Mechanism capable of converting single crystal wafer clamp into double crystal wafer clamp

Abstract

The utility model discloses a mechanism capable of converting a single-crystal wafer clamp into a double-crystal wafer clamp, which comprises a bracket assembly, a plurality of positioning groove assemblies, a plurality of clamping assemblies and a plurality of clamping assemblies, the bracket assembly is internally provided with a placing cavity, the placing cavity is internally provided with a plurality of positioning groove assemblies along a first direction, and the positioning groove assemblies are used for placing wafers; the driving assembly is in transmission connection with the bracket assembly and used for driving the bracket assembly to move in the first direction or in the direction opposite to the first direction. The utility model has the advantages of strong compatibility with the original machine, high stability and small occupied space, improves the processing efficiency and reduces the cost.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a mechanism that can be transformed from a single-wafer chuck to a double-wafer chuck. Background Art

[0002] In semiconductor process equipment, especially the wafer carrier mechanism, it is a semiconductor manufacturing equipment with very wide applications. In wafer processing equipment, the wafer carrier mechanism is one of the most important mechanisms.

[0003] In the prior art, the processing quantity and efficiency of a single-wafer chuck machine cannot meet the current requirements. Therefore, a double-wafer chuck machine is designed, which can double the number of wafers processed at the same time, thereby improving the processing efficiency. However, the current double-wafer chuck machine is large in size, occupies a large space, and has a high cost, resulting in that the double-wafer chuck machine is not accepted by most enterprises. Therefore, a new wafer chuck mechanism is urgently needed. Summary of the Utility Model

[0004] Aiming at the above problems existing in the existing double-wafer chuck machine, the present invention aims to provide a mechanism that can be transformed from a single-wafer chuck to a double-wafer chuck, which has strong compatibility with the original machine, high stability, small occupied space, improves the processing efficiency, and reduces the cost.

[0005] The specific technical solutions are as follows:

[0006] A mechanism that can be transformed from a single-wafer chuck to a double-wafer chuck, comprising:

[0007] A bracket assembly, which has a placement cavity therein. Along a first direction in the placement cavity, there are several positioning groove assemblies for placing wafers.

[0008] A driving assembly, which is in transmission connection with the bracket assembly and is used to drive the bracket assembly to move along the first direction or the reverse direction of the first direction.

[0009] In the above-mentioned mechanism that can be transformed from a single-wafer chuck to a double-wafer chuck, the driving assembly includes: a driving member, a lead screw, a nut, and a connecting block. The driving member is in transmission connection with the lead screw to rotate the lead screw. The nut moves along the first direction on the lead screw, and the connecting block is fixedly connected to the nut and the bracket assembly respectively.

[0010] In the above-mentioned mechanism that can be transformed from a single-wafer chuck to a double-wafer chuck, the driving member is in transmission connection with the lead screw through a synchronous assembly. The synchronous assembly includes: two synchronous pulleys and a synchronous belt. One synchronous pulley is installed on the driving member, and the other synchronous pulley is installed on the lead screw. The synchronous belt is arranged in transmission on the two synchronous pulleys.

[0011] The lead screw is arranged along the first direction.

[0012] The mechanism capable of transforming from a single-wafer chuck to a double-wafer chuck, further comprising: a fixing frame, the driving assembly is installed in the fixing frame, at least one slide rail is provided on the fixing frame, at least one slider is provided on the bracket assembly, and the slider is slidably engaged with the slide rail;

[0013] The slide rail is arranged along the first direction.

[0014] The mechanism capable of transforming from a single-wafer chuck to a double-wafer chuck, wherein at least one photoelectric sensor is provided on the bracket assembly, at least one induction piece is provided on the fixing frame, and the photoelectric sensor is inductively engaged with the induction piece.

[0015] The mechanism capable of transforming from a single-wafer chuck to a double-wafer chuck, wherein a positioning assembly is provided in the bracket assembly, and a plurality of the positioning groove assemblies are arranged along the first direction on the positioning assembly.

[0016] The mechanism capable of transforming from a single-wafer chuck to a double-wafer chuck, wherein the positioning assembly includes: at least two brackets, the two brackets are arranged in parallel, and a plurality of the positioning groove assemblies are provided on the two brackets;

[0017] Each of the positioning groove assemblies includes at least two positioning grooves, the two positioning grooves are respectively provided on the two brackets correspondingly, and each wafer is positioned on the two oppositely arranged positioning grooves;

[0018] A plurality of the positioning groove assemblies are arranged at equal intervals along the first direction.

