Graphite base capable of preventing wafer from facing edge
By setting step grooves and sliders on the edge of the graphite base pit and combining the extrusion mechanism, the problem of wafer adhesion rupture is solved, achieving convenient wafer removal and safety improvement.
Patent Information
- Application Number
- CN202421676276.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-07-16
AI Technical Summary
The wafer slips and sticks in the foundation pit of the graphite base, causing the adhesion and cracking of the lower edge of the high temperature, affecting the safety of the pick-up and placement sheet.
Step grooves are set up at the edge of the foundation pit of the graphite base, and several sliders and positioning mechanisms are provided. Combined with the extrusion mechanism, the movement of the sliders and the coordination of the positioning grooves can prevent the wafer from being smeared and facilitate removal.
It effectively reduces the possibility of chip adhesion to the base, improves the convenience and safety of chip removal, and reduces the risk of chip rupture.
Smart Images
Figure CN223038932U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer epitaxy, in particular to a graphite base for preventing wafers from sticking to the edge. Background Art
[0002] During the wafer epitaxy production process, in order to make the surface reach the temperature required for epitaxial deposition, the wafer needs to be placed on a graphite base. In order to facilitate the picking and placing of the wafer, the position of the wafer on the graphite base must be fixed. Therefore, a foundation pit is opened on the graphite base so that the wafer is placed in the foundation pit of the graphite base for easy processing.
[0003] However, when the wafer is placed in the foundation pit, it will slip to varying degrees and finally stick tightly to the edge of the groove. In the case of high temperature, a layer of silicon will also be generated at the position where the wafer edge contacts the foundation pit edge of the base, causing the wafer to adhere to the foundation pit edge, and thus may cause the wafer to break when picking and placing the wafer; therefore, a graphite base for preventing wafers from sticking to the edge is proposed for the above problems. Summary of the Utility Model
[0004] In order to make up for the deficiencies of the prior art and reduce the risk of wafer breakage caused by adhesion, the utility model proposes a graphite base for preventing wafers from sticking to the edge.
[0005] The technical solution adopted by the utility model to solve its technical problems is: a graphite base for preventing wafers from sticking to the edge of the utility model, which includes a base body, an anti-sticking edge mechanism and an extrusion mechanism. A foundation pit is opened on the surface of the base body for placing the wafer;
[0006] The anti-sticking edge mechanism includes a slider. A step groove is opened on the surface of the foundation pit, and the slider is arranged in the step groove for preventing the wafer from sticking to the edge;
[0007] A plurality of sliders are provided, and a positioning mechanism is arranged in each slider for positioning the slider;
[0008] The extrusion mechanism includes a top plate, a dial rod and a clamping block. The clamping block drives the top plate to rotate through the dial rod. The slider is slidably connected in the step groove. The positioning mechanism includes a top block, the end of the top block is arc-shaped, and a plurality of positioning grooves are opened on the surface of the step groove relative to the positioning block;
[0009] By opening a stepped groove at the edge of the foundation pit and changing the steps into several sliders, the possibility of adhesion between the base and the wafer can be reduced. At the same time, through multiple movable small blocks, the effect that the wafer can avoid sticking to the edge in any direction of sliding can be achieved. At the same time, through the cooperation of the top block and the positioning groove, when the slider slides, the positioning groove squeezes the arc angle on the surface of the top block, so that the top block realizes the bouncing effect, which can improve the feel of the staff when sliding the slider, and can play a positioning role at the same time. When the slider is not in use, it can be positioned to avoid the slider sliding randomly and the possibility of sticking to the wafer surface again. After the epitaxy of the wafer is completed, the wafer is lifted by the extrusion mechanism, which is convenient for the staff to take.
