Packaging structure of insulation monitoring and positioning device

Abstract

The utility model relates to a packaging structure of an insulation monitoring positioning device, and the structure comprises a housing which forms an internal packaging space for the device, and the housing comprises a left side vertical surface, a right side vertical surface, a front side vertical surface or a rear side vertical surface, a bottom surface, and a top surface; the housing is internally provided with a monitoring unit which is used for monitoring ground insulation resistance values of a plurality of field loop buses; the positioning unit is used for sending test current to a plurality of field loops to position a failed loop after the monitoring unit monitors the insulation fault signal; the processor is in electric signal connection with the monitoring unit and the positioning unit and is used for enabling the positioning unit to send test current to different output ports according to a preset polling instruction; wherein a plurality of fixing assemblies are arranged on the inner surface of the bottom surface; and a plurality of electric signal interfaces are arranged on the front side vertical surface or the rear side vertical surface, so that the monitoring unit and the positioning unit receive or send signals to a specified device through the electric signal interfaces. The equipment scale is reduced.

Description

Technical Field

[0001] This application relates to the technical field of offshore power supply, and particularly to a packaging structure of an insulation monitoring and positioning device. Background Art

[0002] Offshore oil production is a high-risk operation with high requirements for the stability of the power system. Most equipment on offshore platforms is powered by 400V voltage. Affected by the humid offshore environment, insulation failures of electrical equipment occur frequently, which greatly affects the safe production of the platform. At the same time, the space on the offshore platform is tight, and the number of low-voltage circuits reaches hundreds. The existing on-site insulation monitoring system needs to configure multiple locators to achieve the insulation monitoring required for multiple circuits. For example, in one existing technology solution, one insulation monitor can monitor and access multiple (up to 50) insulation locators through an RS-485 interface (BS bus protocol); one locator is connected to a 12-channel current measurement transformer (that is, one locator is connected to 12 circuits). Such a large number of hardware configuration requirements lead to complex construction and installation, high system configuration cost, and difficulty in popularization and implementation. Summary of the Invention

[0003] In view of this, the technical problem to be solved by this application is to provide a packaging structure of an insulation monitoring and positioning device to solve the problems that the existing on-site insulation monitoring system is complex, large, occupies more on-site space, and limits the number of monitored circuits.

[0004] To solve the above problems, this application provides a packaging structure of an insulation monitoring and positioning device, including:

[0005] A housing that forms an internal packaging space for the device. The housing includes a left side face, a right side face, a front side face or a rear side face, a bottom face, and a top face; inside the housing are provided: a monitoring unit for monitoring the insulation resistance value of multiple on-site circuit buses to the ground; a positioning unit for sending a test current to multiple on-site circuits to locate the faulty circuit after the monitoring unit detects an insulation fault signal; a processor electrically connected to the monitoring unit and the positioning unit, and used to make the positioning unit send a test current to different output ports according to a preset polling instruction; wherein, a plurality of fixing components are arranged on the inner surface of the bottom face, and the arrangement positions of the fixing components correspond to the fixing positions of the monitoring unit, the positioning unit, and the processor, and are used to fix or limit the monitoring unit and the positioning unit to the inner side of the bottom face; a plurality of electrical signal interfaces are arranged on the front side face or the rear side face, so that the monitoring unit and the positioning unit receive or send signals to a specified device through the electrical signal interfaces.

[0006] The packaging structure design of the insulation monitoring and positioning device of the present application cooperates with the multi-loop switching matrix module to jointly solve the problems in the prior art such as complex, large-scale, and space-consuming equipment in the insulation monitoring system. The present application enables an insulation monitoring and positioning device and a multi-loop switching matrix module to achieve the insulation monitoring of 144 on-site loops. Under the condition of achieving the same monitoring range as the prior art, the equipment scale is greatly reduced, the equipment cost is reduced, and the requirement for on-site space is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 The structural explosion diagram of the packaging structure of the insulation monitoring and positioning device provided by an embodiment of the present application is shown;

[0008] Figure 2A As shown in Figure 1 The internal space and layout diagram of the packaging structure of the embodiment shown;

[0009] Figure 2B For Figure 2A The partial diagram of the embodiment shown. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0010] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer and more understandable, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0011] In the present application, the words related to directions, such as up, down, top, bottom, inside, outside, high, and low, are based on the position of the packaging structure of the insulation monitoring and positioning device in the normal use state as the reference position.

