Silicon optical chip structure with U-shaped waveguide
By etching the U-shaped waveguide on the silicon optical chip and coupling it with the optical fiber array, the optical fiber array coupling without the need for electrical signals and MPD response current is achieved, solving the problems of complex structure and large volume in the prior art, and improving the coupling efficiency.
Patent Information
- Application Number
- CN202421878289.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-05
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-08-05
AI Technical Summary
The existing silicon optical chip structures require additional structures to detect optical power during the optical fiber array coupling process, resulting in complex structures and large volumes.
Using a silicon optical chip structure with U-shaped waveguide, the U-shaped waveguide is etched on both sides of the ordinary waveguide of the silicon optical chip and coupled with the optical fiber on the optical fiber array, and the output optical signal input and output of the optical fiber is monitored to complete the coupling, avoiding the need for LD power supply and MPD response current.
The coupling process is simplified, the power supply fixture is removed, the coupling working hours are shortened, and the coupling efficiency is improved.
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Figure CN223051540U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon optical chips, and more specifically, to a silicon optical chip structure with a U-shaped waveguide. Background Art
[0002] There are two specific ways for the existing direct coupling of FA (fiber array):
[0003] First, when FA is used as the output optical fiber and LD is used as the input optical signal, during coupling, power needs to be supplied to LD, and the output optical power of FA needs to be monitored in real time.
[0004] Second, when FA is used as the input optical fiber, the waveguide on the silicon optical chip needs to be designed with an MPD (monitoring optoelectronic conversion) structure. During coupling, an external light source is input into the waveguide of the silicon optical chip through FA, and the MPD response current is monitored in real time.
[0005] According to the above two methods, an additional structure is required to detect the optical power of FA, resulting in a complex structure and a large volume on the silicon optical chip. Therefore, we propose a silicon optical chip structure with a U-shaped waveguide to solve the above problems. Summary of the Utility Model
[0006] To solve the problems raised in the above background art, the utility model provides a silicon optical chip structure with a U-shaped waveguide.
[0007] The silicon optical chip structure with a U-shaped waveguide provided by the utility model adopts the following technical solutions:
[0008] A silicon optical chip structure with a U-shaped waveguide includes a silicon optical chip and a common waveguide. A group of U-shaped waveguides are etched on both sides of the common waveguide of the silicon optical chip. The U-shaped waveguides and the common waveguide are coupled and docked with the optical fibers on the fiber array, and several optical fibers on the fiber array are installed on the fiber array component.
[0009] The fiber array component includes a groove plate and a glass cover plate. The glass cover plate is fixedly installed on the groove plate through UV glue, and the bare optical fibers on the fiber array are installed inside the groove plate.
[0010] Preferably, the serial numbers of the optical fibers are provided on the top surface of the fiber array component and above the groove plate, and the shape of the groove plate is V-shaped.
[0011] Preferably, the fiber array is composed of several optical fibers, and the optical fibers on the fiber array are numbered in sequence from left to right.
[0012] Preferably, the number of the U-shaped waveguides is at least 2, and the two U-shaped waveguides are located on both sides of the waveguide.
[0013] In summary, the utility model includes the following beneficial technical effects:
[0014] Through the design of two U-shaped waveguides, during coupling, the optical signal of the external light source is input from the 51st and 57th optical fibers into the silicon photonic chip. After passing through the U-shaped waveguides, the optical signal is output from the 52nd and 58th optical fibers. By monitoring the output optical signal of the 52nd and 58th optical fibers, the coupling can be completed. Thus, throughout the coupling process, no electrical signal is required, that is, no power needs to be supplied to the LD, nor is it necessary to monitor the response current of the MPD, simplifying the coupling process, removing the power supply fixture, and shortening the coupling working hours. Description of the Drawings
[0015] Figure 1 It is a front three-dimensional structural schematic diagram in an embodiment of the utility model.
[0016] Description of the reference numerals in the drawings: 1. Silicon photonic chip; 2. U-shaped waveguide; 3. Fiber array assembly; 4. Groove plate; 5. Fiber array; 6. Glass cover plate. Detailed Embodiment
[0017] The following further elaborates on the utility model in conjunction with the attached Figure 1 drawings.