[0010] Preferably, the extrusion mechanism further includes a groove, the groove is opened on the surface of the slider, a sliding shaft is slidably connected in the groove through a spring, one end of the sliding shaft penetrates through the groove and is slidably connected, and a clamping block is fixedly connected to the end. An empty groove is opened on the surface of the foundation pit, a cross bar is fixedly connected in the empty groove, a threaded shaft is slidably connected to the surface of the cross bar, the surface of the threaded shaft is rotationally connected to the lever through a thread, a cavity is opened in the base body, and the lever is movably connected in the cavity through a spring. A through groove is opened on the surface of the stepped groove, a limiting shaft is fixedly connected to one side of the top plate, and the side of the limiting shaft away from the top plate penetrates through the cross bar and is slidably connected;
[0011] First, move the slider above the through groove, then press the sliding shaft to move downward, and at the same time, it will squeeze the spring to generate elastic force. When the sliding shaft moves, it will drive the clamping block to move, so that the clamping block penetrates through the through groove and is stuck on the surface of the lever. At this time, slide the slider, so that the slider drives the lever to rotate, and at the same time, it will stretch the spring on one side of the lever to generate elastic force. Because the threaded shaft and the lever are threadedly connected, when the lever rotates, it will drive the top plate to move upward, and push out the wafer in the foundation pit, so as to facilitate the staff to clamp the wafer. Through the limiting shaft, it can be avoided that when the lever rotates, it drives the top plate to rotate synchronously, so that the top plate cannot rise. After the wafer is taken out, release the sliding shaft, the clamping block disengages from the lever, and at this time the spring drives the lever to reset, and the top plate drops, and then the foundation pit is cleaned to facilitate the next wafer epitaxy processing.
[0012] Preferably, a pressing block is fixedly connected to the end of the sliding shaft away from the clamping block, an inwards concave arc is opened on the surface of the pressing block, a clamping block is arranged in each slider, and an inclined angle is opened on the surface of the clamping block. Through the inclined angle, when the clamping block moves downward, it can be more conveniently stuck on one side of the lever, avoiding the situation of empty clamping.
[0013] Preferably, a limiting block is fixedly connected to the surface of the clamping block, the limiting block is in an "L" shape, and a limiting groove is opened on the side wall of the cavity at the position corresponding to the limiting block;
[0014] While pressing the pressing block to drive the clamping block to move, the clamping block will drive the limiting block to move. Then, when the sliding drives the limiting block to move to the position of the limiting groove, release the slider, so that the slider is reset under the drive of the spring, and at the same time drive the limiting block to snap into the limiting groove to position the clamping block. Through the cooperation of the positioning block and the positioning groove, the top plate is ejected and fixed at the same time, which can further assist the staff to take out the wafer more conveniently.
[0015] Preferably, anti-slip grooves are provided on the surface of the pressing block; during work, the anti-slip friction and the concave arc can further improve the friction of the staff's hand, avoid slipping and improve the comfort of the staff's hand at the same time.
[0016] The beneficial effects of the present utility model are as follows:
[0017] 1. By providing a stepped groove at the edge of the foundation pit and changing the steps into several sliders, the present utility model can reduce the possibility of adhesion between the base and the wafer. At the same time, through multiple movable small blocks, the effect that the wafer can avoid sticking to the edge in any direction of sliding can be achieved. Finally, the wafer is lifted by the extrusion mechanism, which is convenient for the staff to take.
[0018] 2. The present utility model positions while ejecting the top plate through the cooperation of the limiting block and the limiting groove, which can further assist the staff to take out the wafer more conveniently. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0020] Figure 1 Schematic structural diagram of the base body of Embodiment 1;
[0021] Figure 2 Schematic partial sectional structure diagram of the base body of Embodiment 1;
[0022] Figure 3 Schematic partial sectional structure diagram of the top plate of Embodiment 1;
[0023] Figure 4 For Embodiment 1 Figure 3 Schematic diagram of the structure at A in
[0024] Figure 5 For Embodiment 1 Figure 3 Schematic diagram of the structure at B in
[0025] Figure 6Schematic diagram of the anti-slip groove structure of Embodiment 2.
