High-strength wear-resistant high-temperature-resistant intelligent IC card

Abstract

The utility model provides a high-strength wear-resistant high-temperature-resistant intelligent IC card comprising a protection assembly which comprises a chip layer, an IC chip, a heat insulation layer, a reinforcing layer and an induction coil. The upper surface and the lower surface of the chip layer are fixedly connected with heat insulation layers. According to the utility model, the two surfaces of the IC chip layer are respectively provided with the wear-resistant layer, the waterproof layer, the high-strength layer and the thermal insulation layer, so that the IC chip is protected in all directions, and the wear-resistant layers are arranged, so that the surface wear resistance of the intelligent IC card is remarkably improved, and card damage and information loss caused by wear are reduced; the waterproof layer is added to effectively prevent water from corroding the interior of the card body, and the use reliability of the card in a humid environment is enhanced; the introduction of the high-strength layer enhances the overall strength of the card body, so that the card body can bear larger external force impact and is not easy to deform or crack; and the thermal insulating layer can effectively block high temperature and protect the internal IC chip to work normally in a high-temperature environment, so that the application range of the intelligent IC card is widened.

Description

Technical Field

[0001] The utility model relates to the technical field of IC cards, and particularly relates to a high-strength, wear-resistant and high-temperature-resistant intelligent IC card. Background Technique

[0002] As a convenient information storage and transmission tool, intelligent IC cards have been widely used in many fields such as finance, transportation, communication, and identity recognition. However, in the actual use process, there are some deficiencies in the existing intelligent IC cards.

[0003] Ordinary intelligent IC cards have low strength and are prone to deformation or even damage when subjected to external extrusion or collision, affecting their normal use. In addition, during daily use, the surface of the intelligent IC card frequently contacts and rubs against external objects, and wear is likely to occur, resulting in blurred card surface information and damaged chips, reducing the service life. At the same time, in some special environments, such as high-temperature and high-humidity environments, the performance of ordinary intelligent IC cards will be greatly affected, and problems such as data loss, card deformation, and water damage may occur. Therefore, a high-strength, wear-resistant and high-temperature-resistant intelligent IC card is proposed. Content of the Utility Model

[0004] In view of this, the utility model hopes to provide a high-strength, wear-resistant and high-temperature-resistant intelligent IC card to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial option.

[0005] The technical solution of the embodiment of the utility model is realized as follows: A high-strength, wear-resistant and high-temperature-resistant intelligent IC card includes a protection component, and the protection component includes a chip layer, an IC chip, a heat insulation layer, a strengthening layer, a waterproof layer, a wear-resistant layer, a wear-resistant frame and an induction coil;

[0006] The upper surface and the lower surface of the chip layer are both fixedly connected with a heat insulation layer, the opposite sides of the two heat insulation layers are both fixedly connected with a strengthening layer, the opposite sides of the two strengthening layers are both fixedly connected with a waterproof layer, the opposite sides of the two waterproof layers are both fixedly connected with a wear-resistant layer, the outer side walls of the chip layer, the heat insulation layer, the strengthening layer, the waterproof layer and the wear-resistant layer are fixedly connected with a wear-resistant frame, an IC chip is arranged on one side of the upper surface of the chip layer, and an induction coil is arranged outside the upper surface of the chip layer.

[0007] Further preferably, the thickness of the chip layer is 0.1 - 0.15 mm.

[0008] Further preferably, the thickness of the heat insulation layer is 0.2 - 0.3 mm.

[0009] Further preferably, the thickness of the strengthening layer is 0.5 - 1 mm.

[0010] Further preferably, the thickness of the waterproof layer is 0.05 - 0.1 mm.

[0011] Further preferably, the thickness of the wear-resistant layer is 0.1 - 0.2 mm, and the thickness of the wear-resistant frame is 0.2 - 0.3 mm.

[0012] Further preferably, rounded corners are provided at the four corners of the outer side walls of the chip layer, the heat insulation layer, the strengthening layer, the waterproof layer, and the wear-resistant layer.

[0013] Further preferably, through holes are provided at one corner of the upper surfaces of the chip layer, the heat insulation layer, the strengthening layer, the waterproof layer, and the wear-resistant layer, and a wear-resistant ring is fixedly connected to the inner side wall of the through hole.

