Test equipment and test system
By fixing the connection harness on the circuit board and using a combined support structure to fix the current caliper, the problem of unfixed connection harness position is solved, and the stability and accuracy of the test equipment are improved.
Patent Information
- Application Number
- CN202421898015.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-06
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-08-06
AI Technical Summary
In the prior art, since the connecting wire harness is not fixed during each test, the stability and accuracy of the electromagnetic compatibility test results of vehicle parts are poor.
By fixing the connection wiring harness on the circuit board and using a combined support structure to fix the current caliper around the combined support structure in the area to be tested, ensuring that the connection wiring harness and the current caliper are relatively fixed during each test, avoiding differences in transverse and longitudinal positions.
Improve the stability and accuracy of the test results and ensure the test accuracy of the test equipment.
Smart Images
Figure CN223051436U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of testing technologies, and particularly to a testing device and a testing system. Background Art
[0002] In the electromagnetic compatibility (EMC) test of vehicle parts (as the parts to be tested), the bulk current injection (BCI) test is a necessary test item for the anti-interference test of vehicle parts. To ensure the accurate progress of the test, it is necessary to regularly verify the testing device to verify whether the test results of the testing device are accurate.
[0003] In the prior art, during each test process, due to the differences in the relative positions between each wire in the wire harness connecting the parts to be tested and the deviation in the absolute positions of each wire in the current clamp within the wire harness, the test results are deviated, reducing the stability of the test results, and thus the test accuracy of the testing device cannot be guaranteed. Therefore, improving the stability of the test results to ensure the test accuracy of the testing device has become an urgent problem to be solved. Utility Model Content
[0004] To solve the above technical problems, the present disclosure provides a testing device and a testing system, which are beneficial to improving the stability of the test results and can ensure the test accuracy of the testing device.
[0005] In a first aspect, the present disclosure provides a testing device, including:
[0006] A circuit board, a current clamp, a support structure, and a load simulator;
[0007] One side of the circuit board is fixedly provided with a wire harness; the first end of the wire harness is connected to the load simulator, and the second end is connected to the part to be tested;
[0008] The circuit board includes a plurality of areas to be tested, the support structure includes a combined support structure, the combined support structure includes a first combined part and a second combined part, and the first combined part and the second combined part are respectively located on opposite sides of the current area to be tested;
[0009] The current clamp is fixed around the combined support structure in the current area to be tested; the current clamp includes a connection end for accessing current, and the load simulator is signal-connected to the part to be tested through the wire harness.
[0010] In some embodiments, the area to be tested forms two opposite openings, and the current clamp is fixed around the combined support structure through the openings in the current area to be tested.
[0011] In some embodiments, along the extending direction of the connection wire harness, the width of the opening is equal to the width of the current clamp.
[0012] In some embodiments, the support structure further includes a first support structure for supporting the non-tested area of the circuit board.
[0013] In some embodiments, the support structure further includes a second support structure for supporting other areas to be tested except the current area to be tested.
[0014] In some embodiments, the test device further includes:
[0015] An isolation interference device and a power supply device; the power supply device is connected to the load simulator through the isolation interference device.
[0016] In some embodiments, the test device further includes:
[0017] An auxiliary device, a first optical conversion device, and a second optical conversion device;
[0018] The auxiliary device is sequentially connected to the load simulator through the first optical conversion device and the second optical conversion device.
[0019] In some embodiments, the test device further includes:
[0020] A first connector and a second connector located at opposite side edges of the circuit board;
[0021] The first end of the connection wire harness is connected to the load simulator through the first connector, and the second end of the connection wire harness is connected to the component to be tested through the second connector.
[0022] In some embodiments, the test device further includes:
[0023] A fixing structure, and the circuit board is fixed to one side of the support structure through the fixing structure.
[0024] In a second aspect, the present disclosure further provides a test system including the test device as described in the first aspect.
