Cooling forming device for processing high-temperature-resistant superhard material

Abstract

The utility model discloses a cooling forming device for processing a high-temperature-resistant superhard material, which comprises an upper die and a lower die, and cooling mechanisms are arranged in the upper die and the lower die; the cooling mechanism comprises a reducer pipe, cooling cavities are formed in the upper mold and the lower mold, a first cooling pipeline is fixed to the inner wall of the cooling cavity in the upper mold, one end of the first cooling pipeline communicates with the reducer pipe, connecting plates are fixed to the two sides of the upper mold, and air cooling pipes are fixed to the bottoms of the connecting plates. A plurality of spray heads communicate with the surface of the air cooling pipe, a second cooling pipeline is fixed to the inner wall of the cooling cavity in the lower mold, and flow dividing pipes communicate with the two sides of the second cooling pipeline correspondingly. The forming mold has the advantages that the upper mold and the lower mold can be cooled, so that the cooling effect of the upper mold and the lower mold is more uniform, and the problems that the cooling effect of the forming mold is poor and the upper mold is difficult to effectively cool are solved.

Description

Technical Field

[0001] The utility model relates to the technical fields of molds and superhard material processing, and particularly relates to a cooling and forming device for processing high-temperature resistant superhard materials. Background Technique

[0002] Superhard materials generally refer to materials with extremely high hardness and strong wear resistance, such as diamond, cubic boron nitride, etc. These materials can be injected into a mold after being heated and melted, and then cooled and solidified to form the required shape. Artificial diamond needs to use a mold for shaping during production.

[0003] After retrieval, the Chinese patent with the publication number of CN220179949U discloses a high-temperature resistant shaping mold device.

[0004] The utility model includes an upper mold. The bottom of the upper mold is detachably connected to a lower mold through bolts. The bottom of the lower mold is fixedly connected to a base. A storage table is arranged at the bottom of the base. A storage box is welded to the bottom of the storage table. A circulating liquid discharge pump is fixedly connected to the bottom of the storage box. A liquid inlet pipe is fixedly connected to one side of the circulating liquid discharge pump. A liquid outlet pipe is fixedly connected to the other side of the circulating liquid discharge pump. The tops of the liquid inlet pipe and the liquid outlet pipe both extend into a cooling cavity opened inside the lower mold. For this high-temperature resistant shaping mold, through the arranged high-temperature resistant components, the high-temperature resistance and heat dissipation efficiency of the mold can be effectively improved, avoiding the situation that the temperature inside the mold is too high to ensure the rapid shaping of the internal finished product, and effectively improving the shaping speed of the finished product.

[0005] However, the patent still has the following problems: The device cools and reduces the temperature of the lower mold through the cooling cavity and heat dissipation columns, but the upper mold in the device cannot be effectively cooled. This will not only lead to too long cooling time of the product and reduced production efficiency, but also cause unstable product dimensions, increased internal stress, and make the upper mold easily damaged, making it difficult to meet the usage requirements. Summary of the Invention

[0006] The purpose of the utility model is to provide a cooling and forming device for processing high-temperature resistant superhard materials, which has the advantages of being able to cool the upper and lower molds and making the cooling effects on the upper and lower molds more uniform, and solves the problems of poor cooling effect of the shaping mold and difficulty in effectively cooling and reducing the temperature of the upper mold.

[0007] To achieve the above purpose, the utility model provides the following technical solution: A cooling and forming device for high-temperature processing of superhard materials includes an upper mold and a lower mold, and cooling mechanisms are arranged inside both the upper mold and the lower mold;

[0008] The cooling mechanism includes a variable-diameter pipe. Cooling cavities are provided inside both the upper mold and the lower mold. A first cooling pipe is fixed to the inner wall of the cooling cavity inside the upper mold. One end of the first cooling pipe is communicated with the variable-diameter pipe. Connecting plates are fixed to both sides of the upper mold. An air-cooling pipe is fixed to the bottom of the connecting plate. A plurality of nozzles are communicated with the surface of the air-cooling pipe. A second cooling pipe is fixed to the inner wall of the cooling cavity inside the lower mold. Flow-dividing pipes are communicated with both sides of the second cooling pipe.

[0009] As a preferred embodiment of the sizing die for high-temperature processing of superhard materials of the present invention, both the first cooling pipe and the second cooling pipe are made of copper alloy, and the inner wall of the first cooling pipe is chrome-plated.

[0010] As a preferred embodiment of the sizing die for high-temperature processing of superhard materials of the present invention, both the upper mold and the lower mold are made of WC-Co cemented carbide.

[0011] As a preferred embodiment of the sizing die for high-temperature processing of superhard materials of the present invention, thermocouples are installed on the surfaces of both the upper mold and the lower mold.

[0012] As a preferred embodiment of the sizing die for high-temperature processing of superhard materials of the present invention, the nozzles are aligned below the surface of the upper mold.

[0013] As a preferred embodiment of the sizing die for high-temperature processing of superhard materials of the present invention, a guide rod is fixed to the top of the upper mold, and a guide groove for cooperating with the guide rod is provided on the surface of the lower mold.

