Rivet fixing structure for lamination of multiple layers of PCBs

Abstract

The utility model relates to a rivet fixing structure for multi-layer PCB (printed circuit board) lamination, which belongs to the technical field of PCB lamination rivets and comprises a rivet main body, a rivet component for limiting is mounted at the top of the rivet main body, and a fixing component for rolling and limiting the multi-layer PCB is mounted on the outer side of the rivet main body. The fixing assembly comprises a turnup piece and a filling sleeve, wherein the turnup piece is fixed to the bottom of the rivet body, the section of the turnup piece is conical, and the filling sleeve is bonded to the outer side of the rivet body and used for achieving a certain filling effect. The rivet assembly comprises a rivet base fixed to the top of the rivet body, a through hole formed in the top of the rivet base and communicated with the interior of the rivet body, and a gasket bonded to the bottom of the rivet base. According to the rivet fixing structure for lamination of the multi-layer PCB, the multi-layer PCB can be effectively laminated and fixed, meanwhile, the bottom of the rivet can be prevented from blooming and tearing to generate rivet chips, and the quality of the PCB is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board pressing rivets, in particular to a rivet fixing structure for pressing multi-layer PCB boards. Background Technique

[0002] The Chinese name of the PCB board is printed circuit board, also known as printed circuit board and printed wiring board. It is an important electronic component, a support for electronic components, and a provider of electrical connections for electronic components. When pressing multi-layer boards, a rivet structure is used for fixing and limiting.

[0003] Due to the particularity of PCB board pressing, it is necessary to ensure that the protruding surfaces of the rivets on both sides of the PCB board are not excessive, which restricts the types of rivets and the stamping methods of the riveting machine. In the prior art, a riveting machine with a lower die is usually used for pressing and processing. The lower die cuts the bottom of the incoming rivet to make it break, so as to position the PCB board. However, such a pressing and processing method will cause a certain amount of rivet chips at the rivet blooming position, and it is necessary to manually paste and clean it with plasticine. Such an operation method is undoubtedly of low efficiency, and the falling off of the plasticine is also likely to cause problems such as poor delamination. In view of this, the present application provides a rivet fixing structure for pressing multi-layer PCB boards to solve the above problems. Summary of the Utility Model

[0004] (1) Technical Problems to be Solved

[0005] In view of the deficiencies of the prior art, the utility model provides a rivet fixing structure for pressing multi-layer PCB boards, which has the advantages of being able to effectively press and fix multi-layer PCB boards and preventing the bottom of the rivet from blooming and tearing to generate rivet chips, and solves the problems that the rivet fixing structure for pressing existing multi-layer PCB boards will be torn by the lower die during the fixing process and it is difficult to clean the rivet chips.

[0006] (2) Technical Solutions

[0007] In order to achieve the purpose of effectively pressing and fixing multi-layer PCB boards and preventing the bottom of the rivet from blooming and tearing to generate rivet chips, the utility model provides the following technical solutions: a rivet fixing structure for pressing multi-layer PCB boards, including a rivet body, a rivet assembly for limiting is installed at the top of the rivet body, and a fixing assembly for curling and limiting multi-layer PCB boards is installed outside the rivet body;

[0008] The fixing assembly includes a curling member fixed to the bottom of the rivet body and having a conical cross-section, and a filling sleeve bonded to the outside of the rivet body for playing a certain filling role;

[0009] The rivet assembly includes a rivet base fixed to the top of the rivet body, a through hole opened at the top of the rivet base and communicating with the inside of the rivet body, and a gasket bonded to the bottom of the rivet base.

[0010] Further, the curling member is a conical frame body with openings at both the top and the bottom, and the bottom diameter of the curling member is larger than the top diameter.

[0011] Further, the vertical height of the curling member is 0.3 mm, and the outer and inner sides of the bottom of the curling member are both arc-shaped.

[0012] Further, the outer diameter of the filling sleeve is equal to the outer diameter of the bottom of the curling member, and the bottom of the gasket is bonded to the top of the filling sleeve.

[0013] Further, the filling sleeve is a cylinder with openings at both the top and the bottom, and the outer diameter of the filling sleeve is smaller than the outer diameter of the gasket.

[0014] Further, the rivet body is a hollow cylinder with openings at both the top and the bottom, and the inner diameter is equal to the inner diameter of the through hole.

