Solder strip processing device and series welding machine

Abstract

The utility model discloses a welding strip processing device and a series welding machine, and the welding strip processing device comprises a flattening mechanism which is used for pressing a welding strip and processing the welding strip into a preset shape; the cutter mechanism is arranged at the downstream of the flattening mechanism, and the cutter mechanism is used for cutting off the welding strip; the first traction mechanism and the second traction mechanism are sequentially arranged at the downstream of the cutter mechanism; the transfer station is located between the first traction mechanism and the second traction mechanism, the workbench is located on the downstream of the transfer station, the first traction mechanism can reciprocate between the cutter mechanism and the transfer station, and the second traction mechanism can reciprocate between the cutter mechanism and the transfer station. The second traction mechanism can move between the transfer station and the workbench in a reciprocating mode, and the first traction mechanism can transfer the clamped welding strip to the second traction mechanism at the transfer station.

Description

Technical Field

[0001] This application belongs to the technical field of photovoltaic module production, and particularly relates to a solder ribbon processing device and a string welding machine. Background Art

[0002] In the prior art, the solder ribbon processing device has two first traction mechanisms and a second traction mechanism. The cutting mechanism is arranged between the first traction mechanism and the second traction mechanism. The first traction mechanism moves the end of the solder ribbon from the material taking place to the second traction mechanism. The first traction mechanism returns to the material taking end. The solder ribbon is clamped by the first traction mechanism and the second traction mechanism, and then is cut off by the cutting mechanism. The second traction mechanism transfers the cut solder ribbon segment to the workbench. In this way, the waiting time is relatively long, it is time-consuming, and the production efficiency is low. Summary of the Utility Model

[0003] The purpose of the embodiments of this application is to provide a solder ribbon processing device and a string welding machine.

[0004] According to the first aspect of the embodiments of this application, a solder ribbon processing device is provided, including:

[0005] A flattening mechanism for pressing the solder ribbon and processing it into a preset shape;

[0006] A cutting mechanism arranged downstream of the flattening mechanism for cutting the solder ribbon;

[0007] A first traction mechanism and a second traction mechanism, which are sequentially arranged downstream of the cutting mechanism;

[0008] A handover station and a workbench. The handover station is located between the first traction mechanism and the second traction mechanism, and the workbench is located downstream of the handover station. The first traction mechanism can reciprocate between the cutting mechanism and the handover station, and the second traction mechanism can reciprocate between the handover station and the workbench. At the handover station, the first traction mechanism can transfer the clamped solder ribbon to the second traction mechanism.

[0009] Optionally, the solder ribbon processing device includes a first working state. In the first working state, the first traction mechanism clamps the solder ribbon at the cutting mechanism and transfers it to the handover station. The second traction mechanism moves to the handover station at the workbench. The cutting mechanism cuts the solder ribbon. The first traction mechanism transfers the solder ribbon segment cut by the cutting mechanism to the second traction mechanism.

[0010] Optionally, the solder strip processing device includes a second working state, in which the first traction mechanism returns to the cutter mechanism to clamp the solder strip, and the second traction mechanism transfers the clamped solder strip segment to the workbench.

[0011] Optionally, the first traction mechanism includes a first driving component and a first clamping component. The first clamping component is connected to the driving end of the first driving component, and the first driving component can drive the first clamping component to reciprocate between the cutter mechanism and the transfer station.

[0012] Optionally, the first traction mechanism further includes a first bearing plate, which is arranged on the side of the first clamping component close to the second traction mechanism.

[0013] Optionally, the second traction mechanism includes a second driving component and a second clamping component. The second clamping component is connected to the driving end of the second driving component, and the second driving component can drive the second clamping component to reciprocate between the workbench and the transfer station.

[0014] Optionally, the second traction mechanism further includes a second bearing plate, which is arranged on the side of the second clamping component close to the first traction mechanism.

[0015] Optionally, the cutter mechanism includes a third driving component and a cutter component. The cutter component is connected to the driving end of the third driving component, and the third driving component can drive the cutter component to move along the length direction of the solder strip.

