Automatic feeding CCD (Charge Coupled Device) detecting and packaging device

Abstract

The utility model relates to an automatic feeding CCD (Charge Coupled Device) detection packaging device which comprises a bottom plate, a first detection station, a transfer station and a second detection station, wherein the first detection station, the transfer station and the second detection station are arranged on the bottom plate; the feeding conveying mechanism and the feeding station are arranged on the feeding conveying mechanism; the carrying mechanism comprises a first suction rod assembly, a second suction rod assembly, a third suction rod assembly and a fourth suction rod assembly; the detection mechanism comprises a first CCD assembly used for detecting the first detection station, and a second CCD assembly and a third CCD assembly which are used for detecting the second detection station; the packaging and discharging mechanism and a discharging station on the packaging and discharging mechanism are used for packaging and discharging; the carrying mechanism is further used for driving the first suction rod assembly, the second suction rod assembly, the third suction rod assembly and the fourth suction rod assembly to be switched among the feeding station, the first detection station, the transfer station, the second detection station and the discharging station. According to the full-automatic full-automatic packaging machine, automatic conveying, feeding, omni-directional CCD detection, automatic packaging and discharging can be achieved, labor is saved, and production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor component inspection and manufacturing equipment, in particular to an automatic loading CCD detection and packaging device. Background Art

[0002] During the use of semiconductor components, strict testing and packaging are required. Traditionally, manual visual inspection and manual packaging are used. The efficiency of this manual visual inspection is low, resulting in low production efficiency. At the same time, the labor intensity of personnel is high, and the recognition error is large, resulting in a relatively high defective rate of semiconductor components and increasing the production cost. To improve the detection efficiency, improve the comprehensiveness of detection, and reduce the equipment cost, it is necessary to design a device with a streamlined structure and full automation. Summary of the Utility Model

[0003] To solve the above technical problems, the utility model provides an automatic loading CCD detection and packaging device, which has automatic conveying and automatic loading. During the loading process, multi-angle and all-round CCD vision detection is carried out simultaneously. After the detection is completed, automatic packaging and discharging are carried out. The whole process is automated, saving labor and improving production efficiency, and can be directly and automatically docked with the production line.

[0004] The technical solution adopted by the utility model to solve its technical problems is: an automatic loading CCD detection and packaging device, including: a bottom plate, on which a first detection station, a transfer station, and a second detection station are evenly distributed in sequence in the left-right direction;

[0005] A loading conveying mechanism, installed in the left region of the bottom plate, and a loading station is arranged at the end of its conveying direction;

[0006] A handling mechanism, installed on the bottom plate and located to the right of the loading conveying mechanism; the handling mechanism includes a fixed frame, a left-right moving component installed on the fixed frame, an up-down moving component installed on the moving end of the left-right moving component, and a handling mounting plate installed on the moving end of the up-down moving component; four suction rod components are evenly installed along the left-right direction on the rear side of the handling mounting plate, namely a first suction rod component, a first suction rod component, a third suction rod component, and a fourth suction rod component;

[0007] A detection mechanism, including a CCD component installed on the bottom plate; the CCD component has three groups, including a first CCD component located in front of the first detection station for detecting semiconductor components at the first detection station, a second CCD component located in front of the second detection station for detecting semiconductor components at the second detection station, and a third CCD component located behind the second detection station for detecting semiconductor components at the second detection station;

[0008] The packaging and blanking mechanism is installed in the right area of the bottom plate and includes a blanking conveyor mechanism; the blanking conveyor mechanism is provided with a blanking station; the packaging and blanking mechanism further includes a packaging mechanism for packaging semiconductor components on the blanking conveyor mechanism.

[0009] The handling mechanism is used to drive the first suction rod assembly to switch between the loading station and the first inspection station, and is also used to drive the second suction rod assembly to switch between the first inspection station and the transfer station, and is also used to drive the third suction rod assembly to switch between the transfer station and the second inspection station, and is also used to drive the fourth suction rod assembly to switch between the second inspection station and the blanking station.

