Firmly-locked fixing device for semiconductor wafer test

Abstract

The utility model relates to the technical field of wafer fixing, in particular to a firmly-locked fixing device for semiconductor wafer testing, which comprises a base and a fixed semiconductor wafer, a top plate is fixed at the top of the base, the wafer is fixed on the top plate through a first locking assembly, and the wafer is fixed on the top plate through a second locking assembly. The beneficial effects of the utility model are that: can carry out the dual fixation of clamping and compacting to the semiconductor wafer, the locking is firm to prevent the excursion of semiconductor wafer when testing, and is not influenced by the diameter size of semiconductor wafer, and the testing efficiency is improved. The semiconductor wafer locking device is wide in application range, simple to operate and suitable for popularization and application.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer fixing, in particular to a firmly locked fixing device for semiconductor wafer testing. Background Art

[0002] Semiconductor wafers are a basic material used to manufacture integrated circuits or other semiconductor devices. They are usually round slices made of high-purity silicon with a smooth surface and special processing and treatment. Various process steps can be performed on the wafer, such as deposition, etching, photolithography, etc., which are used to manufacture tiny structures and circuits in electronic devices. The semiconductor material on the wafer can achieve various functions by controlling the doping, structure and properties of different areas, thereby forming various components in integrated circuits. Wafer manufacturing is a vital link in the semiconductor industry and plays an important role in the performance and function of electronic products.

[0003] After searching, a wafer fixing device for semiconductor testing with announcement number CN217881449U is found, comprising a disc, the outer surface of the disc is evenly installed with a clamping mechanism in a ring shape, the clamping mechanism comprises a fixed block and a connecting rod, the inner surface of the fixed block is fixedly connected to the connecting rod, and torsion springs are symmetrically inserted on the two side surfaces of the connecting rod, a rotating clamping rod is sleeved at the center position of the connecting rod, the lower end surface of the disc is fixedly connected to an adsorption disc, a fixed sleeve is fixedly connected at the center position of the top end of the disc, and a movable adjusting screw is inserted at the center position of the fixed sleeve, the lower end surface of the movable adjusting screw is connected to a fixed seat through a bearing, the lower end surface of the movable adjusting screw is sleeved with two groups of movable screw sleeves, and a sliding disc is clamped between the two groups of movable screw sleeves.

[0004] Although the above utility model patent can doubly fix the wafer by means of a suction cup and a plurality of rotating clamping rods that can automatically rebound and close to prevent the wafer from shifting during testing, when it fixes a wafer with a smaller diameter, there is a disadvantage that the plurality of rotating clamping rods excessively clamp the wafer, thereby wrapping and shielding a large area of ​​the wafer, which is not conducive to normal testing operations of the wafer.

[0005] Therefore, it is necessary to invent a semiconductor wafer testing fixture with firm locking. Utility Model Content

[0006] To this end, the utility model provides a firmly locked semiconductor wafer testing fixture to solve the problems raised in the above background technology.

[0007] To achieve the above object, the present utility model provides the following technical solution: A fixing device for semiconductor wafer testing with firm locking, including a base and the fixed semiconductor wafer. A top plate is fixedly arranged at the top of the base. The wafer is fixed on the top plate through a first locking component, and a second locking component for fixing the edge of the wafer is arranged on the first locking component.

[0008] Preferably, the first locking component includes a partition plate, which is horizontally and fixedly arranged below the interior of the base. A servo motor is vertically fixed at the center of the bottom of the partition plate, and a through hole is opened at the center of the partition plate.

[0009] Preferably, the top end of the output shaft of the servo motor vertically passes through the through hole, and a lead screw is vertically fixed at the top end of the output shaft of the servo motor. A threaded sleeve is threadedly connected to the surface of the lead screw, and a plurality of connecting rods are rotatably connected to the side of the threaded sleeve in a circular array.

[0010] Preferably, the first locking component further includes a plurality of rectangular grooves, which are opened on the top plate in a circular array. Moving blocks are slidably connected inside the rectangular grooves.

[0011] Preferably, the plurality of moving blocks and the plurality of connecting rods correspond to each other one by one. The top ends of the connecting rods are rotatably connected to the bottoms of the corresponding moving blocks. Clamping plates are fixedly arranged at the tops of the moving blocks. The clamping plates are in a right-angled shape, and the side surface of the semiconductor wafer abuts against the surfaces of the plurality of clamping plates.

[0012] Preferably, the second locking component includes a plurality of threaded holes, which are vertically opened at the tops of the plurality of clamping plates respectively. Adjusting screws are threadedly connected to the inner walls of the threaded holes. Rotating handles are fixedly arranged at the top ends of the adjusting screws, and pressing plates are rotatably connected to the bottom ends of the adjusting screws.

