Non-contact silicon wafer extraction structure

Abstract

The utility model relates to the technical field of photovoltaic cell manufacturing, in particular to a non-contact silicon wafer extraction structure, which comprises a bottom plate, a vacuum part, a cover plate, a gas flow groove, a gas flow groove, a gas flow groove, a gas flow groove, a gas flow groove, a gas flow groove, a gas flow groove, a gas flow groove and a gas flow groove, wherein the vacuum part and the cover plate are fixedly arranged at the top of the bottom plate; one end of the gas flowing groove is communicated with the interior of the vacuum part and is provided with at least one first gas outlet hole, the other end of the gas flowing groove penetrates through the cover plate and is provided with a gas inlet hole, the two supporting parts are arranged at one end of the vacuum part respectively, each supporting part is fixedly connected with the bottom plate, gas enters the gas flowing groove through the gas inlet hole, and the gas flowing groove is communicated with the vacuum part. And the first air outlet hole acts on the vacuum part, so that a vacuum area is formed above the bottom plate, and a downward suction force is generated by the silicon wafer, so that the silicon wafer is fixed on the supporting part.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic cell manufacturing, in particular to a non-contact silicon wafer extraction structure. Background Art

[0002] In the field of photovoltaic cell manufacturing, when extracting silicon wafers from a flower basket containing silicon wafers, generally, a cylinder is used in cooperation with a belt. The belt is inserted into the flower basket, and the silicon wafers in the flower basket fall onto the belt, so as to achieve the purpose of transporting the silicon wafers.

[0003] In the field of photovoltaic cell manufacturing, it is often required that no traces are left when the silicon wafers are transported. However, the method of extracting silicon wafers through a belt will more or less leave traces on the surface of the silicon wafers. Therefore, when high requirements are placed on the surface of the cell, the method of extracting silicon wafers through a belt cannot be used to transport the silicon wafers. Summary of the Utility Model

[0004] In view of this, the purpose of the present utility model is to provide a non-contact silicon wafer extraction structure to solve the problem that traces are easily left on the surface of silicon wafers by the method of extracting silicon wafers through a belt.

[0005] Based on the above purpose, the present utility model provides a non-contact silicon wafer extraction structure, including:

[0006] A bottom plate, on the top of which a vacuum part is fixedly arranged;

[0007] A cover plate, fixedly arranged at the bottom of the bottom plate;

[0008] A gas flow channel, arranged between the bottom plate and the cover plate. One end of the gas flow channel is communicated with the inside of the vacuum part and is provided with at least one first air outlet hole, and the other end passes through the cover plate and is provided with an air inlet hole;

[0009] Two support parts, respectively arranged at one end of the vacuum part, and each support part is fixedly connected with the bottom plate;

[0010] Wherein, gas enters the gas flow channel through the air inlet hole and acts on the vacuum part from the first air outlet hole, so as to form a vacuum area above the bottom plate, thereby generating a downward suction force on the silicon wafer and fixing the silicon wafer on the support part.

[0011] Preferably, one end of the bottom plate is provided with a slot, and the bottom of the other end is provided with a U-shaped groove.

[0012] Preferably, the vacuum part includes:

[0013] A return-shaped frame, fixedly arranged on the top of the bottom plate. The inner wall of the return-shaped frame is inclined outward and provided with a first inclined surface, and the first air outlet hole is arranged inside the return-shaped frame;

[0014] The top plate is arranged inside the loop-shaped frame. The top plate is fixedly connected to the bottom plate. An annular groove is provided on the bottom surface of the top plate. One end of the annular groove is provided with an avoidance opening, and the avoidance opening is communicated with the first air outlet hole. Moreover, a plurality of second air outlet holes communicated with the annular groove are provided on the outer wall of the top plate.

[0015] Preferably, installation grooves are provided at both ends of the vacuum part. One of the installation grooves is arranged at the top of one end of the bottom plate, and the other installation groove is arranged in the middle of the bottom plate. The support part is fixedly arranged in the installation groove.

[0016] Preferably, the support part includes at least two support blocks. Each support block is fixedly arranged on the installation groove. A second inclined surface is provided on the top surface of each support block, and the lowest end of each second inclined surface is arranged close to the vacuum part.

[0017] Preferably, a pipe joint is installed on the air inlet hole.

