Resistor substrate rearrangement mechanism

Abstract

The utility model provides a resistor substrate rearrangement mechanism, which is used for rearranging a plurality of resistor substrates according to terminal intervals on a material belt, and comprises a variable-interval positioning jig for bearing the plurality of resistor substrates, and a distance adjusting driving device for driving the positioning jig to be switched between a minimum interval and a maximum interval, the positioning jig comprises a plurality of positioning blocks arranged in the distance adjusting direction, the positioning blocks are connected through telescopic structures which are arranged at equal intervals in the distance adjusting direction, the top face of each positioning block is provided with a positioning point for positioning the resistor substrate, and the positioning points are linearly distributed in the distance adjusting direction. During production, a plurality of resistor substrates are respectively placed on the positioning points on the top surfaces of the positioning blocks for positioning, and then the distance adjusting driving device is used for driving the positioning blocks to move to the maximum distance, so that the distance between the resistor substrates can be adjusted to correspond to the distance between terminals, and subsequent automatic assembly production is facilitated; the rearrangement mechanism is simple in structure and accurate in positioning.

Description

Technical Field

[0001] The utility model relates to the technical field of potentiometer production equipment, in particular to a resistor substrate rearrangement mechanism. Background Art

[0002] Potentiometers belong to precision electronic devices, with many parts, small volume, and high precision requirements, making their production and assembly costs relatively high. How to improve production efficiency and quality and reduce product costs is the core for manufacturers to enhance competitiveness.

[0003] Among them, one or more groups of resistor substrates are provided inside a rotary potentiometer, and the resistor substrates are connected with three conductive terminals for soldering the potentiometer to a circuit board. During the production process, the conductive layer of the resistor substrate is printed on the surface of an insulating mother board in a matrix, and then cut and formed. When cutting, only slots are cut out on each mother board to keep the mother board integral, which is convenient for storage and transportation, and then separated during subsequent production; the terminals are also punched and formed from a metal strip. Usually, two groups of juxtaposed and oppositely directed terminals are formed on the strip, and then separated during subsequent production. Considering maximizing the use of materials to reduce costs, the arrangement spacing and direction of the resistor substrates on the mother board do not correspond one-to-one to the arrangement spacing and direction of the terminals on the strip. Therefore, it is impossible to continuously and automatically supply the two parts in the form of a strip through equipment and align them to complete riveting. Therefore, it is necessary to design a resistor substrate rearrangement mechanism to rearrange the scattered resistor substrates removed from the mother board, so as to facilitate automatic assembly production with the terminal strip. Summary of the Utility Model

[0004] Aiming at the problems existing in the prior art, the utility model provides a resistor substrate rearrangement mechanism to facilitate the automatic assembly production of resistor substrates and terminals.

[0005] To achieve the above object, the technical solution adopted by the utility model is as follows:

[0006] A resistor substrate rearrangement mechanism for rearranging a plurality of resistor substrates according to the terminal spacing on a strip, comprising a positioning jig with variable spacing for receiving a plurality of resistor substrates, and a distance adjustment driving device for driving the positioning jig to switch between the minimum spacing and the maximum spacing; the positioning jig includes a plurality of positioning blocks arranged in the distance adjustment direction, and each of the positioning blocks is connected to each other through an equidistant telescopic structure along the distance adjustment direction. Each top surface of the positioning blocks has a positioning point for positioning the resistor substrate, and the positioning points are linearly distributed along the distance adjustment direction.

[0007] A preferred solution is that the telescopic structure includes a T-shaped block formed on one of the positioning blocks and extending along the distance adjustment direction, and a T-shaped groove formed on an adjacent other positioning block and inserted and matched with the T-shaped block, and there is a spacing space in the T-shaped groove for the T-shaped block to move a set length along the distance adjustment direction.

[0008] A preferred solution is that the rearrangement mechanism further includes a linear slide rail arranged along the distance adjustment direction. Among them, the positioning block far from the distance adjustment driving device is fixedly installed, and the remaining positioning blocks are slidably installed on the linear slide rail, and the positioning block close to the distance adjustment driving device is connected to the distance adjustment driving device.

[0009] A preferred solution is that each top surface of the positioning blocks has two positioning points distributed perpendicular to the distance adjustment direction, so that two sets of the positioning points arranged side by side and linearly distributed along the distance adjustment direction are formed on the top surface of the positioning jig.

[0010] A preferred solution is that the rearrangement mechanism further includes a commutation device, and a transfer device for transferring the two sets of the resistance substrates on the positioning jig to the commutation device as a whole; the commutation device includes two sets of positioning grooves corresponding to the distance between the two sets of positioning points at the maximum distance, a fixed table provided with one set of the positioning grooves, a rotating table provided with the other set of the positioning grooves, and a commutation driving device for driving the rotating table to translate and rotate 180°.