[0014] As a preferred embodiment of the sizing die for high-temperature processing of superhard materials of the present invention, the number of cooling cavities on the surface of the second cooling pipe and the lower mold is four, and the cooling cavities on the surface of the lower mold are evenly distributed at the bottom of the inner wall of the lower mold.

[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows: Through the setting of the cooling mechanism, the upper die and the lower die can obtain a uniform cooling effect. The external coolant enters the first cooling pipeline through the surface inlet and outlet nozzle of the reducing pipe and the reducing pipe itself. When the coolant enters the inside of the first cooling pipeline, due to the sudden reduction of the channel cross-sectional area, the fluid velocity is forced to increase, and a large flow velocity is likely to form turbulence near the reducing section. This structure is beneficial to increasing the local flow velocity, thereby improving the convective heat transfer efficiency. After that, the coolant inside the first cooling pipeline will absorb the self-temperature of the upper die, and the first cooling pipeline is designed in a shape like a Chinese character "mu". This design will cause the fluid to collide and mix at the intersection, thereby further forming turbulence. In the turbulent state, the molecules in the fluid are more fully mixed, and the hot fluid near the wall of the first cooling pipeline continuously exchanges heat with the colder fluid in the center, improving the heat transfer rate per unit area. At the same time, there are a large number of vortices and eddies in the turbulent flow. These microscopic structures promote the rapid diffusion and transfer of heat inside the fluid, thereby increasing the cooling effect of the upper die. In addition, the surface inlet and outlet nozzle of the air-cooling pipe can be externally connected to compressed air, so that the high-pressure air is blown onto the surface of the upper die and above the lower die through the nozzle to improve the cooling effect. When cooling the lower die, the coolant enters the inside of the shunt pipe through the surface inlet and outlet nozzle on one side of the shunt pipe, and then is dispersed into a plurality of second cooling pipelines. The plurality of distributed second cooling pipelines can evenly absorb the self-heat of the lower die, making the cooling effect of the lower die better. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a three-dimensional structure schematic diagram of the present utility model;

[0017] Figure 2 is a three-dimensional structure schematic diagram of another perspective of the present utility model;

[0018] Figure 3 is a structure schematic diagram of the cooling mechanism in the present utility model;

[0019] Figure 4 is a partial cross-sectional structure schematic diagram of the present utility model;

[0020] Figure 5 is a partial cross-sectional structure schematic diagram of the present utility model.

[0021] In the figure: 1, upper die; 2, cooling mechanism; 201, reducing pipe; 202, first cooling pipeline; 203, connecting plate; 204, air-cooling pipe; 205, nozzle; 206, shunt pipe; 207, second cooling pipeline; 208, thermocouple; 3, lower die; 4, guide rod. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] Please refer to Figures 1-5, A cooling and forming device for processing high-temperature superhard materials, including an upper mold 1 and a lower mold 3, and a cooling mechanism 2 is provided inside both the upper mold 1 and the lower mold 3;

[0023] The cooling mechanism 2 enables the upper mold 1 and the lower mold 3 to obtain a uniform cooling effect.

[0024] The cooling mechanism 2 includes a variable-diameter pipe 201. Cooling cavities are provided inside both the upper mold 1 and the lower mold 3. A first cooling pipe 202 is fixed to the inner wall of the cooling cavity inside the upper mold 1. One end of the first cooling pipe 202 is connected to the variable-diameter pipe 201. The first cooling pipe 202 is arranged in a mesh structure. Connecting plates 203 are fixed to both sides of the upper mold 1. An air-cooling pipe 204 is fixed to the bottom of the connecting plate 203. A plurality of nozzles 205 are communicated with the surface of the air-cooling pipe 204. A second cooling pipe 207 is fixed to the inner wall of the cooling cavity inside the lower mold 3. A shunt pipe 206 is communicated with both sides of the second cooling pipe 207. Inlet and outlet nozzles are communicated with the surfaces of the variable-diameter pipe 201, the first cooling pipe 202, the air-cooling pipe 204, and the shunt pipe 206;

[0025] External coolant enters the first cooling pipe 202 through the inlet and outlet nozzle on the surface of the variable-diameter pipe 201 and the variable-diameter pipe 201 itself. When the coolant enters the inside of the first cooling pipe 202, due to the sudden reduction of the channel cross-sectional area, the fluid velocity is forced to increase, and a large flow velocity is likely to form turbulence near the variable-diameter part. This structure is beneficial to increasing the local flow velocity, thereby improving the convective heat transfer efficiency. After that, the coolant inside the first cooling pipe 202 will absorb the self-temperature of the upper mold 1, and the mesh design of the first cooling pipe 202 will cause the fluid to collide and mix at the intersection, thereby further forming turbulence. In the turbulent state, the molecules in the fluid are mixed more fully, and the hot fluid near the wall of the first cooling pipe 202 continuously exchanges heat with the colder fluid in the center, improving the heat transfer rate per unit area. At the same time, there are a large number of vortices and eddies in the turbulent flow, and these microscopic structures promote the rapid diffusion and transfer of heat inside the fluid, thereby increasing the cooling effect of the upper mold 1. And the inlet and outlet nozzle on the surface of the air-cooling pipe 204 can be externally connected to compressed air, so that the high-pressure air is blown onto the surface of the upper mold 1 and above the lower mold 3 to improve the cooling effect. When cooling the lower mold 3, the coolant enters the shunt pipe 206 through the inlet and outlet nozzle on the surface of one shunt pipe 206 and then is dispersed into a plurality of second cooling pipes 207. The plurality of distributed second cooling pipes 207 can evenly absorb the self-heat of the lower mold 3, making the cooling effect of the lower mold 3 better.

