Wearable heat dissipation device

Abstract

The utility model belongs to the technical field of heat dissipation, and particularly relates to a wearable heat dissipation device which comprises a heat dissipation body. A heat dissipation cavity is formed in the heat dissipation body, the heat dissipation cavity is filled with heat dissipation substances, the heat dissipation substances can flow in the heat dissipation cavity, and a mounting part is arranged on the upper surface of the heat dissipation body and used for mounting an electronic product to be subjected to heat dissipation; and a fixing member. The two ends of the fixing piece are connected with the heat dissipation body, and the fixing piece can fix the heat dissipation body to all parts of the human body. The heat dissipation material is arranged in the heat dissipation cavity to help an electronic product installed on the heat dissipation body to dissipate heat, the micro liquid pump is arranged to enable the heat dissipation material to circularly flow, the flowing heat dissipation material can continuously take away heat transferred to the heat dissipation body by the electronic product, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation, and particularly relates to a wearable heat dissipation device. Background Art

[0002] Electronic products are the most commonly used items in our lives. With the development of electronic products, their performance has become stronger and stronger. Products such as VR, AR, action cameras, and eye masks belong to wearable electronic products. When such products work, their chips will also generate a large amount of heat. If the chips cannot be cooled in time, it will lead to a decline in product performance and at the same time cause the shell temperature to be too high, reducing the user experience.

[0003] For example, a heat dissipation component and a wearable device with the application number CN118338621A relate to the technical field of heat dissipation devices. The heat dissipation component includes a heat dissipation fan and a plurality of heat dissipation fins. The heat dissipation fan includes a housing and a fan body. The housing forms an air outlet channel, and the fan body is arranged at the air inlet end of the air outlet channel; a plurality of the heat dissipation fins are arranged in the air outlet channel. The heat dissipation fins have a near-air end and a far-air end that are spaced apart along the air outlet direction. The cross-sectional profile of the heat dissipation fins is streamlined, and the thickness of the far-air end is smaller than the thickness of the near-air end. The technical solution of this application can reduce power consumption while improving the heat dissipation efficiency.

[0004] Most of the existing portable heat dissipation devices use fans for heat dissipation, with low heat dissipation efficiency. Moreover, fan heat dissipation will generate relatively large noise and significant vibration, and is not suitable in some occasions. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a wearable heat dissipation device, aiming to solve the technical problems of low heat dissipation efficiency and insufficient wide applicability of the existing portable heat dissipation devices.

[0006] To achieve the above purpose, a wearable heat dissipation device provided by an embodiment of the utility model includes a heat dissipation body; a heat dissipation cavity is arranged inside the heat dissipation body, a heat dissipation substance is filled in the heat dissipation cavity, the heat dissipation substance can flow in the heat dissipation cavity, an installation part is arranged on the upper surface of the heat dissipation body, and the installation part is used for installing the electronic product to be cooled; and

[0007] a fixing member; both ends of the fixing member are connected to the heat dissipation body, and the fixing member can fix the heat dissipation body on various parts of the human body.

[0008] Optionally, a flow pipeline is arranged inside the fixing member, the flow pipeline is communicated with the heat dissipation cavity, and the heat dissipation substance can flow between the flow pipeline and the heat dissipation cavity.

[0009] Optionally, two openings are provided on the heat dissipation body, and the two openings communicate with the heat dissipation cavity, and both ends of the flow pipeline are respectively connected to the two openings to communicate with the heat dissipation cavity.

[0010] Optionally, a micro liquid pump is provided in the flow pipeline, and the micro liquid pump is used to make the heat dissipation substance in the flow pipeline and the heat dissipation cavity flow.

[0011] Optionally, a plurality of flow guiding members are provided in the heat dissipation cavity, and flow channels are formed between the flow guiding members.

[0012] Optionally, a liquid cooling film is provided in the heat dissipation body, and a heat dissipation cavity is formed between the liquid cooling film and the inner wall of the heat dissipation body.

[0013] Optionally, a micro liquid pump is provided on the liquid cooling film, and the micro liquid pump is used to make the heat dissipation substance in the flow pipeline and the heat dissipation cavity flow.

[0014] Optionally, heat dissipation channels are engraved on one side of the liquid cooling film close to the heat dissipation cavity.

[0015] Optionally, a liquid pump driving board is provided on the micro liquid pump, a power supply is provided on the heat dissipation body, and the power supply is electrically connected to the liquid pump driving board.

