Multi-station detection device for chips

Abstract

The utility model relates to the technical field of chip detection, in particular to a multi-station detection device for chips, which mainly comprises an electric power supporting box, a processing platform is mounted on the top wall of the electric power supporting box, a position adjusting assembly is mounted on the left side of the top of the processing platform, and an air suction pipe is mounted at the bottom end of the inner side of the position adjusting assembly. A suction nozzle assembly is installed at the bottom end of the air suction pipe, and the chip containing assembly is fixedly connected to the right side of the top end of the machining platform. According to the multi-station detection device for the chip, by arranging the multiple sets of air suction pipes, multi-station flexible adsorption adjustment is conducted on the chip, damage to the chip is avoided, the suction nozzle assembly is located at the bottom end, position adjustment can be conducted, the adsorption position can be finely adjusted, the adsorption accuracy is improved, and then the detection efficiency of the device is improved; the chip tray can be easily grabbed when being placed in the chip placing assembly, the situation that the chip tray is difficult to adjust and subsequent replacement of the chip tray is affected is avoided, and the practicability of the equipment is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip detection, in particular to a multi-station detection device for chips. Background Art

[0002] With the continuous innovation of electronic products, and chips being the core components of electronic products, the market is expanding day by day. With the expansion of the electronic market, the demand for chips is also increasing. During the production process, inspecting whether the chip quality is qualified is an essential and important link to ensure quality.

[0003] In existing chip detection equipment, a clamping and moving method is usually adopted to handle chip units. These devices pick up chip units from trays and then place them on the circuit boards for detection. The clamping and pinching processes may cause damage to the edges of the chips. Since chips are usually very fragile, such physical operations can easily lead to chip damage, affecting their performance and reliability. Moreover, the clamping range is limited and cannot be adjusted effectively according to the positions of the trays more fittingly, resulting in a reduction in transmission efficiency and thus affecting the detection efficiency of the equipment. Therefore, optimization and improvement are needed. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a multi-station detection device for chips to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A multi-station detection device for chips, comprising:

[0007] A power support box, on the top wall of which a processing platform is installed. On the top left side of the processing platform, a position adjustment component is installed. At the inner bottom end of the position adjustment component, an air suction pipe is installed, and at the bottom end of the air suction pipe, a suction nozzle component is installed.

[0008] A chip placement component, which is fixedly connected to the top right side of the processing platform. On the top of the chip placement component, a chip tray is provided. On the left and right sides of the bottom end of the chip tray, grasping components are fixedly connected respectively. In the middle of the top end of the power support box, a detection circuit board is fixedly connected.

[0009] Preferably, the position adjustment component includes a transverse movement module, which is fixedly connected to the front and back sides of the top end of the processing platform. On the top of the transverse movement module, a longitudinal movement module is slidably connected. On the right end of the longitudinal movement module, a feeding downward movement module is slidably connected.

[0010] Preferably, the nozzle assembly includes an air suction connection end, and the air suction connection end is sleeved on the bottom end of the air suction pipe. The bottom end of the air suction connection end is clamped with an adsorption head, and adjustment grooves are formed on the front and rear sides inside the adsorption head. Plugging plates are inserted into the adjustment grooves.

[0011] Preferably, the chip placement assembly includes a placement mold, and the placement mold is fixedly connected to the right side of the top of the processing platform. Gripping grooves are formed on the inner sides of the front and rear walls of the placement mold.

[0012] Preferably, the gripping assembly includes a gripping frame, and the gripping frame is fixedly connected to the front and rear sides of the bottom end of the chip tray. Extrusion springs are connected to the left and right ends of the gripping frame.

[0013] Preferably, side extrusion blocks are elastically connected to the outer sides of the extrusion springs, and anti-slip pads are bonded to the outer sides of the side extrusion blocks.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] By arranging multiple air suction pipes, the present utility model performs multi-station flexible adsorption adjustment on the chip, avoiding chip breakage. The nozzle assembly at the bottom end can be adjusted in position to finely adjust the adsorption position, facilitating the accuracy of adsorption, and thus improving the detection efficiency of the equipment.

[0016] Through the arrangement of the gripping assembly, it is convenient to grip the chip tray when it is placed inside the chip placement assembly, avoiding difficult mobilization and affecting the subsequent replacement of the chip tray, and improving the practicability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a three-dimensional structural diagram of the present utility model;

[0018] Figure 2 is a three-dimensional structural diagram of the air suction pipe and the nozzle assembly of the present utility model;

[0019] Figure 3 is a three-dimensional structural diagram of the partial separation of the nozzle assembly of the present utility model;

[0020] Figure 4 is a three-dimensional structural diagram of the chip placement assembly of the present utility model;

[0021] Figure 5 is a three-dimensional structural diagram of the partial separation of the gripping assembly of the present utility model.