[0025] The technical solutions provided by the embodiments of the present disclosure have the following advantages compared with the prior art:
[0026] The test equipment provided by the embodiments of the present disclosure includes: a circuit board, a current clamp, a support structure, and a load simulator; a connection wire harness is fixedly arranged on one side of the circuit board; the first end of the connection wire harness is connected to the load simulator, and the second end is connected to the component to be tested; the circuit board includes a plurality of areas to be tested, the support structure includes a combined support structure, the combined support structure includes a first combined part and a second combined part, and the first combined part and the second combined part are respectively located on two opposite sides of the current area to be tested; the current clamp is fixed around the combined support structure in the current area to be tested; the current clamp includes a connection end for accessing current, and the load simulator is signal-connected to the component to be tested through the connection wire harness. By fixedly arranging the connection wire harness on the circuit board, the problem in the prior art that the relative positions between each wire in the connection wire harness are different after each test process layout, resulting in deviation of the test results, can be avoided. By setting the combined support structure, the current clamp can be fixed around the combined support structure in the current area to be tested, ensuring that the positions of the current clamp and the connection wire harness are relatively fixed during each test process. For example, the distance between each wire in the connection wire harness and the inner diameter of the current clamp remains unchanged, thus avoiding the problem in the prior art that the test result stability of the test equipment is poor due to the differences in the horizontal and vertical positions of the connection wire harness in the current clamp, affecting the test accuracy of the test equipment. Therefore, the test equipment provided by the embodiments of the present disclosure is beneficial to improving the stability of the test results and ensuring the test accuracy of the test equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] The drawings here are incorporated into the description and form a part of this description, showing embodiments consistent with the present disclosure and used together with the description to explain the principles of the present disclosure.
[0028] To more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0029] Figure 1 FIG. 12 is a schematic structural diagram of a test equipment provided in the related art;
[0030] Figure 2 FIG. 16 is a schematic structural diagram of a test equipment provided by the embodiments of the present disclosure;
[0031] Figure 3 FIG. 20 is a schematic structural diagram of a combined support structure provided by the embodiments of the present disclosure;
[0032] Figure 4 FIG. 24 is a schematic structural diagram of a current clamp provided by the embodiments of the present disclosure;
[0033] Figure 5 Schematic structural diagram of another testing device provided by an embodiment of the present disclosure;
[0034] Figure 6 Schematic structural diagram of yet another testing device provided by an embodiment of the present disclosure;
[0035] Figure 7 Schematic structural diagram of yet another testing device provided by an embodiment of the present disclosure;
[0036] Figure 8 Schematic structural diagram of yet another testing device provided by an embodiment of the present disclosure;
[0037] Figure 9 Schematic structural diagram of a testing system provided by an embodiment of the present disclosure. Detailed implementation manners
[0038] In order to more clearly understand the above-mentioned objects, features and advantages of the present disclosure, the solutions of the present disclosure will be further described below. It should be noted that, without conflict, the embodiments of the present disclosure and the features in the embodiments may be combined with each other.
[0039] Many specific details are set forth in the following description in order to fully understand the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only a part of the embodiments of the present disclosure, rather than all the embodiments.
[0040] Figure 1 Schematic structural diagram of a testing device provided in the related art. As Figure 1 shown, a load simulator 10 is connected to a component under test 14 through a connection wire harness 12, and the connection wire harness 12 and the component under test 14 are located on an insulating support plate 011. Since the integration degree of the component under test 14 is getting higher and higher, the number of wires included in the connection wire harness 12 also increases accordingly during testing, resulting in differences in the relative positions between each wire in the connection wire harness 12 after each test process layout. Since the position of the connection wire harness 12 in the current clamp 13 cannot be fixed, the test results are unstable. At the same time, most of the connection wire harness 12 is a flexible wire harness. During the test process, when the tester moves the current clamp 13, it is very easy to cause deviations in the horizontal and vertical positions of the connection wire harness 12 in the current clamp 13, directly affecting the absolute position of each wire in the current clamp 13. Thus, during the test process, due to the differences in the relative positions between each wire in the connection wire harness 12 and the differences in the horizontal and vertical positions of the connection wire harness 12 in the current clamp 13, the stability of the test results of the testing device is poor, affecting the test accuracy of the testing device.
[0041] In view of the technical problems existing in the above related technologies, embodiments of the present disclosure provide a testing device. The testing device provided by the embodiments of the present disclosure fixes the connection wire harness on the circuit board, which can avoid the problem that in the prior art, due to the difference in the relative positions of each wire in the connection wire harness after each test process arrangement, the test results are deviated. By setting up a combined support structure, the current clamp can be fixed around the combined support structure in the current area to be tested, which can ensure that the position between the current clamp and the connection wire harness is relatively fixed during each test process. For example, the distance between each wire in the connection wire harness and the inner diameter of the current clamp remains unchanged, thus avoiding the problem that in the prior art, due to the differences in the horizontal and vertical positions of the connection wire harness in the current clamp, the test result stability of the testing device is poor, affecting the test accuracy of the testing device.