[0016] Optionally, the heat dissipation body is made of a heat-conducting material.

[0017] Compared with the prior art, at least one of the above one or more technical solutions in the wearable heat dissipation device provided by the embodiment of the present invention has the following technical effects:

[0018] By arranging a heat dissipation substance in the heat dissipation cavity, it can help the electronic product installed on the heat dissipation body to dissipate heat. The heat dissipation substance can flow, which can accelerate the heat dissipation efficiency. By arranging fixing members, the heat dissipation body can be fixed to various parts of the body.

[0019] By arranging a micro liquid pump, the heat dissipation substance can be circulated, and the flowing heat dissipation substance can continuously take away the heat transferred from the electronic product to the heat dissipation body, increasing the heat dissipation efficiency. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0021] Figure 1 It is a schematic diagram of the square structure of Embodiment 1.

[0022] Figure 2 For Figure 1 The structural schematic diagram at location A.

[0023] Figure 3 It is the structural schematic diagram of the circular cross-section in Embodiment 1.

[0024] Figure 4 It is the structural schematic diagram of the circular cross-section in Embodiment 1.

[0025] Figure 5 It is the explosion structural schematic diagram of Embodiment 2.

[0026] Figure 6 It is the structural schematic diagram of Embodiment 3.

[0027] Among them, the reference signs in the figures are as follows:

[0028] 100, heat dissipation body; 110, heat dissipation cavity; 120, installation part; 130, opening; 140, flow guiding member; 150, liquid cooling film; 151, heat dissipation flow channel; 160, connector; 170, partition board; 180, cavity; 190, semiconductor cooler;

[0029] 200, fixing member; 210, flow pipeline;

[0030] 300, micro liquid pump; 310, liquid pump driving board. Detailed implementation manners

[0031] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the embodiments of the present utility model, and should not be construed as a limitation to the present utility model.

[0032] In the description of the embodiments of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0033] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present utility model, the meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0034] In the embodiments of the present utility model, unless otherwise clearly specified and defined, terms such as "installed", "connected", "linked", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0035] Embodiment 1

[0036] According to Figures 1-4 As shown, a wearable heat dissipation device includes a heat dissipation body 100; a heat dissipation cavity 110 is provided inside the heat dissipation body 100, a heat dissipation substance is filled in the heat dissipation cavity 110, the heat dissipation substance can flow in the heat dissipation cavity 110, an installation part 120 is provided on the upper surface of the heat dissipation body 100, and the installation part 120 is used for installing the electronic product to be dissipated; and a fixing member 200; both ends of the fixing member 200 are connected to the heat dissipation body 100, and the fixing member 200 can fix the heat dissipation body 100 on various parts of the human body.

[0037] Specifically, by arranging a heat dissipation substance in the heat dissipation cavity 110, it can help the electronic product installed on the heat dissipation body 100 to dissipate heat. The heat dissipation substance can flow, which can improve the heat dissipation efficiency. By arranging the fixing member 200, the heat dissipation body 100 can be fixed on various parts of the body.

[0038] Furthermore, the heat dissipation substance can be pure water, an alcohol-water mixture, a fluorinated liquid, etc.

[0039] It can be understood that some electronic products need to be arranged on the human body for use, such as cameras, VR, AR devices, etc., and the heat dissipation body 100 needs to be fixed and adapted to different parts of the body.

[0040] It can be understood that the fixing member 200 can be of different structures such as a fixing belt, a fixing rope, a fixing ring, etc. The fixing member can be elastic or non-elastic. If it is elastic, it is sleeved on the human body part through the elastic force, such as the head, the arm part, or the waist, etc. If it is non-elastic, it is wearable, such as worn or sleeved on the neck or the wrist.

[0041] According to Figures 1-4 As shown, a flow pipe 210 is provided inside the fixing member 200. The flow pipe 210 communicates with the heat dissipation cavity 110. The heat dissipation substance can flow between the flow pipe 210 and the heat dissipation cavity 110. Two openings 130 are provided on the heat dissipation body 100. The two openings 130 communicate with the heat dissipation cavity 110. The two ends of the flow pipe 210 are respectively connected to the two openings 130 to communicate with the heat dissipation cavity 110. The opening 130 is an inlet and outlet hole. In actual design, multiple inlet holes and multiple outlet holes can also be provided.

