Accurate grinding assembly and high-precision silicon wafer grinding machine

Abstract

The utility model relates to the technical field of grinding equipment, and discloses a precise grinding assembly and a high-precision silicon wafer grinder, the precise grinding assembly comprises a lower grinding mechanism, an upper grinding mechanism and a supporting mechanism, the upper grinding mechanism is arranged above the lower grinding mechanism, and both the lower grinding mechanism and the upper grinding mechanism are arranged on the supporting mechanism. The lower grinding mechanism comprises a lower grinding disc, the middle of the lower grinding disc is meshed with a rotating gear, the upper grinding mechanism comprises an upper grinding disc connected to the surface of a positioning column in a sleeving mode, a fixing disc is arranged above the upper grinding disc, the supporting mechanism comprises a grinding table, and a fixing support is fixedly installed at the top of the grinding table. The lower grinding disc is rotationally connected to the top of the grinding table and below the fixing support. According to the precise grinding assembly and the high-precision silicon wafer grinding machine, the upper grinding disc and the lower grinding disc are conveniently positioned, meanwhile, grinding liquid is conveniently added, the grinding efficiency and quality are improved, and a user can conveniently use the precise grinding assembly and the high-precision silicon wafer grinding machine.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding equipment, in particular to a precise grinding assembly and a high-precision silicon wafer grinding machine. Background Technique

[0002] A silicon wafer grinding machine is a device specifically used for semiconductor material processing, mainly used for surface grinding of silicon wafers. It grinds the silicon wafers evenly and meticulously through high-speed rotating upper and lower grinding discs, cooperating with a precise control system, to remove unevenness, oxide layers or other impurities on the surface of the silicon wafers, improve the surface quality and smoothness of the silicon wafers. The silicon wafer grinding machine is widely used in fields such as semiconductor manufacturing and integrated circuit production, and is an essential tool for manufacturing high-precision and high-quality silicon wafers. Through the grinding process, the performance of the silicon wafers can be significantly improved, laying a solid foundation for subsequent processing and manufacturing.

[0003] At present, during the grinding process of some high-precision silicon wafer grinding machines on the market, due to the inaccurate positioning between the lower grinding disc and the upper grinding disc, deviation may occur during the grinding of silicon wafers, affecting the grinding accuracy and product quality. Moreover, there may be uneven problems in the addition of grinding fluid in some grinding machines, resulting in uneven distribution of the grinding fluid in the grinding area, affecting the lubrication and cooling effects during the grinding process, and reducing the grinding efficiency and quality. Therefore, a precise grinding assembly and a high-precision silicon wafer grinding machine are proposed to solve the above problems. Summary of the Utility Model

[0004] (1) Technical Problems to be Solved

[0005] Aiming at the deficiencies of the prior art, the utility model provides a precise grinding assembly and a high-precision silicon wafer grinding machine, which have the advantages of convenient addition of grinding fluid, etc., and solve the problems that during the grinding process of some high-precision silicon wafer grinding machines on the market, due to the inaccurate positioning between the lower grinding disc and the upper grinding disc, deviation may occur during the grinding of silicon wafers, affecting the grinding accuracy and product quality, and there may be uneven problems in the addition of grinding fluid in some grinding machines, resulting in uneven distribution of the grinding fluid in the grinding area, affecting the lubrication and cooling effects during the grinding process, and reducing the grinding efficiency and quality.

[0006] (2) Technical Solutions

[0007] To achieve the purpose of convenient addition of grinding fluid, the utility model provides the following technical solutions:

[0008] On the one hand, the utility model provides a precise grinding assembly, including a lower grinding mechanism and an upper grinding mechanism, and the upper grinding mechanism is arranged above the lower grinding mechanism;

[0009] The lower grinding mechanism includes a lower grinding disc, a rotating gear is meshed in the middle of the lower grinding disc, and a positioning column is fixedly installed at the top of the rotating gear;

[0010] The upper grinding mechanism includes an upper grinding disc sleeved on the surface of the positioning column. A fixed disc is arranged above the upper grinding disc. Four fixed columns are fixedly installed between the middle of the bottom of the fixed disc and the top of the upper grinding disc. A rotating rod is fixedly installed in the middle of the top of the fixed column.

[0011] As a preferred technical solution of the present invention, a first rotating motor is arranged at the bottom of the lower grinding disc, and the bottom of the rotating gear is fixedly installed on the output shaft at the top of the first rotating motor.

[0012] As a preferred technical solution of the present invention, a plurality of grinding liquid pipes are fixedly installed between the outer edge of the top of the upper grinding disc and the bottom of the fixed disc. A liquid adding groove is formed in a circle on the outer edge of the top of the fixed disc, and the grinding liquid pipes are all communicated with the liquid adding groove.