[0042] The following will exemplarily describe the testing device and the testing system provided by the embodiments of the present disclosure with reference to the accompanying drawings.
[0043] Figure 2 FIG. is a schematic structural diagram of a testing device provided by an embodiment of the present disclosure. As Figure 2 shown, the testing device includes a circuit board 15, a current clamp 13, a support structure, and a load simulator 10; a connection wire harness 12 is fixedly arranged on one side of the circuit board 15; the first end of the connection wire harness 12 is connected to the load simulator 10, and the second end is connected to a component under test 14; the circuit board 15 includes a plurality of areas to be tested, the support structure includes a combined support structure, the combined support structure includes a first combined part and a second combined part, and the first combined part and the second combined part are respectively located on opposite sides of the current area to be tested; the current clamp 13 is fixed around the combined support structure in the current area to be tested; the current clamp 13 includes a connection end for accessing current, and the load simulator 10 is used to output an analog load signal to the component under test 14 through the connection wire harness 12 to obtain a test signal reflecting the functional state of the component under test 14.
[0044] Specifically, the support structure can be an insulating support structure for supporting the circuit board 15 ( Figure 2 Shown is a top view, and the support structure cannot be seen. For understanding, reference can be made to the support structure 11 shown in Figure 7 ).
[0045] Among them, the circuit board 15 includes three areas to be tested 18, namely a first area to be tested 181, a second area to be tested 182, and a third area to be tested 183. The area to be tested 18 is an area according to standard test requirements. Among them, the current clamp 13 is clamped in the area to be tested 18, Figure 2 In which, it is exemplarily shown that the current clamp 13 is clamped in the second area to be tested 182, then the second area to be tested 182 is the current area to be tested.
[0046] The current clamp 13 is used to access the current as an interference signal. For example, the current clamp 13 is connected to an interference injection device ( Figure 2 not shown in the figure), and the interference injection device injects current into the current clamp 13. When the current clamp 13 accesses the interference signal, the load simulator 10 can output an analog load signal to the component under test 14 through the connection cable harness 12, and the component under test 14 receives the analog load signal and operates. When the component under test 14 is operating, the load simulator 10 collects test signals reflecting the functional state of the component under test 14 through the connection cable harness 12.
[0047] Exemplarily, the component under test 14 can be a vehicle seat adjustment component. When an analog load signal for adjusting the movement of the vehicle seat adjustment component is output to the vehicle seat adjustment component, it can be detected whether the vehicle seat adjustment component moves as expected, so as to test the functional state of the component under test 14 and collect test signals reflecting the functional state of the component under test 14.
[0048] In the implementation of the present disclosure, by fixedly arranging the connection cable harness 12 on the circuit board 15, it is possible to avoid the problem in the prior art that due to the difference in the relative positions of each wire in the connection cable harness 12 after each test process layout, the test results are deviated. Exemplarily, the copper layer of the circuit board 15 forms the connection cable harness 12 by printing, so as to fixedly arrange the connection cable harness 12 on one side of the circuit board 15.
[0049] Among them, the support structure can include a combined support structure (which can refer to the combined support structure 111 shown in Figure 7 ). Exemplarily, Figure 3 is a schematic structural diagram of a combined support structure provided by an embodiment of the present disclosure. As Figure 3 shown, the combined support structure 111 can be a cylinder, and the combined support structure 111 can be disassembled into a first combined part 01 and a second combined part 02, and the first combined part 01 and the second combined part 02 are respectively located on opposite sides of the current area to be tested.