[0019] The mechanism capable of transforming from a single-wafer chuck to a double-wafer chuck, wherein a plurality of wafers on a plurality of the positioning groove assemblies in the bracket assembly are placed by the jaws of a robotic arm, and the number of a plurality of wafers on the jaws of the robotic arm is half of the number of a plurality of the positioning groove assemblies.

[0020] The mechanism capable of transforming from a single-wafer chuck to a double-wafer chuck, wherein the positioning assembly includes: a plurality of the brackets, the plurality of the brackets are respectively a first bracket and two second brackets, and the two second brackets are respectively arranged in parallel on both sides of the first bracket;

[0021] The positioning groove assembly includes: a plurality of the positioning grooves, the plurality of the positioning grooves are respectively a first positioning groove and two second positioning grooves, a plurality of the first positioning grooves are arranged along the first direction on the first bracket, a plurality of the second positioning grooves are arranged along the first direction on the second bracket, and one wafer is placed in one oppositely arranged first positioning groove and two second positioning grooves.

[0022] The above-mentioned mechanism that can be transformed from a single-wafer chuck to a double-wafer chuck, wherein the bracket assembly includes:

[0023] A bracket base, and the positioning assembly is arranged inside the bracket base;

[0024] A cover plate, the cover plate is fixed on the bracket base, a placement cavity is formed between the cover plate and the bracket base, and an opening communicating with the placement cavity is provided on the cover plate;

[0025] A support frame, the support frame is fixed between the bracket base and the cover plate, and the slide rail and the photoelectric sensor are arranged on the support frame.

[0026] The positive effects of the above technical solution compared with the prior art are:

[0027] The utility model is provided with at least twice as many positioning groove assemblies on the bracket assembly. By adjusting the position of the bracket assembly through the driving assembly, the positions of several positioning groove assemblies are adjusted. By placing several wafers on the jaws of the robotic arm into several positioning groove assemblies at least twice, the number of wafers placed on the original machine table is increased. It has strong compatibility with the original machine table, high stability, small occupied space, improves processing efficiency, and reduces costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure for placing wafers of a mechanism of the utility model that can be transformed from a single-wafer chuck to a double-wafer chuck;

[0029] Figure 2 It is a schematic diagram of the overall structure for placing wafers of a mechanism of the utility model that can be transformed from a single-wafer chuck to a double-wafer chuck;

[0030] Figure 3 It is a front view of the overall structure for placing wafers of a mechanism of the utility model that can be transformed from a single-wafer chuck to a double-wafer chuck;

[0031] Figure 4 It is a side view of the overall structure for placing wafers of a mechanism of the utility model that can be transformed from a single-wafer chuck to a double-wafer chuck;

[0032] Figure 5 It is a schematic diagram of the overall structure of a mechanism of the utility model that can be transformed from a single-wafer chuck to a double-wafer chuck;

[0033] Figure 6 It is a cross-sectional view of the overall structure of a mechanism of the utility model that can be transformed from a single-wafer chuck to a double-wafer chuck;

[0034] Figure 7 It is of a mechanism of the utility model that can be transformed from a single-wafer chuck to a double-wafer chuck Figure 6 partial enlarged view;

[0035] In the drawings: 1. Bracket assembly; 11. Bracket base; 12. Cover plate; 13. Support frame; 14. Opening; 2. Driving assembly; 21. Driving member; 22. Lead screw; 23. Nut; 24. Connecting block; 25. Synchronization assembly; 26. Synchronization pulley; 27. Synchronization belt; 3. Placing cavity; 4. Positioning groove assembly; 40. Positioning groove; 41. First positioning groove; 42. Second positioning groove; 5. Wafer; 6. Fixing frame; 61. Slide rail; 62. Slide block; 63. Photoelectric sensor; 64. Inductive sheet; 7. Positioning assembly; 70. Bracket; 71. First bracket; 72. Second bracket. Detailed implementation manners

[0036] The present utility model will be further described below in conjunction with the drawings and specific embodiments, but it is not limited to the present utility model.

[0037] As Figures 1 to 7 shown, a mechanism capable of changing from a single-wafer clamp to a double-wafer clamp in a preferred embodiment is shown, including: a bracket assembly 1 and a driving assembly 2. The bracket assembly 1 has a placing cavity 3 therein. Along a first direction in the placing cavity 3, there are several positioning groove assemblies 4. The positioning groove assemblies 4 are used for placing wafers 5. The driving assembly 2 is in transmission connection with the bracket assembly 1 and is used for driving the bracket assembly 1 to move along the first direction or the reverse direction of the first direction.