[0016] Optionally, the solder strip processing device further includes a tail clamping mechanism, which is arranged on the side of the workbench close to the transfer station.

[0017] According to the second aspect of the embodiments of the present application, a string welding machine is provided, including the above-mentioned solder strip processing device.

[0018] One technical effect of the embodiments of the present application is that the solder strip is tightened by the flattening mechanism and the first traction mechanism and cut by the cutter mechanism, and the first traction mechanism and the second traction mechanism can move towards each other or away from each other simultaneously, so as to reduce the production beat of the solder strip processing device and improve the working efficiency of the solder strip processing device.

[0019] Through the following detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings, other features and advantages of the present application will become clear. Description of the Drawings

[0020] The accompanying drawings incorporated in and forming a part of this specification illustrate embodiments of the present application and, together with the description thereof, serve to explain the principles of the present application.

[0021] Figure 1 It is a schematic structural diagram of the solder strip processing device in the embodiment of the present application;

[0022] Figure 2 It is a schematic structural diagram of the solder strip processing device in the embodiment of the present application;

[0023] Figure 3 It is a schematic structural diagram of the solder strip processing device in the embodiment of the present application.

[0024] Description of reference numerals: Flattening mechanism 1; Cutting tool mechanism 2; First traction mechanism 3; First driving component 31; First clamping component 32; First bearing plate 33; Second traction mechanism 4; Second driving component 41; Second clamping component 42; Second bearing plate 43; Workbench 5; Handover station 6; Tail clamp mechanism 7. Detailed embodiments

[0025] Now, various exemplary embodiments of the present application will be described in detail with reference to the accompanying drawings. It should be noted that: Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0026] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way limits the present application, its application, or its use.

[0027] Techniques, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be regarded as part of the specification.

[0028] In all the examples shown and discussed herein, any specific value should be construed as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.

[0029] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0030] As Figures 1-3As shown in the figure, according to the first aspect of the embodiments of the present application, a solder strip processing device is provided, including a flattening mechanism 1, a cutting mechanism 2, a first traction mechanism 3, a second traction mechanism 4, a transfer station 6 and a workbench 5; the flattening mechanism 1 is used to press the solder strip and process the solder strip into a preset shape; the cutting mechanism 2 is arranged downstream of the flattening mechanism 1, and the cutting mechanism 2 is used to cut the solder strip; the first traction mechanism 3 and the second traction mechanism 4 are sequentially arranged downstream of the cutting mechanism 2; the transfer station 6 is located between the first traction mechanism 3 and the second traction mechanism 4, the workbench 5 is located downstream of the transfer station 6, the first traction mechanism 3 can reciprocate between the cutting mechanism 2 and the transfer station 6, the second traction mechanism 4 can reciprocate between the transfer station 6 and the workbench 5, and at the transfer station 6, the first traction mechanism 3 can transfer the clamped solder strip to the second traction mechanism 4.

[0031] As Figure 1 shown in the figure, the solder strip processing device includes a flattening mechanism 1, a cutting mechanism 2, a first traction mechanism 3, a second traction mechanism 4, a transfer station 6 and a workbench 5. Among them, the flattening mechanism 1 is used to process the solder strip into a preset shape, and the flattening mechanism 1 can also clamp the solder strip; the cutting mechanism 2 is used to cut the solder strip; the first traction mechanism 3 and the second traction mechanism 4 are used to stretch the solder strip; the transfer station 6 is used for the first traction mechanism 3 to transfer the solder strip segment to the second traction mechanism 4 here; the workbench 5 can be a welding platform, and the solder strip segment is placed on the welding platform for standby.

[0032] In the embodiments of the present application, the downstream mentioned refers to the moving direction of the solder strip; for example, the cutting mechanism 2 is located downstream of the flattening mechanism 1, which means that the solder strip moves from the flattening mechanism 1 to the cutting mechanism 2.

[0033] Further explanation, the order of the solder strip processing device arranged from upstream to downstream is the flattening mechanism 1, the cutting mechanism 2, the transfer station 6 and the workbench 5. The first traction mechanism 3 is arranged between the cutting mechanism 2 and the transfer station 6 and can reciprocate between the cutting mechanism 2 and the transfer station 6; the second traction mechanism 4 is arranged between the transfer station 6 and the workbench 5, and the second traction mechanism 4 can reciprocate between the transfer station 6 and the workbench 5.