[0050] Specifically, Figure 4 is a schematic structural diagram of a current clamp provided by an embodiment of the present disclosure. Combining Figures 2 - 4, according to the positions of the two sides of the current test area relative to the upper and lower vertices of the current clamp 13, the combined support structure 111 can be disassembled according to the positions. The two disassembled parts of the combined support structure 111 are respectively placed on the opposite sides of the current test area, that is, on the upper and lower sides of the circuit board 15. Among them, the outer diameter R1 of the combined support structure 111 matches the inner diameter R2 of the current clamp 13, so that the current clamp 13 can be fixed around the combined support structure 111 in the current test area, ensuring that the position between the current clamp 13 and the connection wire harness 12 is relatively fixed during each test. For example, the distance between each wire in the connection wire harness 12 and the inner diameter of the current clamp 13 remains unchanged, thus avoiding the problem in the prior art that due to the differences in the horizontal and vertical positions of the connection wire harness 12 in the current clamp 13, the test result stability of the test equipment is poor and the test accuracy of the test equipment is affected.
[0051] The test equipment provided by the embodiments of the present disclosure fixes the connection wire harness on the circuit board, which can avoid the problem in the prior art that due to the differences in the relative positions of each wire in the connection wire harness after each test arrangement, the test results are deviated. By setting the combined support structure, the current clamp can be fixed around the combined support structure in the current test area, ensuring that the position between the current clamp and the connection wire harness is relatively fixed during each test. For example, the distance between each wire in the connection wire harness and the inner diameter of the current clamp remains unchanged, thus avoiding the problem in the prior art that due to the differences in the horizontal and vertical positions of the connection wire harness in the current clamp, the test result stability of the test equipment is poor and the test accuracy of the test equipment is affected. Therefore, the test equipment provided by the embodiments of the present disclosure is beneficial to improving the stability of the test results and ensuring the test accuracy of the test equipment.
[0052] In some embodiments, Figure 5 is a schematic structural diagram of another test equipment provided by the embodiments of the present disclosure, Figure 6 is a schematic structural diagram of yet another test equipment provided by the embodiments of the present disclosure, Figure 7 is a schematic structural diagram of yet another test equipment provided by the embodiments of the present disclosure. As Figures 5 - 7 shown, the current test area forms two opposite openings 17, and the current clamp 13 is fixed around the combined support structure 111 in the current test area through the openings 17.
[0053] Specifically, in Figure 2In this case, due to the requirements for the arrangement position of the current clamp 13, it is necessary to rely on the tester to manually adjust the current clamp 13 to the area to be tested 18 to meet the test arrangement requirements. For example, the tester manually moves the current clamp 13 from the first area to be tested 181 to the second area to be tested 182. Since the position of the current clamp 13 is adjusted manually by the tester and different experimenters are involved in the operation, it is very easy to cause deviations in the measured positions, such as when two tests are performed in the second area to be tested 182.
[0054] Based on this, in the embodiments of the present disclosure, by forming two opposite openings 17 in the area to be tested 18 (as shown in Figure 2 any of the figures shown in Figures 5 - 7 ), the current clamp 13 is fixed to the current area to be tested by surrounding the combined support structure 111 through the openings 17. Wherein, along the extension direction of the connecting wire harness 12, the width of the opening 17 is equal to the width of the current clamp 13, and the outer diameter of the combined support structure 111 matches the inner diameter of the current clamp 13. Thus, by forming two opposite openings 17 in the area to be tested, it is not necessary to rely on the tester to manually adjust the position of the current clamp 13. Instead, at the openings 17 in the area to be tested, the current clamp 13 can be directly fixed by surrounding the combined support structure 111.
[0055] Thus, in the embodiments of the present disclosure, by forming two opposite openings 17 in the area to be tested, the current clamp 13 is fixed to the current area to be tested by surrounding the combined support structure 111 through the openings 17. There is no need for the experimenter to manually move and adjust the position of the current clamp 13, thereby avoiding the problem of deviation in the measured position and improving the test efficiency.
[0056] It should be noted that for the structure of the circuit board, Figure 5 the distances between the centers of the openings 17 formed by the three areas to be tested 18 shown in the figure and the component to be measured 14 can be 150 mm, 450 mm, and 750 mm respectively, for example, to meet the requirements of the standard test positions.
[0057] In some embodiments, as shown in Figure 7 , the support structure 11 further includes a first support structure 112 for supporting the non-test area of the circuit board 15.
[0058] Specifically, the first support structure 112 is disposed in the non-test area of the circuit board 15 and is used to support the non-test area. During the test, since the position of the non-test area remains unchanged, the position of the first support structure 112 remains unchanged.
