Multifunctional wafer detection device

Abstract

The utility model discloses a multifunctional wafer detection device, which belongs to the technical field of wafer test equipment and comprises an installation platform, a jig assembly arranged on the installation platform and a first displacement mechanism arranged between the installation platform and the jig assembly. The mounting frame is arranged on the mounting platform and comprises a first mounting part and a second mounting part, and a second displacement mechanism is arranged between the first mounting part and the mounting frame; an optical analysis assembly, a range finder and a film thickness measuring instrument are respectively arranged on the first mounting part; and a light emitting assembly is arranged on the second mounting part and is rotationally arranged on the second mounting part. According to the multifunctional wafer detection device, the function that a single testing device tests all multiple parameters of the wafer is achieved, the problem that the wafer is frequently carried among multiple pieces of testing equipment is solved, and the wafer testing efficiency is greatly improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer testing equipment, and particularly relates to a multifunctional wafer detection device. Background Art

[0002] With the rapid development of the semiconductor and new display industries, the demand for detection equipment for semiconductor and new display devices is also increasing, and more and more functions need to be tested.

[0003] As the basic material in the semiconductor and new display industries, the manufacturing, testing, and packaging processes of wafers directly affect the performance of subsequent devices. In the existing wafer testing process, it is usually necessary to test the film thickness, surface warpage, surface spectral performance, etc. of the wafer surface. In the prior art, multiple testing devices are often required to test different performances of the wafer, and the wafer needs to be frequently relocated to different detection devices, resulting in a cumbersome detection process and low detection efficiency. Summary of the Utility Model

[0004] In view of one or more of the above defects or improvement requirements in the prior art, the utility model provides a multifunctional wafer detection device to solve the problem of frequently replacing detection devices in the existing wafer detection process.

[0005] To achieve the above object, the utility model provides a multifunctional wafer detection device, which includes:

[0006] An installation platform, a fixture assembly provided on the installation platform, and the fixture assembly is used for placing the wafer; a first displacement mechanism is provided between the installation platform and the fixture assembly, and the first displacement mechanism is used to drive the fixture assembly to move and rotate in a horizontal plane;

[0007] An installation frame, the installation frame is provided on the installation platform, and the installation frame is provided with a first installation part and a second installation part, and both the first installation part and the second installation part are provided above the fixture assembly;

[0008] A second displacement mechanism is provided between the first installation part and the installation frame, and the second displacement mechanism is used to drive the first installation part to move vertically;

[0009] An optical analysis component, a rangefinder, and a film thickness measuring instrument are respectively provided on the first installation part, and a light emitting component is provided on the second installation part, and the light emitting component is rotatably provided on the second installation part.

[0010] As a further improvement of the utility model, the light emitting component includes a laser and a collimating mirror connected to the laser;

[0011] An arc-shaped sliding groove is provided on the second mounting portion, and the collimating mirror is slidably arranged in the arc-shaped sliding groove, so that when performing spectral measurement, the optical axis of the light emitted by the laser intersects the optical axis of the optical analysis component at the center point of the wafer.

[0012] As a further improvement of the present utility model, the collimating mirror is mounted on a sliding base, and the sliding base is slidably mounted in the arc-shaped sliding groove;

[0013] A waist-shaped groove is provided on the end face of the collimating mirror that matches the sliding base, and a screw is passed through the waist-shaped groove.

[0014] As a further improvement of the present utility model, the first displacement mechanism includes a first slide rail arranged along a first direction, and the first slide rail is provided on the mounting platform;

[0015] A second slide rail is slidably matched with the first slide rail, the second slide rail is arranged along a second direction, and a sliding seat is slidably matched with the second slide rail;

[0016] The fixture assembly is provided on the sliding seat, and a rotating platform is provided between the sliding seat and the fixture assembly.

[0017] As a further improvement of the present utility model, a linear guide rail arranged side by side with the first slide rail is further provided on the mounting platform, and the second slide rail is slidably matched with the linear guide rail.

[0018] As a further improvement of the present utility model, a visual positioning component is further provided on the mounting frame.

[0019] As a further improvement of the present utility model, a code reader and an ion fan are further provided on the first mounting portion, and the air outlet of the ion fan is arranged towards the fixture assembly.

[0020] As a further improvement of the present utility model, a wire trough is further provided on the mounting frame, the wire trough is communicated with the mounting platform, and the wire harnesses of the optical analysis component, the distance measuring instrument and the film thickness measuring instrument are all embedded in the wire trough.