[0010] Further, the suction rod assembly includes a suction rod mounting block fixed to the handling mounting plate and a suction rod inserted into the bottom side of the suction rod mounting block; the outer wall of the bottom side of the suction rod is square; the handling mechanism further includes a rotating guide plate hinged to the fixed frame; the rotating guide plate has a degree of freedom of rotation in the horizontal direction, and the end of the rotating guide plate away from the hinge is further formed with a U-shaped groove, which is matched with the square outer wall of the suction rod of the third suction rod assembly, and is used to make the suction rod of the third suction rod assembly rotate under the guiding action of the U-shaped groove when switching between the transfer station and the second inspection station, so that the semiconductor component rotates to a set angle when being transferred from the transfer station to the second inspection station.

[0011] Further, on the bottom plate, loading platforms are respectively fixed at the first inspection station, the transfer station, and the second inspection station; the loading platform includes a support column and a fixture installed on the top side of the support column; the fixture is used to hold semiconductor components.

[0012] Further, the inspection mechanism further includes a light source assembly installed on the bottom plate; there are three groups of the light source assemblies, including a first light source assembly located between the first inspection station and the first CCD assembly, a second light source assembly located between the second inspection station and the first CCD assembly, and a third light source assembly located between the second inspection station and the third CCD assembly.

[0013] Further, the CCD assembly includes a CCD mounting base installed on the bottom plate, a CCD support installed on the CCD mounting base, and a CCD camera fixed to the CCD support; the light source assembly includes a light source support installed on the bottom plate and a light source fixed to the light source support.

[0014] Further, the loading conveyor mechanism includes a conveyor belt, a baffle block is installed at the end of the conveyor belt, and the left side of the baffle block forms the loading station; guide strips are respectively arranged on the front and rear sides of the conveying surface of the conveyor belt.

[0015] Further, the left - right moving component includes a first mounting plate installed on the fixed frame, a horizontal slide rail installed on the first mounting plate, and a horizontal slider assembled with the horizontal slide rail and serving as the moving end of the left - right moving component; the left - right moving component further includes a horizontal air cylinder installed on the first mounting plate, and the horizontal air cylinder is used to drive the entire up - down moving component to move left and right along the horizontal slide rail.

[0016] Further, the up - down moving component includes a second mounting plate installed on the moving end of the left - right moving component, a vertical slide rail installed on the second mounting plate, and a vertical slider assembled with the vertical slide rail and serving as the moving end of the up - down moving component; the up - down moving component further includes a lifting air cylinder installed on the second mounting plate, and the lifting air cylinder is used to drive the entire handling mounting plate to move up and down along the vertical slide rail.

[0017] Further, the blanking conveying mechanism includes a conveying belt; the packaging and blanking mechanism further includes a packaging belt mechanism installed on the bottom plate and located at the rear position above the conveying belt, a packaging belt collecting mechanism installed on the bottom plate and located at the front position above the conveying belt, and a guiding plate installed on the top side of the conveying belt; the packaging belt mechanism is used to supply the packaging belt; the packaging belt collecting mechanism is used to wind up the packaging belt; the guiding plate is used to guide the packaging belt of the packaging belt mechanism from the rear end of the guiding plate to the lower part of the guiding plate, and then from the front end of the guiding plate to the packaging belt collecting mechanism; the packaging and blanking mechanism further includes a roller assembly, and the roller assembly is used to slightly roll - press the packaging belt and the semiconductor components to make them fit tightly.

[0018] Further, an NG conveying mechanism is also provided at the blanking station; the NG conveying mechanism includes a loading groove and an NG conveying air cylinder for controlling the movement of the loading groove; the moving direction of the loading groove is perpendicular to the conveying direction of the blanking conveying mechanism; the NG conveying air cylinder is used to drive the loading groove to extend into or out of the blanking station.