[0013] As a preferred technical solution of the present invention, a fixed sleeve is sleeved on one end of the outer wall of the rotating rod close to the fixed disc. A cross bracket is fixedly installed at the bottom of the fixed sleeve. Fixing holes are formed on the surfaces of the cross brackets far away from the fixed sleeve. The four fixing holes are above the liquid adding groove, and fixing rods are fixedly installed on the left and right outer walls of the fixed sleeve.

[0014] Another aspect of the present invention provides a high-precision silicon wafer grinding machine, which includes a precise grinding component in the above-mentioned one aspect, and further includes a supporting mechanism. The lower grinding mechanism and the upper grinding mechanism are both arranged on the supporting mechanism;

[0015] The supporting mechanism includes a grinding table. A fixed bracket is fixedly installed on the top of the grinding table. The lower grinding disc is rotatably connected below the fixed bracket on the top of the grinding table. A second rotating motor is fixedly installed at the bottom of the fixed bracket. The output shaft at the bottom of the second rotating motor is connected to the rotating rod. The top of the two fixing rods is fixedly installed on the fixed bracket.

[0016] As a preferred technical solution of the present invention, a connecting column is fixedly installed on the left side of the top of the grinding table, and a control panel is rotatably connected to the top of the connecting column.

[0017] As a preferred technical solution of the present invention, a feeding tank is fixedly installed between the fixed bracket and the control panel. An infusion pipe is arranged at the top of the feeding tank. One end of the infusion pipe away from the feeding tank is clamped in the fixing hole on the cross bracket.

[0018] (III) Beneficial effects

[0019] Compared with the prior art, the utility model provides a precise grinding assembly and a high-precision silicon wafer grinding machine, which have the following beneficial effects:

[0020] With the precise grinding assembly and the high-precision silicon wafer grinding machine, precise positioning and stable grinding during silicon wafer grinding are achieved by setting a lower grinding disc, a rotating gear, a positioning column, an upper grinding disc, a fixed disc, a fixed column, a rotating rod, etc. The upper grinding disc is sleeved on the positioning column, ensuring the centering between the upper and lower grinding discs and improving the grinding precision. Then, by fixedly installing a grinding fluid pipe between the outer edge of the top of the upper grinding disc and the bottom of the fixed disc and opening a liquid adding groove on the outer edge of the top of the fixed disc, uniform addition of the grinding fluid is realized. The grinding fluid flows into the liquid adding groove through the grinding fluid pipe and is evenly distributed to the grinding area by the liquid adding, ensuring the lubrication and cooling effects during the grinding process, and improving the grinding efficiency and quality. By sleeving a fixed sleeve on the outer wall of the rotating rod and installing a cross support at the bottom of the fixed sleeve, and cooperating with a feeding tank and an infusion pipe, the flexibility of grinding fluid addition is realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the high-precision silicon wafer grinding machine in the utility model;

[0022] Figure 2 It is a schematic diagram of the precise grinding assembly in the utility model;

[0023] Figure 3 It is a schematic diagram of the lower grinding mechanism in the utility model;

[0024] Figure 4 It is a schematic diagram of the upper grinding mechanism in the utility model.

[0025] In the figure: 1, lower grinding disc; 2, rotating gear; 3, positioning column; 4, upper grinding disc; 5, fixed disc; 6, fixed column; 7, rotating rod; 8, first rotating motor; 9, grinding fluid pipe; 10, liquid adding groove; 11, fixed sleeve; 12, cross support; 13, fixed rod; 14, grinding table; 15, fixed support; 16, second rotating motor; 17, control panel; 18, feeding tank; 19, infusion pipe. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] Next, the technical solutions in the embodiments of the utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the utility model. Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the utility model.

[0027] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0028] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0029] Please refer to Figures 1-4 , a precise grinding assembly and a high-precision silicon wafer grinding machine, including a lower grinding mechanism, an upper grinding mechanism, and a support mechanism. The upper grinding mechanism is arranged above the lower grinding mechanism, and both the lower grinding mechanism and the upper grinding mechanism are arranged on the support mechanism.

[0030] Embodiment 1

[0031] The lower grinding mechanism includes a lower grinding disc 1. A rotating gear 2 is meshed in the middle of the lower grinding disc 1. A positioning column 3 is fixedly installed at the top of the rotating gear 2. The upper grinding mechanism includes an upper grinding disc 4 sleeved on the surface of the positioning column 3. A fixed disc 5 is arranged above the upper grinding disc 4. Four fixed columns 6 are fixedly installed between the middle of the bottom of the fixed disc 5 and the top of the upper grinding disc 4. A rotating rod 7 is fixedly installed in the middle of the top of the fixed columns 6.