[0013] Preferably, rubber gaskets are fixedly arranged at the bottoms of the pressing plates, and the bottoms of the plurality of rubber gaskets abut against the top edges of the semiconductor wafer.

[0014] The beneficial effects of the present utility model are as follows: Through the combined use of the arranged base, semiconductor wafer, top plate, first locking component and second locking component, the semiconductor wafer can be fixed by double clamping and pressing, with firm locking, so as to prevent the semiconductor wafer from shifting during testing, and it is not affected by the diameter size of the semiconductor wafer, that is, semiconductor wafers with different diameter sizes can be locked and fixed, with a wide application range, simple operation, and is suitable for popularization and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a structural sectional view provided by the present utility model;

[0016] Figure 2 isFigure 1 Enlarged view of the structure at position A in

[0017] Figure 3 Front view of the structure provided by the present utility model;

[0018] Figure 4 Top view of the structure provided by the present utility model.

[0019] In the figure: 1, base; 2, semiconductor wafer; 3, top plate; 4, partition; 5, servo motor; 6, through hole; 7, lead screw; 8, threaded sleeve; 9, connecting rod; 10, rectangular groove; 11, moving block; 12, clamping plate; 13, threaded hole; 14, adjusting screw; 15, turning handle; 16, pressing plate; 17, rubber gasket. Specific embodiments

[0020] The following is a description of the preferred embodiments of the present utility model with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only for the purpose of illustrating and explaining the present utility model, and are not used to limit the present utility model.

[0021] Please refer to the attached Figures 1-4 , A fixing device for semiconductor wafer testing with firm locking provided by the present utility model includes a base 1 and a fixed semiconductor wafer 2. A top plate 3 is fixed on the top of the base 1. The wafer 2 is fixed on the top plate 3 through a first locking assembly, and a second locking assembly for fixing the edge of the wafer 2 is arranged on the first locking assembly;

[0022] The first locking assembly includes a partition 4. The partition 4 is horizontally fixed below the interior of the base 1. A servo motor 5 is vertically fixed at the center of the bottom of the partition 4. A through hole 6 is opened at the center of the partition 4. The top end of the output shaft of the servo motor 5 vertically passes through the through hole 6, and a lead screw 7 is vertically fixed at the top end of the output shaft of the servo motor 5. A threaded sleeve 8 is threadedly connected to the surface of the lead screw 7. A plurality of connecting rods 9 are rotatably connected to the side of the threaded sleeve 8 in a circular array. Specifically, when the servo motor 5 operates, it can drive the lead screw 7 to rotate forward and backward, thereby driving the threaded sleeve 8 to move accordingly;

[0023] The first locking assembly further includes a number of rectangular slots 10 which are arranged in a circular array on the top plate 3. A moving block 11 is slidably connected inside each rectangular slot 10. The number of moving blocks 11 corresponds to the number of connecting rods 9 one by one. The top ends of the connecting rods 9 are rotatably connected to the bottoms of the corresponding moving blocks 11. That is, under the limiting action of the connecting rod 9, the moving block 11 and the rectangular slot 10, when the servo motor 5 operates to drive the lead screw 7 to rotate forward and backward, the threaded sleeve 8 threadedly connected to the surface of the lead screw 7 can perform a linear lifting motion. And when the threaded sleeve 8 moves up and down, it can drive the moving block 11 to move linearly back and forth in the corresponding rectangular slot 10 through the connecting rod 9. A clamping plate 12 is fixed on the top of each moving block 11. The clamping plate 12 is in a right-angled shape. The side surface of the semiconductor wafer 2 abuts against the surfaces of the clamping plates 12. Specifically, when the moving block 11 moves linearly back and forth, it can drive the corresponding clamping plate 12 to move linearly back and forth, so as to control the clamping plates 12 to move towards the center of the top plate 3 to close or move in the reverse direction to expand, thereby preliminarily clamping and fixing semiconductor wafers 2 with different diameters;