[0019] The beneficial effects of the present utility model: An automatic feeding CCD detection and packaging device of the present utility model realizes automatic conveying and automatic feeding. During the feeding process, multi - angle and all - round CCD vision detection is carried out simultaneously. After the detection is completed, it automatically packages and blanks. The whole process is automated, saving labor and improving production efficiency, and can be directly and automatically docked with the production line. Description of the Drawings

[0020] Figure 1 A three - dimensional schematic diagram of an automatic feeding CCD detection and packaging device for an embodiment;

[0021] Figure 2 A top - view schematic diagram of an automatic feeding CCD detection and packaging device for an embodiment;

[0022] Figure 3Schematic three-dimensional view of the handling mechanism and the inspection mechanism of an automatic loading CCD inspection and packaging device according to an embodiment;

[0023] Figure 4 Schematic top view of the handling mechanism and the inspection mechanism of an automatic loading CCD inspection and packaging device according to an embodiment;

[0024] Figure 5 Schematic rear view of the handling mechanism of an automatic loading CCD inspection and packaging device according to an embodiment;

[0025] Figure 6 Schematic three-dimensional view of the suction rod assembly of an automatic loading CCD inspection and packaging device according to an embodiment;

[0026] Figure 7 Schematic three-dimensional view of the rotating guide plate of an automatic loading CCD inspection and packaging device according to an embodiment;

[0027] Figure 8 Schematic three-dimensional view of the CCD assembly of an automatic loading CCD inspection and packaging device according to an embodiment;

[0028] Figure 9 Schematic three-dimensional view of the light source assembly of an automatic loading CCD inspection and packaging device according to an embodiment;

[0029] Figure 10 Schematic three-dimensional view of the carrier table of an automatic loading CCD inspection and packaging device according to an embodiment;

[0030] Figure 11 Schematic three-dimensional view of the unloading conveying mechanism, the guide plate, and the NG conveying mechanism of an automatic loading CCD inspection and packaging device according to an embodiment;

[0031] Among them, 1 - bottom plate, 2 - feeding conveyor mechanism, 3 - handling mechanism, 4 - detection mechanism, 5 - packaging and discharging mechanism, 6 - NG conveyor mechanism, 11 - first detection station, 12 - transfer station, 13 - second detection station, 14 - carrier, 141 - pillar, 142 - fixture, 21 - conveyor belt, 22 - feeding station, 211 - stop block, 212 - guiding strip, 31 - fixing frame, 32 - left - right moving assembly, 33 - up - down moving assembly, 34 - handling mounting plate, 35 - suction rod assembly, 36 - rotating guiding plate, 35a - first suction rod assembly, 35b - second suction rod assembly, 35c - third suction rod assembly, 35d - fourth suction rod assembly, 321 - first mounting plate, 322 - horizontal slide rail, 323 - horizontal slider, 324 - horizontal cylinder, 331 - second mounting plate, 332 - vertical slide rail, 333 - vertical slider, 334 - lifting cylinder, 351 - suction rod, 352 - suction rod mounting block, 361 - U - shaped groove, 41 - CCD assembly, 42 - light source assembly, 41A - first CCD assembly, 41B - second CCD assembly, 41C - third CCD assembly, 42A - first light source assembly, 42B - second light source assembly, 42C - third light source assembly, 411 - CCD camera, 412 - CCD mounting base, 413 - CCD support, 421 - light source, 422 - light source support, 51 - discharging conveyor mechanism, 52 - material bag mechanism, 53 - bag collecting mechanism, 54 - guiding plate, 55 - roller assembly, 56 - discharging station, 511 - conveying tape, 61 - loading groove, 62 - NG conveying cylinder. Detailed implementation manners

[0032] To deepen the understanding of the present utility model, the following will further describe the present utility model in detail in conjunction with the drawings and embodiments. The embodiments are only used to explain the present utility model and do not limit the protection scope of the present utility model.

[0033] Embodiment

[0034] Please refer to Figures 1 to 11 As shown in the figure, this embodiment provides an automatic feeding CCD detection and packaging device, including:

[0035] The bottom plate 1, on which there are successively and evenly distributed the first detection station 11, the transfer station 12, and the second detection station 13 in the left - right direction;

[0036] The feeding conveyor mechanism 2, installed in the left - hand area of the bottom plate 1, and the end of its conveying direction is provided with a feeding station 22;