[0011] A preferred solution is that the commutation driving device includes a rotation driving device and a lifting driving device; the rotation driving device includes a gear concentrically fixed with the rotating table, a rack meshing with the gear, and a first cylinder for driving the rack to translate; and the lifting driving device includes a second cylinder for driving the rotating table and the rotation driving device as a whole to lift.

[0012] The beneficial effects of the present utility model are as follows: During production, several resistance substrates are respectively placed on the positioning points on the top surfaces of the positioning blocks for positioning, and then the distance adjustment driving device is used to drive each positioning block to move to the maximum distance, so that the distances between the resistance substrates can be adjusted to correspond to the terminal distances, which is convenient for subsequent automated assembly production; the rearrangement mechanism has a simple structure and accurate positioning. Description of the Drawings

[0013] The following further describes the present utility model in detail with reference to the drawings and specific embodiments.

[0014] Figure 1 It is a schematic diagram of the overall structure of the rearrangement mechanism in the embodiment;

[0015] Figure 2 It is Figure 1 a schematic diagram of the structure of the positioning jig in

[0016] Figure 3 is Figure 2 a schematic structural diagram of a positioning fixture and a commutation device in Specific embodiments

[0017] The present utility model will be further described below with reference to the accompanying drawings:

[0018] The embodiments described by referring to the accompanying drawings are exemplary and are intended to explain the present application, rather than being construed as a limitation to the present application. In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. In addition, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection", "fixation" should be understood in a broad sense. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0019] Referring to Figures 1 to 3 As shown, a resistor substrate rearrangement mechanism in this embodiment is used to rearrange a plurality of resistor substrates according to the terminal pitch on a tape, and includes a positioning fixture 1 with variable pitch for receiving a plurality of resistor substrates, and a pitch adjustment driving device 2 for driving the positioning fixture 1 to switch between the minimum pitch and the maximum pitch; the positioning fixture 1 includes a plurality of positioning blocks 11 arranged in the pitch adjustment direction, and each of the positioning blocks 11 is connected to each other through a telescopic structure 12 with equal pitch along the pitch adjustment direction. Each top surface of the positioning blocks 11 has a positioning point 13 for positioning the resistor substrate, and the positioning points 13 are linearly distributed along the pitch adjustment direction.

[0020] During production, a plurality of resistor substrates are respectively placed on the positioning points 13 on the top surfaces of the positioning blocks 11 for positioning, and then the pitch adjustment driving device 2 is used to drive each positioning block 11 to move to the maximum pitch, so that the pitch of each resistor substrate can be adjusted to correspond to the terminal pitch, which is convenient for subsequent automated assembly production; the rearrangement mechanism has a simple structure and accurate positioning.

[0021] A preferred solution is that the telescopic structure 12 in this embodiment includes a T-shaped block 12a formed on one of the positioning blocks 11 and extending in the distance adjustment direction, and a T-shaped groove 12b formed on another adjacent positioning block 11 and in plug-in fit with the T-shaped block 12a. Moreover, there is a spacing space in the T-shaped groove 12b for the T-shaped block 12a to move a set length in the distance adjustment direction. The cooperation between the T-shaped block 12a and the T-shaped groove 12b between two adjacent positioning blocks 11 enables the adjustment of the maximum and minimum spacings by sliding the positioning block 11. This equidistant telescopic structure 12 has strong stability and a simple structure. In other embodiments, the adjacent positioning blocks 11 can also be connected by other equidistant telescopic structures 12 with a set minimum length and maximum length, such as telescopic rods, fixed-length connecting ropes, etc.

[0022] A preferred solution is that the rearrangement mechanism in this embodiment further includes a linear slide rail 3 arranged in the distance adjustment direction. Among them, the positioning block 11 far from the distance adjustment driving device 2 is fixedly installed, while the remaining positioning blocks 11 are slidably installed on the linear slide rail 3, and the positioning block 11 close to the distance adjustment driving device 2 is connected to the distance adjustment driving device 2. The linear slide rail 3 ensures that each positioning block 11 remains in the same straight line during the distance adjustment, ensuring the stability of the structure and improving the arrangement accuracy of each resistor substrate.