[0032] It should be noted that the lower grinding disc 1 serves as the main working surface for grinding the silicon wafer and jointly forms a grinding area with the upper grinding disc 4. The rotating gear 2 drives the lower grinding disc 1 to rotate to realize the grinding action of the silicon wafer. The positioning column 3 is used for the positioning and installation of the upper grinding disc 4 to ensure the centering and stability between the upper and lower grinding discs. The upper grinding disc 4 cooperates with the lower grinding disc 1 to form a grinding area for grinding the silicon wafer. The fixed disc 5 fixes the upper grinding disc 4 and the grinding liquid pipe 9, and at the same time provides the installation position of the liquid adding groove 10. The fixed columns 6 connect the fixed disc 5 and the upper grinding disc 4 to maintain the stable relationship between the two. The rotating rod 7 drives the fixed disc 5 and the upper grinding disc 4 to rotate through the second rotating motor 16 to realize the all-round grinding of the silicon wafer.

[0033] In this embodiment, a first rotating motor 8 is arranged at the bottom of the lower grinding disc 1, and the bottom of the rotating gear 2 is fixedly installed on the top output shaft of the first rotating motor 8.

[0034] It should be noted that the first rotating motor 8 provides power for the rotating gear 2 to drive the lower grinding disc 1 to rotate, so as to provide stable power output, ensure the rotation speed and stability of the lower grinding disc 1, and meet the grinding requirements.

[0035] In this embodiment, a plurality of grinding fluid pipes 9 are fixedly installed between the outer edge of the top of the upper grinding disc 4 and the bottom of the fixed disc 5. A liquid adding groove 10 is formed in the outer edge of the top of the fixed disc 5, and the grinding fluid pipes 9 are all communicated with the liquid adding groove 10.

[0036] It should be noted that the grinding fluid pipes 9 transport the grinding fluid from the liquid adding groove 10 to the grinding area, provide lubrication and cooling for the grinding process, ensure that the grinding fluid can be evenly distributed in the grinding area, improve the grinding efficiency and quality, and at the same time reduce the thermal damage of the silicon wafer during the grinding process. The liquid adding groove 10 stores the grinding fluid and transports the grinding fluid to the grinding area through the grinding fluid pipes 9 to ensure the continuous supply and even distribution of the grinding fluid during the grinding process.

[0037] In this embodiment, a fixing sleeve 11 is sleeved on the outer wall of the rotating rod 7 near one end of the fixed disc 5. A cross bracket 12 is fixedly installed at the bottom of the fixing sleeve 11. Fixing holes are formed on the surfaces of the cross bracket 12 away from the fixing sleeve 11. The four fixing holes are above the liquid adding groove 10. Fixing rods 13 are fixedly installed on the left and right outer walls of the fixing sleeve 11.

[0038] It should be noted that the fixing sleeve 11 and the cross bracket 12 are used to fix the infusion pipe 19 to achieve the dynamic addition of the grinding fluid. The fixing rods 13 fix the fixing sleeve 11 and the cross bracket 12 on the fixing bracket 15 to maintain their stability.

[0039] Embodiment 2

[0040] On the basis of the above embodiment, the support mechanism includes a grinding table 14. A fixing bracket 15 is fixedly installed on the top of the grinding table 14. The lower grinding disc 1 is rotatably connected below the fixing bracket 15 on the top of the grinding table 14. A second rotating motor 16 is fixedly installed at the bottom of the fixing bracket 15. The output shaft at the bottom of the second rotating motor 16 is connected to the rotating rod 7. The tops of the two fixing rods 13 are both fixedly installed on the fixing bracket 15.

[0041] It should be noted that the grinding table 14 provides stable basic support for the entire grinding system to ensure the stability of the grinding process. The fixing bracket 15 is used to fix and support the main components of the grinding machine, such as the lower grinding disc 1, the rotating rod 7, the feeding tank 18, etc. The second rotating motor 16 provides power for the rotating rod 7 to drive the rotation of the upper grinding disc 4.

[0042] In this embodiment, a connecting column is fixedly installed on the left side of the top of the grinding table 14. A control panel 17 is rotatably connected to the top of the connecting column.

[0043] It should be noted that the control panel 17, as the operation and control center of the grinding machine, is responsible for receiving and sending control instructions and monitoring the operating status of the grinding machine.

[0044] In this embodiment, a feeding tank 18 is fixedly installed between the fixed bracket 15 and the control panel 17. A liquid infusion pipe 19 is provided at the top of the feeding tank 18, and one end of the liquid infusion pipe 19 away from the feeding tank 18 is clamped in a fixing hole on the cross bracket 12.

[0045] It should be noted that the feeding tank 18 stores the grinding liquid and provides the grinding liquid supply for the grinding process. The liquid infusion pipe 19 transports the grinding liquid in the feeding tank 18 to the grinding area.