[0059] Among them, the first support structure 112 is set as an insulating structure. By supporting the non-test area through the first support structure 112, other interference signals can be prevented from being introduced into the circuit board.
[0060] In some embodiments, as Figure 7 shown, the support structure 11 further includes a second support structure 113 for supporting other areas to be tested except the current area to be tested. Specifically, in combination with Figure 2 、 Figures 5 to 7 , when testing the first area to be tested 181, that is, when the current clamp 13 is clamped on the first area to be tested 181, and the first area to be tested 181 is the current area to be tested. At this time, the current clamp 13 is fixed on the first area to be tested 181 by surrounding the combined support structure 111 through the opening 17, and the second area to be tested 182 and the third area to be tested 183 are supported by the second support structure 113.
[0061] Similarly, when testing the second area to be tested 182, the first area to be tested 181 and the third area to be tested 183 are supported by the second support structure 113; and when testing the third area to be tested 183, the first area to be tested 181 and the second area to be tested 182 are supported by the second support structure 113.
[0062] Specifically, the second support structure 113 is used to support other areas to be tested except the current area to be tested. Therefore, the position of the second support structure 113 changes during the test. The second support structure 113 is set as an insulating structure. By supporting other areas to be tested except the current area to be tested through the second support structure 113, other interference signals can be avoided from being introduced into the circuit board.
[0063] In some embodiments, Figure 8 is a schematic structural diagram of another test device provided by an embodiment of the present disclosure. As Figure 8 shown, the test device further includes: an isolation interference device 19 and a power supply device 20; the power supply device 20 is connected to the load simulator 10 through the isolation interference device 19. Specifically, by setting an isolation interference device 19 such as an artificial network between the load simulator 10 and the power supply device 20, while ensuring that the power supply device 20 supplies power to the component under test 14 through the load simulator 10, the AC interference between the power supply device 20 and the component under test 14 is avoided, which is beneficial to improving the accuracy of the test results.
[0064] In some embodiments, as Figure 8As shown in the figure, the test equipment further includes: an auxiliary device 22, a first optical conversion device 211, and a second optical conversion device 212; the auxiliary device 22 is connected to the load simulator 10 through the first optical conversion device 211 and the second optical conversion device 212 in sequence; the auxiliary device 22 is used to send a signal source to the load simulator 10 to enable the load simulator 10 to generate an analog load signal, and the auxiliary device 22 is used to receive the test signal transmitted by the load simulator 10; the first optical conversion device 211 is used to convert the electrical signal sent by the auxiliary device 22 into a first optical signal, and the second optical conversion device 212 is used to convert the first optical signal into an electrical signal and transmit it to the load simulator 10; and, the second optical conversion device 212 is used to convert the electrical signal transmitted by the load simulator 10 into a second optical signal, and the first optical conversion device 211 is used to convert the second optical signal into an electrical signal and transmit it to the auxiliary device 22; wherein, both the signal source and the test signal are electrical signals.
[0065] Specifically, as Figure 9 shown in the figure, the auxiliary device 22 is located in the monitoring room 24, and the load simulator 10 is located in the laboratory 23. By setting the first optical conversion device 211 in the monitoring room 24 and the second optical conversion device 212 in the laboratory 23, it is possible to convert the electrical signal sent by the auxiliary device 22 in the monitoring room 24 into an optical signal. The optical signal is output from the monitoring room 24 and enters the laboratory 23 to be received by the second optical conversion device 212. Then, the second optical conversion device 212 converts the optical signal into an electrical signal and inputs it to the load simulator 10, which can avoid introducing additional interference signals. For example, if the load simulator 10 and the auxiliary device 22 are directly connected by wires to transmit electrical signals to each other, there will be interference signals such as electromagnetic waves when the wires transmit electrical signals.
[0066] Similarly, it is possible to convert the electrical signal sent by the load simulator 10 in the laboratory 23 into an optical signal. The optical signal is output from the laboratory 23 and enters the monitoring room 24 to be received by the first optical conversion device 211. Then, the first optical conversion device 211 converts the optical signal into an electrical signal and inputs it to the auxiliary device 22, which can avoid introducing additional interference signals.