[0015] (III) Beneficial Effects

[0016] Compared with the prior art, the present utility model provides a rivet fixing structure for multi-layer PCB board pressing, which has the following beneficial effects:

[0017] By the combined use of the rivet assembly at the top of the rivet body and the fixing assembly on the outside, this rivet fixing structure for multi-layer PCB board pressing can effectively press and fix the multi-layer PCB board, prevent the bottom of the rivet from blooming and tearing to generate rivet chips, ensure the quality of the PCB board, eliminate the risk probability of defective problems due to rivet chips, and is also beneficial to improving the stability of the multi-layer PCB board after pressing and fixing, making this rivet fixing structure for multi-layer PCB board pressing highly practical. Description of the Drawings

[0018] Figure 1 is a schematic structural diagram of the present utility model;

[0019] Figure 2 is a schematic diagram of the gasket connection structure in the structure of the present utility model;

[0020] Figure 3 is a bottom view schematic diagram of the structure of the present utility model.

[0021] In the figure: 1 rivet body, 200 rivet assembly, 201 rivet base, 202 through hole, 203 gasket, 300 fixing assembly, 301 curling member, 302 filling sleeve. Detailed Embodiments

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] Please refer to Figures 1-3 , the present utility model provides a technical solution: a rivet fixing structure for laminating a multi-layer PCB board, including a rivet body 1, a rivet assembly 200 for limiting is installed on the top of the rivet body 1, and a fixing assembly 300 for curling and limiting the multi-layer PCB board is installed on the outside of the rivet body 1; by the combined use of the rivet assembly 200 on the top of the rivet body 1 and the fixing assembly 300 on the outside, while effectively laminating and fixing the multi-layer PCB board, it can also prevent the bottom of the rivet from blooming and tearing to generate rivet chips, ensuring the quality of the PCB board, eliminating the risk probability of defective problems due to rivet chips, and also being beneficial to improving the stability of the multi-layer PCB board after lamination and fixing, making the rivet fixing structure for laminating the multi-layer PCB board have high practicability.

[0024] In this embodiment, the fixing assembly 300 is a structure for limiting and fixing the PCB board.

[0025] As Figure 1 , Figure 2 and Figure 3 shown, the fixing assembly 300 includes a curling member 301 fixed to the bottom of the rivet body 1 and having a conical cross-section, and a filling sleeve 302 bonded to the outside of the rivet body 1 and used for playing a certain filling role.

[0026] It should be noted that the curling member 301 is a conical frame body with both the top and the bottom being open. The bottom diameter of the curling member 301 is larger than the top diameter, and the vertical height of the curling member 301 is 0.3 mm, so that the curling member 301 can be curled upward at the bottom under the action of the stamping pressure, so as to cover and clamp the bottom of the PCB board. At the same time, through the conical setting and the limitation of the short vertical height, the curling member 301 is not easy to break during the curling process and can play a stable clamping and fixing role. The outer and inner sides of the bottom of the curling member 301 are both arc-shaped, which is convenient for the curling member 301 to slide and open through the arc-shaped bottom during the lamination process.

[0027] Meanwhile, the outer diameter of the filling sleeve 302 is equal to the outer diameter of the bottom of the curling part 301. The filling sleeve 302 is a cylinder with openings at both the top and the bottom, enabling the filling sleeve 302 to play a role in filling and limiting. The height of the rivet body 1 needs to be changed according to the overall thickness of the PCB board, and it is ensured that the height of the rivet body 1 is equal to the sum of the thicknesses of the multi-layer PCB boards. When the PCB boards are subjected to multi-layer lamination, multiple PCB boards need to be stacked together, and punching is performed between their tops using a punching device. This hole is used for the rivet body 1 and the curling part 301 to pass through. The filling sleeve 302 can be a rubber sleeve or other structures with a certain elastic deformation ability and can be used to fill the gap. The role of the filling sleeve 302 is to fill the gap between the outside of the rivet body 1 and the inside of the hole, thereby playing a certain role in filling and limiting, and facilitating the improvement of the stability after the overall lamination and fixation.

[0028] In this embodiment, the rivet assembly 200 is a structure for limiting the other side of the PCB board.

[0029] As Figure 1 、 Figure 2 and Figure 3 shown, the rivet assembly 200 includes a rivet base 201 fixed to the top of the rivet body 1, a through hole 202 opened at the top of the rivet base 201 and communicating with the inside of the rivet body 1, and a gasket 203 bonded to the bottom of the rivet base 201.

[0030] It should be noted that the bottom of the gasket 203 is bonded to the top of the filling sleeve 302. The outer diameter of the filling sleeve 302 is smaller than the outer diameter of the gasket 203. The gasket 203 can be a metal sheet, a rubber sheet, or other connecting sheet structures that can play a buffering role between structures and can improve the lamination stability, enabling the gasket 203 to improve the overall stability after lamination.

[0031] In addition, the rivet body 1 is a hollow cylinder with openings at both the top and the bottom, and the inner diameter is equal to the inner diameter of the through hole 202, which can save processing materials and can play a good fixing role for lightweight lamination boards.