[0042] Specifically, a flow pipe 210 is provided inside the fixing member 200. The heat dissipation substance can flow between the flow pipe 210 and the heat dissipation cavity 110, increasing the heat dissipation area, which can accelerate the dissipation of heat and increase the heat dissipation efficiency.

[0043] According to Figure 1 and 2 As shown, a micro liquid pump 300 is provided inside the flow pipe 210. The micro liquid pump 300 is used to make the heat dissipation substance in the flow pipe 210 and the heat dissipation cavity 110 flow. Specifically, without adding the micro liquid pump 300, the heat dissipation substance can slosh between the flow pipe 210 and the heat dissipation cavity 110, and the heat dissipation substance does not form a cycle. After adding the micro liquid pump 300, the heat dissipation substance flows completely. The flowing heat dissipation substance can continuously take away the heat transferred from the electronic product to the heat dissipation body, preventing the temperature of the local area from rising. And static water is very easy to form a temperature gradient, and the overall heat transfer capacity is not as good as that of flowing water. It can be known that the heat dissipation effect is better and the efficiency is higher after adding the micro liquid pump 300.

[0044] According to Figure 3 and 4 As shown, a plurality of flow guiding members 140 are provided inside the heat dissipation cavity 110. A flow channel is formed between the two flow guiding members 140. Specifically, the flow guiding member 140 can interrupt the straight-line flow of the liquid, increasing the tortuosity and turbulence intensity of the flow. This can effectively increase the convective heat transfer coefficient between the liquid and the heat dissipation surface, and at the same time can also increase the convective heat transfer coefficient, thereby enhancing the heat dissipation effect and increasing the heat dissipation efficiency. The flow guiding member 140 can be cylindrical ( Figure 3 ), strip-shaped ( Figure 4 ), etc.

[0045] According to Figure 4As shown, a liquid pump driving board 310 is provided on the micro liquid pump 300, and a power supply (not shown) is provided on the heat dissipation body 100. The power supply is electrically connected to the liquid pump driving board 310. Specifically, the liquid pump driving board 310 is a control unit. When the power consumption of the electronic product is not high and the heat generation is less, only passive heat dissipation is required, and there is no need to turn on the micro liquid pump 300. When the electronic product operates with high power consumption and generates more heat, the micro liquid pump 300 can be turned on at this time for efficient heat dissipation. It can be understood that a power supply compartment (not shown) is provided inside the heat dissipation body 100, the power supply is arranged in the power supply compartment, and the power supply compartment is partitioned from the heat dissipation cavity 110.

[0046] According to Figures 1-5 As shown, the heat dissipation body 100 is made of a heat-conducting material. Specifically, only a heat-conducting material can transfer the heat of the electronic product to the heat dissipation body 100 to the greatest extent by means of solid conduction, and then the heat is dissipated through the heat dissipation body 100. The heat-conducting material can be aluminum alloy, and can be any material that can conduct heat, such as PC, magnesium alloy, copper material, etc. Aluminum alloy is preferred because aluminum alloy is light in weight and good in heat-conducting performance. As a wearable device, weight is a relatively important consideration factor.

[0047] In Embodiment 1, the micro liquid pump 300 is located outside the heat dissipation body 100. The shape of the heat dissipation body 100 can be arbitrary, and can be square, such as Figure 1 and Figure 2 shown; it can be circular, such as Figure 3 and Figure 4 shown. It can also be any other shape, which is within the protection scope of the present utility model.

[0048] Embodiment 2

[0049] As Figure 5 shown, in Embodiment 2, the micro liquid pump 300 is located inside the heat dissipation body 100. A liquid cooling film 150 is provided inside the heat dissipation body 100, and a heat dissipation cavity 110 is formed between the liquid cooling film 150 and the inner wall of the heat dissipation body 100. The micro liquid pump 300 is provided on the liquid cooling film 150, and the micro liquid pump 300 is used to make the heat dissipation substance in the flow pipeline 210 and the heat dissipation cavity 110 flow. A heat dissipation flow channel 151 is engraved on one side of the liquid cooling film 150 close to the heat dissipation cavity 110. Specifically, through the compressed flow channel design, a heat dissipation flow channel 151 is engraved on one side of the liquid cooling film 150 close to the heat dissipation cavity 110, which can interrupt the linear flow of the liquid, increase the tortuosity of the flow and the turbulence intensity. This can effectively improve the convective heat transfer coefficient between the liquid and the heat dissipation surface, and at the same time can also improve the convective heat transfer coefficient, thereby enhancing the heat dissipation effect and increasing the heat dissipation efficiency.