[0038] Further, as a preferred embodiment, the driving assembly 2 includes: a driving member 21, a lead screw 22, a nut 23 and a connecting block 24. The driving member 21 is in transmission connection with the lead screw 22 to rotate the lead screw 22. The nut 23 moves along the first direction on the lead screw 22. The connecting block 24 is fixedly connected to the nut 23 and the bracket assembly 1 respectively.

[0039] Further, as a preferred embodiment, the driving member 21 is in transmission connection with the lead screw 22 through a synchronization assembly 25. The synchronization assembly 25 includes: two synchronization pulleys 26 and a synchronization belt 27. One synchronization pulley 26 is installed on the driving member 21, and the other synchronization pulley 26 is installed on the lead screw 22. The synchronization belt 27 is arranged in transmission between the two synchronization pulleys 26.

[0040] Further, as a preferred embodiment, the lead screw 32 is arranged along the first direction.

[0041] Further, as a preferred embodiment, the mechanism capable of changing from a single-wafer clamp to a double-wafer clamp further includes: a fixing frame 6. The driving assembly 2 is installed in the fixing frame 6. The fixing frame 6 has at least one slide rail 61. The bracket assembly 1 has at least one slide block 62. The slide block 62 is in sliding fit with the slide rail 61.

[0042] Further, as a preferred embodiment, the slide rail 61 is arranged along the first direction.

[0043] The above is only a preferred embodiment of the present utility model, and does not limit the implementation manners and protection scope of the present utility model accordingly.

[0044] On the basis above, the present utility model further has the following implementation manners:

[0045] In a further embodiment of the present utility model, please continue to refer to Figures 1 to 7 As shown, at least one photoelectric sensor 63 is provided on the bracket assembly 1, at least one induction piece 64 is provided on the fixing bracket 6, and the photoelectric sensor 63 is in induction cooperation with the induction piece 64.

[0046] In a further embodiment of the present utility model, a positioning assembly 7 is provided inside the bracket assembly 1, and a plurality of positioning groove assemblies 4 are provided on the positioning assembly 7 along a first direction.

[0047] In a further embodiment of the present utility model, the positioning assembly 7 includes: at least two brackets 70, the two brackets 70 are arranged in parallel, and a plurality of positioning groove assemblies 4 are provided on the two brackets 70.

[0048] In a further embodiment of the present utility model, each positioning groove assembly 4 includes at least two positioning grooves 40, the two positioning grooves 40 are respectively provided on the two brackets 70 correspondingly, and each wafer 5 is positioned on the two opposite positioning grooves 40.

[0049] In a further embodiment of the present utility model, the plurality of positioning groove assemblies 4 are arranged at equal intervals along the first direction.

[0050] In a further embodiment of the present utility model, a plurality of wafers 5 on the plurality of positioning groove assemblies 4 inside the bracket assembly 1 are placed by the jaws of a robotic arm (not shown in the figure), and the number of the plurality of wafers 5 on the jaws of the robotic arm is half of the number of the plurality of positioning groove assemblies 4.

[0051] The number of wafers 5 clamped by the jaws of the robotic arm mentioned in the present utility model remains consistent.

[0052] In a further embodiment of the present utility model, the positioning assembly 7 includes: a plurality of brackets 70, the plurality of brackets 70 are respectively a first bracket 71 and two second brackets 72, and the two second brackets 72 are respectively arranged in parallel on both sides of the first bracket 71.

[0053] In a further embodiment of the present utility model, the positioning groove assembly 4 includes: a plurality of positioning grooves 40, the plurality of positioning grooves 40 are respectively a first positioning groove 41 and two second positioning grooves 42, a plurality of first positioning grooves 41 are provided on the first bracket 71 along the first direction, a plurality of second positioning grooves 42 are provided on the second bracket 72 along the first direction, and the same wafer 5 is placed in the opposite first positioning groove 41 and two second positioning grooves 42.

[0054] In a further embodiment of the present utility model, the bracket assembly 1 includes: a bracket base 11, a cover plate 12 and a support frame 13. The positioning assembly 7 is disposed within the bracket base 11. The cover plate 12 is fixed to the bracket base 11. A placement cavity 3 is formed between the cover plate 12 and the bracket base 11. The cover plate 12 has an opening 14 communicating with the placement cavity 3. The support frame 13 is fixed between the bracket base 11 and the cover plate 12. The slide rail 61 and the photoelectric sensor 63 are disposed on the support frame 13.

[0055] In the present utility model, at least twice as many positioning groove assemblies 4 are provided on the bracket assembly 1. The position of the bracket assembly 1 is adjusted by the driving assembly 2, so as to adjust the positions of the plurality of positioning groove assemblies 4. The plurality of wafers 5 on the jaws of the robotic arm are placed into the plurality of positioning groove assemblies 4 at least twice, so as to increase the number of wafers placed on the original machine platform. It has strong compatibility with the original machine platform, high stability, small occupied space, improves the processing efficiency and reduces the cost.

