Heat dissipation module and electronic equipment
By introducing a double-sided heat-conducting heat plate design into the heat dissipation module, the heat dissipation problems of high-power-consumption chips and power supply components are solved, achieving more efficient heat dissipation effects and structural simplification.
Patent Information
- Application Number
- CN202422076139.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-26
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-08-26
AI Technical Summary
In the prior art, by overlapping copper plates, heat pipes and fins in turn, the heat source can only conduct heat from the single side of the heat pipe, which cannot meet the heat dissipation needs of high-power chips, and there is room for improvement in heat exchange efficiency.
The heat dissipation module design includes the first heat dissipation plate and the second heat dissipation plate. The two heat dissipation plates are respectively in contact with the heat source and are connected through the heat dissipation pipe. The heat conduction is carried out using two heat conduction paths to increase the contact area and heat transfer area of the heat dissipation pipe to achieve double-sided heat conduction.
It significantly improves heat exchange efficiency and reduces the operating temperature of the heat source, especially in the case of high power consumption, solves the problem of excessive temperature of chips and power supply components, and at the same time simplifies the structure and is easy to manufacture.
Smart Images
Figure CN223053335U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of heat dissipation of electronic devices, in particular to a heat dissipation module and an electronic device capable of significantly improving the heat exchange efficiency. Background Art
[0002] Due to the rapid update and iteration of electronic products and electronic chips, the operating power consumption of electronic products continues to increase. In order to ensure that electronic products can maintain a normal working temperature, the heat dissipation module is crucial. Common heat dissipation modules include structures such as copper plates, heat pipes, VC vapor chambers, and fins. Chips and power supply components (inductors / capacitors, etc.) are lapped on the same copper plate as heat sources. The copper plate is then connected to the fins through heat pipes, and the heat is taken out from the fin end by a fan. This is the currently commonly used heat dissipation module structure design, which is simple and has a low cost and can meet general heat dissipation requirements.
[0003] However, in the above-mentioned prior art, the heat dissipation method through the sequentially lapped copper plate, heat pipe, and fin only allows the heat source to conduct heat from one side of the heat pipe to complete cooling, which cannot meet the heat dissipation requirements of high-power chips, and there is still room for improvement in the heat exchange efficiency.
[0004] Therefore, it is necessary to provide a heat dissipation module and an electronic device capable of significantly improving the heat exchange efficiency to solve the above problems. Summary of the Utility Model
[0005] An object of the utility model is to provide a heat dissipation module capable of significantly improving the heat exchange efficiency.
[0006] Another object of the utility model is to provide an electronic device having a heat dissipation module capable of significantly improving the heat exchange efficiency.
[0007] To achieve the above object, the technical solution of the utility model is: to provide a heat dissipation module, which includes a first heat dissipation plate, a second heat dissipation plate, and a heat dissipation tube; wherein, the first heat dissipation plate is used to contact a first heat source; the second heat dissipation plate is used to contact a second heat source; the heat dissipation tube is arranged between the first heat dissipation plate and the second heat dissipation plate, and both sides of the heat dissipation tube are respectively in contact with the first heat dissipation plate and the second heat dissipation plate.
[0008] Preferably, in the thickness direction of the heat dissipation module, the first heat dissipation plate and the second heat dissipation plate are arranged opposite to each other or staggered up and down.
[0009] Preferably, the first heat dissipation plate includes a first connection end, the second heat dissipation plate includes a second connection end, and the first connection end and the second connection end are clamped on both sides of the heat dissipation tube and fixed to the heat dissipation tube.
[0010] Preferably, the first heat dissipation plate further includes a third connection end that is bent with respect to the first connection end, and the third connection end is used to contact the first heat source; the second heat dissipation plate further includes a fourth connection end that is bent with respect to the second connection end, and the fourth connection end is used to contact the second heat source; the third connection end and the fourth connection end protrude in the same direction or in opposite directions with respect to the heat dissipation tube, facilitating the conduction of heat from the two heat sources to the heat dissipation tube through two heat conduction paths.
[0011] Preferably, in the thickness direction of the heat dissipation module, the third connection end and the fourth connection end protrude towards each other or in opposite directions, facilitating contact with the two heat sources to achieve heat transfer.
[0012] Preferably, the first heat dissipation plate and the second heat dissipation plate are both silver plates, copper plates, aluminum plates or steel plates.
[0013] Preferably, at least one end of the heat dissipation tube protrudes beyond the first heat dissipation plate and the second heat dissipation plate.
[0014] Preferably, the heat dissipation module further includes fins, and the fins are connected to one end of the heat dissipation tube that protrudes beyond the first heat dissipation plate and the second heat dissipation plate.
[0015] Correspondingly, the present invention also provides an electronic device, which includes a first heat source contact, a second heat source contact, and the heat dissipation module as described above.