[0026] In the figure: 1, base body; 2, step groove; 3, top plate; 4, through groove; 5, slider; 6, pressing block; 7, foundation pit; 8, cavity; 9, limiting groove; 10, limiting block; 11, sliding shaft; 12, groove; 13, clamping block; 14, lever; 15, cross bar; 16, empty groove; 17, threaded shaft; 18, limiting shaft; 19, top block; 20, anti-slip groove. Detailed implementation mode
[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0028] Embodiment 1
[0029] Please refer to Figures 1-5 As shown, a graphite base for preventing wafer edge sticking includes a base body 1, an anti-edge-sticking mechanism and an extrusion mechanism. A foundation pit 7 is formed on the surface of the base body 1 for placing wafers;
[0030] The anti-edge-sticking mechanism includes a slider 5. A step groove 2 is formed on the surface of the foundation pit 7, and the slider 5 is arranged in the step groove 2 to prevent the wafer from sticking to the edge;
[0031] A plurality of sliders 5 are provided, and a positioning mechanism is arranged in each slider 5 for positioning the slider 5;
[0032] The extrusion mechanism includes a top plate 3, a lever 14 and a clamping block 13. The clamping block 13 drives the top plate 3 to rotate through the lever 14. The slider 5 is slidably connected in the step groove 2. The positioning mechanism includes a top block 19. The end of the top block 19 is arc-shaped, and a plurality of positioning grooves are formed on the surface of the step groove 2 at the position relative to the positioning block;
[0033] During operation, by opening a stepped groove 2 at the edge of the foundation pit 7 and changing the steps into several sliders 5, the possibility of adhesion between the base and the wafer can be reduced. At the same time, through multiple movable small blocks, the effect that the wafer can slide in any direction and avoid sticking to the edge can be achieved. At the same time, through the cooperation of the top block 19 and the positioning groove, when the slider 5 slides, the positioning groove squeezes the arc angle on the surface of the top block 19, enabling the top block 19 to achieve a bouncing effect, which can improve the feel of the operator when sliding the slider 5 and can also play a positioning role. When the slider 5 is not in use, it is positioned to prevent the slider 5 from sliding randomly and the possibility of sticking to the wafer surface again. After the epitaxy of the wafer is completed, the wafer is lifted by the extrusion mechanism, facilitating the operator to pick it up.
[0034] The extrusion mechanism further includes a groove 12, which is opened on the surface of the slider 5. A sliding shaft 11 is slidably connected in the groove 12 through a spring. One end of the sliding shaft 11 penetrates through the groove 12 and is slidably connected, and a clamping block 13 is fixedly connected to the end. An empty groove 16 is opened on the surface of the foundation pit 7, and a cross bar 15 is fixedly connected in the empty groove 16. A threaded shaft 17 is slidably connected to the surface of the cross bar 15. The surface of the threaded shaft 17 is rotationally connected to the lever 14 through a thread. A cavity 8 is opened in the base body 1, and the lever 14 is movably connected in the cavity 8 through a spring. A through groove 4 is opened on the surface of the stepped groove 2. A limiting shaft 18 is fixedly connected to one side of the top plate 3. The side of the limiting shaft 18 away from the top plate 3 penetrates through the cross bar 15 and is slidably connected;
[0035] During operation, first move the slider 5 above the through groove 4, then press the sliding shaft 11 to move downward, and at the same time, it will squeeze the spring to generate elastic force. When the sliding shaft 11 moves, it will drive the clamping block 13 to move, so that the clamping block 13 penetrates through the through groove 4 and is stuck on the surface of the lever 14. At this time, slide the slider 5, so that the slider 5 drives the lever 14 to rotate, and at the same time, it will stretch the spring on one side of the lever 14 to generate elastic force. Because the threaded shaft 17 and the lever 14 are threadedly connected, when the lever 14 rotates, it will drive the top plate 3 to move upward, ejecting the wafer in the foundation pit 7, thereby facilitating the operator to clamp the wafer. Through the limiting shaft 18, it can be avoided that when the lever 14 rotates, it drives the top plate 3 to rotate synchronously, making the top plate 3 unable to rise. After the wafer is taken out, release the sliding shaft 11, and the clamping block 13 disengages from the lever 14. At this time, the spring drives the lever 14 to reset, and the top plate 3 drops, and then the foundation pit 7 is cleaned to facilitate the next wafer epitaxy processing.
[0036] One end of the sliding shaft 11 away from the clamping block 13 is fixedly connected with a pressing block 6, and the surface of the pressing block 6 is provided with an in - concave arc. Each slider 5 is provided with a clamping block 13, and the surface of the clamping block 13 is provided with an oblique angle; During operation, through the oblique angle, when the clamping block 13 moves downward, it can be more conveniently stuck on one side of the lever 14, avoiding the situation of missing the catch.