[0034] In the embodiment of the present application, the flattening mechanism 1 can press the solder tape tightly. Therefore, the first traction mechanism 3 clamps the end of the solder tape and moves it from the cutting mechanism 2 to the transfer station 6. The first traction mechanism 3 and the flattening mechanism 1 work together to keep the solder tape in a taut state. The cutting mechanism 2 is located between the flattening mechanism 1 and the first traction mechanism 3, so the cutting mechanism 2 is convenient for cutting the solder tape to obtain a solder tape segment. The first traction mechanism 3 transfers the solder tape segment to the second traction mechanism 4 at the transfer station 6. The second traction mechanism 4 moves towards the workbench 5 to transfer the solder tape segment to the workbench 5. At the same time, the first traction mechanism 3 returns to the cutting mechanism 2 to clamp the end of the solder tape. While the second traction mechanism 4 moves from the workbench 5 to the transfer station 6, the first traction mechanism 3 clamps the end of the solder tape and moves towards the transfer station 6, and then the above steps are repeated.

[0035] In the embodiment of the present application, the solder tape is tightened by the flattening mechanism 1 and the first traction mechanism 3, and the solder tape is cut by the cutting mechanism 2. Neither the first traction mechanism 3 nor the second traction mechanism 4 needs to wait. The first traction mechanism 3 and the second traction mechanism 4 can move towards each other or move away from each other simultaneously, so as to reduce the production cycle of the solder tape processing device and improve the working efficiency of the solder tape processing device.

[0036] In an optional embodiment, the solder tape processing device includes a first working state and a second working state. In the first working state, the first traction mechanism 3 clamps the solder tape at the cutting mechanism 2 and transfers it to the transfer station 6. The second traction mechanism 4 moves from the workbench 5 to the transfer station 6. The cutting mechanism 2 cuts the solder tape. The first traction mechanism 3 transfers the solder tape segment cut by the cutting mechanism 2 to the second traction mechanism 4. In the second working state, the first traction mechanism 3 returns to the cutting mechanism 2 to clamp the solder tape, and the second traction mechanism 4 transfers the clamped solder tape segment to the workbench 5.

[0037] Further explanation, the solder tape processing device includes a first working state and a second working state.

[0038] The first working state is that the first traction mechanism 3 clamps the end of the solder tape at the cutting mechanism 2 and moves it to the transfer station 6. At the same time, the second traction mechanism 4 moves from the workbench 5 to the transfer station 6. The flattening mechanism 1 and the first traction mechanism 3 tighten the solder tape to facilitate the cutting mechanism 2 to cut the solder tape. The first traction mechanism 3 then clamps a fixed-length solder tape segment, and the end of the solder tape is located at the cutting mechanism 2. The first traction mechanism 3 transfers the solder tape segment to the second traction mechanism 4.

[0039] The second working state is that the first traction mechanism 3 returns from the transfer station 6 to the cutter mechanism 2 to clamp the end of the welding tape again. At the same time, the second traction mechanism 4 moves from the transfer station 6 to the workbench 5 to place the welding tape section on the workbench 5 for standby.

[0040] The welding tape processing device repeats the first working state and the second working state. The first traction mechanism 3 and the second traction mechanism 4 can work simultaneously, avoiding the waiting time of the first traction mechanism 3 and the second traction mechanism 4, thereby improving the working efficiency of the welding tape processing device.

[0041] In an alternative embodiment, the first traction mechanism 3 includes a first driving assembly 31 and a first clamping assembly 32. The first clamping assembly 32 is connected to the driving end of the first driving assembly 31. The first driving assembly 31 can drive the first clamping assembly 32 to reciprocate between the cutter mechanism 2 and the transfer station 6.