[0056] The above are only the preferred embodiments of the present utility model, and do not limit the implementation manners and protection scope of the present utility model accordingly. For those skilled in the art, it should be realized that all the equivalent replacements and obvious changes made by using the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A mechanism capable of transforming from a single wafer clamp to a double wafer clamp, characterized in that: include: A bracket assembly, wherein the bracket assembly has a placement cavity, wherein the placement cavity has a plurality of positioning groove assemblies along a first direction, and the positioning groove assemblies are used to place wafers; A driving assembly is drivingly connected to the bracket assembly and is used to drive the bracket assembly to move along the first direction or in a direction opposite to the first direction.

2. The mechanism capable of transforming from a single wafer clamp to a double wafer clamp according to claim 1, characterized in that: The driving assembly includes: a driving member, a screw rod, a nut and a connecting block. The driving member is connected to the screw rod in a transmission manner to rotate the screw rod. The nut moves on the screw rod along the first direction. The connecting block is fixedly connected to the nut and the bracket assembly respectively.

3. The mechanism capable of transforming from a single wafer clamp to a double wafer clamp according to claim 2, characterized in that: The driving member is connected to the screw through a synchronous assembly, and the synchronous assembly includes: two synchronous wheels and a synchronous belt, one of the synchronous wheels is mounted on the driving member, and the other synchronous wheel is mounted on the screw, and the synchronous belt transmission is arranged on the two synchronous wheels; The screw rod is arranged along the first direction.

4. The mechanism capable of transforming from a single wafer clamp to a double wafer clamp according to claim 2, characterized in that: It also includes: a fixed frame, the driving assembly is installed in the fixed frame, the fixed frame has at least one slide rail, the bracket assembly has at least one slider, and the slider is slidably matched with the slide rail; The slide rail is arranged along the first direction.

5. The mechanism capable of transforming from a single wafer clamp to a double wafer clamp according to claim 4, characterized in that: At least one photoelectric sensor is disposed on the bracket assembly, and at least one induction sheet is disposed on the fixing frame. The photoelectric sensor and the induction sheet are inductively matched.

6. The mechanism capable of transforming from a single wafer clamp to a double wafer clamp according to claim 5, characterized in that: A positioning assembly is provided inside the bracket assembly, and a plurality of positioning slot assemblies are provided on the positioning assembly along the first direction.

7. The mechanism capable of transforming from a single wafer clamp to a double wafer clamp according to claim 6, characterized in that: The positioning assembly comprises: at least two brackets, the two brackets are arranged in parallel, and the two brackets have a plurality of positioning slot assemblies; Each of the positioning groove assemblies comprises at least two positioning grooves, the two positioning grooves are respectively and correspondingly arranged on the two brackets, and each of the wafers is positioned on the two positioning grooves facing each other; A plurality of the positioning slot components are arranged at equal intervals along the first direction.

8. The mechanism capable of transforming from a single wafer clamp to a double wafer clamp according to claim 1, characterized in that: The plurality of wafers on the plurality of positioning slot assemblies in the bracket assembly are placed in through the clamping claws of the robotic arm, and the number of the plurality of wafers on the clamping claws of the robotic arm is half of the number of the positioning slot assemblies.

9. The mechanism capable of transforming from a single wafer clamp to a double wafer clamp according to claim 7, characterized in that: The positioning assembly comprises: a plurality of brackets, wherein the plurality of brackets are respectively a first bracket and two second brackets, and the two second brackets are respectively arranged in parallel on both sides of the first bracket; The positioning groove assembly includes: a plurality of positioning grooves, wherein the plurality of positioning grooves are respectively a first positioning groove and two second positioning grooves, the first bracket is provided with a plurality of the first positioning grooves along the first direction, the second bracket is provided with a plurality of the second positioning grooves along the first direction, and a wafer is placed in one of the first positioning grooves and two of the second positioning grooves facing each other.

10. The mechanism capable of transforming from a single wafer clamp to a double wafer clamp according to claim 6, characterized in that: The bracket assembly comprises: A bracket seat, wherein the positioning assembly is disposed in the bracket seat; A cover plate, the cover plate is fixed on the bracket seat, the placement cavity is formed between the cover plate and the bracket seat, and the cover plate has an opening communicating with the placement cavity; A support frame is fixed between the bracket seat and the cover plate, and the slide rail and the photoelectric sensor are arranged on the support frame.

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