[0023] A preferred solution is that the top surface of each positioning block 11 of this embodiment has two positioning points 13 distributed perpendicular to the distance adjustment direction, so that the top surface of the positioning fixture 1 forms two parallel groups of positioning points 13 distributed in a straight line along the distance adjustment direction. Furthermore, the rearrangement mechanism also includes a reversing device 4, and a transfer device 5 that transfers the two groups of resistor substrates on the positioning fixture 1 to the reversing device 4 as a whole; the reversing device 4 includes two groups of positioning grooves 41 corresponding to the spacing between the two groups of positioning points 13 with the largest spacing, a fixed table 42 for setting one group of the positioning grooves 41, a rotating table 43 for setting the other group of the positioning grooves 41, and a reversing drive device 44 that drives the rotating table 43 to translate and rotate 180°. Normally, in order to save materials and facilitate molding and production, the material strip is configured to have two sets of terminals that are opposite and in opposite directions. The reversing device 4 is used to reverse the direction of one set of resistor substrates so that the two sets of opposite resistor substrates are simultaneously plugged and matched with the terminals at the same section of the material strip to complete the riveting. During operation, the transfer device 5 simultaneously transfers the two sets of resistor substrates with adjusted spacing to the two sets of positioning grooves 411, and the reversing drive device 44 drives the rotating table 43 to translate to be offset from the plane of the fixed table 42, such as lifting or moving forward and backward, or moving left and right to avoid interference between the rotating table 43 and the fixed table 42, and then drives the rotating table 43 to rotate 180°, and finally resets it to remain in the same plane with the fixed table 42, so as to complete the reversal of one set of resistor substrates. The lifting or translation of the reversing drive device 44, as well as the rotating structure, can be achieved by conventional technical means in the field, and will not be described in detail. In other embodiments, the reversing device 4 can also be set on the transfer device 5, that is, the transfer device 5 includes two parallel groups of jaws, one group of jaws first completes a 180° rotation when transferring the resistor substrate to the positioning groove 41; it can also be other methods, such as the transfer device 5 is only provided with one group of jaws, but the two groups of resistor substrates are transferred in two times, and one group is rotated 180° during transfer.

[0024] A preferred solution, the reversing drive device 44 of this embodiment includes a rotating drive device 441 and a lifting drive device 442; the rotating drive device 441 includes a gear fixed concentrically with the rotating platform 43, a rack 4411 meshing with the gear, and a first cylinder 4412 driving the rack 4411 to translate; and the lifting drive device 442 includes a second cylinder 4421 driving the rotating platform 43 and the rotating drive device 441 to lift and lower as a whole. When working, the second cylinder 4421 drives the rotating platform 43 as a whole to move away from or approach the fixed platform 42, and the first cylinder 4412 drives the rack 4411 to translate, thereby driving the rotating platform 43 to rotate through the gear.

[0025] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A resistor substrate rearrangement mechanism, used to rearrange a plurality of resistor substrates according to the terminal spacing on a material strip, comprising a positioning fixture with a variable spacing for receiving a plurality of resistor substrates, and a spacing drive device for driving the positioning fixture to switch between a minimum spacing and a maximum spacing; the positioning fixture comprises a plurality of positioning blocks arranged in a spacing adjustment direction, and each of the positioning blocks is interconnected by an equidistant telescopic structure along the spacing adjustment direction, each of the positioning blocks has a positioning point on the top surface for positioning the resistor substrate, and each of the positioning points is distributed in a straight line along the spacing adjustment direction.

2. The resistor substrate rearrangement mechanism according to claim 1, characterized in that: The telescopic structure includes a T-block formed on one of the positioning blocks and extending along the distance adjustment direction, and a T-slot formed on another adjacent positioning block and plugged into the T-block, and the T-slot has a spacing space for the T-block to move a set length along the distance adjustment direction.

3. The resistor substrate rearrangement mechanism according to claim 2, characterized in that: The rearrangement mechanism also includes a linear slide rail arranged along the distance adjustment direction, wherein the positioning block away from the distance adjustment drive device is fixedly installed, and the remaining positioning blocks are slidably installed on the linear slide rail, and the positioning block close to the distance adjustment drive device is connected to the distance adjustment drive device.

4. The resistor substrate rearrangement mechanism according to claim 1, characterized in that: The top surface of each positioning block has two positioning points distributed perpendicular to the distance adjustment direction, so that the top surface of the positioning fixture forms two parallel groups of positioning points distributed in a straight line along the distance adjustment direction.

5. The resistor substrate rearrangement mechanism according to claim 4, characterized in that: The rearrangement mechanism also includes a reversing device, and a transferring device that transfers the two groups of the resistor substrates on the positioning fixture as a whole to the reversing device; the reversing device includes two groups of positioning grooves corresponding to the spacing between the positioning points with the maximum spacing between the two groups, a fixed table for setting one group of the positioning grooves, a rotating table for setting the other group of the positioning grooves, and a reversing drive device that drives the rotating table to translate and rotate 180°.

6. The resistor substrate rearrangement mechanism according to claim 5, characterized in that: The reversing drive device includes a rotation drive device and a lifting drive device; the rotation drive device includes a gear fixed concentrically with the rotating table, a rack meshing with the gear, and a first cylinder driving the rack to translate; and the lifting drive device includes a second cylinder driving the rotating table and the rotation drive device to rise and fall as a whole.

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