Testing tool plate based on FPC
By setting up metal wires and windows on the FPC board and soldering them with the chip pins, the difficulty of signal capture in chip debugging is solved, and the cost and time is reduced, avoiding the design needs of various test circuit boards.
Patent Information
- Application Number
- CN202421910588.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-07
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-08-07
AI Technical Summary
The prior art is difficult to effectively capture the waveforms of chip pin output during chip debugging, resulting in increased testing costs and time, and requires the design of multiple test circuit boards for different PCBs.
Using a test tooling board based on FPC, a number of metal wires and corresponding windows are set on the FPC board, the metal wires are welded to the chip pins, and the other end is welded to the motherboard, and signal measurement is performed using the metal wires in the middle position.
Effective measurement of chip pin output waveforms is achieved, reducing test costs and time, and avoiding the need to design multiple test circuit boards for different PCBs.
Smart Images
Figure CN223051377U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of chip testing, and particularly relates to a test tooling board based on FPC. Background Technique
[0002] With the gradual reduction of the product size, the density of the printed circuit board (PCB) is getting higher and higher, and the pin pitch of the components is also more dense. During the debugging process of the chip after welding, it is necessary to measure the output waveform at the root of the chip pins. However, due to the limitation of the product size, the probe often cannot reach the root of the chip pins to capture the signal.
[0003] To facilitate the debugging of the chip, in the prior art, most of them are to redesign the test circuit board for the chip, and different PCBs of the same chip will generate more test circuit boards, which will greatly increase the investment in time and production and processing costs.
[0004] Therefore, how to provide an effective solution to reduce the time and production and processing costs in the chip testing process has become an urgent problem to be solved in the prior art. Content of the Utility Model
[0005] The purpose of the utility model is to provide a test tooling board based on FPC to solve the above problems existing in the prior art.
[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A test tooling board based on FPC includes an FPC board. A plurality of metal wires are arranged in the FPC board. The plurality of metal wires are distributed along the direction from the middle area of the FPC board to the edge area of the FPC board. Windows are arranged at the positions corresponding to both ends of each metal wire and at the positions corresponding to the middle of each metal wire on the FPC board. The plurality of windows corresponding to one end of the plurality of metal wires close to the middle area of the FPC board on the FPC board correspond to the plurality of pins of the chip to be tested one by one.
[0008] Based on the above-disclosed content, the test tooling board based on FPC provided by the present utility model has multiple metal wires arranged in the FPC board. The multiple metal wires are distributed in the direction from the middle area of the FPC board to the edge area of the FPC board. Windows are provided at positions corresponding to both ends of each metal wire and at positions corresponding to the middle of each metal wire on the FPC board. Moreover, the multiple windows corresponding to the ends of the multiple metal wires near the middle area of the FPC board on the FPC board correspond one by one to the multiple pins of the chip to be tested. In this way, when testing the chip to be tested, the multiple pins of the chip to be tested can be soldered to the ends of the metal wires in the corresponding multiple windows, and the ends of the metal wires in the multiple windows at the other end are soldered to the main board, thereby lengthening the pins of the chip to be tested. During testing, the probe can be connected to the metal wire in the window at the middle position of the corresponding metal wire, which is convenient for measuring the waveform output by the pins of the chip to be tested. It can effectively solve the problem of signal acquisition during the testing process. At the same time, only one test tooling board based on FPC is required, and there is no need to specifically design a large number of test circuit boards for the chip to be tested, shortening the design cycle and reducing the production and processing costs.
[0009] In a possible design, the test tooling board based on FPC further includes a reinforcing board, and the reinforcing board is located on the side of the FPC board where no window is provided.
[0010] In a possible design, the FPC board is in a "cross" shape.
[0011] In a possible design, the reinforcing board is located at a position corresponding to the chip to be tested on the side of the FPC board where no window is provided.
[0012] In a possible design, the reinforcing board is a fiberglass board.
[0013] In a possible design, a first metal wire layout layer and a second metal wire layout layer are provided in the FPC board, and the multiple metal wires are alternately distributed in the first metal wire layout layer and the second metal wire layout layer in sequence.
[0014] In a possible design, a first metal wire layout layer and a second metal wire layout layer are provided in the FPC board, and the multiple metal wires are evenly distributed in the first metal wire layout layer and the second metal wire layout layer.
[0015] In a possible design, the FPC board is made of polyimide material.