[0012] The technical solution provided by the present application is as follows:

[0013] A packaging structure of an insulation monitoring and positioning device, comprising:

[0014] The housing forms an internal encapsulation space for the device. The housing includes a left side face, a right side face, a front side face or a rear side face, a bottom face, and a top face. Inside the housing, there are provided: a monitoring unit for monitoring the insulation resistance values of multiple on-site loop buses to the ground; a positioning unit for sending a test current to multiple on-site loops to locate the faulty loop after the monitoring unit detects an insulation fault signal; a processor electrically connected to the monitoring unit and the positioning unit, for causing the positioning unit to send a test current to different output ports according to a preset polling instruction. Wherein, a plurality of fixing components are arranged on the inner surface of the bottom face, and the arrangement positions of the fixing components correspond to the fixing positions of the monitoring unit, the positioning unit, and the processor, for fixing or restricting the monitoring unit and the positioning unit inside the bottom face; a plurality of electrical signal interfaces are arranged on the front side face or the rear side face, enabling the monitoring unit and the positioning unit to receive or send signals to a specified device through the electrical signal interfaces.

[0015] In at least one embodiment, the monitoring unit and the positioning unit are arranged diagonally in the encapsulation space.

[0016] In at least one embodiment, a display and control buttons are arranged on the top face.

[0017] In at least one embodiment, a raised surface is arranged on the top face, and the display and control buttons are arranged on the raised surface.

[0018] In at least one embodiment, an indicating signal lamp is further arranged on the raised surface; the indicating signal lamp and the control buttons are respectively arranged on both sides of the display.

[0019] In at least one embodiment, heat dissipation holes are further arranged on the left side face and the right side face.

[0020] In at least one embodiment, a plurality of electrical signal interfaces arranged on the front side face or the rear side face include a signal input interface and a signal output interface. The signal input interface is used for receiving the insulation resistance value of the on-site loop feedback to the ground; the signal output interface is used for connecting a multi-loop switching matrix module. In at least one embodiment, both the signal input interface and the signal output interface are arranged on the front side face.

[0021] In at least one embodiment, the fixing component includes a nut fixing column, a bottom frame, a connecting column, a top frame, and a bolt. Wherein, the nut fixing column is fixed on the inner side face of the bottom face. One end of the connecting column is a bolt column and the other end is a nut groove. Through holes corresponding to the position of the nut fixing column are arranged on the bottom frame and the top frame. One end of the bolt column of the connecting column passes through the through hole on the bottom frame and is threadedly connected to the corresponding nut column. One end of the nut groove of the connecting column passes through the through hole on the top frame and is threadedly connected to the corresponding bolt.

[0022] The following will describe in detail the specific implementation process of the embodiments of the present application in conjunction with the drawings.

[0023] AsFigure 1 The figure shows the packaging structure of an insulation monitoring and positioning device according to an embodiment of the present application. Its housing includes six faces, namely the left vertical face, the right vertical face, the front vertical face or the rear vertical face, the bottom face and the top face. Among them, heat dissipation holes 10 are provided on the left vertical face 4 and the symmetrically arranged right vertical face. The top face 2 has a convex surface, on which a display 3 and some buttons and signal lights are provided. The signal lights are used to display warning signals and alarm signals, and the display is used to display the status of monitoring data. A signal input interface 42 and a signal output interface 41 are provided on the front vertical face 4. The signal input interface is used to receive the ground insulation resistance value feedback from the on-site loop. The signal output interface is used to connect to a multi-loop switching matrix module, and the multi-loop switching matrix module is used to connect the test current of the positioning unit to different loops according to the polling instruction.

[0024] As Figure 2A and 2B shown in Figure 1 the internal space and layout of the packaging structure of the embodiment shown in Figure 2A shown, a monitoring unit 7, a positioning unit 6, and a processor 8 are provided inside the housing. The processor 8 is electrically connected to the monitoring unit 7 and the positioning unit 6. Among them, the monitoring unit 7 and the positioning unit 6 are arranged in the packaging space. The monitoring unit 7 is used to monitor the ground insulation resistance values of multiple on-site loop buses. The positioning unit 6 is used to send a test current to multiple on-site loops to locate the faulty loop after the monitoring unit 7 detects an insulation fault signal. The processor 8 is used to make the positioning unit send a test current to different output ports according to a preset polling instruction. Concave surfaces are provided on the front vertical face and the rear vertical face to facilitate the setting of interfaces, so that after the interfaces are fixed on the front vertical face or the rear vertical face, their heights are adapted to the overall height of the front vertical face and the rear vertical face. The electrical signal interfaces provided on the front vertical face or the rear vertical face include a signal input interface and a signal output interface. The signal input interface is used to receive the ground insulation resistance value feedback from the on-site loop. The signal output interface is used to connect to a multi-loop switching matrix module.