[0018] It should be noted that the drawings are schematic and not drawn to scale. For the sake of clarity and convenience in the figures, the relative sizes and proportions of the parts shown in the figures are exaggerated or reduced in size for illustration. Any size is merely exemplary and not limiting. Additionally, the same reference numerals are used for the same structures, elements, or fittings that appear in more than two figures to represent similar features.
[0019] An embodiment of the utility model discloses a silicon photonic chip structure with U-shaped waveguides. Referring to Figure 1 , a silicon photonic chip structure with U-shaped waveguides includes a silicon photonic chip 1 and a common waveguide. The common waveguide is etched on the silicon photonic chip 1. A set of U-shaped waveguides 2 is etched on each side of the common waveguide of the silicon photonic chip 1. The number of U-shaped waveguides 2 is at least 2, and the two U-shaped waveguides 2 are located on both sides of the waveguide. The U-shaped waveguides 2 and the common waveguide are coupled to the optical fibers on the fiber array 3 together. The fiber array 5 is composed of several optical fibers, and the several optical fibers on the fiber array 5 are installed on the fiber array assembly 3;
[0020] The fiber array assembly 3 includes a groove plate 4 and a glass cover plate 6. The glass cover plate 6 is fixedly installed on the groove plate 4 through UV glue. The bare optical fibers on the fiber array 5 are installed inside the groove plate 4. The serial numbers of the optical fibers are provided on the top surface of the fiber array assembly 3 and above the groove plate 4. The serial numbers corresponding to the optical fibers on the fiber array 5 from left to right are 51 - 58 (as Figure 1 ) shown, and the shape of the groove plate 4 is V-shaped;
[0021] Specifically, through the design of two U-shaped waveguides 2, during coupling, the optical signal of the external light source is input into the silicon photonic chip from optical fibers No. 51 and No. 57. After passing through the U-shaped waveguides, the optical signal is output from optical fibers No. 52 and No. 58. By monitoring the output optical signals of optical fibers No. 2 and No. 8, the coupling can be completed.
[0022] Through the above structural design, the entire coupling process is achieved without the need for an electrical signal, that is, there is no need to power the LD, nor is it necessary to monitor the response current of the MPD. The coupling process is simplified, the power supply fixture is removed, and the coupling working hours are shortened.
[0023] Finally, several points should be noted: First, in the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense, which can be a mechanical connection or an electrical connection, or the internal connection of two components, and can be directly connected. "Up", "down", "left", "right", etc. are only used to represent the relative position relationship. When the absolute position of the object being described changes, the relative position relationship may change.
[0024] Second: In the attached drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are involved. For other structures, the general design can be referred to. Without conflict, the same embodiment and different embodiments of the present invention can be combined with each other.
[0025] Finally: The above description is only a preferred embodiment of the present invention and is not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.
Claims
1. A silicon photonic chip structure with a U-shaped waveguide, comprising a silicon photonic chip (1) and a common waveguide, characterized in that: A group of U-shaped waveguides (2) are respectively etched on both sides of the common waveguide of the silicon photonic chip (1); the U-shaped waveguides (2) and the common waveguides are coupled together to the optical fibers on the optical fiber array (5); and a plurality of optical fibers on the optical fiber array (5) are mounted on the optical fiber array assembly (3); The optical fiber array assembly (3) comprises a slot plate (4) and a glass cover plate (6); the glass cover plate (6) is fixedly mounted on the slot plate (4) by means of UV glue; and bare optical fibers on the optical fiber array (5) are installed inside the slot plate (4).
2. The silicon photonic chip structure with a U-shaped waveguide according to claim 1, characterized in that: The top surface of the optical fiber array assembly (3) and located above the slot plate (4) is provided with a serial number of the optical fiber, and the slot plate (4) is in a V-shape.
3. The silicon photonic chip structure with a U-shaped waveguide according to claim 1, characterized in that: The optical fiber array (5) is composed of a plurality of optical fibers.
4. The silicon photonic chip structure with a U-shaped waveguide according to claim 1, characterized in that: The number of the U-shaped waveguides (2) is at least two, and the two U-shaped waveguides (2) are located on both sides of the waveguide.