[0046] Working principle: The bottom of the rotating gear 2 is fixedly installed on the output shaft of the top of the first rotating motor 8. The first rotating motor 8 provides power for the rotating gear 2 to drive the lower grinding disc 1 to rotate, realizing the grinding action of the silicon wafer. The upper grinding disc 4 cooperates with the lower grinding disc 1 to form a grinding area for grinding the silicon wafer. The fixing disc 5 is fixed above the upper grinding disc 4, and four fixing columns 6 are fixedly installed between the middle of the bottom and the top of the upper grinding disc 4 to maintain a stable relationship between the two. The rotating rod 7 is fixed in the middle of the top of the fixing disc 5 through the fixing column 6 and is driven to rotate by the second rotating motor 16 to realize the all-round grinding of the silicon wafer. A plurality of grinding liquid pipes 9 are fixedly installed between the outer edge of the top of the upper grinding disc 4 and the bottom of the fixing disc 5. The grinding liquid pipes 9 are all communicated with the liquid adding groove 10. The grinding liquid flows into the liquid adding groove 10 through the grinding liquid pipes 9 and is evenly distributed to the grinding area by the liquid adding groove 10 to provide lubrication and cooling for the grinding process. The second rotating motor 16 is installed at the bottom of the fixed bracket 15, and its output shaft is connected to the rotating rod 7 to provide power for the rotating rod 7, thereby driving the rotation of the upper grinding disc 4. The liquid infusion pipe 19 transports the grinding liquid in the feeding tank 18 to the grinding area, and one end of the liquid infusion pipe 19 away from the feeding tank 18 is clamped in a fixing hole on the cross bracket 12 to realize the dynamic addition of the grinding liquid. The control panel 17, as the operation and control center of the grinding machine, is responsible for receiving and sending control instructions and monitoring the operating status of the grinding machine, such as the grinding speed, the addition amount of the grinding liquid, etc.

[0047] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A precise grinding assembly, comprising a lower grinding mechanism and an upper grinding mechanism, wherein the upper grinding mechanism is arranged above the lower grinding mechanism; It is characterized in that: The lower grinding mechanism includes a lower grinding disc, a rotating gear is meshed in the middle of the lower grinding disc, and a positioning column is fixedly installed at the top of the rotating gear; The upper grinding mechanism includes an upper grinding disc sleeved on the surface of the positioning column, a fixed disc is arranged above the upper grinding disc, four fixed columns are fixedly installed between the middle of the bottom of the fixed disc and the top of the upper grinding disc, and a rotating rod is fixedly installed in the middle of the top of the fixed column.

2. The precision grinding assembly according to claim 1, wherein: A first rotating motor is arranged at the bottom of the lower grinding disc, and the bottom of the rotating gear is fixedly installed on the top output shaft of the first rotating motor.

3. The precise grinding assembly according to claim 1, wherein: A plurality of grinding liquid pipes are fixedly installed between the outer edge of the top of the upper grinding disc and the bottom of the fixed disc, a liquid adding groove is formed in a circle on the outer edge of the top of the fixed disc, and the grinding liquid pipes are all communicated with the liquid adding groove.

4. The precise grinding assembly according to claim 3, wherein: A fixed sleeve is sleeved at one end of the outer wall of the rotating rod close to the fixed disc, a cross bracket is fixedly installed at the bottom of the fixed sleeve, fixing holes are formed at one ends of the surface of the cross bracket far from the fixed sleeve, the four fixing holes are above the liquid adding groove, and fixing rods are fixedly installed on the left and right outer walls of the fixed sleeve.

5. A high-precision silicon wafer grinding machine, comprising a precise grinding assembly according to any one of claims 1-4; Characterized in that: The high-precision silicon wafer grinding machine includes a support mechanism, and both the lower grinding mechanism and the upper grinding mechanism are arranged on the support mechanism; The support mechanism includes a grinding table, a fixed bracket is fixedly installed on the top of the grinding table, the lower grinding disc is rotatably connected below the fixed bracket on the top of the grinding table, a second rotating motor is fixedly installed at the bottom of the fixed bracket, the bottom output shaft of the second rotating motor is connected to the rotating rod, and the tops of the two fixing rods are both fixedly installed on the fixed bracket.

6. The high-precision silicon wafer grinding machine according to claim 5, wherein: A connecting column is fixedly installed on the left side of the top of the grinding table, and a control panel is rotatably connected to the top of the connecting column.

7. The high-precision silicon wafer grinding machine according to claim 6, characterized in that: A feeding tank is fixedly installed between the fixed bracket and the control panel, an infusion pipe is arranged at the top of the feeding tank, and the end of the infusion pipe far from the feeding tank is clamped in the fixing hole on the cross bracket.

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