[0016] In a possible design, there are wire grooves at positions between adjacent two metal wires on the surface of the FPC board.
[0017] Beneficial effects:
[0018] When the test fixture board based on FPC provided by the present utility model is used to test a chip to be tested, multiple pins of the chip to be tested can be welded to the ends of metal wires in corresponding multiple openings, and the ends of metal wires in multiple openings at the other end are welded to the main board, so as to lengthen the pins of the chip to be tested. During the test, the probe can be connected to the metal wire in the opening at the middle position of the corresponding metal wire, which is convenient for measuring the waveform output by the pins of the chip to be tested. It can effectively solve the problem of signal acquisition during the test. At the same time, only one test fixture board based on FPC needs to be set, without the need to specially design a large number of test circuit boards for the chip to be tested, shortening the design cycle, reducing the production and processing costs, and being convenient for practical application and promotion. Description of the Drawings
[0019] Figure 1 It is a perspective schematic diagram of the test fixture board based on FPC provided by an embodiment of the present application;
[0020] Figure 2 It is a structural schematic diagram of the test fixture board based on FPC provided by an embodiment of the present application.
[0021] Reference Signs:
[0022] 10 - FPC board; 11 - metal wire; 12 - opening; 20 - reinforcing plate. Detailed Embodiments
[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the present utility model in combination with the drawings and the descriptions of the embodiments or the prior art. Obviously, the following descriptions of the structures of the drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings. It should be noted here that the descriptions of these embodiments are used to help understand the present utility model, but do not constitute a limitation to the present utility model.
[0024] It should be understood that although terms such as first and second may be used herein to describe various units, these units should not be limited by these terms. These terms are only used to distinguish one unit from another. For example, the first unit can be called the second unit, and similarly, the second unit can be called the first unit, without departing from the scope of the exemplary embodiments of the present utility model.
[0025] It should be understood that for the term "and / or" that may appear in this text, it is merely a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, B exists alone, and A and B exist simultaneously. For the term " / and" that may appear in this text, it describes another association object relationship, indicating that two relationships can exist. For example, A / and B can represent two situations: A exists alone, and A and B exist simultaneously. Additionally, for the character " / " that may appear in this text, it generally indicates that the front and back associated objects are in an "or" relationship.
[0026] As Figure 1 shown, this embodiment provides a test tooling board based on FPC. The test tooling board based on FPC includes an FPC board 10 (Flexible Printed Circuit), and multiple metal wires 11 are arranged inside the FPC board 10. The multiple metal wires 11 are distributed in the direction from the middle area to the edge area of the FPC board 10. Windows 12 are provided at positions corresponding to both ends of each metal wire 11 on the FPC board 10. The multiple windows 12 on the FPC board 10 corresponding to one end of the multiple metal wires 11 near the middle area of the FPC board 10 correspond one-to-one to the multiple pins of the chip to be tested.
[0027] The size of the FPC board 10 is larger than the size of the chip to be tested. The shape of the FPC board 10 can be, but is not limited to, square, circular, or "cross" shape, etc. In the embodiments of this application, the shape of the FPC board 10 is "cross". The FPC board 10 can be made of, but is not limited to, polyimide material or polyester material.
[0028] Please refer to Figure 2 , considering that the FPC board 10 has high flexibility and bendability, to facilitate the soldering of the chip to be tested, the test tooling board based on FPC provided in the embodiments of this application further includes a reinforcing board 20, and the reinforcing board 20 is located on the side of the FPC board 10 where no window 12 is provided.
[0029] Specifically, the reinforcing board 20 is located at a position corresponding to the chip to be tested on the side of the FPC board 10 where no window 12 is provided. The reinforcing board 20 and the FPC board 10 can be fixed together by bonding or hot melting connection, etc. The shape of the reinforcing board 20 is the same as the shape of the chip to be tested (generally square), and the size of the reinforcing board 20 can be approximately the same as or slightly larger than the size of the chip to be tested.
[0030] The reinforcing plate 20 can be, but is not limited to, a plate-like structure such as a fiber glass board (FR-4), a plastic board, etc. that is not easily deformed. Since the fiber glass board has advantages such as heat insulation, environmental protection, and flame retardancy, in the embodiments of the present application, the reinforcing plate 20 is made of a fiber glass board.