[0037] A limiting block 10 is fixedly connected to the surface of the clamping block 13. The limiting block 10 is in an "L" shape, and a limiting groove 9 is formed in the side wall of the cavity 8 at a position corresponding to the limiting block 10.
[0038] During operation, when pressing the pressing block 6 to drive the clamping block 13 to move, the clamping block 13 will drive the limiting block 10 to move. Then, when the limiting block 10 is driven to move to the position of the limiting groove 9 by sliding, release the slider 5, so that the slider 5 is reset under the drive of the spring, and at the same time drive the limiting block 10 to be stuck into the limiting groove 9 to position the clamping block 13. By matching the positioning block with the positioning groove, the top plate 3 is ejected and fixed at the same time, so as to assist the staff to take out the wafer more conveniently.
[0039] Embodiment 2
[0040] Please refer to Figure 6 As shown, compared with Embodiment 1, as another implementation manner of the present invention, anti-slip grooves 20 are formed on the surface of the pressing block 6; during operation, the anti-slip friction and the concave arc can further improve the friction of the staff's hand, avoid slipping and improve the comfort of the staff's hand at the same time.
[0041] In the description of this specification, the descriptions referring to terms such as "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0042] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.
Claims
1. A graphite susceptor for preventing wafer from sticking to the edge, characterized in that: It comprises a base body (1), an anti-adherence mechanism and an extrusion mechanism, wherein a foundation pit (7) is provided on the surface of the base body (1) for placing a wafer; The anti-edge-adherence mechanism comprises a slider (5), a step groove (2) is provided on the surface of the foundation pit (7), and the slider (5) is arranged in the step groove (2) to prevent the wafer from adhering to the edge; A plurality of the sliders (5) are provided, and each of the sliders (5) is provided with a positioning mechanism for positioning the slider (5); The extrusion mechanism comprises a top plate (3), a lever (14) and a clamping block (13); the clamping block (13) drives the top plate (3) to rotate via the lever (14).
2. The graphite susceptor for preventing wafer from sticking to the edge according to claim 1, characterized in that: The sliding block (5) is slidably connected in the step groove (2), the positioning mechanism comprises a top block (19), the end of the top block (19) is arc-shaped, and a plurality of positioning grooves are provided on the surface of the step groove (2) relative to the position of the positioning block.
3. The graphite susceptor for preventing wafer from sticking to the edge according to claim 2, characterized in that: The extrusion mechanism further comprises a groove (12), wherein the groove (12) is provided on the surface of the slider (5), a sliding shaft (11) is slidably connected in the groove (12) via a spring, one end of the sliding shaft (11) passes through the groove (12) and is slidably connected, and a clamping block (13) is fixedly connected to the end thereof, a hollow groove (16) is provided on the surface of the foundation pit (7), a cross bar (15) is fixedly connected in the hollow groove (16), a threaded shaft (17) is slidably connected to the surface of the cross bar (15), and the surface of the threaded shaft (17) is rotatably connected to the shifting rod (14) via a thread, a hollow cavity (8) is provided in the base body (1), and the shifting rod (14) is movably connected in the hollow cavity (8) via a spring, and a through groove (4) is provided on the surface of the step groove (2).
4. The graphite susceptor for preventing wafer from sticking to the edge according to claim 3, characterized in that: A limiting shaft (18) is fixedly connected to one side of the top plate (3), and a side of the limiting shaft (18) away from the top plate (3) passes through the cross bar (15) for sliding connection.
5. The graphite susceptor for preventing wafer from sticking to the edge according to claim 4, characterized in that: One end of the sliding shaft (11) away from the clamping block (13) is fixedly connected to a pressing block (6), the surface of the pressing block (6) is provided with an inwardly concave arc, each of the sliding blocks (5) is provided with a clamping block (13), and the surface of the clamping block (13) is provided with an oblique angle.
6. The graphite susceptor for preventing wafer from sticking to the edge according to claim 5, characterized in that: The surface of the clamping block (13) is fixedly connected to a limiting block (10); the limiting block (10) is in an "L" shape; and a limiting groove (9) is provided on the side wall of the cavity (8) at a position relative to the limiting block (10).
7. The graphite susceptor for preventing wafer from sticking to the edge according to claim 6, characterized in that: The surface of the pressing block (6) is provided with an anti-slip groove (20).