Circulating diode injection molding machine mold

Abstract

The utility model discloses a circulating diode injection molding machine mold, which belongs to the technical field of diode injection molding and comprises a shell, a mold cavity arranged inside the shell, a cooling cavity arranged on the inner wall of the shell and used for assisting in accelerating molding of a diode, and a water stop plate arranged inside the cooling cavity. A cooling assembly used for cooling water in the cooling cavity is arranged on one side of the surface of the shell. A cooling box is connected to one side of the shell, a heat dissipation pipe is arranged in the cooling box, and the two ends of the heat dissipation pipe communicate with an inner cavity of the cooling cavity through a water inlet pipe and a water outlet pipe correspondingly; the flow guide assembly is arranged in the cooling box and is used for guiding the internal liquid; according to the utility model, the cooling range in the use process of the diode injection molding machine mold can be further expanded, the cooling efficiency is improved, the circulating refrigeration effect is achieved, the refrigeration effect is good, the molding speed of the diode is accelerated, the diode is prevented from being deformed in the cooling process, and the production efficiency is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of diode injection molding, in particular to a circulating diode injection molding machine mold. Background Technique

[0002] A diode, also known as a crystal diode, is simply called a diode. In addition, there was an early vacuum electron diode. It is an electronic device with unidirectional conduction current. Inside a semiconductor diode, there is a PN junction and two lead terminals. This electronic device has the transduction of unidirectional current according to the direction of the applied voltage. Common diodes are mostly made by injection molding. This method has a slow molding speed and is prone to cause deformation of the diode. Therefore, an injection molding machine mold with a circulating heat dissipation function is needed.

[0003] As in the prior art, the Chinese utility model content with the publication number: CN209812972U discloses a circulating diode injection molding machine mold, and specifically discloses a circulating diode injection molding machine mold. This kind of circulating diode injection molding machine mold can refrigerate the water within the range of the cold conduction sheet through a refrigeration device, and at the same time, a water pump can pump and drain water to achieve the effect of circulating refrigeration; however, for the above-mentioned circulating diode injection molding machine mold, during the use of the diode injection molding machine mold, only the water within the range of the cold conduction sheet can be refrigerated by the refrigeration device, and the refrigeration effect is not ideal. Therefore, we need to propose a circulating diode injection molding machine mold. Content of the Utility Model

[0004] The purpose of the utility model is to provide a circulating diode injection molding machine mold, which can further increase the cooling range during the use of the diode injection molding machine mold, improve the cooling efficiency at the same time, achieve the effect of circulating refrigeration, have a good refrigeration effect, accelerate the molding speed of the diode, avoid deformation of the diode during the cooling process, and ensure the production efficiency, so as to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides: a circulating diode injection molding machine mold, including a housing, a mold cavity is arranged inside the housing, a cooling cavity for assisting in accelerating the molding of the diode is arranged on the inner wall of the housing, a water stop plate is arranged inside the cooling cavity, and a cooling component for cooling the water inside the cooling cavity is arranged on one side of the housing surface; a cooling box is connected to one side of the housing, a heat dissipation pipe is arranged inside the cooling box, and both ends of the heat dissipation pipe are respectively communicated with the inner cavity of the cooling cavity through a water inlet pipe and a water outlet pipe; a diversion component for guiding the internal liquid is arranged inside the cooling box, and semiconductor refrigeration sheets for cooling the internal liquid are embedded on both sides of the cooling box.

[0006] Preferably, the water inlet pipe is connected to the cooling cavity on one side of the water stop plate through a micro water pump, the other end of the water outlet pipe is connected to the cooling cavity on one side of the water stop plate, and a drain port and a water supply port communicating with the cooling cavity are respectively arranged on one side of the housing.

[0007] Preferably, the cooling assembly includes: a refrigeration plate disposed inside the cooling box and embedded on the surface of the cooling cavity, a connecting plate connected to the heat release surface of the refrigeration plate, and a diversion fan mounted on the surface of the connecting plate.

[0008] Preferably, the diversion assembly includes: a fixing block connected to the inner wall of the cooling box, and a diversion fan movably inserted on the fixing block; wherein, a limiting card slot is formed on the surface of the fixing block, a positioning rod is connected to the top of the fixing block, and the diversion fan is installed inside the assembly frame.

[0009] Preferably, one side of the assembly frame is connected with a positioning card plate, the assembly frame is movably inserted into the limiting card slot through the positioning card plate, and the top end of the positioning rod is cooperatively clamped with the positioning card plate.

[0010] Preferably, a protection plate is hermetically installed on the top of the cooling box, and a drain pipe is arranged at the bottom of the cooling box.