[0037] The handling mechanism 3 is installed on the bottom plate 1 and is located to the right of the feeding conveyor mechanism 2; the handling mechanism 3 includes a fixed frame 31, a left-right moving component 32 installed on the fixed frame 31, an up-down moving component 33 installed on the moving end of the left-right moving component 32, and a handling mounting plate 34 installed on the moving end of the up-down moving component 33; four suction rod components 35 are evenly installed along the left-right direction on the rear side of the handling mounting plate 34, namely a first suction rod component 35a, a second suction rod component 35b, a third suction rod component 35c, and a fourth suction rod component 35d;

[0038] The detection mechanism 4 includes a CCD component 41 installed on the bottom plate 1; there are three groups of the CCD components 41, including a first CCD component 41A located in front of the first detection station 11 for detecting semiconductor components at the first detection station 11, a second CCD component 41B located in front of the second detection station 13 for detecting semiconductor components at the second detection station 13, and a third CCD component 41C located behind the second detection station 13 for detecting semiconductor components at the second detection station 13;

[0039] The packaging and discharging mechanism 5 is installed in the right area of the bottom plate 1, and it includes a discharging conveyor mechanism 51 and a packaging mechanism; the discharging conveyor mechanism 51 is provided with a discharging station 56; the packaging and discharging mechanism 5 further includes a packaging mechanism for packaging the semiconductor components of the discharging conveyor mechanism 51;

[0040] The handling mechanism 3 is used to drive the first suction rod component 35a to switch between the feeding station 22 and the first detection station 11, and is also used to drive the second suction rod component 35b to switch between the first detection station 11 and the transfer station 12, and is also used to drive the third suction rod component 35c to switch between the transfer station 12 and the second detection station 13, and is also used to drive the fourth suction rod component 35d to switch between the second detection station 13 and the discharging station 56.

[0041] In this embodiment, the bottom plate is a square metal plate, serving as the installation foundation for other components of the automatic feeding CCD detection and packaging device.

[0042] Refer again to Figure 2As shown in the figure, the feeding and conveying mechanism 2 includes a conveying belt 21. A baffle block 211 is installed at the end of the conveying belt 21, and the left side of the baffle block 211 forms the feeding station 22. Guide bars 212 are respectively arranged on the front and rear sides of the conveying surface of the conveying belt 21. In this embodiment, the feeding and conveying mechanism 2 further includes a feeding and conveying motor. The feeding and conveying motor is a power mechanism that provides power for the conveying belt 21, drives the driven wheel through the driving wheel, and then drives the conveying belt to move in a cycle. The conveying belt is a conveying channel for semiconductor components. There are two guide bars, which are respectively arranged on the left and right sides of the conveying belt for guiding the conveying movement. The feeding and conveying mechanism further includes support columns, and the feeding and conveying mechanism is fixed to the bottom plate through the support columns. By replacing the conveying belt and adjusting the distance between the guide bars, the conveying width is adapted to the size of the semiconductor components, so as to be compatible with different models of semiconductor components.

[0043] Referring again to Figure 4 As shown in the figure, the detection mechanism 4 further includes a light source assembly 42 installed on the bottom plate 1. There are three groups of the light source assemblies 42, including a first light source assembly 42A located between the first detection station 11 and the first CCD assembly 41A, a second light source assembly 42B located between the second detection station 13 and the second CCD assembly 41B, and a third light source assembly 42C located between the second detection station 13 and the third CCD assembly 41C.

[0044] Referring again to Figure 8 As shown in the figure, the CCD assembly 41 includes a CCD mounting base 412 installed on the bottom plate 1, a CCD support 413 installed on the CCD mounting base 412, and a CCD camera 411 fixed on the CCD support 413. Specifically, the CCD mounting base 412 has a chute in the front-rear direction. The CCD support 413 can move back and forth along the chute. After adjusting the front-rear position, the CCD support and the CCD mounting base are connected and fixed by bolt fasteners. The CCD support includes a support seat assembled with the CCD mounting base 412 and a vertical plate located in front of the support seat. The CCD camera is installed on the front side of the vertical plate. The CCD support further includes a rib plate, and the rib plate is arranged between the vertical plate and the support seat for strengthening the CCD support. The CCD camera provides visual photography for detection, and finally the visual software analyzes and compares the photography results to determine whether the detected semiconductor components are qualified.