[0022] In the figure:

[0023] 1, power support box; 2, processing platform;

[0024] 3. Position adjustment component; 301. Horizontal movement module; 302. Vertical movement module; 303. Feeding downward movement module;

[0025] 4. Suction air pipe;

[0026] 5. Suction nozzle component; 501. Suction air connection end; 502. Adsorption head; 503. Adjustment slot; 504. Plugging plate;

[0027] 6. Detection circuit board;

[0028] 7. Chip placement component; 701. Placement mold; 702. Gripping slot;

[0029] 8. Chip tray;

[0030] 9. Gripping component; 901. Gripping frame; 902. Extrusion spring; 903. Side extrusion block; 904. Anti-slip cushion block. Detailed implementation mode

[0031] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The following will describe the present application in detail with reference to the drawings and in combination with the embodiments.

[0032] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present application.

[0033] As Figures 1-5 shown, the present application provides a multi-station detection device for chips, including:

[0034] Power support box 1, the top wall of the power support box 1 is installed with a processing platform 2, and the left side of the top of the processing platform 2 is installed with a position adjustment component 3. The inner bottom end of the position adjustment component 3 is installed with a suction air pipe 4, and the bottom end of the suction air pipe 4 is installed with a suction nozzle component 5;

[0035] Chip placement component 7, the chip placement component 7 is fixedly connected to the right side of the top of the processing platform 2, and the top of the chip placement component 7 is provided with a chip tray 8. Both the left and right sides of the bottom end of the chip tray 8 are fixedly connected with a gripping component 9. The middle of the top of the power support box 1 is fixedly connected with a detection circuit board 6;

[0036] In this embodiment: A plurality of air suction pipes 4 are provided to perform multi-station flexible adsorption adjustment on the chip to avoid chip breakage. The nozzle assembly 5 is located at the bottom and can be adjusted in position to finely adjust the adsorption position, facilitating the accuracy of adsorption, thereby improving the detection efficiency of the device. Through the setting of the grasping assembly 9, it is convenient to grasp the chip tray 8 when it is placed inside the chip placement assembly 7, avoiding difficult mobilization and affecting the subsequent replacement of the chip tray 8, and improving the practicability of the device.

[0037] Specifically, as Figure 1 shown, the position adjustment assembly 3 includes a lateral movement module 301, and the lateral movement module 301 is fixedly connected to the front and rear sides of the top of the processing platform 2. A longitudinal movement module 302 is slidably connected to the top of the lateral movement module 301, and a feeding downward movement module 303 is slidably connected to the right end of the longitudinal movement module 302;

[0038] In this embodiment: The lateral movement module 301 facilitates the movement adjustment of the longitudinal movement module 302, the longitudinal movement module 302 facilitates the movement adjustment of the feeding downward movement module 303, and the air suction pipes 4 inside the feeding downward movement module 303 can be adjusted up and down for easy adsorption.

[0039] Specifically, as Figure 2 and Figure 3 shown, the nozzle assembly 5 includes an air suction connection end 501, and the air suction connection end 501 is sleeved on the bottom end of the air suction pipe 4. An adsorption head 502 is clamped at the bottom end of the air suction connection end 501, and adjustment grooves 503 are opened on the front and rear sides inside the adsorption head 502. Plugging plates 504 are inserted into the adjustment grooves 503;

[0040] In this embodiment: The air suction pipe 4 is fixedly sleeved with the air suction connection end 501. The nozzle assembly 5 is made of silica gel as a whole. The adsorption head 502 can be inserted into the groove inside the air suction connection end 501. The size of the groove is slightly larger than the end of the adsorption head 502, which facilitates the left and right adjustment of the adsorption head 502 and does not affect the internal pipe ventilation. Then, the plugging plates 504 are inserted into the side adjustment grooves 503 for limit fixation.

[0041] Specifically, as Figure 4 shown, the chip placement assembly 7 includes a placement mold 701, and the placement mold 701 is fixedly connected to the right side of the top of the processing platform 2. Grasping grooves 702 are opened on the inner sides of the front and rear walls of the placement mold 701;

[0042] In this embodiment: The inner groove provided in the placement mold 701 can perform clamping adsorption and limit fixation on the chip tray 8, and the two-sided grasping grooves 702 facilitate the removal and filling of the chip tray 8.

[0043] Specifically, as Figure 5As shown in the figure, the grasping assembly 9 includes a grasping frame 901, and the grasping frame 901 is fixedly connected to the front and rear sides of the bottom end of the chip tray 8. Extrusion springs 902 are connected to both the left and right ends of the grasping frame 901;

[0044] In this embodiment: A groove is provided inside the grasping frame 901 for easy grasping, and the extrusion springs 902 on both sides can provide elastic support.

