along a first direction; and A first cavity, comprising a first upper cavity and a first lower cavity, wherein the first upper cavity is used to accommodate the polishing pad conditioning disc to be replaced, and the first lower cavity is used to accommodate the polishing pad conditioning disc to be replaced; A first opening and a second opening are provided at the connection between the first upper cavity and the first lower cavity, which are opposite to and parallel to the surface of the first supporting platform in the first direction. The height of the first opening is greater than the thickness of the first supporting platform and less than the sum of the thicknesses of the first supporting platform and the grinding pad dressing plate. The height of the second opening is greater than the sum of the thicknesses of the first supporting platform and the grinding pad dressing plate.

2. The polishing pad conditioning disc replacement device according to claim 1, characterized in that: Also included is a support assembly, the support assembly includes at least one support portion, the support portion is disposed in the cavity of the first upper cavity and is movably mounted in the first upper cavity; The support portion includes a first state and a second state. When the support portion is in the first state, the support portion limits the grinding pad dressing disk in the first upper cavity in the second direction; when the support portion is in the second state, the support portion cancels the limitation on the grinding pad dressing disk, and the second direction intersects with the first direction.

3. The polishing pad conditioning disc replacement device according to claim 1, characterized in that: The first upper cavity comprises a third opening, and the third opening is a passage for storing the polishing pad dressing disc to be replaced into the first upper cavity; and / or The first lower cavity comprises a fourth opening, and the fourth opening is a passage for the polishing pad conditioning disc to be replaced to be taken out from the first lower cavity.

4. The polishing pad conditioning disc replacement device according to claim 1, characterized in that: Also includes: A second carrier platform, used for receiving the polishing pad dressing disc to be replaced transmitted from the first carrier platform; and The second driving member is connected to the second carrying platform and is used to drive the second carrying platform to move along a second direction, and the second direction intersects with the first direction.

5. The grinding pad conditioning disc replacement device according to claim 4, characterized in that: It also includes a second cavity, and the second driving member drives the second bearing platform to move along the second direction in the second cavity; The second cavity includes a fifth opening, and the fifth opening has a third state and a fourth state; When the fifth opening is in the third state, the height of the fifth opening is greater than the thickness of the first carrier platform and less than the sum of the thicknesses of the first carrier platform and the grinding pad conditioning disk; When the fifth opening is in the fourth state, a height of the fifth opening is greater than a sum of thicknesses of the first carrier platform and the grinding pad conditioning disk.

6. The grinding pad conditioning disc replacement device according to claim 5, characterized in that: The first cavity is connected to the second cavity; Wherein, the second opening and the fifth opening are the same opening.

7. The grinding pad conditioning disc replacement device according to claim 5, characterized in that: The cavity wall of the second cavity is arranged around the circumference of the second supporting platform to prevent the grinding pad dressing plate from falling off from the second supporting platform.

8. A grinding pad conditioning disc replacement system, characterized in that: include: A grinding device including a grinding pad conditioning disc; and The grinding pad conditioning disc replacement device according to any one of claims 1 to 7, wherein the grinding pad conditioning disc replacement device is used to replace the grinding pad conditioning disc.

9. The polishing pad conditioning disc replacement system according to claim 8, characterized in that: The grinding device further comprises a connecting piece connected to the grinding pad conditioning disc, and the connecting piece vacuum-adsorbs the grinding pad conditioning disc.

10. The polishing pad conditioning disc replacement system according to claim 9, characterized in that: The connecting piece is provided with a vacuum groove on one side close to the grinding pad dressing disc.

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