[0031] It can be understood that in some other embodiments, the reinforcing plate 20 can also be consistent with the shape and size of the FPC board 10.
[0032] Limited by the size, the intervals between multiple pins of the chip to be tested are small. To facilitate subsequent measurement of the waveforms output by the pins of the chip to be tested, in the test tooling board based on FPC provided in the embodiments of the present application, a first metal wire 11 laying layer and a second metal wire 11 laying layer are arranged in the FPC board 10. Multiple metal wires 11 can be alternately distributed in the first metal wire 11 laying layer and the second metal wire 11 laying layer in sequence. That is, among all adjacent two metal wires 11, one is located in the first metal wire 11 laying layer, and the other is located in the second metal wire 11 laying layer. By adopting such a setting, the interval between the metal wires 11 can be increased, so as to facilitate measuring the waveforms output by the pins of the chip to be tested through the metal wires 11.
[0033] It can be understood that in some other embodiments, multiple metal wires can also be evenly distributed in the first metal wire laying layer and the second metal wire laying layer.
[0034] In one or more embodiments, there are wire grooves at the positions between adjacent two metal wires 11 on the surface of the FPC board 10. By setting the wire grooves, it is convenient to fix the hook needles used for chip testing during the testing process.
[0035] When testing the chip to be tested through the test tooling board based on FPC, multiple pins of the chip to be tested can be first welded to the ends of the metal wires 11 in multiple openings 12 near the middle area of the FPC board 10 corresponding to multiple metal wires 11 on the FPC board 10, and the ends of the metal wires in multiple openings at the other end are welded to the main board. The metal wires 11 can extend the pins of the chip to be tested. When measuring the waveform output by a certain pin of the chip to be tested, the probe / hook needle can be connected to the metal wire in the opening at the middle position of the corresponding metal wire, and then the waveform output by the pin can be extracted, so as to facilitate measuring the waveforms output by the pins of the chip to be tested, effectively solving the problem of signal acquisition during the testing process. At the same time, only one FPC test tooling board needs to be set, without the need to specially design a large number of test circuit boards for the chip to be tested, shortening the design cycle, reducing the production and processing cost, and facilitating practical application and popularization.
[0036] It should be understood that specific details are provided in the following description to facilitate a complete understanding of the exemplary embodiments. However, those of ordinary skill in the art should understand that the exemplary embodiments can be implemented without these specific details. For example, a system can be shown in a block diagram to avoid obscuring the example with unnecessary details. In other instances, well-known processes, structures, and techniques can be shown without unnecessary detail to avoid obscuring the exemplary embodiments.
[0037] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.
Claims
1. A test fixture board based on FPC, characterized in that: The invention comprises an FPC board, wherein a plurality of metal wires are arranged in the FPC board, wherein the plurality of metal wires are distributed along the direction from the middle area of the FPC board to the edge area of the FPC board, wherein windows are arranged at positions corresponding to both ends of each metal wire and at positions corresponding to the middle of each metal wire, and wherein a plurality of windows corresponding to one end of the plurality of metal wires on the FPC board near the middle area of the FPC board correspond one to one with a plurality of pins of a chip to be tested.
2. The FPC-based test fixture board according to claim 1, characterized in that: It also includes a reinforcing plate, which is located on a side of the FPC board where no window is provided.
3. The FPC-based test fixture board according to claim 2, characterized in that: The FPC board is in a "cross" shape.
4. The FPC-based test fixture board according to claim 2, characterized in that: The reinforcing plate is located at a position corresponding to the chip to be tested on the side of the FPC board where no window is provided.
5. The FPC-based test fixture board according to claim 2, characterized in that: The reinforcing plate is a glass fiber plate.
6. The FPC-based test fixture board according to claim 1, characterized in that: A first metal wire layout layer and a second metal wire layout layer are provided in the FPC board, and the plurality of metal wires are alternately distributed in the first metal wire layout layer and the second metal wire layout layer in sequence.
7. The FPC-based test fixture board according to claim 1, characterized in that: A first metal wire layout layer and a second metal wire layout layer are provided in the FPC board, and the plurality of metal wires are evenly distributed in the first metal wire layout layer and the second metal wire layout layer.
8. The FPC-based test fixture board according to claim 1, characterized in that: The FPC board is made of polyimide material.
9. The FPC-based test fixture board according to claim 1, characterized in that: A wire groove is provided on the surface of the FPC board between two adjacent metal wires.