[0025] As Figure 2B shown in Figure 2A a partial schematic diagram of the embodiment shown, in which a plurality of fixing components 9 are provided on the inner surface of the bottom face 5. The setting positions of the fixing components 9 correspond to the fixing positions of the monitoring unit, the positioning unit, and the processor, and are used to fix or limit the monitoring unit and the positioning unit to the inner side of the bottom face. The fixing component 9 includes a nut fixing column 91, a bottom frame, a connecting column 93, a top frame, and a bolt 93. Among them, the nut fixing column 91 is fixed on the inner side face of the bottom face. One end of the connecting column is a bolt column and the other end is a nut groove. Through holes corresponding to the positions of the nut fixing columns are provided on the bottom frame and the top frame. One end of the bolt column of the connecting column passes through the through hole on the bottom frame and is threadedly connected to the corresponding nut column. One end of the nut groove of the connecting column passes through the through hole on the top frame and is threadedly connected to the corresponding bolt.

[0026] The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, which do not limit the scope of the present invention. Those skilled in the art can implement the present invention in various variant embodiments without departing from the scope and essence of the present invention. For example, the features of one embodiment can be used in another embodiment to obtain another embodiment. Any modification, equivalent replacement, and improvement made within the technical concept of the present invention shall fall within the scope of the present invention.

Claims

1. A packaging structure of an insulation monitoring and positioning device, characterized in that include: A housing, forming an internal packaging space for the device, the housing comprising a left side elevation, a right side elevation, a front side elevation, a rear side elevation, a bottom surface and a top surface; The housing is provided with: A monitoring unit, used to monitor the insulation resistance to ground of multiple field loop busbars; A positioning unit, configured to send a test current to the plurality of field loops to locate a faulty loop after the monitoring unit detects an insulation fault signal; A processor, connected to the monitoring unit and the positioning unit by electrical signals, and configured to enable the positioning unit to send a test current to different output ports according to a preset polling instruction; Wherein, a plurality of fixing components are arranged on the inner surface of the bottom surface, and the setting positions of the fixing components correspond to the fixing positions of the monitoring unit, the positioning unit and the processor, and are used to fix or limit the monitoring unit and the positioning unit to the inner side of the bottom surface; A plurality of electrical signal interfaces are arranged on the front side facade or the rear side facade, so that the monitoring unit and the positioning unit receive or send signals to a designated device through the electrical signal interfaces.

2. The packaging structure according to claim 1, characterized in that: The monitoring unit and the positioning unit are arranged diagonally in the packaging space.

3. The packaging structure according to claim 1, characterized in that: The top surface is provided with a display and control buttons.

4. The packaging structure according to claim 3, characterized in that: The top surface is provided with a convex surface, and the display and the control buttons are arranged on the convex surface.

5. The packaging structure according to claim 4, characterized in that: The raised surface is also provided with an indication signal light; the indication signal light and the control button are respectively arranged on both sides of the display.

6. The packaging structure according to claim 1, characterized in that: The left side facade and the right side facade are also provided with heat dissipation holes.

7. The packaging structure according to claim 1, characterized in that: The electrical signal interface includes a signal input interface and a signal output interface. The signal input interface is used to receive the insulation resistance to ground fed back by the field loop; the signal output interface is used to connect to a multi-loop switching matrix module.

8. The packaging structure according to claim 1, characterized in that: The fixing assembly includes a nut fixing column, a base frame, a connecting column, a top frame and a bolt, wherein the nut fixing column is fixed to the inner side of the bottom surface, one end of the connecting column is a bolt column and the other end is a nut groove, and through holes corresponding to the position of the nut fixing column are provided on the base frame and the top frame, one end of the bolt column of the connecting column passes through the through hole on the base frame and is threadedly connected to the corresponding nut column, and one end of the nut groove of the connecting column passes through the through hole on the top frame and is threadedly connected to the corresponding bolt.

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