[0021] As a further improvement of the present utility model, support columns are further provided at the four corners of the mounting platform, and vibration isolation pads are provided at the joints of the support columns and the mounting platform.

[0022] As a further improvement of the present utility model, a foot cup and a caster are further provided at one end of each support column away from the mounting platform, and the vertical height of the foot cup is adjustable.

[0023] As long as the above-mentioned improved technical features do not conflict with each other, they can be combined with each other.

[0024] Generally speaking, compared with the prior art, the beneficial effects of the above technical solution conceived by the present utility model include:

[0025] (1) In the multi-functional wafer detection device of the present utility model, by setting a first displacement mechanism between the installation platform and the fixture assembly, the fixture assembly can perform horizontal movement and rotation on the installation platform to adjust the position of the wafer on the fixture assembly; and an installation frame is set on the installation platform. By setting a second displacement mechanism between the installation frame and the first installation part, the vertical heights of the above-mentioned optical analysis component, distance measuring instrument, and film thickness measuring instrument can be correspondingly adjusted. By the combined movement of the first displacement mechanism and the second displacement mechanism, the position adjustment and alignment of the optical analysis component, distance measuring instrument, and film thickness measuring instrument to the positions to be tested on the wafer are realized respectively, so as to complete the tests of the spectral performance, surface film thickness, and surface warpage degree of the wafer respectively; moreover, the rotational setting of the light emitting component on the second installation part enables the optical path between the light emitting component and the optical analysis component to be correspondingly adjusted, and the spectral performance of various parts of the wafer surface can be analyzed without the overall adjustment of the wafer position by the first displacement mechanism and the second displacement mechanism, improving the test efficiency of spectral performance; the multi-functional wafer detection device in this application realizes the function of a single test device to test all multiple parameters of the wafer, avoids the problem of frequent handling of the wafer between multiple test devices, and greatly improves the wafer test efficiency.

[0026] (2) In the multi-functional wafer detection device of the present utility model, an arc-shaped sliding groove is correspondingly set on the second installation part, and the sliding base is arranged in the arc-shaped sliding groove; and a waist-shaped groove is opened on the end face of the collimator mirror matching the sliding base to realize the angle adjustment of the collimator mirror on the second installation part and achieve the optical path matching with the optical analysis component to complete the spectral performance analysis of different positions on the wafer surface.

[0027] (3) In the multi-functional wafer detection device of the present utility model, by setting a vision positioning component, the position of the wafer is recognized to correspondingly adjust the positions of the optical analysis component, distance measuring instrument, film thickness measuring instrument, and light emitting component, so as to correspondingly realize various tests of the wafer; at the same time, an ion fan is added to eliminate the static electricity on the wafer surface and ensure the accuracy of the test results. Description of the Drawings

[0028] Figure 1 is the overall structural schematic diagram of the multi-functional wafer detection device in the embodiment of the present utility model;

[0029] Figure 2 is the back structural schematic diagram of the multi-functional wafer detection device in the embodiment of the present utility model;

[0030] Figure 3 is the structural schematic diagram at the second installation part in the embodiment of the present utility model.

[0031] In all the drawings, the same reference numerals denote the same technical features, specifically:

[0032] 1. Installation platform; 2. Fixture assembly; 3. First slide rail; 4. Second slide rail; 5. Rotating platform; 6. Second displacement mechanism; 7. First mounting part; 8. Second mounting part; 9. Optical analysis assembly; 10. Rangefinder; 11. Film thickness measuring instrument; 12. Laser; 13. Collimating mirror; 14. Sliding base; 15. Kidney-shaped groove; 16. Linear guide rail; 17. Visual positioning assembly; 18. Barcode reader; 19. Ion fan; 20. Wiring groove; 21. Support column; 22. Vibration isolation pad; 23. Foot cup; 24. Mounting bracket. Detailed implementation manners

[0033] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model. In addition, the technical features involved in the various implementation manners of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0034] In the description of the present utility model, it should be understood that unless otherwise specified, the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present utility model.