[0042] As Figure 1 shown, the first traction mechanism 3 includes a first driving assembly 31 and a first clamping assembly 32. The first clamping assembly 32 is connected to the driving end of the first driving assembly 31. The first driving assembly 31 can drive the first clamping assembly 32 to reciprocate between the cutter mechanism 2 and the transfer station 6; the first clamping assembly 32 is used to clamp or release the end of the welding tape; when the first traction mechanism 3 needs to stretch the welding tape from the cutter mechanism 2, the first clamping assembly 32 clamps the end of the welding tape, and the first driving assembly 31 drives the first clamping assembly 32 to move from the cutter mechanism 2 to the transfer station 6; when the first traction mechanism 3 needs to transfer the cut welding tape section to the second traction mechanism 4, the first clamping assembly 32 will release the end of the welding tape to facilitate the second traction mechanism 4 to transfer the welding tape section to the workbench 5.

[0043] Among them, the first driving assembly 31 can adopt a linear motor, a hydraulic cylinder or a pneumatic cylinder.

[0044] In an alternative embodiment, the first traction mechanism 3 further includes a first carrier plate 33. The first carrier plate 33 is arranged on the side of the first clamping assembly 32 close to the second traction mechanism 4. The first carrier plate 33 is used to carry the welding tape clamped by the first clamping assembly 32, and when the first clamping assembly 32 clamps and moves the welding tape, it can prevent the welding tape from bending.

[0045] In an alternative embodiment, the second traction mechanism 4 includes a second driving assembly 41 and a second clamping assembly 42. The second clamping assembly 42 is connected to the driving end of the second driving assembly 41. The second driving assembly 41 can drive the second clamping assembly 42 to reciprocate between the workbench 5 and the transfer station 6.

[0046] AsFigure 1 As shown, the second traction mechanism 4 includes a second drive assembly 41 and a second clamping assembly 42. The second clamping assembly 42 is connected to the drive end of the second drive assembly 41. The second drive assembly 41 can drive the second clamping assembly 42 to reciprocate between the transfer station 6 and the workbench 5. The second clamping assembly 42 is used to clamp or release the solder tape segment. When the second traction mechanism 4 needs to stretch the solder tape segment from the first traction mechanism 3, the second clamping assembly 42 will clamp the solder tape segment, and the second drive assembly 41 drives the second clamping assembly 42 to move from the transfer station 6 to the workbench 5. When the second traction mechanism 4 needs to place the solder tape segment on the workbench 5, the second clamping assembly 42 releases the solder tape segment, thereby placing the solder tape segment on the workbench 5.

[0047] Among them, the second drive assembly 41 can adopt a linear motor, a hydraulic cylinder or a cylinder.

[0048] In an optional implementation manner, the second traction mechanism 4 further includes a second carrier plate 43, and the second carrier plate 43 is arranged on the side of the second clamping assembly 42 close to the first traction mechanism 3. The second carrier plate 43 is used to carry the solder tape segment clamped by the second clamping assembly 42. When the second clamping assembly 42 clamps and moves the solder tape segment, it can avoid bending of the solder tape segment.

[0049] In an optional implementation manner, the cutting mechanism 2 includes a third drive assembly and a cutting tool assembly. The cutting tool assembly is connected to the drive end of the third drive assembly, and the third drive assembly can drive the cutting tool assembly to move along the length direction of the solder tape.

[0050] Further explanation, the cutting mechanism 2 includes a third drive assembly and a cutting tool assembly. The cutting tool assembly is connected to the drive end of the third drive assembly, and the third drive assembly can drive the cutting tool assembly to move along the length direction of the solder tape. That is to say, the third drive assembly can drive the cutting tool assembly to approach or move away from the flattening mechanism 1.

[0051] Specifically, the cutting tool assembly is used to cut the solder tape. After the cutting tool assembly cuts the solder tape, the exposed part of the end of the solder tape at the cutting tool assembly is less, which is not conducive to the first traction mechanism 3 clamping the end of the solder tape at the cutting tool assembly. Therefore, after the cutting tool assembly cuts the solder tape, the third drive assembly drives the cutting tool assembly to move towards the direction close to the flattening mechanism 1, so that the end of the solder tape is exposed from the cutting tool assembly, so as to facilitate the first traction mechanism 3 clamping the end of the solder tape at the cutting mechanism 2.