[0011] Preferably, the heat absorption surface of the semiconductor refrigeration sheet is connected with heat absorption fins, and the heat absorption fins are arranged inside the cooling box.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] Through the cooperation of structures such as the cooling cavity, the water stop plate, the heat dissipation pipe, the cooling box, the cooling assembly and the diversion assembly, water is injected into the cooling cavity through the water supply port, and at the same time, the water in the cooling cavity can be cooled by cooperating with the refrigeration plate, and the diode in the mold cavity is cooled. The water in the cooling cavity is circulated by the micro water pump cooperating with the water inlet pipe, and the circulated water is dissipated by cooperating with the heat dissipation pipe, so as to accelerate the cooling efficiency of the internal water; the cooling water in the cooling box can be cooled by the heat absorption fins to cool the refrigeration plate and the heat dissipation pipe, and the cooling water in the cooling box can be circulated and diverted by cooperating with the diversion fan, further ensuring the cooling effect of the heat dissipation pipe and the refrigeration plate on the cooling cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0015] Figure 2 is a schematic diagram of the internal structure of the cooling box of the present utility model;

[0016] Figure 3 is a schematic diagram of the heat dissipation pipe structure of the present utility model;

[0017] Figure 4 Schematic diagram of the assembly frame structure of the present utility model.

[0018] In the figure: 1, outer shell; 2, mold cavity; 3, cooling cavity; 4, water stop plate; 5, drain port; 6, water supply port; 7, refrigeration plate; 8, connecting plate; 9, diversion fan; 10, water inlet pipe; 11, heat dissipation pipe; 12, water outlet pipe; 13, first diversion device; 14, cooling box; 15, heat absorption fin; 16, semiconductor refrigeration sheet; 17, fixing block; 18, limit card slot; 19, positioning rod; 20, positioning card plate; 21, assembly frame; 22, diversion fan; 23, drain pipe; 24, protection plate. Specific embodiments

[0019] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0020] Please refer to Figures 1-4 , the present utility model provides: a circulating diode injection molding machine mold, including an outer shell 1, a mold cavity 2 is arranged inside the outer shell 1, a cooling cavity 3 for assisting in accelerating the formation of diodes is arranged on the inner wall of the outer shell 1, a water stop plate 4 is arranged inside the cooling cavity 3, and a cooling assembly for cooling the water inside the cooling cavity 3 is arranged on one side of the surface of the outer shell 1; a cooling box 14 is connected to one side of the outer shell 1, a heat dissipation pipe 11 is arranged inside the cooling box 14, and both ends of the heat dissipation pipe 11 are respectively communicated with the inner cavity of the cooling cavity 3 through a water inlet pipe 10 and a water outlet pipe 12; a diversion assembly for guiding the internal liquid is arranged inside the cooling box 14, and semiconductor refrigeration sheets 16 for cooling the internal liquid are embedded on both sides of the cooling box 14.

[0021] It should be noted that through the combined setting of the structures of the cooling cavity 3, the water stop plate 4, the heat dissipation pipe 11, the cooling box 14, the cooling assembly and the diversion assembly, the cooling range during the use of the diode injection molding machine mold can be further improved, and at the same time, the cooling efficiency can be improved, achieving the effect of circulating refrigeration, with good refrigeration effect, accelerating the formation speed of diodes, avoiding the deformation of diodes during the cooling process, and ensuring the production efficiency.

[0022] Specifically, the water inlet pipe 10 is connected to the cooling chamber 3 on one side of the water stop plate 4 through a micro water pump, and the other end of the water outlet pipe 12 is connected to the cooling chamber 3 on one side of the water stop plate 4. A drain port 5 and a water supply port 6 communicating with the cooling chamber 3 are respectively arranged on one side of the outer shell 1. The heat absorption surface of the semiconductor refrigeration sheet 16 is connected with a heat absorption fin 15, and the heat absorption fin 15 is arranged inside the cooling box 14. A first flow guiding device 13 is arranged on one side of the heat dissipation pipe 11. The first flow guiding device 13 has the same overall structure as the flow guiding fan 22 and guides the water inside the cooling box 14.

[0023] In addition, the water stop plate 4 restricts the water inside the cooling chamber 3 and cooperates with the micro water pump to circulate and cool the water inside the cooling chamber 3. The cooperation of the water outlet pipe 12 and the water inlet pipe 10 can further improve the circulation effect. The semiconductor refrigeration sheet 16 is a component for cooling the cooling water inside the cooling box 14, and the heat absorption fin 15 increases the contact area of the semiconductor refrigeration sheet 16 for cooling the cooling water and improves the cooling effect.

[0024] Among them, the cooling component includes: a refrigeration plate 7 arranged inside the cooling box 14 and embedded on the surface of the cooling chamber 3. The heat dissipation surface of the refrigeration plate 7 is connected with a connecting plate 8, and a drainage fan 9 is installed on the surface of the connecting plate 8. A protection plate 24 is hermetically installed on the top of the cooling box 14, and a drain pipe 23 is arranged at the bottom of the cooling box 14. The cooling box 14 functions to cool the refrigeration plate 7. The refrigeration plate 7 is a component for cooling the water inside the cooling chamber 3. The connecting plate 8 is a component for accelerating the heat dissipation effect of the refrigeration plate 7. The drainage fan 9 is a component for accelerating the heat dissipation of the refrigeration plate 7, thereby accelerating the cooling structure. The protection plate 24 is a structure for protecting the cooling box 14.