[0035] In addition, unless otherwise specified, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0036] In the present utility model, unless otherwise clearly specified or defined, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0037] In the present utility model, unless otherwise clearly specified or defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0038] Embodiment:

[0039] Please refer to Figures 1 to 3 , in the multifunctional wafer detection device in the preferred embodiment of the present utility model, it includes an installation platform 1, a fixture assembly 2 provided on the installation platform 1, and the fixture assembly 2 is used for placing wafers; at the same time, a first displacement mechanism is provided between the installation platform 1 and the fixture assembly 2, and the first displacement mechanism is used to drive the fixture assembly 2 to move and rotate in a horizontal plane; and, a mounting bracket 24, which is also provided on the installation platform 1, the mounting bracket 24 has a first mounting portion 7 and a second mounting portion 8, and both the first mounting portion 7 and the second mounting portion 8 are provided above the fixture assembly 2, a second displacement mechanism 6 is provided between the first mounting portion 7 and the mounting bracket 24, and the second displacement mechanism 6 is used to drive the first mounting portion 7 to move vertically; an optical analysis component 9, a rangefinder 10 and a film thickness measuring instrument 11 are respectively provided on the first mounting portion 7, and a light emitting component is provided on the second mounting portion 8, and the light emitting component is rotatably arranged on the second mounting portion 8.

[0040] Specifically, in the present application, a first displacement mechanism is provided between the installation platform 1 and the fixture assembly 2, enabling the fixture assembly 2 to perform horizontal movement and rotation on the installation platform 1 to adjust the position of the wafer on the fixture assembly 2; and an installation rack 24 is provided on the installation platform 1. By providing a second displacement mechanism 6 between the installation rack 24 and the first installation part 7, the vertical heights of the above-mentioned optical analysis component 9, rangefinder 10, and film thickness measuring instrument 11 can be correspondingly adjusted. By the coordinated movement of the first displacement mechanism and the second displacement mechanism 6, the position adjustment and alignment of the optical analysis component 9, rangefinder 10, and film thickness measuring instrument 11 with respect to the positions to be tested on the wafer are realized, respectively, so as to complete the tests of the spectral performance, surface film thickness, and surface warpage degree of the wafer; moreover, the rotational setting of the light emitting component on the second installation part 8 enables the optical path between the light emitting component and the optical analysis component 9 to be correspondingly adjusted. Without the need to globally adjust the position of the wafer through the first displacement mechanism and the second displacement mechanism 6, the spectral performance of various parts of the wafer surface can be analyzed, improving the spectral performance test efficiency; the multifunctional wafer detection device in the present application realizes the function of a single test device to test all multiple parameters of the wafer, avoiding the problem of frequent handling of the wafer between multiple test devices, and greatly improving the wafer test efficiency.

[0041] Preferably, the optical analysis component 9 in the present application is preferably a spectrometer, which is mainly used to receive the light emitted by the light emitting component. When the light is reflected from the wafer surface to the spectrometer, the spectrometer can correspondingly analyze its spectral performance; the rangefinder 10 is preferably a laser rangefinder 10, which is mainly used to test the surface warpage degree of the wafer; the film thickness measuring instrument 11 is mainly used to test the surface film thickness of the wafer.

[0042] Furthermore, as a preferred embodiment of the present invention, the light emitting component in the present application includes a laser 12 and a collimating mirror 13 connected to the laser 12. An arc-shaped sliding groove is correspondingly provided on the second installation part 8, and the collimating mirror 13 is slidably arranged in the arc-shaped sliding groove, so that when performing spectral measurement, the optical axis of the light emitted by the laser 12 intersects the optical axis of the optical analysis component at the center point of the wafer. In order to realize the adjustment of the light emission angle of the light emitting component towards the wafer surface in the present application, an arc-shaped sliding groove is correspondingly provided on the second installation part 8. By slidably arranging the collimating mirror 13 in the arc-shaped sliding groove, the adjustment of the light emission angle of the collimating mirror 13 is realized through the constraint of the arc-shaped sliding groove. Since the size of the laser 12 is larger than that of the collimating mirror 13, in order to facilitate its adjustment in the arc-shaped sliding groove, the laser 12 is fixed on the second installation part 8, and the connection between the laser 12 and the collimating mirror 13 is realized through an optical fiber. Then, the collimating mirror 13 is slidably adjusted in the arc-shaped sliding groove to realize the adjustment of the light emission angle, so that the optical axis of the light emitted by the laser 12 intersects the optical axis of the optical analysis component at the center point of the wafer to complete the spectral measurement of the wafer.

[0043] Further preferably, the collimating mirror 13 in the present application is installed on the sliding base 14, and the sliding base 14 is slidably installed in the arc-shaped chute. At the same time, a waist-shaped groove 15 is formed on the end surface of the collimating mirror 13 that matches the sliding base 14, and a screw is inserted through the waist-shaped groove 15. Since the adjustment range of the arc-shaped chute itself is limited, the direction adjustment of the collimating mirror 13 is also limited. In order to increase the adjustment range of the collimating mirror 13, the present application correspondingly fixes the collimating mirror 13 on the sliding base 14 and sets a waist-shaped groove 15 on the end surface of the collimating mirror 13 that matches the sliding base 14. When the angle of the collimating mirror 13 needs to be adjusted, the screw is loosened, and the collimating mirror 13 is rotated to complete the angle adjustment, and then the collimating mirror 13 is fixed on the sliding base 14 by the screw again.