[0014] Due to the adoption of the above technical solutions in the embodiments of the present utility model, it has the following advantages:

[0015] In the embodiments of the present utility model, wear-resistant layers, waterproof layers, high-strength layers, and heat insulation layers are provided on both sides of the IC chip layer, which comprehensively protects the IC chip. By providing the wear-resistant layer, the surface wear resistance of the smart IC card is significantly improved, and the card damage and information loss caused by wear are reduced; the addition of the waterproof layer effectively prevents the erosion of moisture on the inside of the card body and enhances the reliability of the card in a humid environment; the introduction of the high-strength layer enhances the overall strength of the card body, enabling it to withstand greater external force impacts without being easily deformed or broken; the heat insulation layer can effectively block high temperatures and protect the internal IC chip from working properly in a high-temperature environment, thereby broadening the application range of the smart IC card.

[0016] The above summary is only for the purpose of the specification and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present utility model will be readily apparent by reference to the drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 It is the overall structure diagram of the present utility model;

[0019] Figure 2 It is the structure diagram of the strengthening layer and the wear-resistant layer of the present utility model;

[0020] Figure 3Structural diagram of the chip layer and the IC chip of the present utility model;

[0021] Figure 4 Structural diagram of the wear-resistant frame and the wear-resistant ring of the present utility model.

[0022] Reference numerals: 1, protection component; 11, chip layer; 12, IC chip; 13, heat insulation layer; 14, strengthening layer; 15, waterproof layer; 16, wear-resistant layer; 17, wear-resistant frame; 18, induction coil; 19, rounded corner part; 20, through hole; 21, wear-resistant ring. Detailed implementation manners

[0023] In the following, only some exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present utility model. Therefore, the drawings and the description are considered to be exemplary in nature rather than restrictive.

[0024] The embodiments of the present utility model will be described in detail below with reference to the drawings.

[0025] As Figures 1 - 4 shown, an embodiment of the present utility model provides a high-strength wear-resistant and high-temperature-resistant intelligent IC card, including a protection component 1, and the protection component 1 includes a chip layer 11, an IC chip 12, a heat insulation layer 13, a strengthening layer 14, a waterproof layer 15, a wear-resistant layer 16, a wear-resistant frame 17 and an induction coil 18;

[0026] Heat insulation layers 13 are fixedly connected to both the upper surface and the lower surface of the chip layer 11, strengthening layers 14 are fixedly connected to the opposite sides of the two heat insulation layers 13, waterproof layers 15 are fixedly connected to the opposite sides of the two strengthening layers 14, wear-resistant layers 16 are fixedly connected to the opposite sides of the two waterproof layers 15, a wear-resistant frame 17 is fixedly connected to the outer side walls of the chip layer 11, the heat insulation layer 13, the strengthening layer 14, the waterproof layer 15 and the wear-resistant layer 16, an IC chip 12 is arranged on one side of the upper surface of the chip layer 11, and an induction coil 18 is arranged outside the upper surface of the chip layer 11. Among them, both the wear-resistant layer 16 and the wear-resistant frame 17 are made of polymer wear-resistant materials; the waterproof layer 15 is a polytetrafluoroethylene waterproof coating; the strengthening layer 14 is a carbon fiber reinforced composite material; the heat insulation layer 13 is an aerogel heat insulation material.

[0027] In one embodiment, specifically: the thickness of the chip layer 11 is 0.1 - 0.15 mm. Among them, the IC chip 12 and the induction coil 18 are fixed inside the chip layer 11 through a packaging process and perform data interaction with external reading and writing devices.

[0028] In one embodiment, specifically: the thickness of the heat insulation layer 13 is 0.2 - 0.3 mm, and through the heat insulation layer 13, the influence of external high temperature on the IC chip 12 can be effectively isolated.

[0029] In one embodiment, specifically: the thickness of the strengthening layer 14 is 0.5 - 1 mm, and the content of carbon fiber in the strengthening layer 14 is 30% - 50%. By strengthening the strength of the strengthening body of the strengthening layer 14, the strength and toughness of the card body are ensured.

[0030] In one embodiment, specifically: the thickness of the waterproof layer 15 is 0.05 - 0.1 mm, and through the waterproof layer 15, moisture intrusion into the interior of the card body can be effectively prevented, thereby protecting the IC chip 12 and the induction coil 18.

[0031] In one embodiment, specifically: the thickness of the wear-resistant layer 16 is 0.1 - 0.2 mm, and the thickness of the wear-resistant frame 17 is 0.2 - 0.3 mm. Among them, the surface of the wear-resistant layer 16 is subjected to matte treatment to increase the friction and wear resistance.

[0032] In one embodiment, specifically: rounded corners 19 are provided at the four corners of the outer sidewalls of the chip layer 11, the heat insulation layer 13, the strengthening layer 14, the waterproof layer 15, and the wear-resistant layer 16. Through the setting of the rounded corners 19, the smoothness of the four corners of the card body and the aesthetics of the card body are increased.