[0045] Referring again to Figure 9 As shown in the figure, the light source assembly 42 includes a light source support 422 installed on the bottom plate 1 and a light source 421 fixed on the light source support 422. The light source assembly 42 provides the light source required for photography for the CCD assembly 41. The light source support has adjustable functions in the up, down, left, right, front, and rear directions, which is convenient for fine-tuning the position of the light source to ensure the effect provided by the light source.

[0046] Referring again to Figure 3 , Figure 4 and Figure 10 shown in the figures, on the bottom plate 1, loading platforms 14 are respectively fixed at the first detection station 11, transfer station 12, and second detection station 13; the loading platform 14 includes a support column 141 and a fixture 142 installed on the top side of the support column; the fixture 142 is used to hold semiconductor components. Specifically, the support column is in the shape of a "work" character and is fixed on the bottom plate. The size of the fixture can adapt to the size of the semiconductor components, thereby achieving compatibility with different models of semiconductor components.

[0047] Referring again to Figure 4 shown in the figure, the left - right moving assembly 32 includes a first mounting plate 321 installed on the fixed frame 31, a horizontal sliding rail 322 installed on the first mounting plate 321, and a horizontal slider 323 assembled with the horizontal sliding rail 322 and serving as the moving end of the left - right moving assembly 32; the left - right moving assembly 32 further includes a horizontal air cylinder 324 installed on the first mounting plate 321, and the horizontal air cylinder 324 is used to drive the entire up - down moving assembly 33 to move left and right along the horizontal sliding rail 322. The up - down moving assembly 33 includes a second mounting plate 331 installed on the moving end of the left - right moving assembly 32, a vertical sliding rail 332 installed on the second mounting plate 331, and a vertical slider 333 assembled with the vertical sliding rail 332 and serving as the moving end of the up - down moving assembly 33; the up - down moving assembly 33 further includes a lifting air cylinder 334 installed on the second mounting plate 331, and the lifting air cylinder 334 is used to drive the entire handling mounting plate 34 to move up and down along the vertical sliding rail 332. The left - right moving assembly 32 and the up - down moving assembly 33 cooperate together to control the movement of the suction rod assembly.

[0048] Referring again to Figure 6 shown in the figure, the suction rod assembly 35 includes a suction rod mounting block 352 fixed to the handling mounting plate 34 and a suction rod 351 inserted into the bottom side of the suction rod mounting block 352; the center of the suction rod 351 is a hollow pipe for air extraction, and the semiconductor components are sucked by means of vacuum pumping. The suction rod can be replaced by direct plug - and - play to match different semiconductor component sizes. Of course, the suction rod can also be replaced with other structures, for example, replaced with a magnetic attraction structure to suck magnetic - attractable semiconductor components, or replaced with a clamping jaw to clamp semiconductor components. This can be set according to the specific requirements of the semiconductor components as long as it is convenient to transfer the semiconductor components, and details are not elaborated here.

[0049] Referring again to Figures 5 to 7As shown, the outer wall of the bottom side of the suction rod 351 is square; the handling mechanism 3 further includes a rotary guide plate 36 hinged to the fixed frame 31; the rotary guide plate 36 has a degree of freedom of rotation in the horizontal direction, and a U-shaped groove 361 is formed at the end of the rotary guide plate 36 away from the hinge. The U-shaped groove 361 cooperates with the square outer wall of the suction rod 351 of the third suction rod assembly 35c, and is used to make the suction rod 351 of the third suction rod assembly 35c rotate under the guiding action of the U-shaped groove 361 when switching between the transfer station 12 and the second detection station 13, so that when the semiconductor component is transferred from the transfer station 12 to the second detection station 13, it rotates to a set angle. In this embodiment, the design of the rotary guide plate enables the second CCD assembly 41B and the second CCD assembly 41C to take pictures at different angles from the first CCD assembly 41A, realizing a comprehensive inspection of the surrounding of the semiconductor component. At the same time, the design of the rotary guide plate eliminates the need to set up CCD assemblies at corresponding angles according to the required inspection angles; multiple CCD assemblies can be installed compactly, effectively utilizing the limited installation space of the mounting plate.