[0067] In some embodiments, as Figure 8 shown in the figure, the test equipment may further include: a first connector 161 and a second connector 162, located on opposite side edges of the circuit board 15; the first end of the connection wire harness 12 is connected to the load simulator 10 through the first connector 161, and the second end of the connection wire harness 12 is connected to the component under test 14 through the second connector 162.
[0068] Specifically, by respectively arranging a first connector 161 and a second connector 162 at both ends of the connection wire harness 12, the connection relationship between the load simulator 10 and the connection wire harness 12 can be realized through the first connector 161, and the connection relationship between the component under test and the connection wire harness 12 can be realized through the second connector 162. The first connector 161 and the second connector 162 can be fixedly arranged at both ends of the connection wire harness 12. When testing is required, the load simulator 10 is connected to the first connector 161, and the component under test is connected to the second connector 162, which is convenient and fast and is beneficial to improving the test efficiency.
[0069] In some embodiments, as Figure 7 shown, the test device may further include: a fixing structure 018, and the circuit board 15 is fixed to one side of the support structure 11 through the fixing structure 018. Specifically, the fixing structure 018 may be, for example, a fixing screw, and the fixing screw is used to fix the circuit board 15 on the first support structure 112. During the actual design process, the size of the fixing screw should match the size of the circuit board 15, and it can be in accordance with the actual test requirements in the standard, and no specific limitation is made here.
[0070] In some embodiments, as Figure 8 shown, the test device further includes an insulator 110 for supporting the component under test 14. It should be noted that both the insulator 110 for supporting the component under test 14 and the support structure 11 for supporting the circuit board 15 are located on the ground plane.
[0071] Based on the above embodiments, the present disclosure further provides a test system. Figure 9 The structure diagram of a test system provided by an embodiment of the present disclosure is shown. As Figure 9 shown, the test system includes the test device, a laboratory 23 and a monitoring room 24 as described in the above embodiments. Among them, the first optical conversion device 211 and the auxiliary device 22 in the test device are located in the monitoring room 24; the remaining components in the test device and the component under test 14 are all located in the laboratory 23.
[0072] It should be noted that in this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising said element.
[0073] The above are only specific embodiments of the present disclosure, enabling those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to these embodiments described herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.
Claims
1. A testing device, characterized in that: include: circuit boards, current calipers, support structures, and load simulators; A connecting harness is fixedly arranged on one side of the circuit board; a first end of the connecting harness is connected to the load simulator, and a second end of the connecting harness is connected to the component to be tested; The circuit board includes a plurality of areas to be tested, the support structure includes a combined support structure, the combined support structure includes a first combined part and a second combined part, the first combined part and the second combined part are respectively located on two opposite sides of the current area to be tested; The current clamp is fixed around the combined support structure in the current to-be-tested area; the current clamp comprises a connection terminal for accessing the current, and the load simulator is connected to the signal of the component to be tested through the connection harness.
2. The test device according to claim 1, characterized in that The area to be tested forms two opposite openings, and the current clamp surrounds the combined support structure and is fixed to the area to be tested via the openings.
3. The testing device according to claim 2, characterized in that Along the extending direction of the connecting wire harness, the width of the opening is equal to the width of the current clamp.
4. The testing device according to claim 1, characterized in that The supporting structure further includes a first supporting structure for supporting a non-to-be-tested area of the circuit board.
5. The testing device according to claim 1, characterized in that The supporting structure also includes a second supporting structure for supporting other areas to be tested except the current area to be tested.
6. The testing device according to claim 1, characterized in that Also includes: Isolate interfering equipment and power supply equipment; The power supply device is connected to the load simulator via an interference isolation device.
7. The testing device according to claim 1, characterized in that Also includes: Auxiliary equipment, a first optical conversion equipment and a second optical conversion equipment; The auxiliary device is connected to the load simulator via the first optical conversion device and the second optical conversion device in sequence.
8. The testing device according to claim 1, characterized in that Also includes: A first connector and a second connector are located on two opposite edges of the circuit board; The first end of the connecting wire harness is connected to the load simulator through the first connector, and the second end of the connecting wire harness is connected to the component to be tested through the second connector.
9. The testing device according to claim 1, characterized in that Also includes: A fixing structure, through which the circuit board is fixed to one side of the supporting structure.
10. A testing system, characterized in that: Comprising a testing device as claimed in any one of claims 1 to 9.