[0026] Furthermore, both the first cooling pipe 202 and the second cooling pipe 207 are made of copper alloy, and the inner wall of the first cooling pipe 202 is chrome-plated;

[0027] Copper alloys have a relatively high thermal conductivity. As cooling pipes, they can quickly absorb the heat transferred from the mold and carry it away through the coolant. Chrome plating treatment can increase the smoothness and corrosion resistance of the inner wall of the pipe, reduce the problem of reduced heat transfer efficiency caused by dirt adhesion and corrosion, and chrome plating treatment can also reduce the heat transfer resistance and increase the heat transfer coefficient.

[0028] Furthermore, both the upper mold 1 and the lower mold 3 are made of WC-Co cemented carbide.

[0029] WC-Co cemented carbide has extremely high hardness and high temperature resistance, and can maintain good dimensional stability at high temperatures, making it suitable for high-temperature processing conditions of superhard materials.

[0030] Furthermore, thermocouples 208 are installed on the surfaces of both the upper mold 1 and the lower mold 3.

[0031] The thermocouples 208 can monitor the temperatures of the upper mold 1 and the lower mold 3, facilitating the operator to understand the mold temperature conditions.

[0032] Furthermore, the nozzle 205 is aligned below the surface of the upper mold 1.

[0033] So that the high-pressure air blown out by the nozzle 205 can blow onto the surface of the upper mold 1 and above the lower mold 3.

[0034] Furthermore, a guide rod 4 is fixed to the top of the upper mold 1, and a guide groove for cooperating with the guide rod 4 is provided on the surface of the lower mold 3.

[0035] When the upper mold 1 and the lower mold 3 are closed, the guide rod 4 can enter the guide groove, so that the upper mold 1 and the lower mold 3 can obtain a guiding effect.

[0036] Furthermore, the number of the second cooling pipes 207 and the cooling cavities on the surface of the lower mold 3 is four, and the cooling cavities on the surface of the lower mold 3 are evenly distributed at the bottom of the inner wall of the lower mold 3.

[0037] This design can enable the second cooling pipes 207 to more evenly disperse the heat of the lower mold 3 itself and improve the cooling effect.

[0038] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A cooling molding device for processing high temperature resistant superhard materials, comprising an upper mold (1) and a lower mold (3), characterized in that: The upper mold (1) and the lower mold (3) are both provided with cooling mechanisms (2); The cooling mechanism (2) comprises a reducer (201), the upper mold (1) and the lower mold (3) are both provided with cooling cavities, a first cooling pipe (202) is fixed to the inner wall of the cooling chamber inside the upper mold (1), one end of the first cooling pipe (202) is connected to the reducer (201), connecting plates (203) are fixed to both sides of the upper mold (1), an air cooling pipe (204) is fixed to the bottom of the connecting plate (203), a surface of the air cooling pipe (204) is connected to a plurality of nozzles (205), a second cooling pipe (207) is fixed to the inner wall of the cooling chamber inside the lower mold (3), and both sides of the second cooling pipe (207) are connected to shunt pipes (206).

2. The cooling and forming device for processing high temperature resistant superhard materials according to claim 1, characterized in that: The first cooling pipe (202) and the second cooling pipe (207) are both made of copper alloy, and the inner wall of the first cooling pipe (202) is chrome-plated.

3. The cooling and forming device for processing high temperature resistant superhard materials according to claim 1, characterized in that: The upper die (1) and the lower die (3) are both made of WC-Co hard alloy.

4. The cooling and forming device for processing high temperature resistant superhard materials according to claim 1, characterized in that: The surfaces of the upper mold (1) and the lower mold (3) are both installed with thermocouples (208).

5. The cooling and forming device for processing high temperature resistant superhard materials according to claim 1, characterized in that: The nozzle (205) is aligned below the surface of the upper mold (1).

6. The cooling and forming device for processing high temperature resistant superhard materials according to claim 1, characterized in that: A guide rod (4) is fixed to the top of the upper mold (1), and a guide groove for cooperating with the guide rod (4) is provided on the surface of the lower mold (3).

7. The cooling and forming device for processing high temperature resistant superhard materials according to claim 1, characterized in that: The number of the second cooling pipe (207) and the lower mold (3) surface cooling cavities is four, and the lower mold (3) surface cooling cavities are evenly distributed at the bottom of the inner wall of the lower mold (3).

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