[0050] Referring again to Figure 2 and Figure 11 As shown, the blanking conveying mechanism 51 includes a conveying tape 511; the packaging and blanking mechanism 5 further includes a packaging tape mechanism 52 installed on the bottom plate and located at the rear position above the conveying tape 511, a packaging tape collecting mechanism 53 installed on the bottom plate and located at the front position above the conveying tape 511, and a guide plate 54 installed on the top side of the conveying tape 511; the packaging tape mechanism 52 is used to supply the packaging tape; the packaging tape collecting mechanism 53 is used to wind up the packaging tape; the guide plate 54 is used to guide the packaging tape of the packaging tape mechanism 52 from the rear end of the guide plate to the lower part of the guide plate 54, and then guide it to the packaging tape collecting mechanism 53 along the front end of the guide plate; the packaging and blanking mechanism 5 further includes a roller assembly 55, and the roller assembly 55 is used to slightly roll-press the packaging tape and the semiconductor component to make them fit tightly. Specifically, the blanking conveying mechanism 51 further includes a blanking conveying motor, the blanking conveying motor drives the conveying tape 511 to move, the fourth suction rod assembly 35d places the semiconductor component on the conveying tape at the blanking station 56, the semiconductor component moves along with the conveying tape, the guide plate is divided into two groups, front and back, to guide the packaging tape, and the roller assembly gently rolls-presses the packaging bag and the semiconductor component to make them fit tightly. The packaging tape of the packaging tape mechanism passes through the guide plate and the roller, and is pulled to the packaging tape collecting mechanism. Under the traction of the packaging tape collecting mechanism, the semiconductor component is packaged and blanked.

[0051] Referring again to Figure 2 and Figure 11As shown, an NG conveying mechanism 6 is further provided at the blanking station 56; the NG conveying mechanism 6 includes a loading trough 61 and an NG conveying cylinder 62 for controlling the movement of the loading trough 61; the moving direction of the loading trough 61 is perpendicular to the conveying direction of the blanking conveying mechanism 51; the NG conveying cylinder 62 is used to drive the loading trough 61 to extend into or out of the blanking station 56. Specifically, when the semiconductor components detected by the detection mechanism are unqualified, the NG conveying cylinder 62 controls the loading trough 61 to extend to the blanking station 56. Driven by the handling mechanism, the fourth suction rod assembly sends the unqualified semiconductor components to the blanking station and places them in the loading trough 61. The NG conveying cylinder 62 controls the loading trough 61 to move out of the blanking station 56, that is, the output of the unqualified semiconductor components is completed.

[0052] The working process of an automatic loading CCD detection and packaging device according to this embodiment is as follows: The conveyor belt of the loading conveying mechanism transports the semiconductor components to the end loading station and stops; the handling mechanism controls the overall lifting of the suction rod assembly through the up-and-down movement component, and then controls the overall leftward movement of the suction rod assembly through the left-and-right movement component, so that the first suction rod assembly moves above the loading station; the handling mechanism controls the overall lowering of the suction rod assembly to the set position through the up-and-down movement component. The bottom end of the first suction rod assembly contacts the semiconductor components at the loading station, and vacuum suction is turned on. The first suction rod assembly sucks the semiconductor components. Synchronously, the second suction rod assembly sucks the semiconductor components at the first detection station, the third suction rod assembly sucks the semiconductor components at the transfer station, and the fourth suction rod assembly sucks the semiconductor components at the second detection station; Then, the handling mechanism controls the overall lifting of the suction rod assembly through the up-and-down movement component, and then controls the overall rightward movement of the suction rod assembly through the left-and-right movement component, so that the first suction rod assembly moves above the first detection station, and then controls the overall lowering of the suction rod assembly to the set position through the up-and-down movement component. The semiconductor components on the first suction rod assembly are placed in the fixture of the stage at the first detection station. Synchronously, the semiconductor components on the second suction rod assembly are placed in the fixture of the stage at the transfer station, the semiconductor components on the third suction rod assembly are placed in the fixture of the stage at the second detection station, and the semiconductor components on the fourth suction rod assembly are placed in the blanking conveyor line or the loading trough at the blanking station; Among them, during the process of the third suction rod assembly transferring the semiconductor components at the transfer station to the second detection station, under the action of the rotating guide plate, the angle changes during the transfer, so that the semiconductor components also rotate, from the first angular orientation at the transfer station to the second angular orientation at the second detection station. When the semiconductor components are transferred to the first detection station, the first CCD component takes a picture of the first angle of the semiconductor components; then, the semiconductor components are transferred to the transfer station and then to the second detection station, and the second CCD component and the third CCD component take pictures of the second angle of the semiconductor components.