[0016] Preferably, the first heat source contact and the second heat source contact are a chip and a power supply component respectively.
[0017] Compared with the prior art, since the heat dissipation module of the present invention adds a heat dissipation plate and can mount the first heat dissipation plate and the second heat dissipation plate on two contact surfaces of the heat dissipation tube, and at the same time uses the first heat dissipation plate and the second heat dissipation plate to contact the first heat source contact and the second heat source contact respectively, therefore, through two heat conduction paths, the heat of the two heat sources is respectively conducted to the heat dissipation tube, improving the efficiency of heat conduction; at the same time, making full use of the two contact surfaces of the heat dissipation tube, increasing the contact area and heat transfer area between the heat dissipation tube and the first heat dissipation plate and the second heat dissipation plate, increasing the heat capacity, thereby significantly improving the heat exchange efficiency, reducing the temperatures of the two heat sources, and effectively solving the problem of excessive operating temperature when the heat source suddenly increases power consumption; furthermore, only adding one heat dissipation plate is not only easy to manufacture and weld, but also can keep the overall structure of the heat dissipation module simplified.
[0018] Correspondingly, an electronic device having the heat dissipation module of the present invention also has the above technical effects, and can effectively reduce the operating temperature of the chip and the surface temperature of the power supply component, solving the problem of excessive operating temperature when the chip suddenly increases power consumption. Description of the Drawings
[0019] Figure 1 It is a schematic structural view of the heat dissipation module of the present utility model.
[0020] Figure 2 is Figure 1 the top view of.
[0021] Figure 3 is Figure 1 the exploded view of.
[0022] Figure 4 is Figure 1 the sectional view of. Specific embodiments
[0023] Now, embodiments of the present utility model will be described with reference to the accompanying drawings, in which like reference numerals represent like elements. It should be noted that the orientation descriptions involved in the present utility model, such as up, down, left, right, front, back, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the technical solutions of the present application or / and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present application. The first, second, etc. described are only used to distinguish technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence of the indicated technical features.
[0024] First, in combination with Figures 1-4 shown, the heat dissipation module 100 provided by the present utility model is particularly suitable for dissipating heat from high-power heat-generating components in electronic devices. However, it is not limited thereto, and of course, it can also be used in other devices to achieve the heat dissipation function.
[0025] In combination with Figures 1-4As shown, in one embodiment of the utility model, the heat dissipation module 100 includes a first heat dissipation plate 110, a second heat dissipation plate 120 and a heat dissipation pipe 130. Among them, the first heat dissipation plate 110 is used to contact the first heat source, and the second heat dissipation plate 120 is used to contact the second heat source; the heat dissipation pipe 130 is arranged between the first heat dissipation plate 110 and the second heat dissipation plate 120, and the two sides of the heat dissipation pipe 130 are respectively in contact with the first heat dissipation plate 110 and the second heat dissipation plate 120. In this way, through two heat conduction paths, the heat of the two heat sources is respectively conducted to the heat dissipation pipe 130, and the two contact surfaces of the heat dissipation pipe 130 are fully utilized, which significantly improves the heat exchange efficiency of the evaporation end and the condensation section of the heat dissipation pipe 130, thereby fully reducing the working temperature of the two heat sources. In addition, the contact heat conduction area and heat transfer area of the first heat dissipation plate 110, the second heat dissipation plate 120 and the heat dissipation pipe 130 are increased, and the heat capacity is also improved, thereby solving the problem of excessively high operating temperature when the two heat sources suddenly increase power consumption.
[0026] In the present invention, in the thickness direction of the heat dissipation module 100, the first heat dissipation plate 110 and the second heat dissipation plate 120 can be arranged relatively up and down, that is, in the thickness direction of the heat dissipation module 100, the projections of the first heat dissipation plate 110 and the second heat dissipation plate 120 completely overlap. This arrangement can reduce the space occupied by the heat dissipation module 100, and is particularly suitable for positions with smaller spaces in electronic devices. Of course, the first heat dissipation plate 110 and the second heat dissipation plate 120 can also be staggered in the thickness direction, that is, in the thickness direction of the heat dissipation module 100, the projections of the first heat dissipation plate 110 and the second heat dissipation plate 120 do not overlap at all or partially overlap, thereby making the position arrangement of the first heat dissipation plate 110 and the second heat dissipation plate 120 more flexible, and the positions of the first heat dissipation plate 110 and the second heat dissipation plate 120 can be flexibly adjusted according to the position of the heat source.
[0027] Combination Figures 3-4 As shown, in one embodiment of the present invention, the first heat sink 110 includes a bent first connection end 111 and a third connection end 112, wherein the first connection end 111 is used to be fixed to a contact surface of the heat sink 130, and the third connection end 112 protrudes out of the heat sink 130 to contact the first heat source. In this way, the heat of the first heat source is conducted to the heat sink 130 through the first heat sink 110.