[0052] Among them, the third drive assembly can adopt a linear motor, a hydraulic cylinder or a cylinder.

[0053] In an alternative embodiment, the solder tape processing device further includes a tail clamp mechanism 7, which is arranged on one side of the workbench 5 close to the transfer station 6.

[0054] As Figure 1 shown, the solder tape processing device further includes a tail clamp mechanism 7, which is arranged between the transfer station 6 and the workbench 5 and is close to the workbench 5. When the second traction mechanism 4 places a solder tape segment on the workbench 5, the tail clamp mechanism 7 will cooperate with the second traction mechanism 4 to position and tension the solder tape segment to ensure that the placement of the solder tape segment is at a preset position.

[0055] According to the second aspect of the embodiments of the present application, a string welding machine is provided, which includes the above-mentioned solder tape processing device.

[0056] Although some specific embodiments of the present application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and not for limiting the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A solder tape processing device, characterized in that, Comprising: A flattening mechanism (1) for pressing the solder tape and processing the solder tape into a preset shape; A cutting mechanism (2) provided downstream of the flattening mechanism (1) for cutting the solder tape; A first traction mechanism (3) and a second traction mechanism (4) successively provided downstream of the cutting mechanism (2); A transfer station (6) and a workbench (5), the transfer station (6) being located between the first traction mechanism (3) and the second traction mechanism (4), the workbench (5) being located downstream of the transfer station (6), the first traction mechanism (3) being capable of reciprocating between the cutting mechanism (2) and the transfer station (6), the second traction mechanism (4) being capable of reciprocating between the transfer station (6) and the workbench (5), and at the transfer station (6), the first traction mechanism (3) being capable of transferring the clamped solder tape to the second traction mechanism (4).

2. The solder tape processing device according to claim 1, wherein The solder tape processing device includes a first working state. In the first working state, the first traction mechanism (3) clamps the solder tape at the cutting mechanism (2) and transfers it to the transfer station (6), the second traction mechanism (4) moves to the transfer station (6) at the workbench (5), the cutting mechanism (2) cuts the solder tape, and the first traction mechanism (3) transfers the solder tape segment cut by the cutting mechanism (2) to the second traction mechanism (4).

3. The solder ribbon processing device according to claim 2, characterized in that The solder tape processing device further includes a second working state. In the second working state, the first traction mechanism (3) returns to the cutting mechanism (2) to clamp the solder tape, and the second traction mechanism (4) transfers the clamped solder tape segment to the workbench (5).

4. The solder strip processing device according to claim 1, wherein The first traction mechanism (3) includes a first driving component (31) and a first clamping component (32), the first clamping component (32) being connected to the driving end of the first driving component (31), and the first driving component (31) being capable of driving the first clamping component (32) to reciprocate between the cutting mechanism (2) and the transfer station (6).

5. The solder strip processing device according to claim 4, wherein The first traction mechanism (3) further includes a first bearing plate (33) provided on the side of the first clamping component (32) close to the second traction mechanism (4).

6. The solder tape processing device according to claim 1, wherein The second traction mechanism (4) includes a second driving component (41) and a second clamping component (42), the second clamping component (42) being connected to the driving end of the second driving component (41), and the second driving component (41) being capable of driving the second clamping component (42) to reciprocate between the workbench (5) and the transfer station (6).

7. The solder strip processing device according to claim 6, wherein The second traction mechanism (4) further includes a second bearing plate (43) provided on the side of the second clamping component (42) close to the first traction mechanism (3).

8. The solder strip processing device according to claim 1, characterized in that, The cutter mechanism (2) includes a third driving assembly and a cutter assembly. The cutter assembly is connected to the driving end of the third driving assembly, and the third driving assembly can drive the cutter assembly to move along the length direction of the solder tape.

9. The solder strip processing device according to claim 1, characterized in that, The solder tape processing device further includes a tail clamp mechanism (7), and the tail clamp mechanism (7) is arranged on one side of the workbench (5) close to the transfer station (6).

10. A string welding machine, characterized in that, It includes the solder tape processing device according to any one of claims 1-9.

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