[0053] In an automatic feeding CCD detection and packaging device according to this embodiment, in order to achieve full automation, sensors are correspondingly set to feedback corresponding signals, and then the control template receives the corresponding signals, and then controls the corresponding driving mechanisms (such as cylinders, motors, etc.) to perform corresponding actions, which can be correspondingly set according to the specific structure and action process of this embodiment.

[0054] The above embodiments should not limit the present invention in any way. All technical solutions obtained by means of equivalent replacement or equivalent conversion fall within the protection scope of the present invention.

Claims

1. An automatic feeding CCD detection and packaging device, characterized in that: It includes: A bottom plate (1) having a first detection station (11), a transfer station (12), and a second detection station (13) that are evenly distributed in the left-right direction in sequence; A loading conveying mechanism (2) installed in the left region of the bottom plate (1), and a loading station (22) is provided at the end of its conveying direction; A handling mechanism (3) installed on the bottom plate (1) and located to the right of the loading conveying mechanism (2); the handling mechanism (3) includes a fixed frame (31), a left-right moving component (32) installed on the fixed frame (31), an up-down moving component (33) installed on the moving end of the left-right moving component (32), and a handling mounting plate (34) installed on the moving end of the up-down moving component (33); four suction rod components (35) are evenly installed along the left-right direction on the rear side of the handling mounting plate (34), namely a first suction rod component (35a), a second suction rod component (35b), a third suction rod component (35c), and a fourth suction rod component (35d); A detection mechanism (4) including a CCD component (41) installed on the bottom plate (1); there are three groups of the CCD components (41), including a first CCD component (41A) located in front of the first detection station (11) for detecting semiconductor components at the first detection station (11), a second CCD component (41B) located in front of the second detection station (13) for detecting semiconductor components at the second detection station (13), and a third CCD component (41C) located behind the second detection station (13) for detecting semiconductor components at the second detection station (13); A packaging and unloading mechanism (5) installed in the right region of the bottom plate (1), which includes a unloading conveying mechanism (51); the unloading conveying mechanism (51) is provided with a unloading station (56); the packaging and unloading mechanism (5) further includes a packaging mechanism for packaging semiconductor components of the unloading conveying mechanism (51); The handling mechanism (3) is used to drive the first suction rod component (35a) to switch between the loading station (22) and the first detection station (11), and is also used to drive the second suction rod component (35b) to switch between the first detection station (11) and the transfer station (12), and is also used to drive the third suction rod component (35c) to switch between the transfer station (12) and the second detection station (13), and is also used to drive the fourth suction rod component (35d) to switch between the second detection station (13) and the unloading station (56).

2. The automatic feeding CCD detection and packaging device according to claim 1, wherein: The suction rod assembly (35) includes a suction rod mounting block (352) fixed to the handling mounting plate (34), and a suction rod (351) inserted into the bottom side of the suction rod mounting block (352); the outer wall of the bottom side of the suction rod (351) is square; the handling mechanism (3) further includes a rotary guide plate (36) hinged to the fixed frame (31); the rotary guide plate (36) has a degree of freedom of rotation in the horizontal direction, and a U-shaped groove (361) is formed at the end of the rotary guide plate (36) away from the hinge. The U-shaped groove (361) cooperates with the square outer wall of the suction rod (351) of the third suction rod assembly (35c) to cause the suction rod (351) of the third suction rod assembly (35c) to rotate under the guiding action of the U-shaped groove (361) when switching between the transfer station (12) and the second detection station (13), so that when the semiconductor component is transferred from the transfer station (12) to the second detection station (13), it rotates to a set angle.