[0028] Correspondingly, the second heat sink 120 includes a bent second connection end 121 and a fourth connection end 122, wherein the second connection end 121 is used to be fixed to another contact surface of the heat sink 130, and the fourth connection end 122 protrudes outside the heat sink 130 to contact the second heat source. The heat of the second heat source is transferred to the heat sink 130 through the second heat sink 120.
[0029] Continue to combine Figures 3-4 As shown, in a specific embodiment, the first connection end 111 and the second connection end 121 are respectively welded to two contact surfaces of the heat dissipation tube 130 to achieve fixation, which is easy to manufacture and weld. And compared with the heat dissipation module in the prior art, only one heat dissipation plate is added, and the overall structure of the heat dissipation module 100 is still simplified. Of course, other methods can also be used to fix the first connection end 111, the second connection end 121 and the heat dissipation tube 130. After the fixation is completed, the first connection end 111 and the second connection end 121 are arranged in parallel, and the first connection end 111 and the second connection end 121 are opposite to each other up and down. In the transverse direction of the heat dissipation module 100, the third connection end 112 and the fourth connection end 122 protrude in two opposite directions relative to the heat dissipation tube 130, so as to be in contact with heat sources in two directions, so that the heat of the two heat sources is conducted to the heat dissipation tube 130 through heat conduction paths in two directions, and the contact surfaces of the heat dissipation tube 130 are fully utilized. Compared with the heat dissipation method in the prior art that only uses one side of one heat dissipation plate to contact two heat sources at the same time and the other side overlaps the heat pipe, the structural setting in the present application can significantly improve the heat exchange efficiency of the heat dissipation tube 130.
[0030] Of course, in other embodiments, in the transverse direction of the heat dissipation module 100, the third connection end 112 and the fourth connection end 122 may also protrude in the same direction relative to the heat dissipation tube 130 to respectively contact two heat sources located on the same side of the heat dissipation tube 130. Similarly, the heat of the two heat sources is respectively conducted to the heat dissipation tube 130 by using two heat conduction paths, and the two contact surfaces of the heat dissipation tube 130 are fully utilized to improve the heat exchange efficiency.
[0031] Continue to combine Figures 3-4 As shown, in the thickness direction of the heat dissipation module 100, the third connection end 112 and the fourth connection end 122 protrude towards each other. In a specific embodiment, the first connection end 111 is fixed to the upper contact surface of the heat dissipation tube 130, and the third connection end 112 is bent and protrudes downward; the second connection end 121 is fixed to the lower contact surface of the heat dissipation tube 130, and the fourth connection end 122 is bent and protrudes upward, so as to be in corresponding contact with two heat sources. Of course, the third connection end 112 and the fourth connection end 122 can protrude in opposite directions, or can be flexibly adjusted according to the specific structure and position of the heat source so that the third connection end 112 and the fourth connection end 122 protrude in other directions. And the installation positions of the first heat dissipation plate 110 and the second heat dissipation plate 120 can be interchanged.
[0032] In a specific embodiment of the present utility model, both the first heat dissipation plate 110 and the second heat dissipation plate 120 are copper plates. Of course, other materials with good heat conduction functions can also be selected for the two, for example, the first heat dissipation plate 110 and the second heat dissipation plate 120 can also be silver plates, aluminum plates or steel plates, etc.
[0033] Combined again Figures 1-2 As shown, in the present utility model, the heat dissipation module 100 further includes fins (not shown in the figure), and the fins are connected to at least one end of the heat dissipation tube 130 protruding beyond the first heat dissipation plate 110 and the second heat dissipation plate 120. In a specific embodiment, both ends of the heat dissipation tube 130 protrude beyond the first heat dissipation plate 110 and the second heat dissipation plate 120, and one end of the heat dissipation tube 130 is connected with the fins. After the heat is conducted to the fins through the heat dissipation tube 130, the heat is then taken out from the fin end by the fan. The other structures of the heat dissipation tube 130, as well as the structures of the fins and the fan, are all conventional structures in the art and will not be described in detail.
[0034] Combined again Figures 1-4 As shown, the present utility model further provides an electronic device, which includes a first heat source contact, a second heat source contact, and the heat dissipation module 100 as described above. Among them, the first heat source contact and the second heat source contact can be the same or different components, and no specific limitation is made here.