[0050] It can be understood that the liquid cooling film 150 can improve the heat transfer efficiency between the liquid and the heat dissipation surface, thereby increasing the heat dissipation efficiency. Both ends of the flow pipe 210 are connected to the heat dissipation cavity 110 through two connectors 160 respectively.

[0051] In Embodiment 2, the rest is the same as that in Embodiment 1.

[0052] Embodiment 3

[0053] As Figure 6 shown, a partition plate 170 is provided inside the heat dissipation body 100. The partition plate 170 divides the inside of the heat dissipation body 100 into two parts, namely a cavity 180 and a heat dissipation cavity 110. A semiconductor refrigerator 190 is provided inside the cavity 180.

[0054] Specifically, one end close to the semiconductor refrigerator 190 is the heat source. The heat absorption end of the semiconductor refrigerator 190 is closely adjacent to the heat source. The heat dissipation end is closely adjacent to the heat dissipation cavity 110. The heat dissipation cavity 110 takes away the heat of the semiconductor refrigerator 190 to achieve the purpose of temperature reduction. The semiconductor refrigerator 190 and liquid cooling are combined for heat dissipation, with better heat dissipation effect and higher heat dissipation efficiency, and can achieve the purpose of quickly cooling electronic products.

[0055] In Embodiment 3, the rest is the same as that in Embodiment 1.

[0056] The above content is a further detailed description of the present utility model in combination with specific preferred embodiments. It cannot be determined that the specific implementation of the present utility model is only limited to these descriptions. For those of ordinary skill in the technical field to which the present utility model belongs, without departing from the concept of the present utility model, its architecture form can be flexible and changeable, and a series of products can be derived. Just making several simple deductions or substitutions should be regarded as belonging to the patent protection scope determined by the claims submitted for the present utility model.

Claims

1. A wearable heat dissipation device, characterized in that: It comprises a heat dissipation body; a heat dissipation cavity is provided in the heat dissipation body, the heat dissipation cavity is filled with heat dissipation material, the heat dissipation material can flow in the heat dissipation cavity, and a mounting portion is provided on the upper surface of the heat dissipation body, the mounting portion is used to mount the electronic product to be dissipated; and Fixing piece; both ends of the fixing piece are connected to the heat dissipation body, and the fixing piece can fix the heat dissipation body on various parts of the human body.

2. The wearable heat dissipation device according to claim 1, characterized in that: A flow pipe is arranged in the fixing part, and the flow pipe is connected to the heat dissipation cavity, and the heat dissipation material can flow between the flow pipe and the heat dissipation cavity.

3. The wearable heat dissipation device according to claim 2, characterized in that: The heat dissipation body is provided with two openings, the two openings are connected to the heat dissipation cavity, and the two ends of the flow pipe are respectively connected to the two openings and are connected to the heat dissipation cavity.

4. The wearable heat dissipation device according to claim 3, characterized in that: A micro liquid pump is arranged in the flow pipeline, and the micro liquid pump is used to make the heat dissipation material in the flow pipeline and the heat dissipation cavity flow.

5. The wearable heat dissipation device according to claim 4, characterized in that: A plurality of flow guides are arranged in the heat dissipation cavity, and a flow channel is formed between two of the flow guides.

6. The wearable heat dissipation device according to claim 3, characterized in that: A liquid cooling film is arranged in the heat dissipation body, and a heat dissipation cavity is formed between the liquid cooling film and the inner wall of the heat dissipation body.

7. The wearable heat dissipation device according to claim 6, characterized in that: The liquid cooling film is provided with a micro liquid pump, and the micro liquid pump is used to make the heat dissipation material in the flow pipe and the heat dissipation cavity flow.

8. The wearable heat dissipation device according to claim 7, characterized in that: A heat dissipation channel is carved on one side of the liquid cooling film close to the heat dissipation cavity.

9. The wearable heat dissipation device according to any one of claims 4 or 7, characterized in that: The micro liquid pump is provided with a liquid pump driving board, the heat dissipation body is provided with a power supply, and the power supply is electrically connected to the liquid pump driving board.

10. The wearable heat dissipation device according to claim 3, characterized in that: A baffle is arranged in the heat dissipation body, and the baffle divides the interior of the heat dissipation body into two parts: a cavity and the heat dissipation cavity. A semiconductor refrigerator is arranged in the cavity.

Images