3. An automatic feeding CCD detection and packaging device according to claim 1, characterized in that: On the bottom plate (1), carriers (14) are respectively fixed at the first detection station (11), the transfer station (12), and the second detection station (13); the carrier (14) includes a support column (141) and a fixture (142) mounted on the top side of the support column; the fixture (142) is used for holding semiconductor components.

4. An automatic feeding CCD detection and packaging device according to claim 1, characterized in that: The detection mechanism (4) further includes a light source assembly (42) mounted on the bottom plate (1); there are three groups of the light source assemblies (42), including a first light source assembly (42A) located between the first detection station (11) and the first CCD assembly (41A), a second light source assembly (42B) located between the second detection station (13) and the second CCD assembly (41B), and a third light source assembly (42C) located between the second detection station (13) and the third CCD assembly (41C).

5. An automatic feeding CCD detection and packaging device according to claim 4, characterized in that: The CCD assembly (41) includes a CCD mounting base (412) mounted on the bottom plate (1), a CCD support (413) mounted on the CCD mounting base (412), and a CCD camera (411) fixed to the CCD support (413); the light source assembly (42) includes a light source support (422) mounted on the bottom plate (1) and a light source (421) fixed to the light source support (422).

6. The automatic feeding CCD detection and packaging device according to claim 1, characterized in that: The loading conveyor mechanism (2) includes a conveyor belt (21), and a baffle block (211) is installed at the end of the conveyor belt (21). The left side of the baffle block (211) forms the loading station (22); guiding strips (212) are respectively arranged on the front and rear sides of the conveying surface of the conveyor belt (21).

7. An automatic feeding CCD detection and packaging device according to claim 1, characterized in that: The left and right moving assembly (32) includes a first mounting plate (321) mounted on the fixed frame (31), a horizontal sliding rail (322) mounted on the first mounting plate (321), and a horizontal sliding block (323) assembled with the horizontal sliding rail (322) and serving as the moving end of the left and right moving assembly (32); the left and right moving assembly (32) further includes a horizontal air cylinder (324) mounted on the first mounting plate (321), and the horizontal air cylinder (324) is used to drive the whole up and down moving assembly (33) to move left and right along the horizontal sliding rail (322).

8. An automatic feeding CCD detection and packaging device according to claim 1, characterized in that: The up and down moving assembly (33) includes a second mounting plate (331) mounted on the moving end of the left and right moving assembly (32), a vertical sliding rail (332) mounted on the second mounting plate (331), and a vertical sliding block (333) assembled with the vertical sliding rail (332) and serving as the moving end of the up and down moving assembly (33); the up and down moving assembly (33) further includes a lifting air cylinder (334) mounted on the second mounting plate (331), and the lifting air cylinder (334) is used to drive the whole handling mounting plate (34) to move up and down along the vertical sliding rail (332).

9. An automatic feeding CCD detection and packaging device according to claim 1, characterized in that: The blanking conveying mechanism (51) includes a conveying tape (511); the packaging and blanking mechanism (5) further includes a packing tape mechanism (52) mounted on the bottom plate and at the rear position above the conveying tape (511), a tape collecting mechanism (53) mounted on the bottom plate and at the front position above the conveying tape (511), and a guiding plate (54) mounted on the top side of the conveying tape (511); the packing tape mechanism (52) is used to supply the packing tape; the tape collecting mechanism (53) is used to wind up the packing tape; the guiding plate (54) is used to guide the packing tape of the packing tape mechanism (52) from the rear end of the guiding plate to the lower part of the guiding plate (54), and then guide it to the tape collecting mechanism (53) along the front end of the guiding plate; the packaging and blanking mechanism (5) further includes a roller assembly (55), and the roller assembly (55) is used to slightly roll-press the packing tape and the semiconductor components to make them fit tightly.

10. An automatic feeding CCD detection and packaging device according to claim 1, characterized in that: An NG conveying mechanism (6) is further provided at the blanking station (56); the NG conveying mechanism (6) includes a loading slot (61) and an NG conveying air cylinder (62) for controlling the movement of the loading slot (61); the moving direction of the loading slot (61) is perpendicular to the conveying direction of the blanking conveying mechanism (51); the NG conveying air cylinder (62) is used to drive the loading slot (61) to extend into or out of the blanking station (56).

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