[0044] Further, whether it is the above-mentioned arc-shaped chute or the waist-shaped groove, the collimating mirror 13 can only adjust the angle within the plane where the second mounting portion 8 is located. In order to realize the adjustment of the collimating mirror 13 at a position perpendicular to the plane where the second mounting portion 8 is located, the present application also correspondingly sets the collimating mirror 13 on the telescopic rod. One end of the telescopic rod is connected to the collimating mirror 13, and the other end thereof has a bottom surface parallel to the sliding base 14.

[0045] Further, as a preferred embodiment of the present utility model, the first displacement mechanism in the present application includes a first slide rail 3 arranged along the first direction, and the first slide rail 3 is arranged on the mounting platform 1; at the same time, a second slide rail 4 is slidably matched on the first slide rail 3, the second slide rail 4 is arranged along the second direction, and a sliding seat is slidably matched on the second slide rail 4. A jig assembly 2 is arranged on the sliding seat, and a rotating platform 5 is arranged between the sliding seat and the jig assembly 2. Specifically, in the present application, by slidably matching the second slide rail 4 with the first slide rail 3, the movement of the second slide rail 4 along the setting direction of the first slide rail 3 is realized, and a sliding seat is slidably matched on the second slide rail 4 to realize the movement along the setting direction of the second slide rail 4, so as to complete the movement of the sliding seat in the setting directions of the first slide rail 3 and the second slide rail 4. Then, by arranging a rotating platform 5 between the sliding seat and the jig assembly 2, the rotation of the jig assembly 2 is realized, so as to complete the movement and rotation of the jig assembly 2 in the horizontal plane.

[0046] Preferably, the first slide rail 3 and the second slide rail 4 in the present application are perpendicular to each other in the horizontal plane.

[0047] Further preferably, a linear guide rail 16 arranged side by side with the first slide rail 3 is also arranged on the mounting platform 1 in the present application, and the second slide rail 4 also matches the linear guide rail 16 at the same time. The form that the linear guide rail 16 and the first slide rail 3 match the second slide rail 4 at the same time enables the second slide rail 4 to move strictly in accordance with the setting direction of the first slide rail 3, so as to increase the movement accuracy of the jig assembly 2.

[0048] Optionally, the second slide rail 4 in the present application is pushed by a driving motor or a driving cylinder to achieve movement in the direction of the first slide rail 3. A transmission belt and a driving motor are arranged between the second slide rail 4 and the sliding seat to achieve the movement of the sliding seat along the direction set by the second slide rail 4.

[0049] Furthermore, a vision positioning component 17 is also provided on the mounting bracket 24 in the present application. The vision positioning component 17 is mainly used to identify the position of the wafer on the fixture component 2, and correspondingly adjust the optical analysis component 9, the rangefinder 10, the film thickness measuring instrument 11 and the light emitting component according to the obtained wafer position to complete various tests on the wafer.

[0050] Further preferably, a code reader 18 and an ion fan 19 are also provided on the first mounting portion 7 in the present application, and the air outlet of the ion fan 19 is arranged facing the fixture component 2. The code reader 18 is mainly used to read the production and processing information of the wafer to ensure the traceability of the product; the ion fan 19 is mainly used to eliminate the static electricity on the surface of the wafer to ensure the accuracy of the detection.

[0051] Furthermore, as a preferred embodiment of the present utility model, a wire groove 20 is also provided on the mounting bracket 24 in the present application, and the wire groove 20 is communicated with the mounting platform 1. The wire harnesses of the above-mentioned optical analysis component 9, rangefinder 10 and film thickness measuring instrument 11 are all embedded in the wire groove 20. The wire groove 20 is mainly used to restrain the wires or optical fibers of the above-mentioned detection devices, etc., to prevent these wire harnesses from affecting the movement of the detection devices, and at the same time lead the wire harnesses to the lower mounting platform 1 to supply power and remotely control the detection devices. The mounting bracket 24 in the present application is a gantry steel frame, which forms a frame structure on the mounting platform 1, and a reinforcing member is arranged at the joint of the mounting bracket 24 and the mounting platform 1 to ensure the overall stability of the multifunctional wafer detection device.