[0025] The flow guiding component includes: a fixed block 17 connected to the inner wall of the cooling box 14, and a flow guiding fan 22 movably inserted on the fixed block 17. Among them, a limit card slot 18 is opened on the surface of the fixed block 17, a positioning rod 19 is connected to the top of the fixed block 17, and the flow guiding fan 22 is installed inside an assembly frame 21. A positioning card plate 20 is connected to one side of the assembly frame 21, and the assembly frame 21 is movably inserted into the limit card slot 18 through the positioning card plate 20, and the top end of the positioning rod 19 is cooperatively clamped with the positioning card plate 20.

[0026] Furthermore, the fixed block 17 is a structure for positioning and clamping the positioning card plate 20. The flow guiding fan 22 is a component for guiding the cooling water inside the cooling box 14. The positioning rod 19 is a structure for assembling the positioning card plate 20. The assembly frame 21 is a structure for assembling the flow guiding fan 22. The limit card slot 18 is a structure for cooperating with the positioning card plate 20 and positioning the assembly frame 21.

[0027] Water is injected into the interior of the cooling chamber 3 through the water inlet 6. At the same time, in cooperation with the refrigeration plate 7, the water inside the cooling chamber 3 can be cooled, and the diodes inside the mold cavity 2 can be cooled. The water inside the cooling chamber 3 is circulated by a micro water pump in cooperation with the water inlet pipe 10, and the circulated water is dissipated by the heat dissipation pipe 11, accelerating the cooling efficiency of the internal water. The cooling water inside the cooling box 14 can be cooled by the heat absorption fins 15 to cool the refrigeration plate 7 and the heat dissipation pipe 11. In cooperation with the guide fan 22, the cooling water inside the cooling box 14 can be circulated and guided, further ensuring the cooling effect of the heat dissipation pipe 11 and the refrigeration plate 7 on the interior of the cooling chamber 3. And when the guide fan 22 is damaged, it can be disassembled and assembled by the cooperation of the positioning rod 19 and the positioning card plate 20, which is convenient to remove the guide fan 22 for replacement.

[0028] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circulating diode injection molding machine mold, characterized in that: include: A shell (1), wherein a mold cavity (2) is arranged inside the shell (1), a cooling cavity (3) for assisting in accelerating the molding of the diode is arranged on the inner wall of the shell (1), a water stop plate (4) is arranged inside the cooling cavity (3), and a cooling component for cooling water inside the cooling cavity (3) is arranged on one side of the surface of the shell (1); A cooling box (14) is connected to one side of the housing (1), a heat dissipation pipe (11) is arranged inside the cooling box (14), and two ends of the heat dissipation pipe (11) are respectively connected to the inner cavity of the cooling cavity (3) through a water inlet pipe (10) and a water outlet pipe (12); A flow guiding component is arranged inside the cooling box (14) for guiding the internal liquid, and semiconductor cooling sheets (16) for cooling the internal liquid are embedded on both sides of the cooling box (14).

2. A circulating diode injection molding machine mold according to claim 1, characterized in that: The water inlet pipe (10) is connected to the cooling chamber (3) on one side of the water stop plate (4) via a micro water pump, and the other end of the water outlet pipe (12) is connected to the cooling chamber (3) on one side of the water stop plate (4). A water outlet (5) and a water supply port (6) connected to the cooling chamber (3) are provided on one side of the housing (1).

3. The circulating diode injection molding machine mold according to claim 1, characterized in that: The cooling assembly comprises: a refrigeration plate (7) arranged inside the cooling box (14) and embedded in the surface of the cooling cavity (3); the heat release surface of the refrigeration plate (7) is connected to a connecting plate (8); and a drainage fan (9) is installed on the surface of the connecting plate (8).

4. The circulating diode injection molding machine mold according to claim 1, characterized in that: The flow guide assembly comprises: a fixing block (17) connected to the inner wall of the cooling box (14), and a guide fan (22) movably inserted into the fixed block (17); A limiting slot (18) is provided on the surface of the fixing block (17), a positioning rod (19) is connected to the top of the fixing block (17), and the air guide fan (22) is installed inside the assembly frame (21).

5. The circulating diode injection molding machine mold according to claim 4, characterized in that: A positioning card plate (20) is connected to one side of the assembly frame (21), and the assembly frame (21) is movably inserted into the interior of the limiting card slot (18) through the positioning card plate (20), and the top end of the positioning rod (19) is matched and clamped with the positioning card plate (20).

6. The circulating diode injection molding machine mold according to claim 1, characterized in that: A protective plate (24) is sealed on the top of the cooling box (14), and a drainage pipe (23) is provided on the bottom of the cooling box (14).

7. The circulating diode injection molding machine mold according to claim 1, characterized in that: The heat absorbing surface of the semiconductor cooling sheet (16) is connected to a heat absorbing fin (15), and the heat absorbing fin (15) is arranged inside the cooling box (14).

Images