[0033] In one embodiment, specifically: through holes 20 are provided at one corner of the upper surfaces of the chip layer 11, the heat insulation layer 13, the strengthening layer 14, the waterproof layer 15, and the wear-resistant layer 16. A wear-resistant ring 21 is fixedly connected to the inner sidewall of the through hole 20. Through the wear-resistant ring 21 inside the through hole 20, it is convenient to thread and hang the entire card body, thereby increasing the portability and anti-loss property of the card body.

[0034] When the utility model works: the high molecular wear-resistant material is formed into a wear-resistant layer 16 with a thickness of 0.1-0.2 mm through injection molding or pressing process, and the surface thereof is subjected to frosting treatment; a polytetrafluoroethylene waterproof coating with a thickness of 0.05-0.1 mm is uniformly coated on the wear-resistant layer 16 to form a waterproof layer 15; a carbon fiber reinforced composite material is used to manufacture a reinforcing layer 14 with a thickness of 0.5-1 mm through molding or extrusion process; an aerogel heat insulation material is used to obtain a heat insulation layer 13 with a thickness of 0.2-0.3 mm through cutting or pressing; on the prepared chip layer 11, the intelligent IC chip 12 and the induction coil 18 are fixed through a packaging process, so that the overall thickness is within the range of 0.1-0.15 mm, and it is ensured that data interaction can be carried out with an external reading and writing device; the wear-resistant layer 16, the waterproof layer 15, the reinforcing layer 14, the heat insulation layer 13, the chip layer 11, the heat insulation layer 13, the reinforcing layer 14, the waterproof layer 15 and the wear-resistant layer 16 are stacked and assembled in sequence from the outside to the inside, and the assembled card body is integrally packaged by using the wear-resistant frame 17 to ensure that there is no gap and looseness between the layers and they are tightly combined. Through the above manufacturing process, an intelligent IC card with high strength, wear resistance, high temperature resistance and waterproof performance can be produced.

[0035] The above is only the specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model can easily think of various changes or substitutions thereof, and these should all be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope of the claimed rights.

Claims

1. A high-strength, wear-resistant and high-temperature resistant smart IC card, characterized in that: The protective component (1) comprises a chip layer (11), an IC chip (12), a heat insulation layer (13), a reinforcement layer (14), a waterproof layer (15), a wear-resistant layer (16), a wear-resistant frame (17), and an induction coil (18); The upper and lower surfaces of the chip layer (11) are both fixedly connected to a heat insulation layer (13); the two heat insulation layers (13) are both fixedly connected to a reinforcing layer (14) on the sides away from each other; the two reinforcing layers (14) are both fixedly connected to a waterproof layer (15) on the sides away from each other; the two waterproof layers (15) are both fixedly connected to a wear-resistant layer (16) on the sides away from each other; the outer walls of the chip layer (11), the heat insulation layer (13), the reinforcing layer (14), the waterproof layer (15) and the wear-resistant layer (16) are fixedly connected to a wear-resistant frame (17); an IC chip (12) is arranged on one side of the upper surface of the chip layer (11); and an induction coil (18) is arranged on the outer side of the upper surface of the chip layer (11).

2. The high-strength, wear-resistant and high-temperature-resistant smart IC card according to claim 1, characterized in that: The thickness of the chip layer (11) is 0.1-0.15 mm.

3. The high-strength, wear-resistant and high-temperature-resistant smart IC card according to claim 1, characterized in that: The thickness of the heat insulation layer (13) is 0.2-0.3 mm.

4. The high-strength, wear-resistant and high-temperature-resistant smart IC card according to claim 1, characterized in that: The thickness of the reinforcement layer (14) is 0.5-1 mm.

5. The high-strength, wear-resistant and high-temperature-resistant smart IC card according to claim 1, characterized in that: The waterproof layer (15) has a thickness of 0.05-0.1 mm.

6. The high-strength, wear-resistant and high-temperature-resistant smart IC card according to claim 1, characterized in that: The thickness of the wear-resistant layer (16) is 0.1-0.2 mm, and the thickness of the wear-resistant frame (17) is 0.2-0.3 mm.

7. The high-strength, wear-resistant and high-temperature-resistant smart IC card according to claim 1, characterized in that: The four corners of the outer walls of the core layer (11), the heat insulation layer (13), the reinforcement layer (14), the waterproof layer (15) and the wear-resistant layer (16) are all provided with rounded corners (19).

8. The high-strength, wear-resistant and high-temperature-resistant smart IC card according to claim 1, characterized in that: A through hole (20) is provided at one corner of the upper surface of the core layer (11), the heat insulation layer (13), the reinforcement layer (14), the waterproof layer (15) and the wear-resistant layer (16), and a wear-resistant ring (21) is fixedly connected to the inner side wall of the through hole (20).

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