[0045] Specifically, as Figure 5 shown, a side extrusion block 903 is elastically connected to the outside of the extrusion spring 902, and an anti-slip cushion block 904 is bonded to the outside of the side extrusion block 903;

[0046] In this embodiment: The extrusion spring 902 elastically supports the side extrusion block 903, allowing the side extrusion block 903 to be extruded against the inner ends of both sides of the grasping groove 702 for easy fixation. The anti-slip cushion block 904 provided further improves the stability of the clamping connection.

[0047] The specific solution of this scheme is as follows: During the chip processing, the lateral movement module 301 facilitates the movement adjustment of the longitudinal movement module 302, and the longitudinal movement module 302 facilitates the movement adjustment of the feeding and pressing movement module 303. The air suction pipe 4 inside the feeding and pressing movement module 303 can be adjusted up and down for easy adsorption. Then, the air suction pipe 4 is fixedly sleeved with the air suction connection end 501. The suction nozzle assembly 5 is made of silica gel as a whole, and the adsorption head 502 can be inserted into the groove inside the air suction connection end 501. The size of the groove is slightly larger than the end of the adsorption head 502, which facilitates the left and right adjustment of the adsorption head 502 and does not affect the internal pipe ventilation. Then, the plugging plate 504 is inserted into the adjustment groove 503 on the side for limit fixation. The inner groove provided in the placement mold 701 can perform clamping adsorption and limit fixation on the chip tray 8. The grasping grooves 702 on both sides facilitate the removal and filling of the chip tray 8. A groove is provided inside the grasping frame 901 for easy grasping, and the extrusion springs 902 on both sides can provide elastic support. The extrusion spring 902 elastically supports the side extrusion block 903, allowing the side extrusion block 903 to be extruded against the inner ends of both sides of the grasping groove 702 for easy fixation. The anti-slip cushion block 904 provided further improves the stability of the clamping connection, which provides convenience for the taking of the chip tray 8.

[0048] Those of ordinary skill in the art should understand that: The discussion of any above embodiment is only exemplary; under the concept of the present invention, the technical features in the above embodiments or different embodiments can also be combined, and the steps can be implemented in any order, and there are many other variations in different aspects of the present invention as described above, which are not provided in detail for the sake of brevity.

[0049] This utility model is intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of this utility model shall be included within the protection scope of this utility model.

Claims

1. A multi-station detection device for chips, characterized in that: include: An electric power support box (1), wherein a processing platform (2) is installed on the top wall of the electric power support box (1), and a position adjustment component (3) is installed on the left side of the top of the processing platform (2), a suction pipe (4) is installed on the inner bottom end of the position adjustment component (3), and a suction nozzle component (5) is installed on the bottom end of the suction pipe (4); A chip placement component (7), the chip placement component (7) is fixedly connected to the right side of the top of the processing platform (2), and a chip tray (8) is arranged at the top of the chip placement component (7), and the left and right sides of the bottom of the chip tray (8) are fixedly connected to the grasping components (9), and the middle part of the top of the power support box (1) is fixedly connected to the detection circuit board (6).

2. A multi-station chip detection device according to claim 1, characterized in that: The position adjustment component (3) comprises a transverse moving module (301), and the transverse moving module (301) is fixedly connected to the front and rear sides of the top of the processing platform (2), the top of the transverse moving module (301) is slidably connected to the longitudinal moving module (302), and the right end of the longitudinal moving module (302) is slidably connected to the material discharge pressing moving module (303).

3. A multi-station chip detection device according to claim 1, characterized in that: The suction nozzle assembly (5) comprises a suction connection end (501), and the suction connection end (501) is sleeved on the bottom end of the suction pipe (4), the bottom end of the suction connection end (501) is clamped with a suction head (502), and the suction head (502) is provided with adjustment grooves (503) on both the front and rear sides, and the adjustment groove (503) is plugged with a plug-in plug plate (504) inside.

4. A multi-station chip detection device according to claim 1, characterized in that: The chip placement assembly (7) comprises a placement mold (701), and the placement mold (701) is fixedly connected to the top right side of the processing platform (2), and the inner sides of the front and rear walls of the placement mold (701) are both provided with grabbing grooves (702).

5. The multi-station chip detection device according to claim 1, characterized in that: The grabbing assembly (9) comprises a grabbing frame (901), and the grabbing frame (901) is fixedly connected to the front and rear sides of the bottom end of the chip tray (8), and the left and right ends of the grabbing frame (901) are both connected to a compression spring (902).

6. A multi-station chip detection device according to claim 5, characterized in that: The outer side of the extrusion spring (902) is elastically connected to a side extrusion block (903), and the outer side of the side extrusion block (903) is bonded to an anti-slip pad block (904).

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