[0035] In a specific embodiment of the present utility model, the first heat source contact is preferably a chip, and the second heat source contact is preferably a power supply component, such as a capacitor / inductor, etc. Separating the chip and the power supply component, with the chip contacting the first heat dissipation plate 110 and the power supply component contacting the second heat dissipation plate 120, not only increases the contact heat conduction area and heat transfer area between the chip and the first heat dissipation plate 110, and between the power supply component and the second heat dissipation plate 120, but also increases the contact heat conduction area and heat transfer area between the first heat dissipation plate 110, the second heat dissipation plate 120 and the heat dissipation tube 130, and fully utilizes the contact surface of the heat dissipation tube 130, thereby significantly improving the heat exchange efficiency of the evaporation end and the condensation section of the heat dissipation tube 130, further reducing the operating temperatures of the chip and the power supply component, and at the same time enhancing the heat capacity, and solving the problem of excessive operating temperature when the chip suddenly raises its power consumption.
[0036] In the present utility model, the first heat source contact and the second heat source contact can of course also be other components that generate heat and have high power consumption.
[0037] In summary, the heat dissipation module 100 of the present utility model adds a heat dissipation plate, mounts the first heat dissipation plate 110 and the second heat dissipation plate 120 on two contact surfaces of the heat dissipation tube 130, and simultaneously uses the first heat dissipation plate 110 and the second heat dissipation plate 120 to contact the first heat source and the second heat source respectively. Therefore, through two heat conduction paths, the heat of the two heat sources is respectively conducted to the heat dissipation tube 130, improving the efficiency of heat conduction; at the same time, the two contact surfaces of the heat dissipation tube 130 are fully utilized to increase the contact area and heat transfer area between the heat dissipation tube 130 and the first heat dissipation plate 110 and the second heat dissipation plate 120, increasing the heat capacity, thereby significantly improving the heat exchange efficiency, reducing the temperatures of the two heat sources, and effectively solving the problem of too high operating temperature when the heat source suddenly increases power consumption; furthermore, only adding one heat dissipation plate is not only easy to manufacture and weld, but also can keep the overall structure of the heat dissipation module 100 simplified.
[0038] Correspondingly, an electronic device having the heat dissipation module 100 of the present utility model also has the above technical effects, and can effectively reduce the operating temperature of the chip and the surface temperature of the power supply components, solving the problem of too high operating temperature when the chip suddenly increases power consumption.
[0039] The structures of other parts of the electronic device involved in the present utility model are all conventional structures well known to those of ordinary skill in the art, and will not be described in detail here.
[0040] The above-disclosed are only the preferred embodiments of the present utility model, and of course cannot be used to limit the scope of rights of the present utility model. Therefore, equivalent changes made according to the scope of the patent application of the present utility model still fall within the scope covered by the present utility model.
Claims
1. A heat dissipation module, characterized in that: include: A first heat sink, used to contact a first heat source; A second heat dissipation plate, used for contacting with a second heat source; The heat dissipation pipe is arranged between the first heat dissipation plate and the second heat dissipation plate, and two surfaces of the heat dissipation pipe are in contact with the first heat dissipation plate and the second heat dissipation plate respectively.
2. The heat dissipation module according to claim 1, characterized in that: In the thickness direction of the heat dissipation module, the first heat dissipation plate and the second heat dissipation plate are arranged opposite to each other or staggered in the vertical direction.
3. The heat dissipation module according to claim 1, characterized in that: The first heat sink includes a first connection end, and the second heat sink includes a second connection end. The first connection end and the second connection end are clamped on two sides of the heat sink and fixed to the heat sink.
4. The heat dissipation module according to claim 3, characterized in that: The first heat sink further comprises a third connection end which is arranged in a bent shape with respect to the first connection end, and the third connection end is used for contacting with the first heat source; The second heat sink further includes a fourth connection end disposed in a bent shape with respect to the second connection end, and the fourth connection end is used to contact the second heat source; The third connection end and the fourth connection end protrude in the same direction or in opposite directions relative to the heat dissipation pipe.
5. The heat dissipation module according to claim 4, characterized in that: In the thickness direction of the heat dissipation module, the third connection end and the fourth connection end protrude toward each other or in opposite directions.
6. The heat dissipation module according to any one of claims 1 to 5, characterized in that: The first heat sink and the second heat sink are both silver plates, copper plates, aluminum plates or steel plates.
7. The heat dissipation module according to any one of claims 1 to 5, characterized in that: At least one end of the heat dissipation pipe protrudes out of the first heat dissipation plate and the second heat dissipation plate.
8. The heat dissipation module according to any one of claims 1 to 5, characterized in that: It also includes a fin, which is connected to one end of the heat dissipation pipe protruding outside the first heat dissipation plate and the second heat dissipation plate.
9. An electronic device, comprising a first heat source contact and a second heat source contact, characterized in that: Also includes: The heat dissipation module according to any one of claims 1 to 8.
10. The electronic device according to claim 9, characterized in that: The first heat source contacts and the second heat source contacts are chips and power supply components respectively.