[0018] The beneficial effects of the present utility model: When the structure extends into the flower basket, the silicon wafers in the flower basket will fall above the four support blocks. Gas is injected into the pipe joint. The gas enters the gas flow groove through the pipe joint, enters the annular groove through the first air outlet hole, and acts on the first inclined surface through the second air outlet hole and flows out of the loop-shaped frame, thereby forming a vacuum area above the bottom plate, so that a downward suction force is generated on the silicon wafers, and the silicon wafers are fixed on the second inclined surfaces of the support blocks. By adopting a plurality of support blocks and applying Bernoulli's principle, the silicon wafers are extracted from the flower basket, and the silicon wafers will not be displaced or deviated. If a Bernoulli suction cup is used, the suction cup is too large to be inserted into the flower basket. Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions in the present utility model or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only those of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 It is the overall mechanism schematic diagram of the embodiment of the present utility model;

[0021] Figure 2 It is the exploded structure schematic diagram of the embodiment of the present utility model;

[0022] Figure 3 It is the three-dimensional structure schematic diagram of the bottom surface of the top plate of the embodiment of the present utility model;

[0023] Figure 4 It is the cross-sectional structure schematic diagram of the embodiment of the present utility model.

[0024] The markings in the figure are as follows:

[0025] 1. Bottom plate; 11. Gas flow groove; 12. First air outlet hole; 13. Slot; 14. U-shaped groove; 15. Return-shaped frame; 16. First inclined surface; 17. Installation groove; 2. Top plate; 21. Annular groove; 22. Avoidance opening; 23. Second air outlet hole; 3. Support block; 31. Second inclined surface; 4. Cover plate; 41. Air inlet hole; 5. Pipe joint. Specific embodiments

[0026] In order to make the purpose, technical solutions and advantages of the present utility model clearer and more understandable, the following further elaborates on the present utility model in conjunction with specific embodiments.

[0027] It should be noted that unless otherwise defined, the technical terms or scientific terms used in the present utility model should have the ordinary meanings understood by those with general skills in the field to which the present utility model belongs. The "first", "second" and similar words used in the present utility model do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "including" or "comprising" mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. Words such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right", etc. are only used to represent relative position relationships, and when the absolute position of the object being described changes, the relative position relationship may also change accordingly.

[0028] As Figures 1 to 4 shown, a non-contact silicon wafer extraction structure includes:

[0029] A bottom plate 1, on the top of which a vacuum part is fixedly provided;

[0030] A cover plate 4, fixedly provided at the bottom of the bottom plate 1;

[0031] A gas flow groove 11, arranged between the bottom plate 1 and the cover plate 4, one end of the gas flow groove 11 is internally connected to the vacuum part and provided with at least one first air outlet hole 12, and the other end passes through the cover plate 4 and is provided with an air inlet hole 41;

[0032] Two support parts, respectively arranged at one end of the vacuum part, and each support part is fixedly connected to the bottom plate 1;

[0033] Among them, gas enters the gas flow groove 11 through the air inlet hole 41 and acts on the vacuum part from the first air outlet hole 12, so that a vacuum area is formed above the bottom plate 1, thereby generating a downward suction force on the silicon wafer, and fixing the silicon wafer on the support part.

[0034] As an alternative embodiment, one end of the bottom plate 1 is provided with a slot 13, and the bottom of the other end is provided with a U-shaped groove 14.

[0035] For example, the top of the bottom plate 1 is provided with a mounting hole communicating with the slot 13. The slot 13 is used for mounting on a pushing device, and the U-shaped groove is used to cooperate with the corresponding U-shaped protrusion in the flower basket structure for positioning, so as to ensure that the silicon wafer accurately falls onto the supporting part.

[0036] As an alternative embodiment, the vacuum part includes:

[0037] A loop-shaped frame 15 is fixedly arranged on the top of the bottom plate 1. The inner wall of the loop-shaped frame 15 is inclined outward to be provided with a first inclined surface 16, and the first air outlet 12 is arranged inside the loop-shaped frame 15;

[0038] A top plate 2 is arranged inside the loop-shaped frame 15. The top plate 2 is fixedly connected to the bottom plate 1. The bottom surface of the top plate 2 is provided with an annular groove 21. One end of the annular groove 21 is provided with an avoidance opening 22. The avoidance opening 22 communicates with the first air outlet 12, and a plurality of second air outlets 23 communicating with the annular groove 21 are arranged on the outer wall of the top plate 2.

[0039] As an alternative embodiment, mounting grooves 17 are arranged at both ends of the vacuum part. One of the mounting grooves 17 is arranged at the top of one end of the bottom plate 1, and the other mounting groove 17 is arranged in the middle of the bottom plate 1. The supporting part is fixedly arranged in the mounting groove 17.