[0024] The second locking assembly includes a number of threaded holes 13 which are vertically opened at the tops of the clamping plates 12 respectively. An adjusting screw 14 is threadedly connected to the inner wall of each threaded hole 13. A rotating handle 15 is fixed at the top of each adjusting screw 14. The bottom end of each adjusting screw 14 is rotatably connected to a pressing plate 16. A rubber gasket 17 is fixed at the bottom of each pressing plate 16. The bottoms of the rubber gaskets 17 abut against the top edge of the semiconductor wafer 2. That is, under the action of the rubber gasket 17, the friction with the top edge of the semiconductor wafer 2 can be increased, and the top edge of the semiconductor wafer 2 can be prevented from being damaged by pressing. Specifically, after the semiconductor wafer 2 is preliminarily clamped and fixed by closing the clamping plates 12, the user can also rotate the adjusting screw 14 through the rotating handle 15 to control the pressing plate 16 to move downwards, so as to perform a secondary pressing and fixing operation on the top edge of the semiconductor wafer 2. That is, the fixing device can perform double fixing of clamping and pressing on the semiconductor wafer 2, and the locking is firm to prevent the semiconductor wafer 2 from shifting during testing. And only the side of the semiconductor wafer 2 is locked, and the area required for testing the semiconductor wafer 2 (such as Figure 4 shown) will not be blocked. Therefore, it is not affected by the diameter of the semiconductor wafer 2, and semiconductor wafers 2 with different diameters can be locked and fixed, and the applicable range is wide.

[0025] The usage process of the present utility model is as follows: The user first places the semiconductor wafer 2 to be tested on the top plate 3, and then controls the operation of the servo motor 5 to control a number of clamping plates 12 to move towards the center of the top plate 3 for closing, so as to perform a preliminary clamping and fixing operation on the semiconductor wafer 2. Then, the user controls the rotation of the adjusting screw 14 through the rotating handle 15 to control the pressing plate 16 to move downward, and then the pressing and fixing operation can be performed on the top edge of the semiconductor wafer 2 again. That is, the fixing device can perform double fixing of clamping and pressing on the semiconductor wafer 2, with firm locking to prevent the semiconductor wafer 2 from shifting during testing. Moreover, only the side of the semiconductor wafer 2 is locked, and the area to be tested of the semiconductor wafer 2 will not be blocked. Therefore, it is not affected by the diameter of the semiconductor wafer 2, and the semiconductor wafers 2 with different diameters can be locked and fixed, with a wide application range and simple operation.

[0026] The above is only the preferred embodiment of the present utility model. Any person skilled in the art can modify the present utility model by using the technical solutions described above or modify it into an equivalent technical solution. Therefore, any simple modification or equivalent replacement made according to the technical solution of the present utility model falls within the scope of protection required by the present utility model.

Claims

1. A firmly locked semiconductor wafer test fixture, comprising a base (1) and the fixed semiconductor wafer (2), characterized in that: A top plate (3) is fixed on the top of the base (1); the wafer (2) is fixed on the top plate (3) via a first locking assembly; and the first locking assembly is provided with a second locking assembly for fixing the edge of the wafer (2); The first locking assembly comprises a partition (4), the partition (4) being horizontally fixed at the bottom of the base (1), a servo motor (5) being vertically fixed at the center of the bottom of the partition (4), and a through hole (6) being opened at the center of the partition (4); The top end of the output shaft of the servo motor (5) vertically passes through the through hole (6), and a screw rod (7) is vertically fixed to the top end of the output shaft of the servo motor (5), a threaded sleeve (8) is threadedly connected to the surface of the screw rod (7), and the side of the threaded sleeve (8) is rotatably connected to a plurality of connecting rods (9) in a circular array; The first locking assembly further comprises a plurality of rectangular grooves (10), the plurality of rectangular grooves (10) being arranged in a circular array on the top plate (3), and the interiors of the rectangular grooves (10) are all slidably connected with moving blocks (11); The plurality of moving blocks (11) correspond to the plurality of connecting rods (9) respectively, the top ends of the connecting rods (9) are rotatably connected to the bottom ends of the corresponding moving blocks (11), the top ends of the moving blocks (11) are fixed with clamping plates (12), the clamping plates (12) are in a right-angle shape, and the side surfaces of the semiconductor wafers (2) are in contact with the surfaces of the plurality of clamping plates (12); The second locking assembly comprises a plurality of threaded holes (13), wherein the plurality of threaded holes (13) are respectively vertically opened at the top ends of the plurality of clamping plates (12), the hole walls of the threaded holes (13) are threadedly connected with adjusting screws (14), the top ends of the adjusting screws (14) are each fixed with a turning handle (15), and the bottom ends of the adjusting screws (14) are rotatably connected with a pressing plate (16).

2. A firmly locked semiconductor wafer testing fixture according to claim 1, characterized in that: The bottom of the pressing plate (16) is fixed with a rubber gasket (17), and the bottoms of several of the rubber gaskets (17) are in contact with the top edge of the semiconductor wafer (2).

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