[0032] It should also be noted that during the actual pressing process, the lower die of the riveting machine needs to be removed and replaced with a flat template. After passing the rivet base 201 through the fixing holes, the end of the rivet base 201 is made to fit against the top of the flat template. Then, the stamping structure at the output end of the riveting machine is used to stamp the rolled part 301 to make it roll up. At the same time, by changing the setting direction of the rivet base 201, specifically, placing some of the rivet bases 201 against the bottom of the bottommost PCB board and the other part on the top of the topmost PCB board, it is possible to fix the stacked multi-layer PCB boards by means of positive and negative pressing and limiting methods. Among them, the riveting machine can be directly replaced by a driving mechanism with a linear output ability, such as a hydraulic cylinder and other equipment, which can play a good stamping role on the rolled part 301, so that the rolled part 301 can play a stable limiting and fixing role on the PCB board.

[0033] The working principle of the above embodiment is as follows:

[0034] When performing the pressing work of multi-layer PCB boards, stack the PCB boards with holes already drilled and make the positions of the holes correspond. Remove the lower die of the riveting machine and use a flat template to place the PCB boards. Make the back of the rivet base 201 fit against the flat template, and make the spacer 203 fit against the bottom of the bottommost PCB board. After the rolled part 301 passes through the holes, it corresponds to the position of the output end of the riveting machine. Under the stamping action of the riveting machine, the end of the rolled part 301 rolls outwards, so that the opening rolls up and clamps on the top of the topmost PCB board. Through the clamping cooperation between the rivet base 201 and the rolled part 301, it is possible to play a good fixing role on the multi-layer PCB boards. And during the process of fixing other rivet bodies 1, a positive and negative buckling method can be adopted for fixing, that is, some of the rivet bases 201 are located on the top of the topmost PCB board, and the other part of the rivet bases 201 are located on the bottom of the bottommost PCB board. In this way, an effective and stable limiting and fixing effect can be achieved on the multi-layer PCB boards, making it difficult for the boards to slide between each other.

[0035] Compared with the prior art, the rivet fixing structure for pressing multi-layer PCB boards, through the combined use of the rivet assembly 200 at the top of the rivet body 1 and the fixing assembly 300 on the outside, can effectively press and fix the multi-layer PCB boards, and at the same time prevent the bottom of the rivet from blooming and tearing to generate rivet chips, ensuring the quality of the PCB board, eliminating the risk probability of adverse problems due to rivet chips, and also being beneficial to improving the stability of the multi-layer PCB boards after pressing and fixing. This makes the rivet fixing structure for pressing multi-layer PCB boards highly practical, and solves the problems that the existing rivet fixing structure for pressing multi-layer PCB boards will be torn by the lower die during the fixing process and it is difficult to clean the rivet chips.

[0036] It should be noted that the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising said element.

[0037] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. A rivet fixing structure for laminating a multi-layer PCB, comprising a rivet body (1), characterized in that: A rivet assembly (200) for limiting the position is installed on the top of the rivet body (1), and a fixing assembly (300) for limiting the rolling of the multi-layer PCB is installed on the outside of the rivet body (1); The fixing assembly (300) comprises a roll-up piece (301) fixed to the bottom of the rivet body (1) and having a conical cross-section, and a filling sleeve (302) bonded to the outside of the rivet body (1) and used to play a certain filling role; The rivet assembly (200) comprises a rivet base (201) fixed to the top of the rivet body (1), a through hole (202) opened at the top of the rivet base (201) and connected to the inside of the rivet body (1), and a gasket (203) bonded to the bottom of the rivet base (201).

2. A rivet fixing structure for laminating a multi-layer PCB according to claim 1, characterized in that: The rolling member (301) is a conical frame with openings at the top and bottom, and the diameter of the bottom of the rolling member (301) is greater than the diameter of the top.

3. The rivet fixing structure for laminating a multi-layer PCB according to claim 1, characterized in that: The vertical height of the rolling piece (301) is 0.3 mm, and the outer side and the inner side of the bottom of the rolling piece (301) are both arc-shaped.

4. The rivet fixing structure for laminating a multi-layer PCB according to claim 1, characterized in that: The outer diameter of the filling sleeve (302) is equal to the outer diameter of the bottom of the roll-up member (301), and the bottom of the gasket (203) is bonded to the top of the filling sleeve (302).

5. The rivet fixing structure for laminating a multi-layer PCB according to claim 1, characterized in that: The filling sleeve (302) is a cylinder with openings at the top and bottom, and the outer diameter of the filling sleeve (302) is smaller than the outer diameter of the gasket (203).

6. The rivet fixing structure for laminating a multi-layer PCB according to claim 1, characterized in that: The rivet body (1) is a hollow cylinder with openings at the top and bottom, and an inner diameter equal to the inner diameter of the through hole (202).

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