[0040] For example, by arranging the mounting groove 17, the height of the supporting block 3 is reduced, so that the silicon wafer is close to the top plate 2, avoiding the situation that the suction force generated by the Bernoulli principle cannot act on the silicon wafer to suck the silicon wafer.

[0041] As an alternative embodiment, the supporting part includes at least two supporting blocks 3. Each supporting block 3 is fixedly arranged on the mounting groove 17. The top surface of each supporting block 3 is provided with a second inclined surface 31, and the lowest end of each second inclined surface 31 is close to the vacuum part.

[0042] For example, by designing the top surface of the supporting block 3 into the second inclined surface 31, the silicon wafer has no surface contact with the supporting block 3, and no trace will be generated on the surface of the silicon wafer.

[0043] As an alternative embodiment, a pipe joint 5 is installed on the air inlet hole 41.

[0044] For example, according to Bernoulli's principle, when flowing at the same height, the faster the flow rate, the smaller the pressure. Connect the pipe joint 5 to the air pipe. When the structure extends into the flower basket, the silicon wafer in the flower basket will fall above the four support blocks 3. Inject gas into the pipe joint 5. The gas enters the gas flow groove 11 through the pipe joint 5, enters the annular groove 21 through the first air outlet 12, and acts on the first inclined surface 16 through the second air outlet 23 and flows out of the return frame 15, thereby forming a vacuum area above the bottom plate 1, so that a downward suction force is generated on the silicon wafer, and the silicon wafer is fixed on the second inclined surface 31 of the support block 3.

[0045] Those of ordinary skill in the art should understand that the discussion of any above embodiment is only exemplary and is not intended to imply that the scope of the present invention is limited to these examples; under the concept of the present invention, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations in different aspects of the present invention as described above, and they are not provided in detail for the sake of brevity. Any omission, modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A contactless extraction silicon wafer structure, characterized in that: include: A bottom plate (1) having a vacuum portion fixedly disposed on the top thereof; A cover plate (4) is fixedly mounted on the bottom of the base plate (1); A gas flow groove (11) is arranged between the bottom plate (1) and the cover plate (4); one end of the gas flow groove (11) is connected to the interior of the vacuum portion and is provided with at least one first gas outlet hole (12); and the other end of the gas flow groove (11) passes through the cover plate (4) and is provided with a gas inlet hole (41); Two support parts, respectively arranged at one end of the vacuum part, each of the support parts being fixedly connected to the bottom plate (1); The gas enters the gas flow groove (11) through the gas inlet hole (41) and acts on the vacuum part from the first gas outlet hole (12), so that a vacuum area is formed above the bottom plate (1), thereby generating a downward suction force on the silicon wafer, so that the silicon wafer is fixed on the support part.

2. The contactless extraction silicon wafer structure according to claim 1, characterized in that: A slot (13) is provided at one end of the bottom plate (1), and a U-shaped groove (14) is provided at the bottom of the other end.

3. The non-contact extraction silicon wafer structure according to claim 1, characterized in that: The vacuum part comprises: A circular frame (15) is fixedly mounted on the top of the bottom plate (1), the inner wall of the circular frame (15) is inclined outwardly and is provided with a first inclined surface (16), and the first air outlet (12) is arranged inside the circular frame (15); A top plate (2) is arranged inside the circular frame (15), the top plate (2) is fixedly connected to the bottom plate (1), an annular groove (21) is provided on the bottom surface of the top plate (2), an escape opening (22) is provided at one end of the annular groove (21), the escape opening (22) is connected to the first air outlet (12), and a plurality of second air outlets (23) connected to the annular groove (21) are provided on the outer wall of the top plate (2).

4. The non-contact extraction silicon wafer structure according to claim 1, characterized in that: Both ends of the vacuum part are provided with mounting grooves (17), one of the mounting grooves (17) is arranged at the top of one end of the base plate (1), and the other mounting groove (17) is arranged in the middle of the base plate (1), and the support part is fixedly arranged in the mounting groove (17).

5. The non-contact extraction silicon wafer structure according to claim 4, characterized in that: The support portion comprises at least two support blocks (3), each of the support blocks (3) is fixedly mounted on the mounting groove (17), the top surface of each of the support blocks (3) is provided with a second inclined surface (31), and the lowest end of each of the second inclined surfaces (31) is arranged close to the vacuum portion.

6. The non-contact extraction silicon wafer structure according to claim 1, characterized in that: A pipe joint (5) is installed on the air inlet hole (41).

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