[0052] Further preferably, the mounting platform 1 in the present application is preferably a square structure as a whole. Support columns 21 are also provided at the four corners of the mounting platform 1, and vibration isolation pads 22 are provided at the joints of the support columns 21 and the mounting platform 1. The mounting platform 1 as a whole is supported by the support columns 21. In order to avoid the influence of surrounding equipment or external vibration on wafer detection, a vibration isolation pad 22 is correspondingly arranged between the support columns 21 and the mounting platform 1 to absorb the external vibration and ensure the smoothness of the mounting platform 1.

[0053] Furthermore, each of the support columns 21 is provided with a foot cup 23 and a caster at one end away from the mounting platform 1, and the vertical height of the foot cup 23 is adjustable. The foot cup 23 is a standard structural component, which is composed of a screw and a chassis. By rotating the screw, the distance between the support column 21 and the ground can be adjusted accordingly. When the multifunctional wafer detection device works normally, the chassis of the foot cup 23 contacts the ground; when the multifunctional wafer detection device needs to be moved, the foot cup 23 is correspondingly raised so that the caster contacts the ground, and the multifunctional wafer detection device can be moved accordingly.

[0054] It is easy for those skilled in the art to understand that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A multifunctional wafer inspection device, characterized in that: include: A mounting platform, and a fixture assembly disposed on the mounting platform, wherein the fixture assembly is used for placing wafers; A first displacement mechanism is provided between the mounting platform and the fixture assembly, and the first displacement mechanism is used to drive the fixture assembly to move and rotate in a horizontal plane; A mounting frame, the mounting frame is arranged on the mounting platform, the mounting frame is provided with a first mounting portion and a second mounting portion, the first mounting portion and the second mounting portion are both arranged above the fixture assembly; A second displacement mechanism is provided between the first mounting portion and the mounting frame, and the second displacement mechanism is used to drive the first mounting portion to move vertically; The first mounting portion is provided with an optical analysis component, a distance meter and a film thickness measuring instrument respectively, and the second mounting portion is provided with a light emitting component, and the light emitting component is rotatably arranged on the second mounting portion.

2. The multifunctional wafer detection device according to claim 1, characterized in that: The light emitting assembly includes a laser and a collimating mirror connected to the laser; The second mounting portion is provided with an arc-shaped slide groove, and the collimating mirror is slidably arranged in the arc-shaped slide groove, so that when performing spectral measurement, the optical axis of the light emitted by the laser intersects with the optical axis of the optical analysis component at the center point of the wafer.

3. The multifunctional wafer detection device according to claim 2, characterized in that: The collimator is mounted on a sliding base, and the sliding base is slidably mounted in the arc-shaped sliding groove; The end surface of the collimating mirror matching the sliding base is provided with a waist-shaped groove, and a screw is passed through the waist-shaped groove.

4. The multifunctional wafer detection device according to claim 1, characterized in that: The first displacement mechanism comprises a first slide rail arranged along a first direction, and the first slide rail is arranged on the mounting platform; The first slide rail is slidably matched with a second slide rail, the second slide rail is arranged along a second direction, and the second slide rail is slidably matched with a slide seat; The fixture assembly is arranged on the sliding seat, and a rotating platform is arranged between the sliding seat and the fixture assembly.

5. The multifunctional wafer detection device according to claim 4, characterized in that: The mounting platform is also provided with a linear guide rail arranged side by side with the first slide rail, and the second slide rail is slidably matched with the linear guide rail.

6. The multifunctional wafer detection device according to claim 1, characterized in that: The mounting frame is also provided with a visual positioning component.

7. The multifunctional wafer inspection device according to claim 1, characterized in that: The first mounting portion is also provided with a code reader and an ion fan, and an air outlet of the ion fan is arranged toward the fixture assembly.

8. The multifunctional wafer inspection device according to claim 1, characterized in that: The mounting frame is also provided with a wiring groove, which is connected to the mounting platform, and the wiring harnesses of the optical analysis component, the rangefinder and the film thickness measuring instrument are all embedded in the wiring groove.

9. The multifunctional wafer inspection device according to claim 1, characterized in that: Support columns are also provided at the four corners of the installation platform, and vibration isolation pads are provided at the joints between the support columns and the installation platform.

10. The multifunctional wafer inspection device according to claim 9, characterized in that: Each support column is also provided with a foot cup and a caster at one end away from the installation platform, and the vertical height of the foot cup is adjustable.

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